RU2805379C1 - Speakers - Google Patents

Abstract

FIELD: acoustics, in particular speakers.

SUBSTANCE: speaker contains a vibrating unit consisting of a vibrating element and a vibrating housing. The vibration element is configured to convert the electrical signal into mechanical vibration, and the vibrating body is in contact with the user's facial skin. The speaker contains an elastic element elastically connected to a vibrating body. The speaker further contains a mass element coupled to the vibrating body via a first resilient member, the mass element being coupled to the first resilient member to form a resonant unit, and the vibrating unit generating a first resonant peak at the first frequency. In the frequency range below the first frequency, the vibration amplitude of the resonant unit exceeds the vibration amplitude of the vibrating body.

EFFECT: reducing the amplitude of vibrations of the vibrating body in contact with the user's face, reducing sound leakage, improving sound quality.

8 cl, 17 dwg

Description

Field of technology to which the invention relates

The present disclosure relates generally to the field of audio output devices and, in particular, to speakers.

State of the art

Speakers capable of conducting sound through bones can convert sound signals into mechanical vibration signals, and transmit mechanical vibration signals to the auditory nerves of the human body through human tissue and bones, so that the user can hear sound.

The present disclosure provides speakers that can reduce the amplitude of vibration at a certain frequency, thereby reducing the vibration sensation of speakers at a low frequency, reduce sound leakage when operating speakers, and improve the sound quality of speakers.

Disclosure of the invention

The present disclosure provides a speaker for reducing the vibration amplitude of a vibrating body in contact with a user's face during use of the speaker, thereby reducing the feeling of vibration at low frequencies, reducing sound leakage of the speaker, and improving sound quality.

To achieve the above function, the present disclosure proposes the following technical schemes:

The speaker may include a vibration unit and a first elastic element. The vibrating unit may comprise a vibrating element and a vibrating housing. The vibration element can convert the electrical signal into mechanical vibration. The vibrating body may contact the user's facial skin. The first elastic element may be elastically connected to the vibrating body.

In some embodiments, the speaker may further comprise a mass element coupled to the vibrating body via a first resilient element. The mass element may be coupled to the first elastic element to form a resonant unit.

In some embodiments, the vibrating body may include a vibration plate in contact with the user's facial skin. The first elastic element may be elastically connected to the vibration plate.

In some embodiments, the mass element may be a groove element. The vibration element may be at least partially located in the groove element. The first elastic element may be connected to the vibration plate and the inner wall of the groove element.

In some embodiments, the first elastic element may be a vibration transmission sheet.

In some embodiments, the ratio of the mass of the mass element to the mass of the vibration plate may be in the range of 0.04-1.25.

In some embodiments, the ratio of the mass of the mass element to the mass of the vibration plate may be in the range of 0.1-0.6.

In some embodiments, the vibrating assembly may generate a first resonant peak at a first frequency. The resonant node may generate a second resonant peak at a second frequency. The ratio of the second frequency to the first frequency can be in the range of 0.5-2.

In some embodiments, the vibration assembly may generate a first resonant peak at a first frequency. The resonant node may generate a second resonant peak at a second frequency. The ratio of the second frequency to the first frequency can be in the range of 0.9-1.1.

In some embodiments, the first frequency and the second frequency may be less than 500 Hz.

In some embodiments, in the frequency range below the first frequency, the amplitude of vibration of the resonant assembly may be greater than the amplitude of vibration of the vibrating body.

In some embodiments, the vibrating body may include a vibrating plate and a back plate positioned opposite the vibrating plate. The vibration plate may contact the user's facial skin. The mass element may be connected to the back plate through the first elastic element. The first elastic element may be located on a surface of the back plate. The contact area between the first elastic element and the back plate may be greater than 10 mm ² .

In some embodiments, the first resilient member may comprise at least one of silica gel, plastic, adhesive, foam, or spring.

In some embodiments, the first elastic element may be an adhesive.

In some embodiments, the adhesive may have a Shore hardness of 30-50.

In some embodiments, the tensile strength of the adhesive may be at least 1 MPa.

In some embodiments, the elongation to break of the adhesive can be in the range of 100%-500%.

In some embodiments, the adhesive strength between the adhesive and the backplate may be in the range of 8 MPa-14 MPa.

In some embodiments, the thickness of the adhesive layer formed by coating the surface of the backplate with adhesive may be in the range of 50 μm to 150 μm.

In some embodiments, the contact area of the adhesive and the backplate may be 1%-98% of the area of the inner wall of the backplate.

In some embodiments, the contact area between the adhesive and the back plate may be in the range of 100 mm ² - 200 mm ² .

In some embodiments, the contact area between the adhesive and the backplate may be 150 mm ² .

In some embodiments, an opening may be provided at least on the interior or surface of the first resilient member.

In some embodiments, the hole may be filled with an absorbent.

In some embodiments, the first elastic element may be foam.

In some embodiments, the foam thickness may be in the range of 0.6 mm - 1.8 mm.

In some embodiments, the ratio of the mass of the mass element to the mass of the vibration plate and the back plate can be in the range of 0.04-1.25.

In some embodiments, the ratio of the mass of the mass element to the mass of the vibration plate and the back plate can be in the range of 0.1-0.6.

In some embodiments, the mass element material may comprise at least one of plastic, metal, or composite material.

In some embodiments, the speaker may include at least two resonant units. In each of the at least two resonant units, the first elastic element can be connected to the back plate. Two adjacent resonant nodes from the at least two resonant nodes can be separated by a given distance.

In some embodiments, the speaker may comprise at least two resonant assemblies stacked along the thickness direction of the first elastic elements in the at least two resonant assemblies. The first elastic element of one of the two adjacent resonant nodes of the at least two resonant nodes can be connected to the mass element of the other of the two adjacent resonant nodes of the at least two resonant nodes.

In some embodiments, the first elastic element may be located on the inner wall of the back plate.

In some embodiments, the first elastic element may include a diaphragm. The mass element may comprise a composite structure attached to the surface of the diaphragm.

In some embodiments, the composite structure may comprise at least one of the following: a paper cone, an aluminum sheet, or a copper sheet.

In some embodiments, the vibrating housing may be provided with a sound outlet. The sound generated by the vibration of the resonant unit can be directed outward through the sound outlet.

In some embodiments, the sound output hole may be located on the back plate.

In some embodiments, the first elastic element may be located on the outer wall of the back plate.

In some embodiments, the mass element may be a groove element. The vibration element may be at least partially located in the groove element. The first elastic element can be connected to the outer wall of the vibrating body and to the inner wall of the groove element. a sound channel may be formed between the inner wall of the groove element and the outer wall of the vibrating body.

In some embodiments, the speaker may further comprise a functional element coupled to the mass element.

In some embodiments, the functional element may include a battery and a circuit board.

In some embodiments, the vibrating assembly may further comprise a second resilient element. The vibrating element may transmit mechanical vibration to the vibrating body through the second elastic element.

In some embodiments, the second elastic element may be a vibration transmission sheet rigidly connected to the vibrating body.

Brief description of drawings

The present disclosure may be further illustrated by exemplary embodiments, which may be described in detail using the accompanying drawings. These embodiments are not limiting, and in these embodiments, the same reference numeral indicates a similar structure, where:

fig. 1—a speaker corresponding to some embodiments of the present disclosure;

fig. 2 is a longitudinal sectional view of a speaker without a vibration damping unit corresponding to some embodiments of the present disclosure;

fig. 3 is a partial frequency response of a speaker without a vibration damping unit corresponding to some embodiments of the present disclosure;

fig. 4 is a longitudinal sectional view of a speaker with a vibration damping unit corresponding to some embodiments of the present disclosure;

fig. 5 – frequency characteristics corresponding to some embodiments of the present disclosure;

fig. 6 is a simplified mechanical model of a speaker without vibration damping unit, corresponding to some embodiments of the present disclosure;

fig. 7 is a simplified mechanical model of a speaker with a vibration damping unit corresponding to some embodiments of the present disclosure;

fig. 8 is a longitudinal sectional view of a speaker in which the first elastic element is a diaphragm, consistent with some embodiments of the present disclosure;

fig. 9 is a longitudinal sectional view of a speaker in which the mass element is a groove element consistent with certain embodiments of the present disclosure;

fig. 10 is a longitudinal sectional view of a speaker with a vibration damping unit, corresponding to some embodiments of the present disclosure;

fig. 11 is a longitudinal section view from a different angle of the speaker shown in FIG. 10.

fig. 12 is a longitudinal sectional view of a speaker in which the vibration damping unit is located in a vibrating housing, corresponding to some embodiments of the present disclosure;

fig. 13—speaker sound leakage intensity characteristics corresponding to some embodiments of the present disclosure;

fig. 14—speaker sound pressure level characteristics corresponding to certain embodiments of the present disclosure;

fig. 15 is a longitudinal sectional view of a speaker in which the first resilient member has an opening, consistent with some embodiments of the present disclosure;

fig. 16 is a longitudinal sectional view of a speaker comprising two resonant units, consistent with certain embodiments of the present disclosure; And

fig. 17 is a longitudinal sectional view of a speaker comprising two resonant units consistent with certain embodiments of the present disclosure.

Carrying out the invention

In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following briefly provides a presentation of the drawings to be used in describing the embodiments. It will be appreciated that the drawings herein are only some examples or embodiments of the present disclosure. Without creativity, the present disclosure can be applied to other similar scenarios corresponding to these drawings by those skilled in the art. It should be understood that these exemplary embodiments are provided only to enable those skilled in the art to better understand and practice the present invention and not to limit the scope of the present disclosure in any way. Unless apparent from the text or otherwise indicated, like reference numerals in the drawings represent the same structure or operation.

As used in the present disclosure and the appended claims, the singular forms include the plural forms unless the content clearly dictates otherwise. In general, the terms “comprise”, “contains” and/or “comprising”, “include”, “includes” and/or “comprising” merely suggest the inclusion of steps and elements that have been clearly defined, and these steps and elements do not constitute exclusion list. The methods or devices may further comprise other steps or elements. The term "one embodiment" means "at least one embodiment". The term “another embodiment” means “at least one additional embodiment.” Other terms may be defined as appropriate in the description below. Hereinafter, without loss of generality, when describing related bone conduction technologies in this invention, the description "bone conduction speaker" or "bone conduction earphone" may be used. This description is only a form of application of bone conduction. For those skilled in the art, "speaker" or "earphone" may further be replaced by other similar words such as "player", "hearing aid", etc.

