RU98117514A - NON-CONDUCTIVE SUBSTRATE FORMING A TAPE OR USE UNIT WHICH ARE PERFORMED BY MULTIPLE CARRYING ELEMENTS - Google Patents

NON-CONDUCTIVE SUBSTRATE FORMING A TAPE OR USE UNIT WHICH ARE PERFORMED BY MULTIPLE CARRYING ELEMENTS

Info

Publication number
RU98117514A
RU98117514A RU98117514/09A RU98117514A RU98117514A RU 98117514 A RU98117514 A RU 98117514A RU 98117514/09 A RU98117514/09 A RU 98117514/09A RU 98117514 A RU98117514 A RU 98117514A RU 98117514 A RU98117514 A RU 98117514A
Authority
RU
Russia
Prior art keywords
contact pads
contour line
substrate
tape
conductive
Prior art date
Application number
RU98117514/09A
Other languages
Russian (ru)
Other versions
RU2202126C2 (en
Inventor
Штампка Петер
Хубер Михель
Шрауд Герхард
Штригель Петер
Менш Ханс-Георг
Original Assignee
Сименс Акциенгезелльшафт
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Сименс Акциенгезелльшафт filed Critical Сименс Акциенгезелльшафт
Publication of RU98117514A publication Critical patent/RU98117514A/en
Application granted granted Critical
Publication of RU2202126C2 publication Critical patent/RU2202126C2/en

Links

Claims (2)

1. Непроводящая подложка, образующая ленту или единицу использования, на которой выполнено множество несущих элементов, в частности, для встраивания в микросхемную карту, причем одна сторона подложки снабжена проводящими контактными площадками, которые лежат внутри определяющей размер несущего элемента внешней контурной линии, отличающаяся тем, что другая сторона подложки снабжена проводящими структурами, которые внутри внешней контурной линии образуют по меньшей мере контактные площадки для по меньшей мере одной подлежащей контактированию катушки и по меньшей мере одной полупроводниковой микросхемы и что вне каждой внешней контурной линии в подложке имеются выемки, сквозь которые с целью тестирования возможен доступ к выводам катушки полупроводниковой микросхемы со стороны контактных площадок, пока несущий элемент еще находится в ленте или в единице использования.1. A non-conductive substrate forming a tape or unit of use on which a plurality of load-bearing elements are made, in particular for embedding in a microcircuit card, one side of the substrate having conductive contact pads that lie inside an external contour line determining the size of the load-bearing element, characterized in that the other side of the substrate is provided with conductive structures which, within the outer contour line, form at least contact pads for at least one contact to be made the coil and at least one semiconductor chip, and that there are recesses in the substrate outside each external contour line through which, for testing purposes, access to the terminals of the semiconductor chip coil from the side of the contact pads is possible while the carrier is still in the tape or in the unit of use. 2. Подложка по п. 1, отличающаяся тем, что выемки выполнены в виде сквозных соединений, соединенных с проводящими структурами. и соответственно находятся в соединении с относительно малой, дополнительной контактной площадкой (6), расположенной на стороне контактных площадок вне внешней контурной линии
3. Подложка по п. 1, отличающаяся тем, что на стороне, противоположной стороне контактных площадок, выемки покрыты проводящей площадкой, соединенной с проводящими структурами
4. Подложка по п. 1, отличающаяся тем, что выемки выполнены в виде сквозных соединений, соединенных с проводящими структурами, и соответственно находятся в соединении с одной из контактных площадок внутри внешней контурной линии.2. The substrate according to claim 1, characterized in that the recesses are made in the form of through joints connected to conductive structures. and, accordingly, are connected to a relatively small, additional contact pad (6) located on the side of the contact pads outside the external contour line
3. The substrate according to claim 1, characterized in that on the side opposite to the side of the contact pads, the recesses are covered with a conductive pad connected to the conductive structures
4. The substrate according to claim 1, characterized in that the recesses are made in the form of end-to-end connections connected to conductive structures and, accordingly, are connected to one of the contact pads inside the external contour line.
RU98117514/09A 1996-12-20 1997-12-18 Nonconducting substrate forming band or unit of use mounting plurality of bearing members RU2202126C2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19653623 1996-12-20
DE19653623.5 1996-12-20

