RU37232U1 - DEVICE FOR HEATING POWER SEMICONDUCTOR DEVICES - Google Patents

Description

POWER SEMICONDUCTOR HEATING DEVICE

DEVICES

The utility model relates to electrical engineering and can be used in testing power semiconductor devices with the aim of heating them to operating temperatures.

A device for checking the temperature characteristics of an optical semiconductor element containing

pressure testing table, heat chamber, air conditioning (Japanese Patent .N 2935344 B2 .G01R 31/26; 08/16/1999.).

It is also known a device for cooling and heating a semiconductor containing a heat-conducting body in the form of a drum with channels between which heaters or coolers are placed (Japanese Patent No. 2868325 B2. 31/26: 03/10/1999.).

The downside of known devices is that. that they do not provide uniform and fast heating of power semiconductor devices to the test temperature.

The closest in technical essence to the proposed} device for heating power semiconductor devices is a device for heating power semiconductor devices selected as a prototype, which contains a heat-conducting body in the form of a drum with channels, heaters, a rotary table, transformer oil, metal balls, movable brittle, electric drive (Patent RF for utility model No. 31454, G01R31 / 26: 08/10/2003.).

A disadvantage of the known device is the complexity of the mechanical part of the device, the insufficient heating rate of power semiconductor devices, as well as large dimensions.

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IPC: GOlR3l26

heating power semiconductor priors. as well as increasing the efficiency of the device due to the redistribution of heat flows when placing the heaters in a horizontal position under the channels.

The technical result is achieved by that. that a heating device for power semiconductor devices, comprising a heat-conducting body in the form of a drum with channels, mounted on a turntable and filled with transformer oil between the channels, which are filled with metal balls. heaters, the terminals of which are connected to the leads of the heater power supply, is equipped with an electromagnet. rigidly connected to the bracket and mounted above the heat-conducting body, the power supply of the electromagnet, the output of which is connected through the contactor to the electromagnet, and the heaters are located in a horizontal position under the channels.

Comparative analysis with the prototype shows that the inventive heating device for power semiconductor devices is characterized by the presence of new units: an electromagnet. power supply electromagnet. contactor. heaters

located horizontally under the channels.

The drawing shows a diagram of a device for heating power semiconductor devices. The heating device for power semiconductor devices includes a rotary table 1. on which is mounted a heat-conducting body in the form of a drum 2 with channels 3 for laying power semiconductor devices. heaters 4. located horizontally under the channels 3 and connected by their leads to the leads of the power source 5 heaters, transformer oil 6. located inside the drum 2 between the channels 3. metal balls 7. electromagnet 8. connected mechanically with the bracket 9 and located above the heat-conducting

body 2. contactor 10, the input of which is connected by the output of the power source of the electromagnet 1 1, and the output with the electromagnet 8.

Using the rotary table 1, the drum 2 with channels 3 is rotated around the circumference. The number of channels 3 depends on the brand of the tested power semiconductor devices. Before starting the tests of power semiconductor devices, metal balls 7 are preheated in channels 3 using heaters 4 and transformer oil 6.

At the beginning of the heating process of power semiconductor devices with the power of the contactor 10, the electro-magnet 8 is turned on. Under the action of which, the metal balls 7 are successively lifted from the channels 3. Then, a cold power semiconductor device is lowered to the bottom of the channel 3. After pressing the contactor 10 again, the electromagnet 8 is brought into an inoperative state, and metal balls 7 are poured into the channel 3 under the action of force with the tested semiconductor device.

The placement of the heaters 4 in a horizontal position under the channels 3 allows you to increase the efficiency of the device due to the redistribution of heat fluxes of the drinkers 4, and the use of electromagnet 3 can reduce the size and simplify the design of the mechanical part of the device.

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Claims (1)

A heating device for power semiconductor devices, comprising a heat-conducting body in the form of a drum with channels, mounted on a rotary table and filled with transformer oil between channels that are filled with metal balls, heaters, the terminals of which are connected to the terminals of the heaters power source, characterized in that it is equipped with an electromagnet, rigidly connected to the bracket and mounted above the heat-conducting body, the power supply of the electromagnet, the output of which is connected through the contactor to the electric electromagnet, and the heaters are located in a horizontal position under the channels.