Some embodiments of the present disclosure provide a speaker with bone conduction function. The speaker may be equipped with a vibration damping unit, which can reduce the intensity of mechanical vibration generated by the speaker during operation. Mechanical vibration may refer to vibration generated by a vibrating body (eg, a vibration plate in contact with the user's facial skin, and a side plate, back plate, etc. attached to the vibration plate) of the speaker. In some cases, the vibration damping unit is used to reduce the mechanical vibration of the vibrating body in the low frequency band, which can reduce the vibration sensation of the vibrating body in the low frequency band, so that the user can wear the speaker more comfortably. In other cases, when the vibration intensity of the vibrating body is reduced, the sound leakage caused by the vibration of the vibrating body can be reduced, which can effectively improve the sound quality of the speaker and the user experience. The speaker in the present disclosure may refer to a speaker that uses bone conduction as one of the primary methods for transmitting sound. For example, when a speaker is operating, the vibrating speaker housing may mechanically vibrate. The vibrating body can transmit mechanical vibrations to the user's auditory nerve through the user's facial skin through bone conduction so that the user can hear sound. For convenience of description, in one or more embodiments of the present disclosure, a speaker may be used as an example for description. It should be noted that the method of transmitting sound through bones is not the only way for the speaker in the present disclosure to transmit sound to the user. In some embodiments, the speaker may also transmit sound in other ways. For example, the speaker may further comprise an air conduction speaker unit, that is, the speaker may include a bone conduction speaker assembly and an air conduction speaker assembly and transmit sound to a user through a combination of bone conduction and air conduction. The air conduction speaker assembly can transmit vibration waves to the user's auditory nerve through the air so that the user can hear sound.

In fig. 1 illustrates a speaker in accordance with some embodiments of the present disclosure. As shown in FIG. 1, speaker 100 may include a vibration assembly 110, a vibration damping assembly 120, and a mounting assembly 130.

The vibration unit 110 can generate mechanical vibrations. The formation of mechanical vibrations is accompanied by energy conversion. The speaker 100 may use the vibration assembly 110 to realize the conversion of signals containing audio information into mechanical vibrations. The transformation process may involve the coexistence and transformation of many different types of energy. For example, electrical signals may be directly converted to mechanical vibrations by a transducer in the vibration unit 110. As another example, audio information may be included in light signals, and a particular transducer may implement a process for converting light signals to vibration signals. Other types of energy that may coexist and be converted during the operating process of the converter may include thermal energy, magnetic field energy, and the like. Energy conversion methods The converter may include moving coil, electrostatic, piezoelectric, moving core, pneumatic, electromagnetic, etc. ways. The vibration assembly may transmit the generated mechanical vibrations to the user's eardrum through the skin of the user's face via bone conduction so that the user can hear sound.

In some embodiments, vibrating assembly 110 may include a vibrating element (eg, vibrating element 211) and a vibrating body (eg, vibrating body 213) coupled to the vibrating element. The vibrating element can generate mechanical vibrations that can be transmitted to the vibrating housing. The vibrating body can contact the user's facial skin and transmit mechanical vibrations to the user's auditory nerves.

In some embodiments, the vibrating element (also referred to as a transducer) may include a magnetic circuit assembly. The magnetic circuit assembly can provide magnetic fields. Magnetic fields may have the ability to convert signals containing audio information into mechanical vibration signals. In some embodiments, the audio information may comprise video files and audio files in a particular data format, or data or files that can be converted to audio in a particular manner. The signals containing audio information may come from a storage unit of the speaker 100 or from a system for generating, storing or transmitting information other than the speaker 100. The signals containing audio information may contain one or a combination of electrical signals, optical signals, magnetic signals, mechanical signals, etc. Signals containing audio information may come from a single source or from multiple sources. The plurality of signal sources may be correlated or uncorrelated. In some embodiments, speaker 100 may receive signals containing audio information in a variety of different ways. The signal can be received over a wired or wireless connection and can be real time or delayed. For example, speaker 100 may receive electrical signals containing audio information via wired or wireless means, or may receive data directly from a storage medium to generate audio signals. As another example, speaker 100 may include a sound collection function. The node can collect sound in the environment, convert mechanical sound vibrations into electrical signals, and obtain electrical signals that meet specific requirements after processing by an amplifier. In some embodiments, the wired connection may comprise a metal cable, an optical cable, or a combination of metal and optical cables. For example, a wired connection may comprise a single cable or a combination of coaxial cable, bonded cable, flexible cable, coiled cable, non-metallic braided cable, metallic braided cable, stranded cable, twisted pair cable, ribbon cable, shielded cable, telecommunications cable, double cable. twisted, parallel two-core wire, twisted pair, etc. The examples described above are for convenience of description only, and the wired connection medium may further comprise other types, such as other carriers for transmitting electrical signals or optical signals.

The wireless connection may include radio communication, free space optical communication, acoustic communication, electromagnetic induction, and the like. Wireless communication can comply with IEEE802.11, IEEE802.15 series standard (such as FDMA, TDMA, SDMA, CDMA and SSMA), first generation mobile technology, second generation mobile technology, general packet radio technology, third generation mobile technology (eg CDMA2000, WCDMA, TD-SCDMA and WiMAX), fourth generation mobile technologies (eg TD-LTE and FDD-LTE), satellite communications (eg GPS technologies), near field communication (NFC) technologies and others technologies operating in the ISM frequency band (such as 2.4 GHz, etc.). Free space optical communications may contain visible light, infrared signals, etc. Electromagnetic induction may contain near field communication technology, etc. The examples described above are used for convenience of illustration only, and the wireless communication environment may further comprise other types of communications, such as Z-wave technology, other toll civilian radio frequency bands and military radio frequency bands, etc. For example, as an example of a wireless connection application, speaker 100 may receive signals containing audio information from other devices via Bluetooth technology.

In some embodiments, the vibrating housing may define a closed or open housing space and the vibrating element may be located within the vibrating housing. In some embodiments, the vibrating body may include a vibrating plate, a side plate, and a back plate that are connected to the vibrating plate. For example, as shown in FIG. 2, the vibration plate 2131, the side plate 2132 and the back plate 2133 may form a housing space, and the vibration element 211 may be located in the housing space. In some embodiments, the side plate 2132 and the back plate 2133 may be separate units. The side plate 2132 and the back plate 2133 may be physically connected or connected and secured by other connecting structures. For example, the side plate 2132 and the back plate 2133 may be separately formed plate-shaped members and then joined together by gluing. In some embodiments, the side plate 2132 and the back plate 2133 may be different parts of the same structure, that is, a continuous connecting surface exists between the side plate 2132 and the back plate 2133. For example, the vibrating body 213 may include a hemispherical body or semi-elliptical body and a vibrating plate 2131 coupled to the vibrating body 213. The hemispherical body or semi-elliptical body may include a side plate 2132 and a back plate 2133, and the side plate 2132 and back plate 2133 may not have an obvious borders. For example, the portion of the vibrating body 213 connected to the vibrating plate 2131 may be a side plate 2132, while the remainder of the vibrating body 213 may be a back plate 2133.

The vibration plate 2131 may be a structure in contact with the user's facial skin. The vibration plate 2131 may be coupled to the vibration member 211, and the mechanical vibrations generated by the vibration member 211 may be transmitted to the user through the vibration plate 2131. The speaker in the present disclosure may transmit sound mainly through bone conduction, through which the mechanical vibrations may be transmitted to the user through the part. (eg, through a vibration plate 2131) that contacts the user's body (eg, the user's facial skin), and is further transmitted to the user's auditory nerve through the user's skin and bones to enable the user to hear sound. In some embodiments, the contact area of the vibration plate 2131 with the user's facial skin may be at least greater than a predetermined contact area. In some embodiments, the specified contact area may be in the range of 50 mm ² -1000 mm ² . In some embodiments, the specified contact area may be in the range of 75 mm ² -850 mm ² . In some embodiments, the specified contact area may be in the range of 100 mm ² -700 mm ² .

In some embodiments, the vibrating body may establish a placement space. In some embodiments, the vibrating body may only include a vibration plate in contact with the user's surface and not a side plate or back plate. For example, in the embodiments shown in FIGS. 10 and fig. 11, the vibrating body 1013 may be of a plate structure, directly connected to the vibrating element 1011, and contacting the user's facial skin. Therefore, in embodiments, the vibrating body 1013 may be equivalent to a vibrating plate.

In some embodiments, the vibration plate (eg, vibration plate 2131 shown in FIG. 2) may be in direct contact with the user's facial skin. In some embodiments, the outside of the vibration plate of the speaker 100 may be wrapped with a vibration transfer layer. The vibration transmission layer may contact the user's facial skin. The vibration system formed by the vibration plate and the vibration transmission layer can transmit the generated sound vibrations to the user's facial skin through the vibration transmission layer. In some embodiments, the outside of the vibration plate may be wrapped with a single vibration transmission layer. In some embodiments, the outer side of the vibration plate may be wrapped with a plurality of vibration transmission layers. In some embodiments, the vibration transmission layer may be made of one or more materials. The materials of the various vibration transmission layers may be the same or different. In some embodiments, multiple vibration transmission layers may be stacked in the thickness direction of the vibration plate, or laid out in the horizontal direction of the vibration plate, or a combination of both of the above-mentioned arrangements. The area of the vibration transmission layer can have different sizes. In some embodiments, the area of the vibration transmission layer may be at least 1 cm ² . In some embodiments, the area of the vibration transmission layer may be at least 2 cm ² . In some embodiments, the area of the vibration transmission layer may be at least 6 cm ² .

In some embodiments, the vibration transmission layer may be made of materials with certain adsorption, flexibility and chemical properties, such as plastics (may contain, but are not limited to, high molecular weight polyethylene, blown nylon, engineered plastics, etc.), rubber or other simple or composite materials that may have the same characteristics. Types of rubber may include, but are not limited to, general rubber and specialty rubber. Conventional rubber may include, but is not limited to, natural rubber, isoprene rubber, styrene butadiene rubber, butadiene rubber, neoprene, and the like. The specialty rubber may include, but is not limited to, nitrile rubber, silicone rubber, fluoride rubber, polysulfide rubber, polyurethane rubber, epichloride rubber, acrylate rubber, propylene oxide rubber, and the like. The styrene butadiene rubber may comprise, but is not limited to, emulsion polymerized styrene butadiene rubber and solution polymerized styrene butadiene rubber. The composite material may contain, but is not limited to, reinforcing materials such as glass fiber, carbon fiber, boron fiber, graphite fiber, fiber, graphene fiber, silicon carbide fiber, or aramid fiber. The composite material may be a compound of other organic and/or inorganic materials, such as glass fiber reinforced unsaturated polyester, epoxy resin, or a phenolic resin matrix composed of various types of FRP. Other materials that can be used to create the vibration transmission layer may include one or a combination of silica gel, polyurethane and polycarbonate.

