RU94031458A - Semiconductor rectifying gate - Google Patents

Semiconductor rectifying gate

Info

Publication number
RU94031458A
RU94031458A RU94031458/25A RU94031458A RU94031458A RU 94031458 A RU94031458 A RU 94031458A RU 94031458/25 A RU94031458/25 A RU 94031458/25A RU 94031458 A RU94031458 A RU 94031458A RU 94031458 A RU94031458 A RU 94031458A
Authority
RU
Russia
Prior art keywords
layer
type
anode
thyristor
conductance
Prior art date
Application number
RU94031458/25A
Other languages
Russian (ru)
Other versions
RU2091907C1 (en
Inventor
Ю.А. Евсеев
Original Assignee
Ю.А. Евсеев
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ю.А. Евсеев filed Critical Ю.А. Евсеев
Priority to RU94031458A priority Critical patent/RU2091907C1/en
Publication of RU94031458A publication Critical patent/RU94031458A/en
Application granted granted Critical
Publication of RU2091907C1 publication Critical patent/RU2091907C1/en

Links

Landscapes

  • Thyristors (AREA)

Abstract

FIELD: electric engineering. SUBSTANCE: each semiconductor rectifying gate is embraced by layer of semiconductor material having first type conductance (side layer). Said layer with first conductance type is isolated from material having second conductance type by separating groove which crosses base p-n junction. Groove is located on side that is opposite to substrate. Invention provides possibility to locate both anode and cathode groups of shared insulating base, which has metal strips for connection to shared terminals of anode and cathode groups. Diode, thyristor, triac, optical thyristor or optical triac may be used as rectifying gate. In case of diode, outer side of grove is located on border between side layer (for example, hole conductance) and source material. Groove may be displaced with respect to peripheral, however, this decreases working area of device. Diode gates may be mounted as separate hybrid gates, as two single-crystal units for anode and cathode groups, which are insulated by air gap, or as integral circuit. In latter case, anode and cathode groups are made on single crystal with shared side layer having p-type conductance; and crystal has two longitudinal dividing grooves, which outer sides are located on border between shared side layer having p-type conductance and source material. Another variant involves design of p-type side layer with central insulating layer with n-type conductance. In this case crystal has upper and lower longitudinal dividing grooves which bottom is located in central insulating n-type layer. Controlled semiconductor rectifying gate may be either thyristor, which is controlled from anode side, or thyristor, which is controlled from cathode side. Multiple-layer structure with alternating conductance type may be used as thyristor, which is controlled from anode side. Invention defines sizes dividing groove which is necessary part of gate. Said sizes provide maximal break-down voltage for locking p-n junctions. EFFECT: decreased sizes, possibility of operations with heavy current and voltage, simplified manufacturing.

Claims (1)