Publications (2)

Publication Number Publication Date
RU98117514A true RU98117514A (en) 2000-07-20
RU2202126C2 RU2202126C2 (en) 2003-04-10

Family

ID=7815743

Family Applications (1)

Application Number Title Priority Date Filing Date
RU98117514/09A RU2202126C2 (en) 1996-12-20 1997-12-18 Nonconducting substrate forming band or unit of use mounting plurality of bearing members

Country Status (11)

Country Link
US (1) US6384425B1 (en)
EP (1) EP0891603B1 (en)
JP (1) JP2000505923A (en)
KR (1) KR19990082575A (en)
CN (1) CN1199132C (en)
AT (1) ATE310995T1 (en)
BR (1) BR9707580A (en)
DE (3) DE19703057A1 (en)
RU (1) RU2202126C2 (en)
UA (1) UA53643C2 (en)
WO (1) WO1998028709A1 (en)

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DE10145752B4 (en) * 2001-09-17 2004-09-02 Infineon Technologies Ag Non-conductive, ribbon or sheet substrate on which a plurality of carrier elements are formed
DE10202257B4 (en) * 2002-01-21 2005-12-01 W.C. Heraeus Gmbh Method for fixing chip carriers
US7214569B2 (en) * 2002-01-23 2007-05-08 Alien Technology Corporation Apparatus incorporating small-feature-size and large-feature-size components and method for making same
US7253735B2 (en) 2003-03-24 2007-08-07 Alien Technology Corporation RFID tags and processes for producing RFID tags
US7615479B1 (en) 2004-11-08 2009-11-10 Alien Technology Corporation Assembly comprising functional block deposited therein
US7688206B2 (en) 2004-11-22 2010-03-30 Alien Technology Corporation Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
US20060109130A1 (en) * 2004-11-22 2006-05-25 Hattick John B Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
US7385284B2 (en) * 2004-11-22 2008-06-10 Alien Technology Corporation Transponder incorporated into an electronic device
DE102005002732A1 (en) * 2005-01-20 2006-08-03 Giesecke & Devrient Gmbh Portable data carrier
US20070031992A1 (en) * 2005-08-05 2007-02-08 Schatz Kenneth D Apparatuses and methods facilitating functional block deposition
CN1980549A (en) * 2005-12-09 2007-06-13 深圳富泰宏精密工业有限公司 Chip-card holding structure
JP2007324865A (en) * 2006-05-31 2007-12-13 Sony Chemical & Information Device Corp Antenna circuit, and transponder
DE102006031568A1 (en) * 2006-07-07 2008-01-10 Siemens Ag Method for electrical testing of chips
JP5108131B2 (en) * 2011-05-31 2012-12-26 デクセリアルズ株式会社 Antenna circuit and transponder
DE102011104508A1 (en) * 2011-06-17 2012-12-20 Giesecke & Devrient Gmbh Method for producing a data carrier with metal-free edge
KR102193434B1 (en) * 2013-12-26 2020-12-21 삼성전자주식회사 Antenna Device and Electrical Device including the Same
US9491867B2 (en) * 2014-09-30 2016-11-08 Ngk Spark Plug Co., Ltd. Wiring substrate and multi-piece wiring substrate
MY197461A (en) * 2016-05-11 2023-06-19 Linxens Holding Conductor path structure, in particular for a lead frame for a smart card application, with at least two superimposed conductor path planes
US10763203B1 (en) 2019-02-08 2020-09-01 Nxp B.V. Conductive trace design for smart card

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JP2672924B2 (en) * 1992-07-30 1997-11-05 三菱電機株式会社 Non-contact IC card, manufacturing method and testing method thereof
JPH0664381A (en) * 1992-08-21 1994-03-08 Oki Electric Ind Co Ltd Ic card module
FR2716281B1 (en) * 1994-02-14 1996-05-03 Gemplus Card Int Method of manufacturing a contactless card.
DE4416697A1 (en) * 1994-05-11 1995-11-16 Giesecke & Devrient Gmbh Data carrier with integrated circuit
DE19500925C2 (en) * 1995-01-16 1999-04-08 Orga Kartensysteme Gmbh Method for producing a contactless chip card
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