In some embodiments, the vibrating element may be attached to any location on the vibrating body. For example, in the embodiments shown in FIGS. 12, the vibration element 1211 may be directly coupled to the vibration plate 12131. As another example, in the embodiments shown in FIGS. 4, the vibration member 411 may be coupled to the side plate 4132. The mechanical vibrations generated by the vibration member 411 may be first transmitted to the side plate 4132, then transmitted to the vibration plate 4131, and finally transmitted to the user through the vibration plate 4131.

The vibration damping assembly 120 may be coupled to a vibrating body (eg, the vibrating body 413 shown in FIG. 4) to reduce the intensity of mechanical vibration of the vibrating body. In some embodiments, vibration damping assembly 120 may be directly coupled to the vibration plate of the vibrating body. For example, in the embodiments shown in FIGS. 10, vibration damping assembly 1020 (the first resilient member 1021 of vibration damping assembly 1020) may be coupled to the vibrating plate 12131. In some embodiments, vibration damping assembly 120 may be coupled to other vibrating body assemblies. For example, in the embodiments shown in FIGS. 4, the vibration damping assembly 420 may be coupled to the back plate 4133 of the vibrating body 413.

In some embodiments, vibration damping assembly 120 may include a first resilient member (eg, first resilient member 421 shown in FIG. 4). In some embodiments, the first elastic element may have a certain damping. In some cases, when the vibrating body vibrates, a first resilient member coupled to the vibrating body may absorb mechanical energy from the vibrating body to reduce the vibration amplitude of the vibrating body. In some embodiments, the damping of the first elastic element may be in the range of 0.005 N.s/m - 0.5 N.s/m. In some embodiments, the damping of the first elastic element may be in the range of 0.0075 N.s/m - 0.4 N.s/m. In some embodiments, the damping of the first elastic element may be in the range of 0.01 N.s/m - 0.3 N.s/m.

In some embodiments, the damping assembly 120 may include a first resilient member (eg, first resilient member 421 shown in FIG. 4) and a mass element coupled to the first resilient member (eg, mass member 423 shown in FIG. 4). The mass element may form a resonant unit with the first elastic element. Mechanical energy of the vibrating body may be transmitted to the mass element through the first elastic element, causing the mass element to vibrate to absorb mechanical energy of the vibrating body to reduce the vibration intensity of the vibrating body. Additional descriptions regarding the vibration damping assembly can be found in other embodiments of the present disclosure (eg, in the embodiments shown in FIG. 4).

As described in the previous embodiments, the mass element and the first elastic element together may form a resonant unit. In some embodiments, vibration damping assembly 120 may include one or more resonant assemblies. In some embodiments, the number of resonant nodes may be one. For example, in the embodiments shown in FIGS. 4, the vibration damping assembly 429 may include only one resonant assembly, and the first elastic member 421 may be coupled to the outer wall of the back plate 4133 of the vibrating body 413. In other embodiments, the number of resonant assemblies may be at least two. For example, in the embodiments shown in FIGS. 16, the vibration damping assembly 1620 may include two resonant assemblies located on the inner wall of the backplate 16133.

In some embodiments, when multiple resonant nodes are provided in the speaker 100, factors such as locations where the resonant nodes are installed, methods of connecting the resonant nodes, and the resonant frequencies of the resonant nodes may influence the vibration reduction effect of the vibration damping assembly 120.

In some embodiments, at least two resonant units may be located inside and/or outside the vibrating body. For example, at least two resonant units may be located in a vibrating housing. For example, in the embodiments shown in FIGS. 16, two resonant units may be coupled to the inner wall of the backplate 16133. As another example, at least two resonant units may be located outside the vibrating housing. As another example, at least two resonant units may be located inside and outside the vibrating body, respectively. For example, a portion of the at least two resonant units may be located outside the vibrating body and the first elastic members of the portion may be attached to an outer wall of the back plate; another portion of the at least two resonant units may be located in the vibrating housing and the first elastic elements of the other portion may be attached to the inner wall of the back plate.

In some embodiments, at least two resonant units may be directly attached to the inner wall or to the outer wall of the vibrating housing. For example, at least two resonant units may be directly attached to the inner wall of the vibrating housing by gluing, welding, integral casting, riveting, screws, or the like. For example, in the embodiments shown in FIGS. 16, the first resilient members (eg, the first resilient member 1621-1 and the first resilient member 1621-2) of the two resonant assemblies may be directly coupled to the inner wall of the back plate 16133. As another example, at least one of at least the two resonant assemblies can be connected to other resonant units instead of being directly connected to the inner wall of the vibrating housing. For example, in the embodiments shown in FIGS. 17, there are two resonant units (including the first resonant unit 1720-1 and the second resonant unit 1720-2), and the first resonant unit 1720-1 can be directly connected to the inner wall of the back plate 17133 (the first elastic element 1721-1 is attached to the inner wall of the back plate 17133). The first elastic member 1721-2 of the second resonant unit 1720-2 may be located on the first resonant unit 1720-1 along the thickness direction of the first elastic unit 1721-1 of the first resonant unit 1720-1. The first elastic element 1721-2 may be coupled to the mass element 1723-1 of the first resonant assembly 1720-1.

In some embodiments, when at least two resonant nodes are located on the inner wall or on the outer wall of the vibrating body, two adjacent resonant nodes may be spaced a predetermined distance apart. For example, in the embodiments shown in FIGS. 16, the vibration damping assembly 1620 may include two resonant assemblies (e.g., a first resonant assembly 1620-1 and a second resonant assembly 1620-2) and first elastic elements (e.g., a first elastic element 1621-1 and a first elastic element 1621-2) of two The resonant units can be directly attached to the inner wall of the back plate 16133 and the edges of the first two elastic elements can be spaced apart by a specified distance. In some embodiments, the specified distance may be in the range of 0.1 mm - 70 mm. In some embodiments, the specified distance may be in the range of 0.2 mm - 60 mm. In some embodiments, the specified distance may be in the range of 0.3 mm - 50 mm. In some embodiments, the resonant assembly may include a positioning element that can be secured to the vibrating body for positioning the first elastic element to accurately position the first elastic element on the vibrating body. For example, the positioning element may be a plastic guard edge located on the vibrating body, and the plastic guard edge may properly position the edges of the first resilient member.

In some embodiments, the at least two resonant nodes may be the same or similar. The same or similar resonant nodes may be associated with the same or similar mass elements, the same or similar first elastic elements and the same or similar resonant frequencies of the resonant nodes. In other embodiments, the at least two resonant nodes may be different. For example, in the embodiments shown in FIGS. 16, the dimensions of the first elastic elements and the mass elements of the two resonant units may clearly differ.

In some embodiments, the resonant frequencies of the at least two resonant nodes may be different. In some cases, when the resonant frequencies of the at least two resonant nodes are different, each of the at least two resonant nodes may produce a vibration damping effect in a frequency band near its resonant frequency. For example, based on the embodiments shown in FIGS. 4, the vibration damping assembly 420 may further comprise another resonant assembly (comprising a mass element and a first elastic element) that has a resonant frequency of approximately 300 Hz. The resonant unit can effectively absorb the mechanical energy of the vibrating body 413 within the range of 250 Hz - 350 Hz. The resonant frequency of the original resonant unit (i.e., the resonant unit formed by the mass element 423 and the first elastic element 421) may be a second frequency "f0" at which the mechanical energy of the vibrating body 413 can be effectively absorbed within the low frequency range (for example, 100 Hz - 200 Hz). Therefore, the two resonant vibration damping units 420 can absorb the mechanical energy of the vibrating body 413 in two frequency bands, thereby effectively expanding the frequency band in which the vibration damping unit 420 absorbs vibration.

In some other embodiments, the resonant frequencies of the at least two resonant nodes may be the same or similar. When the resonant frequencies of the resonant nodes are the same or close, the vibration damping effect in the frequency range near the resonant frequencies can be improved. For example, based on the embodiments shown in FIGS. 4, vibration damping assembly 420 may further comprise another resonant assembly (comprising a mass element and a first elastic element). The resonant frequency of the resonant unit may be the same as or close to the resonant frequency of the original resonant unit (ie, the resonant unit formed by the mass element 423 and the first elastic element 421). For example, the resonant frequencies of the two resonant units may be the second frequency "f0", at which the vibration damping effect of the vibration damping unit 420 in a frequency band near the second frequency "f0" can be improved.

In some embodiments, the vibrating assembly 110 may further comprise a second resilient member (eg, second resilient member 215 shown in FIG. 2). The second elastic element may connect the vibrating element to the vibrating body. Mechanical vibrations generated by the vibrating element can be transmitted to the vibrating body through the second elastic element, thereby causing the vibrating plate to vibrate. Additional descriptions regarding the second elastic element can be found in other embodiments of the present disclosure (eg, in the embodiments shown in FIG. 2).

The mounting assembly 130 may fix and hold the vibration assembly 110 and the vibration damping assembly 120, thereby maintaining stable contact of the speaker 100 with the user's facial skin. The fastening assembly 130 may include one or more fastening connectors. One or more mounting connectors may be attached and secured to the vibration assembly 110 and/or the vibration damping assembly 120. In some embodiments, binaural wear may be achieved through mounting assemblies 130. For example, both ends of mounting assembly 130 may be rigidly coupled to two vibration assemblies 110 (or vibration damping assemblies 120), respectively. When the user wears the speaker 100, the mounting assembly 130 may respectively secure two vibration units 110 (or vibration damping units 120) near the user's left and right ears. In some embodiments, single-ear wear is achieved through a mounting assembly 130. For example, mounting assembly 130 may be rigidly attached to only one vibration assembly 110 (or vibration damping assembly 120). When the user wears the speaker 100, the attachment assembly 130 may attach the vibration assembly 110 (or vibration damping assembly 120) near the ear on one side of the user. In some embodiments, the mounting assembly 130 may be eyewear, such as any combination of one or more of the following: sunglasses, augmented reality (AR) glasses, virtual reality (VR) glasses, helmets, and headbands, although not limited to.

The above description of the design of speaker 100 is merely a specific example and should not be construed as the only feasible implementation. It is obvious that those skilled in the art, after understanding the basic operating principle of the speaker, can make various modifications and changes in the form and details of the specific methods and steps of implementing the speaker 100 without deviating from the said principle. However, these modifications and changes are still within the scope of the above description. For example, speaker 100 may include one or more processors that may execute one or more audio signal processing algorithms. Audio signal processing algorithms can modify or enhance audio signals. For example, audio processing algorithms can perform noise reduction, acoustic feedback suppression, wide dynamic range compression, automatic gain control, active environment sensing, active noise reduction, directional processing, tinnitus processing, multi-channel wide dynamic range compression on the audio signal. range, active howl suppression, volume control or other similar processing, or any combination of the above. These modifications and changes are still within the scope of the present disclosure. As another example, speaker 100 may include one or more sensors, such as a temperature sensor, a humidity sensor, a speed sensor, or a displacement sensor. Sensors can collect user information or environmental information.