Изобретение относится к электротехнике и может быть использовано при выпрямлении переменного тока. Цель изобретения - создание малогабаритного полупроводникового выпрямительного модуля, пригодного для работы с высокими токами и напряжениями, а также упрощение технологии создания подобных модулей. Изобретение заключается в том, что каждый полупроводниковый выпрямительный элемент по боковой поверхности окружен слоем полупроводникового материала первого типа проводимости (боковой слой), причем от материала второго типа проводимости вышеуказанный слой первого типа проводимости отделен замкнутой разделительной канавкой, пересекающей базовый p-n переход. Канавка выполнена со стороны противолежащей плоскости основания. Изобретение позволяет разместить анодную и катодную группы элементов на общее изолирующее основание, на котором в виде металлических полос выполнены контакты к общим точкам анодной и катодной группы. Верхние контакты объединены попарно от одного катодного и одного анодного элементов. В качестве выпрямительного элемента могут быть использованы диод, тиристор, симистор (триак), оптотиристор и оптосимистор. В случае использования диода наружная поверхность канавки расположена на границе бокового, например дырочного, слоя и исходного материала. Канавка может быть смещена от периферии, но в этом случае уменьшается полезная площадь прибора. Диодные элементы могут монтироваться в виде отдельных (гибридных) элементов, в виде двух монокристаллических блоков для анодной и катодной групп, изолированных воздушным промежутком, или в виде интегральной схемы. В последнем случае анодная и катодная группы выполнены в одном кристалле с общим боковым слоем p-типа, причем кристалл выполнен с двумя продольными разделительными канавками, наружные части которых расположены на границе общего бокового слоя p-типа и исходного материала. В другом варианте боковой слой p-типа выполнен с центральным изолирующим слоем n-типа, причем кристалл выполнен с верхней и нижней продольными разделительными канавками, дно которых расположено в центральном изолирующем слое n-типа. В качестве управляемого полупроводникового выпрямительного элемента может быть использован тиристор, управляемый со стороны анода, или тиристор, управляемый со стороны катода. Причем в качестве тиристора, управляемого со стороны анода, может быть использована многослойная структура с чередующимся типом проводимости. В качестве полупроводникового выпрямительного элемента могут быть также использованы оптотиристор, симистор, оптосимистор. В изобретении указываются размеры обязательного элемента модуля - разделительной канавки, обеспечивающие максимальное напряжение пробоя блокирующих p-n переходов.The invention relates to electrical engineering and can be used for rectification of alternating current. The purpose of the invention is the creation of a small-sized semiconductor rectifier module suitable for working with high currents and voltages, as well as simplifying the technology for creating such modules. The invention consists in the fact that each semiconductor rectifier element on the lateral surface is surrounded by a layer of semiconductor material of the first conductivity type (side layer), and from the material of the second conductivity type, the above layer of the first conductivity type is separated by a closed separation groove intersecting the base p-n junction. The groove is made on the side of the opposite plane of the base. The invention allows to place the anode and cathode groups of elements on a common insulating base, on which contacts to common points of the anode and cathode groups are made in the form of metal strips. The upper contacts are combined in pairs from one cathode and one anode elements. As a rectifier element, a diode, a thyristor, a triac (triac), an opto-thyristor and an opto-simistor can be used. In the case of using a diode, the outer surface of the groove is located at the boundary of the lateral, for example hole, layer and the source material. The groove may be offset from the periphery, but in this case the useful area of the device decreases. Diode elements can be mounted in the form of separate (hybrid) elements, in the form of two single-crystal blocks for the anode and cathode groups isolated by the air gap, or in the form of an integrated circuit. In the latter case, the anodic and cathodic groups are made in one crystal with a common p-type side layer, and the crystal is made with two longitudinal dividing grooves, the outer parts of which are located at the border of the common p-type side layer and the source material. In another embodiment, the p-type side layer is made with an n-type central insulating layer, the crystal being made with upper and lower longitudinal dividing grooves, the bottom of which is located in the n-type central insulating layer. As a controlled semiconductor rectifier element, a thyristor controlled from the anode side or a thyristor controlled from the cathode can be used. Moreover, as a thyristor controlled from the side of the anode, a multilayer structure with an alternating type of conductivity can be used. As a semiconductor rectifier element can also be used opto-thyristor, triac, opto-triac. In the invention, the dimensions of the required element of the module, the dividing groove, providing the maximum breakdown voltage of the blocking p-n junctions, are indicated.
RU94031458A 1994-08-26 1994-08-26 Semiconductor rectifier module RU2091907C1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
RU94031458A RU2091907C1 (en) 1994-08-26 1994-08-26 Semiconductor rectifier module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
RU94031458A RU2091907C1 (en) 1994-08-26 1994-08-26 Semiconductor rectifier module

Publications (2)

Publication Number Publication Date
RU94031458A true RU94031458A (en) 1996-07-10
RU2091907C1 RU2091907C1 (en) 1997-09-27

Family

ID=20160055

Family Applications (1)

Application Number Title Priority Date Filing Date
RU94031458A RU2091907C1 (en) 1994-08-26 1994-08-26 Semiconductor rectifier module

Country Status (1)

Country Link
RU (1) RU2091907C1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2739863C1 (en) * 2020-03-23 2020-12-29 Российская Федерация, от имени которой выступает Государственная корпорация по атомной энергии "Росатом" Method of producing diode optoelectronic pairs resistant to gamma-neutron radiation

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2739863C1 (en) * 2020-03-23 2020-12-29 Российская Федерация, от имени которой выступает Государственная корпорация по атомной энергии "Росатом" Method of producing diode optoelectronic pairs resistant to gamma-neutron radiation

Also Published As

Publication number Publication date
RU2091907C1 (en) 1997-09-27

Similar Documents

Publication Publication Date Title
US4819044A (en) Vertical type MOS transistor and its chip
US7808070B2 (en) Power semiconductor component
JPH05152574A (en) Semiconductor device
US7939887B2 (en) Active semiconductor component with a reduced surface area
US4132996A (en) Electric field-controlled semiconductor device
US6765262B2 (en) Vertical high-voltage semiconductor component
US3525910A (en) Contact system for intricate geometry devices
US3996601A (en) Shorting structure for multilayer semiconductor switching devices
US20130168729A1 (en) Voltage-Sustaining Layer Consisting of Semiconductor and Insulator Containing Conductive Particles for Semiconductor Device
JPH11274482A (en) Semiconductor device
KR20020080547A (en) High voltage semiconductor device having a high breakdown voltage isolation region
US5757034A (en) Emitter switched thyristor
US4914045A (en) Method of fabricating packaged TRIAC and trigger switch
US5468976A (en) Semi conductor rectifying module
US3564355A (en) Semiconductor device employing a p-n junction between induced p- and n- regions
RU94031458A (en) Semiconductor rectifying gate
US7683454B2 (en) MOS power component with a reduced surface area
EP0380249A2 (en) Insulated gate bipolar transistor
US4943840A (en) Reverse-conducting thyristor
JPS6136979A (en) Constant-voltage diode
RU2030024C1 (en) Diode rectifier bridge
US20230120729A1 (en) Power semiconductor devices including multiple gate bond pads
JP3217552B2 (en) Horizontal high voltage semiconductor device
US20240186423A1 (en) High power density rectifier device
RU2083027C1 (en) Thyristor controlled module