In fig. 2 is a longitudinal sectional view of a speaker without a vibration damping assembly, consistent with some embodiments of the present disclosure. As shown in FIG. 2, speaker 200 may include a vibration assembly 210 and a mounting assembly 230.

In some embodiments, the vibration assembly 210 may include a vibration element 211, a vibrating body 213, and a second elastic element 215 resiliently coupled to the vibration element 211 and the vibrating body 213. The vibration element 211 may convert audio signals into mechanical vibration signals and generate mechanical vibrations. The mechanical vibration generated by the vibration element 211 can be transmitted to the vibrating body 213 connected to the vibration element 211 through the second elastic element 215 to cause the vibrating body 213 to vibrate. It should be noted that when the vibrating element 211 transmits mechanical vibrations to the vibrating body 213 through the second elastic element 215, the vibration frequency of the vibrating body 213 may be the same as the vibration frequency of the vibrating element 211.

The vibration element 211 in the present disclosure may refer to an element that converts acoustic signals into mechanical vibration signals, such as a transducer. In some embodiments, the vibration element 211 may include a magnetic circuit assembly and a coil. The magnetic circuit assembly may be configured to generate a magnetic field, and the coil may be mechanically vibrated in the magnetic field. Specifically, the coil may be powered by a signal current, and the coil may be in a magnetic field generated by a magnetic circuit assembly and subjected to an Ampere force, thereby being moved to generate mechanical oscillations. At the same time, the magnetic circuit assembly may be subject to a force that counteracts the winding force. Under the action of the Ampere force, the vibration element 211 can generate mechanical vibrations. Mechanical vibrations of the vibration element 211 may be transmitted to the vibrating body 213, so that the vibrating body 213 can vibrate accordingly.

In some embodiments, the vibrating body 213 may include a vibrating plate 2131, a side plate 2132, and a back plate 2133. The vibrating plate 2131 may be referred to as a housing plate. The body plate and the vibration plate 2131 may refer to a vibrating body assembly 213 that contacts the user's facial skin. The back plate 2133 may be located on a side of the vibrating body 213 opposite the vibration plate 2131, that is, on a side of the vibrating body 213 away from the user's facial skin. In some embodiments, the vibration plate 2131 and the back plate 2133 may be respectively located at both ends of the side plate 2132. The vibration plate 2131, the side plate 2132, and the back plate 2133 may form a housing structure with a defined placement space. The vibration element 211 may be located within the housing structure.

In some embodiments, the vibration plate 2131 and the side plate 2132 may be directly connected. For example, the vibration plate 2131 may be attached to the side plate 2132 by adhesive, riveting, welding, screwing, integral casting, or the like. In some embodiments, the vibration plate 2131 and the side plate 2132 may be connected by a connector.

In some embodiments, the vibration plate 2131 and the side plate 2132 may be rigidly connected. For example, the vibration plate 2131 may be attached to the side plate 2132 by welding, riveting, etc., in such cases, the connection between the vibration plate 2131 and the side plate 2132 may be a rigid connection. In some embodiments, the vibration plate 2131 and the side plate 2132 may be elastically coupled. For example, the vibration plate 2131 may be attached to the side plate 2132 through a resilient element (eg, spring, foam, adhesive, etc.), in such cases, the connection between the vibration plate 2131 and the side plate 2132 may be a resilient connection. In some embodiments, the connector may have a certain degree of elasticity to reduce the intensity of mechanical vibration transmitted to the side plate and back plate through the connector, thereby reducing sound leakage caused by vibration of the vibrating body. The resilience of a connector can be determined by the material, thickness, and design of the connector. In some embodiments, the choice of a rigid connection or a flexible connection between the vibration plate 2131 and the side plate 2132 may be determined based on actual conditions, which, for example, may be determined based on the connection between the vibration element 211 and the vibrating body 213. For example, in embodiments , shown in Fig. 4, when the vibration element 411 is attached to the side plate 4132, the vibration plate 4131 and the side plate 4132 can be firmly connected. As another example, in the embodiments shown in FIGS. 12, when the vibration element 1211 is connected to the vibration plate 12131, the vibration plate 12131 and the side plate 2132 can be elastically connected.

The connector material may be, but is not limited to, steel (such as stainless steel, carbon steel, etc.), light alloy (such as aluminum alloy, beryllium copper, magnesium alloy, titanium alloy, etc.), plastics (e.g. high molecular weight polyethylene, blown nylon, engineered plastics, etc.), or other simple or composite materials that may have the same characteristics. Composite materials may contain, but are not limited to, reinforcing materials such as glass fiber, carbon fiber, boron fiber, graphite fiber, graphene fiber, silicon carbide fiber, or aramid fiber. The material may be a compound of other organic and/or inorganic materials, such as glass fiber reinforced unsaturated polyester, epoxy resin, or a phenolic resin matrix composed of various types of FRP.

In some embodiments, the thickness of the connector may be at least 0.005 mm. In some embodiments, the thickness of the connector may be in the range of 0.005 mm - 3 mm. In some embodiments, the thickness of the connector may be in the range of 0.01 mm - 2 mm. In some embodiments, the thickness of the connector may be in the range of 0.01 mm - 1 mm. In some embodiments, the thickness of the connector may be in the range of 0.02 mm - 0.5 mm.

In some embodiments, the connector structure may be mounted as a ring, and the ring connector may be formed into various shapes. For example, the connector may include at least one ring. As another example, the connector may comprise at least two rings, which may be concentric rings or non-concentric rings, and the rings are connected by at least two spacers and the spacers extend radially from the outer ring to the center of the inner ring. In some embodiments, the connector may include at least one elliptical ring. For example, the connector may include at least two elliptical rings, different elliptical rings have different bending radii, and the elliptical rings are connected by spacers. In some embodiments, the connector may include at least one square ring. In some embodiments, the connector may be installed as a sheet. For example, a hollow template may be located on a sheet connector. In some embodiments, the area of the hollow template may be no less than the area of the non-hollow portion of the connector. It should be noted that the materials, thicknesses and designs of the connectors described above can be combined in various ways to form different connectors. In some embodiments, the ring connector may have different thickness distributions. For example, the thickness of the spacers may be equal to the thickness of the ring. As another example, the thickness of the spacers may be greater than the thickness of the ring. As another example, the connector may include at least two rings, and the rings may be connected by at least two spacers. The spacers extend radially from the outer ring to the center of the inner ring and the thickness of the inner ring is greater than the thickness of the outer ring. In embodiments, due to the vibration element 211 and the side plate 2132, the mechanical vibrations of the vibration plate 2131 originate from mechanical energy transmitted from the side plate 2132. To ensure that the vibration plate 2131 has a sufficiently large mechanical vibration intensity and to ensure that the sound volume received by the user's auditory nerve is relatively large, the vibration plate 2131 and the side plate 2132 can be connected by a rigid connection.

In some embodiments, vibrating plate 2131, side plate 2132, and back plate 2133 may be made of the same or different materials. For example, vibrating plate 2131 and side plate 2132 may be made of the same material, while back plate 2133 may be made of different materials. In some embodiments, vibration plate 2131, side plate 2132, and back plate 2133 may be made from different materials.

In some embodiments, the materials of the vibration plate 2131 may be, but are not limited to, acrylonitrile butadiene styrene (ABS), polystyrene (PS), high influence polystyrene (HIPS), polypropylene (PP) ), polyethylene terephthalate (PET), polyester (PES), polycarbonate (PC), polyamides (PA), polyvinyl chloride (PVC), polyurethanes (PU), polyvinylidene chloride ( polyvinylidene chloride, PVDC), polyethylene (PE), polymethyl methacrylate (PMMA), polyether-ether-ketone (PEEK), phenolics (PF), urea-formaldehyde (UF) ), melamine formaldehyde (MF), metals, alloys (such as aluminum alloys, chromium-molybdenum steels, scandium alloys, magnesium alloys, titanium alloys, magnesium-lithium alloys, nickel alloys, etc.), glass fibers, carbon fibers and etc. or any combination thereof. In some embodiments, the materials of the vibration plate 2131 may be fiberglass, carbon fiber, PC, PA, etc., or any combination thereof. In some embodiments, the materials of the vibration plate 2131 may be manufactured by mixing carbon fiber and PC based on a specific ratio. In some embodiments, the materials of the vibration plate 2131 may be manufactured by mixing carbon fiber, glass fiber, and PC based on a specific ratio. In some embodiments, the materials of the vibration plate 2131 may be manufactured by mixing fiberglass and PC based on a specific ratio or by mixing fiberglass and PA based on a specific ratio.

In some embodiments, the vibration plate 2131 may need to have a certain thickness to ensure its rigidity. In some embodiments, the thickness of the vibration plate 2131 may be at least 0.3 mm. In some embodiments, the thickness of the vibration plate 2131 may be at least 0.5 mm. In some embodiments, the thickness of the vibration plate 2131 may be at least 0.8 mm. In some embodiments, the thickness of the vibration plate 2131 may not be less than 1 mm. As the thickness of the vibration plate 2131 increases, the weight of the vibrating body 213 may increase, thereby increasing the weight of the speaker 200 and affecting the sensitivity of the speaker 200. Therefore, the thickness of the vibration plate 2131 should not be too large. In some embodiments, the thickness of the vibration plate 2131 may not exceed 2.0 mm. In some embodiments, the thickness of the vibration plate 2131 may not exceed 1.5 mm.

In some embodiments, the parameters of the vibration plate 2131 may include relative density, tensile strength, elastic modulus, Rockwell hardness, etc. materials of the vibration plate 2131. In some embodiments, the relative density of the vibration plate material may be in the range of 1.02 - 1.50. In some embodiments, the relative density of the vibration plate material may be in the range of 1.14 - 1.45. In some embodiments, the relative density of the vibration plate material may be in the range of 1.15 to 1.20. In some embodiments, the tensile strength of the vibration plate material may be at least 30 MPa. In some embodiments, the tensile strength of the vibration plate material may be in the range of 33 MPa - 52 MPa. In some embodiments, the tensile strength of the vibration plate material may be at least 60 MPa. In some embodiments, the elastic modulus of the vibration plate material may be in the range of 1.0 GPa - 5.0 GPa. In some embodiments, the elastic modulus of the vibration plate material may be in the range of 1.4 GPa - 3.0 GPa. In some embodiments, the elastic modulus of the vibration plate material may be in the range of 1.8 GPa - 2.5 GPa. In some embodiments, the hardness (Rockwell hardness) of the vibrating plate material may be in the range of 60-150. In some embodiments, the hardness of the vibration plate material may be in the range of 80-120. In some embodiments, the hardness of the vibration plate material may be in the range of 90-100. In some embodiments, the relative density and tensile strength of the vibrating plate material are considered simultaneously, and the relative density may be in the range of 1.02 - 1.1, and the tensile strength can be in the range of 33 MPa - 52 MPa. In some embodiments, the relative density may be in the range of 1.20 - 1.45 and the tensile strength can be in the range of 56 MPa - 66 MPa.

In some embodiments, the vibration plate 2131 may have various shapes. For example, the vibrating plate 2131 may have a square shape, a rectangular shape, an approximately rectangular shape (eg, the four corners of the rectangle are replaced by arc-shaped structures), an oval shape, a circular shape, or other arbitrary shapes.

In some embodiments, the vibration plate 2131 may be composed of the same material. In some embodiments, the vibration plate 2131 may be formed by stacking two or more materials on top of each other. In some embodiments, the vibration plate 2131 may be composed of a layer of material with a higher Young's modulus and an additional layer of material with a lower Young's modulus, which may increase the comfort of the contact with the person's face and improve the interaction between the vibration plate 2131 and the contact with the person's face while meeting the requirements to the stiffness of the vibration plate 2131. In some embodiments, the higher Young's modulus material may be acrylonitrile butadiene styrene (ABS), polystyrene PS, high influence polystyrene (HIPS), polypropylene (PP) ), polyethylene terephthalate (PET), polyester (PES), polycarbonate (PC), polyamides (PA), polyvinyl chloride (PVC), polyurethanes (PU), polyvinylidene chloride ( polyvinylidene chloride, PVDC), polyethylene (PE), polymethyl methacrylate (PMMA), polyether-ether-ketone (PEEK), phenolics (PF), urea-formaldehyde (UF) ), melamine formaldehyde (MF), metal, alloy (such as aluminum alloy, chromium-molybdenum steel, scandium alloy, magnesium alloy, titanium alloy, magnesium-lithium alloy, nickel alloys, etc.), fiberglass, carbon fiber, etc. or any combination thereof.

In some embodiments, the vibration plate 2131 may be in direct contact with the user's facial skin. In some embodiments, the contact area of the vibration plate 2131 with the user's facial skin may be all or part of the area of the vibration plate 2131. For example, the vibration plate 2131 may have an arc structure, and a portion of the arc structure may be in contact with the user's facial skin. In some embodiments, the vibration plate 2131 may be in surface contact with the user's facial skin. In some embodiments, the surface of the vibration plate 2131 in contact with the user's facial skin may be a plane. In some embodiments, the outer surface of the vibration plate 2131 may have some projections or indentations. In some embodiments, the outer surface of the vibrating plate 2131 may be a curved surface with any contour.

In some embodiments, the vibration plate 2131 may be in indirect contact with the user's facial skin. For example, the vibration plate 2131 may be provided with a vibration transmission layer in the previous embodiments. The vibration transmission layer may be inserted between the vibration plate 2131 and the user's facial skin and be in contact with the user's facial skin instead of the vibration plate 2131.

[0112] It should be noted that because the vibrating element 211 includes a magnetic circuit assembly and the vibrating element 211 is housed in the vibrating body 213, the volume of the vibrating body 213 (i.e., the volume of the housing space) is increased and the vibrating body 213 can accommodate the assembly a larger magnetic circuit so that speaker 200 can have higher sensitivity. The sensitivity of the speaker 200 may be reflected in the volume generated by the speaker 200 when a particular audio signal is input. When the same audio signal is input, the higher the volume produced by the speaker 200, the higher the sensitivity of the speaker 200. In some embodiments, the volume of the speaker 200 may become greater as the volume of the housing space of the vibrating body 213 is larger. Therefore, the present disclosure may further have a certain requirement for the volume of the vibrating body 213. In some embodiments, in order for the speaker 200 to have relatively high sensitivity (loudness), the volume of the vibrating body 213 may be in the range of 2000 mm ³ - 6000 mm ³ . In some embodiments, the volume of the vibrating body 213 may be in the range of 2000 mm ³ - 5000 mm ³ . In some embodiments, the volume of the vibrating housing 213 may be in the range of 2800 mm ³ - 5000 mm ³ . In some embodiments, the volume of the vibrating body 213 may be in the range of 3500 mm ³ - 5000 mm ³ . In some embodiments, the volume of the vibrating body 213 may be in the range of 1500 mm ³ - 3500 mm ³ . In some embodiments, the volume of the vibrating housing 213 may be in the range of 1500 mm ³ - 2500 mm ³ .

In some embodiments, the mounting assembly 230 may be rigidly coupled to the vibrating body 213 of the vibration assembly 210. The mounting assembly may be configured to maintain stable contact between the speaker 200 and the user's facial skin, thereby avoiding vibration of the speaker 200 and providing the vibration plate 2131 with stable sound transmission. In some embodiments, the attachment assembly 230 may be an arc-shaped resilient assembly that can generate a response force toward the middle of the arc to make stable contact with the human skull. Taking as an example the earhook mounting assembly 230 shown in FIG. 2, the point "p" on the apex of the ear hook corresponds to the head of the human body, and the point "p" on the apex can be regarded as the attachment point. The ear hook may be securely attached to the side plate 2132. The ear hook may be securely attached to the side plate 2132 or the back plate 2133 by adhesive, clamp, welding or threading. The portion of the ear hook attached to the vibrating body 213 may be made of the same, different, or partially the same material as the side plate 2132 or back plate 2133. In some embodiments, to cause the ear hook to have a relatively low stiffness (i.e. ie relatively low stiffness coefficient), the ear hook may contain plastic, silicone and/or metal materials. For example, an arcuate titanium wire may be included in the earhook. In some embodiments, the earhook may be formed entirely with a side plate 2132 or a back plate 2133. Additional examples of the vibrating assembly 210 and vibrating body 213 can be found in PCT International Patent Application No. PCT/CN2019/070545, filed January 5, 2019, and International Patent Application No. PCT/CN2019/070548, filed January 5, 2019, the entire contents of each of which are incorporated herein by reference.

As mentioned above, the vibrating assembly 210 may include a second elastic element 215. The second elastic element 215 may be configured to elastically couple the vibrating element 211 to the vibrating body 213 (for example, to the side plate 2132 of the vibrating body 213) so that mechanical vibrations of the vibrating element 211 could be transmitted to the side plate 2132 of the vibrating body 213 through the second elastic member 215, respectively, so that the vibration plate 2131 could vibrate. After generating mechanical vibrations, the vibration plate 2131, through contact with the skin of the wearer's (or user's) face, can transmit mechanical vibrations to the auditory nerve through bones through a bone conduction method so that the user can hear sound.

In some embodiments, the vibrating element 211 and the second elastic element 215 may be located in the vibrating body 213, and the second elastic element 215 may attach the vibrating element 211 to the inner wall of the vibrating body 213. In some embodiments, the second elastic element 215 may include a first part and a second part . A first portion of the second resilient member 215 may be coupled to the vibrating member 211 (e.g., a magnetic circuit assembly of the vibrating member 211) and a second portion of the second resilient member 215 may be coupled to an interior wall of the vibrating housing 213.

In some embodiments, the second elastic element 215 may be a vibration transmission sheet. A first portion of the vibration transmission sheet may be attached to the vibration element 211, and a second portion of the vibration transmission sheet may be attached to the vibrating body 213. Specifically, the first portion of the vibration transmission sheet may be attached to the magnetic circuit assembly of the vibration element 211, and the second portion of the transmission sheet The vibration transmission sheet may be attached to the inner wall of the vibrating body 213. Alternatively, the vibration transmission sheet may have a ring structure, and the first portion of the vibration transmission sheet may be closer to the central region of the vibration transmission sheet than the second portion. For example, the first part of the vibration transmission sheet may be located in the central region of the vibration transmission sheet, while the second part may be located on the peripheral side of the vibration transmission sheet.

In some embodiments, the vibration transmission sheet may be a resilient member. The elasticity of the vibration transmission sheet can be determined by the material, thickness and structure of the vibration transmission sheet.

In some embodiments, the vibration transmission sheet material may comprise, but is not limited to, plastic (e.g., but not limited to, high molecular weight polyethylene, blown nylon, engineered plastic, etc.), steel (e.g., but not limited to these, stainless steel, carbon steel, etc.), light alloy (such as, but not limited to, aluminum alloy, beryllium copper, magnesium alloy, titanium alloy, etc.) or other simple or composite materials that may have the same characteristics. Composite materials may contain, but are not limited to, reinforcing materials such as glass fiber, carbon fiber, boron fiber, graphite fiber, graphene fiber, silicon carbide fiber or aramid fiber or a compound of other organic and/or inorganic materials, such as unsaturated polyester , glass fiber reinforced, epoxy resin or phenolic resin matrix consisting of various types of FRP.

In some embodiments, the vibration transmission sheet may have a certain thickness. In some embodiments, the thickness of the vibration transmission sheet may be at least 0.005 mm. In some embodiments, the thickness of the vibration transmission sheet may be in the range of 0.005 mm - 3 mm. In some embodiments, the thickness of the vibration transmission sheet may be in the range of 0.01 mm - 2 mm. In some embodiments, the thickness of the vibration transmission sheet may be in the range of 0.01 mm - 1 mm. In some embodiments, the thickness of the vibration transmission sheet may be in the range of 0.02 mm - 0.5 mm.

In some embodiments, the elasticity of the vibration transmission sheet may be provided by the structure of the vibration transmission sheet. For example, the vibration transmission sheet may be an elastic structure, and even if the material of the vibration transmission sheet has a relatively high rigidity, the structure of the vibration transmission sheet may provide elasticity. In some embodiments, the vibration transmission sheet structure may include, but is not limited to, a spring structure, an annular or ring-shaped structure, or the like. In some embodiments, a vibration transmission structure plate may be further installed as a sheet. In some embodiments, a rod may be installed as a plate of the vibration transmission structure. The materials, thicknesses and structures of the vibration transmission sheets described above can be combined in any manner to form various vibration transmission sheets. For example, the sheet-shaped vibration transmission sheet may have different thickness distributions, and the thickness of the first portion of the vibration transmission sheet may be greater than the thickness of the second portion of the vibration transmission sheet. In some embodiments, there may be one or more vibration transmission sheets. For example, there may be two vibration transmission sheets, the second portions of the two vibration transmission sheets may be respectively attached to the inner walls of two side plates 2132 opposite each other, and the first portions of the two vibration transmission sheets may be attached to the vibration member 211.

In some embodiments, the vibration transmission sheet may be directly attached to the vibrating body 213 and the vibration element 211. For example, the vibration transmission sheet may be attached to the vibration element 211 and the vibrating body 213 with adhesive. As another example, the vibration transmission sheet may be attached to the vibration element 211 and the vibrating body 213 by welding, clamping, riveting, threaded connection (for example, a head screw connection, a screw, a screw rod, a bolt, etc.), a clamp connection, a key connection connection, wedge connection or integral casting. Additional examples of vibration transmission sheet can be found in PCT International Patent Application No. PCT/CN2019/070545, filed January 5, 2019, and International Patent Application No. PCT/CN2019/070548, filed January 5, 2019, the entire contents of each of which is incorporated herein by reference.

In some embodiments, vibration assembly 210 may further include a first vibration transmission connector. The vibration transmission sheet may be connected to the vibration element 211 through the first vibration transmission connector. In some embodiments, as shown in FIG. 2, the first vibration transmission connector may be rigidly coupled to the vibration element 211. For example, the first vibration transmission connector may be attached to a surface of the vibration element 211. In some embodiments, the first portion of the vibration element 211 may be rigidly coupled to the first vibration transmission connector. The vibration transmission sheet may be attached to the first vibration transmission connector by welding, clamping, riveting, screw connection (such as a head screw connection, a screw connection, a rod screw connection, a bolt connection, etc.), a clamp connection, a key connection, a wedge connection, or an integral connection. casting

In some embodiments, the vibration assembly 210 may include a second vibration transmission connector, and the second vibration transmission connector may be attached to an inner wall of the vibrating body 213. For example, the second vibration transmission connector may be attached to the inner wall of the side plate 2132. The vibration transmission sheet may be attached to the vibrating body 213 through the second vibration transmission connector. In some embodiments, the second portion of the vibration element 211 may be rigidly coupled to the second vibration transmission connector. The connection method between the second vibration transmission connector and the vibration transmission sheet may be the same or similar to the connection method of the first vibration transmission connector and the vibration transmission sheet in the previous embodiments, which are not repeated here.

In fig. 3 shows a partial frequency response of speaker 200 without a vibration damping assembly, corresponding to some embodiments of the present disclosure. In fig. 3, the horizontal axis indicates the frequency, and the vertical axis indicates the vibration intensity (or vibration amplitude) of the speaker 200. The vibration intensity is understood as the acceleration of vibration of the speaker 200. The larger the value on the vertical axis, the greater the vibration amplitude of the speaker 200, indicating a stronger vibration sensation of the speaker 200. For convenience of description, in some embodiments, the audio frequency range below 500 Hz may be the low frequency range, the audio frequency range 500 Hz - 4000 Hz may be the mid frequency range, and the audio frequency range above 4000 Hz may be the high frequency range. In some embodiments, sounds in the low frequency range may give the user a more pronounced vibration sensation and if a very sharp peak occurs in the low frequency range (i.e., vibration accelerations at frequencies corresponding to the sharp peak are much higher than vibration accelerations at other nearby frequencies ), on the one hand, the sound that the user hears can be rough and harsh, on the other hand, strong vibration can additionally introduce a feeling of discomfort. Therefore, there should be no sharp peaks and valleys in the low frequency range, and the flatter the frequency response, the better the sound effect of the 200 speaker.

As shown in FIG. 3, the speaker 200 can generate a resonant low frequency peak in the low frequency range (about 100 Hz). For ease of description, speaker 200 may be considered to produce a first resonant peak at a first frequency. The resonant low-frequency peak can be understood as generated by the combined action of the vibration unit 210 and the fastening unit 230. The vibration acceleration at the resonant low-frequency peak can be relatively large, resulting in a strong vibration feeling on the vibration plate 2131, thereby causing the user to feel pain on the face when wearing dynamics 200, respectively influencing the comfort and sensations of the user.

In fig. 4 is a sectional view of a speaker with a vibration damping assembly in accordance with certain embodiments of the present disclosure. As shown in FIG. 4, speaker 400 may include a vibration assembly 410 and a vibration damping assembly 420.

In some embodiments, vibrating assembly 410 may include a vibrating element 411, a vibrating body 413, and a second resilient member 415. Vibrating body 413 may include a vibrating plate 4131, a side plate 4132, and a back plate 4133. A side plate 4132 of vibrating body 413 may be resiliently coupled to to the vibration element 411 through the second elastic element 415. When the vibration element 411 is mechanically vibrated, mechanical vibrations may be transmitted to the side plate 4132 through the second elastic element 415 and then transmitted to the vibration plate 4131 and the back plate 4133 through the side plate 4132 to cause the vibration plate 4131 and back plate 4133. In some embodiments, the vibrating element 411, vibrating body 413 and second elastic element 415 may be the same or similar to the vibrating element 211, vibrating body 213 and second elastic element 215 in the speaker 200, respectively, and details of the respective structures are not are repeated.

In some embodiments, vibration damping assembly 420 may include a mass element 423 and a first elastic element 421. The first elastic element 421 may be rigidly coupled to the mass element 423 to form a resonant assembly. The mass element 423 may be coupled to the vibrating body 413 through the first elastic element 421. The vibrating body 413 may transmit mechanical vibrations to the mass element 423 through the first elastic element 421 to drive the mass element 423 to vibrate. When the mass member 423 vibrates, the vibration acceleration, that is, the vibration intensity of the vibrating body 413, can be weakened, thereby reducing the vibration sensation of the vibrating body 413 and improving the user experience.

In some embodiments, the first resilient member 421 may be coupled to any location on the vibrating body 413 other than the vibrating plate 4131. For example, the first resilient member 421 may be coupled to the side plate 4132 or the back plate 4133. For example, in the example shown in FIG. 4, the first elastic member 421 may be attached to the outer wall of the back plate 4133.

In fig. 5 shows frequency characteristics corresponding to some embodiments of the present disclosure. In addition, in FIG. Figure 5 shows the frequency response of the resonant unit (formed by the first elastic element and the mass element). According to FIG. 5, under the action of the resonant unit, the frequency response of the speaker 400 in the low frequency range becomes flatter, which reduces the vibration sensation caused by a sharp low-frequency resonant peak, thereby improving the user experience.

In fig. 6 is a simplified mechanical model of a speaker without vibration damping assembly, corresponding to some embodiments of the present disclosure. For ease of understanding, when the speaker does not contain a resonant unit (ie, formed by the mass element and the first elastic element), the mechanical model of the speaker may be equivalent to the model shown in FIG. 6. For convenience of analysis and description, the vibrating body and the vibrating element can be simplified as mass m ₁ and mass m ₂ , the fastening unit (for example, ear hook) can be simplified as elastic connector k ₁ and the second elastic element can be simplified as elastic connector k ₂ , the attenuation of elastic connector k ₁ and elastic connector k ₂ may be equal to R ₁ and R ₂ , respectively. The vibrating body and the vibrating element may respectively be subjected to an Ampere force F and an Ampere force reaction force -F to vibrate. A composite vibration system consisting of a vibrating body, a vibration element, a second elastic element and a mounting assembly may be mounted at a point "p" on the apex of the earhook.

In fig. 7 is a simplified mechanical model of a speaker with a vibration damping assembly corresponding to some embodiments of the present disclosure. Similar to Fig. 6, for ease of understanding, when the speaker contains a resonant unit (formed by a mass element and a first elastic element), the mechanical model of the speaker may be equivalent to the model shown in FIG. 7. As shown in FIG. 7, mass m ₁ and mass m ₂ may respectively represent the vibrating body and the vibrating element, mass m ₃ may represent the mass element in the resonant unit, k ₁ and R ₁ may respectively represent the elasticity and damping of the fastening unit (for example, the ear hook), k ₂ and R ₂ may respectively represent the elasticity and damping of the second elastic element and k ₃ and R ₃ may respectively represent the elasticity and damping of the first elastic element. The entire composite vibration system can be fixed at point "p" on the top of the earhook. The vibrating body and the vibrating element may, respectively, be subjected to a force F and a force -F to vibrate. Adding a resonant unit is equivalent to increasing the stiffness and damping of the vibrating body, while the F Ampere force and the -F Ampere force do not change, so adding a resonant unit can weaken the vibration amplitude of the vibrating body.

In some embodiments, the vibration assembly 410 and the resonant assembly may respectively produce a low frequency resonant peak at a certain frequency in the low frequency range. The mechanical vibration of the vibrating body 413 can be absorbed by the resonant unit, which achieves the purpose of reducing the amplitude of the mechanical vibration of the vibrating body 413 at a low frequency resonant peak. As shown in FIG. 5, the "no resonant node" curve represents the frequency response of the speaker 400 without the resonant node. It can be seen that the vibration assembly 410 (combined with the mounting assembly 430) can generate a first resonant peak 450 at the first frequency "f". The "resonant node" curve may represent the frequency response of the resonant node. It can be seen that the resonant assembly may produce a second resonant peak 460 at a second frequency "f0". The "with resonant node" curve may represent the frequency response of the speaker 400 resulting from the interaction of the vibration assembly 410 and the resonant node. It can be seen that the frequency response of a speaker 400 with a resonant unit in the low frequency range (eg, 100 Hz - 200 Hz) is flatter than the frequency response of a speaker (for example, speaker 200 shown in FIG. 2) without a resonant unit in the low frequency range. and the amplitude near the first frequency “f” (ie, the frequency corresponding to the first resonant peak 450) corresponding to the “with resonant node” curve is significantly less than the amplitude corresponding to the “without resonant node” curve.

In some exemplary application scenarios, the mechanical vibrations generated by the vibrating element 411 may be transmitted to the vibrating body 413 through the second elastic element 415 such that the vibrating body 413 is forced to vibrate. Therefore, the vibration frequency of the vibrating body 413 may be the same as the vibration frequency of the vibrating element 411. Likewise, the vibrating body 413 may transmit mechanical vibrations to the mass element 423 from the resonance unit through the first elastic element 421 to cause the mass element 423 to vibrate forcibly. Therefore, the vibration frequency of the mass element 423 can be the same as the vibration frequency of the vibrating body 413. From the law of variation of the frequency response of the resonant unit shown in FIG. 5, it can be seen that in the range from 100 Hz to the second frequency "f0" (ie, the frequency corresponding to the second resonant peak 460), the vibration acceleration of the resonant unit increases as the frequency increases. When the frequency is the second frequency "f0", the second resonant peak 460 appears. When the frequency continues to increase further after the second frequency "f0", the vibration acceleration of the resonant unit decreases with increasing frequency. The frequency response of the resonant unit may reflect the response of the resonant unit to external vibrations (ie, vibrations of the vibrating body 413) at various frequencies. For example, at the second frequency "f0" and in the frequency range around it, the resonant unit can absorb more vibration energy from the vibrating body 413, which has the advantage that the resonant unit reduces mainly the vibration of the vibrating body 413 near the low frequency band (for example, frequency corresponding to the first resonant peak 450) and has minimal effect on the vibration of the vibrating body 413 away from the low frequency resonant peak, thereby ultimately flattening the frequency response of the speaker 400 and improving sound quality.

In some embodiments, the first frequency "f" may be the natural frequency of the vibration assembly 410 (integrated with the mounting assembly 430), and the second frequency "f0" may be the natural frequency of the resonant assembly. In some embodiments, the natural frequency may be related to the material, mass, spring constant, shape, and other parameters of the structure.

In some embodiments, to allow the resonant assembly to effectively attenuate the vibration intensity of the first resonant peak 450 of the vibrating body 413, a second frequency "f0" corresponding to the second resonant peak 460 of the resonant assembly may be set near the first frequency "f" corresponding to the first resonant peak 450 vibrating body 413. As shown in FIG. 5, in some embodiments, the ratio of the second frequency "f0" to the first frequency "f" is in the range of 0.5-2. In some embodiments, the ratio of the second frequency "f0" to the first frequency "f" may be in the range of 0.65-1.5. In some embodiments, the ratio of the second frequency "f0" to the first frequency "f" may be in the range of 0.75-1.25. In some embodiments, the ratio of the second frequency "f0" to the first frequency "f" may be in the range of 0.85 to 1.15. In some embodiments, the ratio of the second frequency "f0" to the first frequency "f" may be in the range of 0.9 to 1.1.

To expand the frequency response range of the speaker 400, the structures and materials of the vibration assembly 410 and the resonant assembly may be modified to drive their low frequency resonant peaks (eg, the first resonant peak 450 and the second resonant peak 460) at lower frequencies. In some embodiments, the first resonant peak 450 and the second resonant peak 460 may be set in the low frequency range. In some embodiments, the first frequency "f" and the second frequency "f0" may be less than 800 Hz. In some embodiments, the first frequency "f" and the second frequency "f0" may be less than 700 Hz. In some embodiments, the first frequency "f" and the second frequency "f0" may be less than 600 Hz. In some embodiments, the first frequency "f" and the second frequency "f0" may be less than 500 Hz.

In some embodiments, by controlling the structures and materials of the resonant assembly (e.g., by controlling the mass of the mass element 423, the spring rate of the first elastic element 421, etc.), it is possible to ensure that after the vibrating body 413 transmits vibrations to the resonant assembly, the resonant assembly may oscillate larger than the vibrating body 413. For example, in at least a portion of the frequency range below (or above) the first frequency "f", the amplitude of the resonant assembly may be greater than the amplitude of the vibrating body 413. In some In embodiments, the mounting assembly 430 may be attached to the vibrating body 413, due to which the resonant assembly does not directly contact the user, and large amplitude vibrations of the resonant assembly may not cause the user to feel uncomfortable vibration. In some embodiments, due to the relatively large amplitude of the resonant node, the mass element 423 in the resonant node can be designed as a relatively large area structure. When the resonant unit vibrates, the oscillations of the relatively large area mass unit 423 can move the air, causing it to vibrate, creating a low-frequency air conduction sound and thus improving the low-frequency response of the speaker 400. For example, the mass element 423 can be installed as an element in plate-shaped (such as a round plate, square plate, etc.) and the plate-shaped element can move air to vibrate, and when vibrated, thus produce an air conduction sound.

As shown in FIG. 5, in some embodiments, in the interaction between the vibrating body 413 and the resonant assembly, the speaker 400 may have a low frequency dip 472 (approximately 150 Hz - 200 Hz). The vibration acceleration in the notch 472 is less than the vibration acceleration of the first resonant peak 450. By forming the notch 472, the vibration acceleration peak value of the speaker 400 can be reduced. As shown in FIG. 5, there are two vibration acceleration peaks in the speaker 400, which are both smaller than the vibration acceleration of the first resonant peak 450. The above description shows that the resonant node speaker 400 not only produces a deeper vibration acceleration dip, but additionally has a smaller acceleration peak value. vibration than a speaker without a resonant unit (for example, speaker 200 shown in FIG. 2). That is, the vibrating body 413 has weaker vibration sensitivity in the low frequency region, which gives the user a better feeling when wearing the speaker 400.

In some embodiments, speaker 400 may have a dip in the frequency range below 450 Hz. In some embodiments, speaker 400 may have a dip in the frequency range below 400 Hz. In some embodiments, speaker 400 may have a dip in the frequency range below 350 Hz. In some embodiments, speaker 400 may have a dip in the frequency range below 300 Hz. In some embodiments, speaker 400 may have a dip in the frequency range below 200 Hz.

In some exemplary application scenarios, since the mass of the resonant assembly is provided primarily by the mass element 423, when the mass m ₃ of the mass element 423 is so small that the ratio of the mass m ₃ of the mass element 423 to the mass m ₁ of the vibrating body 413 is too small, the resonant assembly exerts little influence on the mechanical vibration amplitude of the speaker 400, resulting in the mechanical vibrations near the first resonant peak 450 of the vibrating body 413 not being effectively attenuated. For example, if the ratio of the mass m ₃ of the mass element 423 to the mass m ₁ of the vibrating body 413 is too small, the influence of the resonant unit on the amount of mechanical vibration of the vibrating body 413 can be ignored, which causes the vibration acceleration at the first resonant peak 450 of the vibrating body 413 is still relatively large, so the vibration feeling of the speaker 400 cannot be effectively reduced.

In other exemplary application scenarios, when the mass m ₃ of the mass element 423 is so large that the ratio of the mass m ₃ of the mass element 423 to the mass m ₁ of the vibrating body 413 is too large, the influence of the resonant unit on the amount of mechanical vibration of the speaker 400 is too large that may significantly change the frequency response of the speaker 400. Therefore, the mass m ₃ of the resonant mass element 423 may need to be maintained within a certain range.

In some embodiments, the ratio of the mass m ₃ of the mass element 423 of the resonant assembly to the mass m ₁ of the vibrating body 413 can be in the range of 0.04-1.25. In some embodiments, the ratio of the mass m ₃ of the mass element 423 of the resonant assembly to the mass m ₁ of the vibrating body 413 can be in the range of 0.05-1.2. In some embodiments, the ratio of the mass m ₁ of the mass element 423 of the resonant assembly to the mass m ₁ of the vibrating body 413 can be in the range of 0.06-1.1. In some embodiments, the ratio of the mass m ₃ of the mass element 423 of the resonant assembly to the mass m ₁ of the vibrating body 413 can be in the range of 0.07-1.05. In some embodiments, the ratio of the mass m ₃ of the mass element 423 of the resonant assembly to the mass m ₁ of the vibrating body 413 can be in the range of 0.08-0.9. In some embodiments, the ratio of the mass m ₃ of the mass element 423 of the resonant assembly to the mass m ₁ of the vibrating body 413 can be in the range of 0.09-0.75. In some embodiments, the ratio of the mass m ₃ of the mass element 423 of the resonant unit to the mass m ₁ of the vibrating body 413 can be in the range of 0.1-0.6.

In some embodiments, the material of the mass element 423 may include, but is not limited to, plastic, metal, composite material, or the like. In some embodiments, the mass element 423 may be an independent structure. In some embodiments, the mass element 423 may be combined with other speaker assemblies 400 to form a composite structure. For example, in the embodiments shown in FIGS. 8, the first elastic member 821 may be a diaphragm, and the mass member 823 may be disposed on the surface of the diaphragm as an integral part of the structure to form a composite diaphragm structure together with the diaphragm. In a composite diaphragm structure, the mass element 823 may comprise at least one of the following: a paper cone, an aluminum sheet, a copper sheet, or the like. In some embodiments, the speaker 400 may further comprise functional elements, and the mass element 423 may be combined with the functional elements as a composite structure. In other embodiments, the mass element 423 may be a functional element. A functional element may refer to an assembly for implementing one or more specific functions of the speaker 400. An example of a functional element may be at least one of the following: a battery, a circuit board, a communication assembly, or the like.

In some embodiments, the mass element 423 may be a single or a combination of a plate-like structure, a node-like structure, a spherical structure, a pillar-like structure, a cone-like structure, a pin-like structure, or any other possible structure. For example, mass element 923 may be a circular plate-like structure. As another example shown in FIG. 9, the mass element 923 may be a groove element, and the groove element may have a square groove cross-section (the groove cross-section is a square) or a circular groove cross-section (the groove cross-section is a circle). Based on the above, the specific shape and structure of the mass element in the present disclosure can be designed according to specific needs.

In fig. 8 is a longitudinal sectional view of a speaker in which the first elastic element is a diaphragm, consistent with some embodiments of the present disclosure. As shown in FIG. 8, the speaker 800 may include a vibration assembly 810 and a vibration damping assembly 820 820. The vibration assembly 810 may generate mechanical vibrations, contact the skin of a user's face, and transmit mechanical vibrations to the user's auditory nerve through the skin of the user's face through a bone conduction method. The vibration damping assembly 820 may reduce the user's perception of vibration when the vibrating assembly vibrates.

In some embodiments, the vibration assembly 810 may include a vibration element 811, a vibrating body 813, and a second elastic element 815. The vibration element may generate mechanical vibrations based on electrical signals. The vibrating element 811 may be elastically coupled to the vibrating body 813 through the second elastic element 815. When the vibrating element 811 generates mechanical vibrations, the mechanical vibrations may be transmitted to the vibrating body 813 through the second elastic element 815 to drive the vibrating body 813 to vibrate, and then the vibrations may transmitted to the skin of the user's face so that the user can hear sound through a bone conduction method through the skin of the user's face.

In some embodiments, the vibrating body 813 may include a vibrating plate 8131, a side plate 8132, and a back plate 8133. In some embodiments, the vibrating element 811, the vibrating plate 8131, and the second elastic element 815 may be the same or similar to the vibrating element 211, the vibrating plate 2131 and the second elastic element 215 in the dynamics 200, respectively, and the details thereof will not be repeated.

In some embodiments, the vibration damping assembly 820 may include a resonant assembly formed by the first elastic element 821 and the mass element 823. The mass element 823 may be elastically coupled to the vibrating body 813 (side plate 8132 of the vibrating body 813) through the first elastic element 821. The vibrating body 813 may transmit vibrations to the mass element 823 through the first elastic element 821, so that the mechanical vibrations of the vibrating body 813 can be partially are absorbed by the mass element 823, thereby reducing the amplitude of vibration of the vibrating body 813.

As shown in FIG. 8, vibration damping assembly 820 is housed in vibrating housing 813 and is coupled to the inner wall of side plate 8132 via first resilient member 821. In some embodiments, first resilient member 821 may include a diaphragm. The peripheral sides of the diaphragm, through a support structure or directly, may be coupled to the interior of a side plate 8132 of the vibrating body 813. The side plate 8132 may be a side wall disposed around the vibration plate 8131. When the vibrating body 813 vibrates, the side plate 8132 may cause the diaphragm to vibrate. Since the diaphragm is attached to the vibrating body 813 and vibrates under the influence of the vibrating body 813, it can be called a passive diaphragm. In some embodiments, the type of diaphragm may include, but is not limited to, a plastic diaphragm, a metal diaphragm, a paper diaphragm, a biological diaphragm, and the like.

In some embodiments, the mass element 823 may be attached to the surface of the diaphragm to form a composite structure with the diaphragm. The composite structure formed by attaching the mass element 823 to the surface of the diaphragm mainly plays the following roles: (1) the composite structure can be used as a weight element to adjust the mass of the diaphragm system to ensure that the total mass of the diaphragm system is within certain limits so that the diaphragm has a relatively large vibration amplitude, thereby effectively attenuating the vibration amplitude of the speaker 800 in the low frequency band; (2) the composite structure can have higher stiffness so that it is difficult for the surface of the composite diaphragm to produce high order modes, thus avoiding more peaks and valleys in the frequency response of the passive diaphragm.

In some embodiments, the type of mass element 823 may comprise, but is not limited to, a paper cone, an aluminum sheet, or a copper sheet, or a combination thereof. In some embodiments, the mass element 823 may be made from the same material. For example, the composite structure could be a paper cone or an aluminum sheet. In some embodiments, the mass element 823 may be made from a variety of materials. For example, the mass element 823 may be a structure consisting of a paper cone and a copper sheet. As another example, mass element 823 may be a structure formed from a mixture of aluminum or copper in a certain proportion.

In some embodiments, the method of connecting the mass element 823 to the diaphragm may include, but is not limited to, bonding and adhesive bonding, welding, clamp connection, screw connection (cap screw, screw, rod screw, bolt, etc.) , interference connection, clamp connection, keyway connection, wedge connection, integral casting connection.

In some exemplary application scenarios, vibrations of the diaphragm may cause the air in the vibrating housing 813 to vibrate. In some embodiments, a sound outlet 840 may be provided on the vibrating housing 813 to direct vibrations of the air in the vibration housing 813 into and out of the vibrating housing 813. The directed air vibrations can be transmitted to the user's auditory nerve through air conduction so that the user can hear sound. In some cases, due to the existence of the vibration damping assembly 820, the mechanical vibration intensity of the vibration plate 8131 can be attenuated, thereby causing the volume of the speaker 800 to decrease in the bass region. The sound directed by the sound output hole 840 can improve the response of the speaker 800 in the bass region, so that the speaker 800 can still maintain a certain volume at which the feeling of low-frequency vibration becomes weak.

In some embodiments, the sound output port 840 may be provided at any location on the vibrating body 813. In some embodiments, the sound output hole 840 may be provided on the side of the vibrating body 813 facing away from the user's face, that is, on the back plate 8133 In some embodiments, the sound outlet 840 may be provided on the side plate 8132, for example, at a location on the side plate 8132 facing the directions of the user's external auditory canal. In some other embodiments, the sound output hole 840 may be provided at a corner of the vibrating body 813, such as at the junction between the side plate 8132 and the back plate 8133. In some embodiments, the sound output hole 840 may include multiple sound output holes 840. outlet openings 840 may be provided at various locations. For example, a portion of the plurality of sound output holes 840 may be provided on the back plate 8133, and another portion of the plurality of sound output holes 840 may be provided on the side plate 8132. In some embodiments, at least a portion of the sound routed through the sound output holes 840 can be directed toward the user's ear to improve the 800's low-frequency response. In some embodiments, the above goal may be achieved by positioning the sound output ports 840 in a location facing the user's ear. For example, when the speaker 800 is worn by a user, the side plate 8132 faces the user's ear so that the sound output holes 840 can be located on the side plate 8132 and the sound can be directed through the sound output holes 840 and at least a portion of the sound can be directed to the ear. user. In some embodiments, an additional sound guiding structure may be provided to achieve the above purpose. For example, an audio path may be provided at the output of the audio output port 840 to direct sound to the user's ear through the audio path. In some embodiments, the cross-sectional shape of the sound outlet 840 may be, but is not limited to, circular, square, triangular, polygonal, or the like.

In some embodiments, the speaker 800 may further comprise a mounting assembly 830. The mounting assembly 830 may be rigidly coupled to the vibrating body 813 (eg, to a side plate 8132 of the vibrating body 813). The mounting assembly 830 may be configured to hold the speaker 800 in stable contact with the face of the user (eg, the wearer), thereby avoiding shaking of the speaker 800 and thereby ensuring that the speaker 800 stably transmits audio.

In some embodiments, the lower the stiffness of the mounting assembly 830 (i.e., the lower the stiffness factor), the more pronounced the low frequency response of the speaker 800 at the first resonant peak 450 is (i.e., the greater the vibration acceleration and the higher the sensitivity of the speaker 800), and better sound quality of the speaker 800. In addition, the relatively low stiffness (i.e., relatively low stiffness coefficient) of the mounting assembly 830 helps reduce vibration of the vibrating housing 813.

In some embodiments, the mounting assembly 830 may be a temple. Both ends of the fastening assembly 830 may respectively be attached to one vibrating body 813 to respectively secure two vibrating bodies 813 on both sides of the user's skull via the earhook. In such cases, the speaker may be a binaural speaker. In some embodiments, the mounting assembly 830 may be a single ear clip. The attachment assembly 830 may be attached to one vibrating body 813 and secure the vibrating body 813 to one side of the user's skull. The design of the fastening assembly 830 may be the same or similar to the designs of fastening assemblies (eg, fastening assembly 230) in other embodiments of the present disclosure, the description of which will not be repeated.

In fig. 9 is a longitudinal section through a speaker in which the mass element is a groove element, corresponding to some embodiments demonstrating the present disclosure. As shown in FIG. 9, the speaker 900 may include a vibrating assembly 910, a vibration damping assembly 920, and a mounting assembly 930. The vibrating assembly 910 may include a vibrating element 911, a vibrating body 913, and a second resilient element 915. The second resilient element 915 may be resiliently coupled to the vibrating element. element 911 and a vibrating body 913 for transmitting mechanical vibrations of the vibrating element 911 to the vibrating body 913. The vibrating body 913 can contact the user's facial skin and transmit mechanical vibrations to the user's auditory nerve. The vibration damping assembly 920 may reduce the vibration sensation transmitted to the user when the vibrating body 913 vibrates. The mounting assembly is rigidly coupled to the resonant assembly 920.

In some embodiments, the vibrating element 911, the vibrating body 913 and the second elastic element 915 may be the same or similar to the vibrating element 411, the vibrating body 413 and the second elastic element 415 of the speaker 400, respectively, and the description of the details of their structures will not be repeated.

The vibration damping assembly 920 may include a mass element 920 and a first elastic element 921. The mass element 923 may be elastically coupled to the vibrating body 913 through the first elastic element 921. As shown in FIG. 9, the vibration damping assembly 920 may be coupled to the outer wall of the back plate 9133 through the first elastic member 921. When the vibrating body 913 is mechanically vibrated, the resonance unit formed by the mass member 923 and the first elastic member 921 may absorb a portion of the mechanical energy of the vibrating body 913. thus reducing the vibration amplitude of the vibrating body 913.

Unlike the speaker 400, the mass element 923 of the vibration damping assembly 920 may be a groove element. The vibrating body 913 may be at least partially housed within the groove member. In some embodiments, the cross-section of the groove of the groove element may be circular, square, polygonal, or the like. In some embodiments, the cross-section of the groove of the groove element may correspond to the outer contour of the vibrating body 913 so that the vibrating body 913 can be housed therein. For example, if the outer contour of the vibrating body 913 is a rectangle, the cross-section of the groove of the groove element can suitably be square. In some embodiments, the vibrating body 913 may be located entirely within the groove of the groove element. In some embodiments, the vibrating body 913 may be partially located in the groove of the groove element. For example, the vibration plate 9131 of the vibrating body 913 and at least a portion of the body side plate 9132 may be located outside the groove to facilitate contact of the vibration plate 9131 with the user's facial skin to transmit vibration.

In some embodiments, the first elastic element 921 may comprise a first portion and a second portion. The first part of the first elastic element can be attached to the vibrating body. The first portion of the first elastic element 921 may be attached to the inner wall of the groove element. For example, in the embodiments shown in FIGS. 9, a first portion of the first resilient member 921 may be coupled to an outer wall of the back plate 9133, and a second portion of the first resilient member 921 may be coupled to an inner wall of the groove member. As another example, a first portion of the first resilient member may be coupled to an outer wall of the side plate, and a second portion of the first resilient member may be coupled to an inner bottom wall of the groove member. In some alternative embodiments, the vibrating body 913 may include only a vibrating plate 9131 and a side plate 9132 attached to the vibrating plate 9131, and not a back plate 9133. In such cases, the mass element 923 may be attached to the inner wall and/or the outer wall of the side plates 9132 through the first elastic element 921.

In some specific embodiments, the first resilient member 921 may be a ring structure, the first portion of the first resilient member 921 may be located in a central region of the ring structure, and the second portion of the first resilient member 921 may be located on a peripheral side of the ring structure. In some alternative embodiments, the first elastic element may be a spring and two ends of the spring serve as a first part and a second part, respectively, for attaching the vibrating body and the groove groove.

In some embodiments, the first elastic element 921 may be directly coupled to the back plate 9133 and the groove element. For example, the first elastic element may be attached to the back plate 9133 and the groove element by welding, adhesive, integral casting, etc. In some embodiments, the first resilient member 921 may be coupled to the back plate 9133 and to the groove member via a connector. For example, the third connector may be rigidly attached to the back plate 9133 and the first portion of the first elastic member 921 may be rigidly attached to the third connector. The fourth connector may be rigidly attached to the groove, and the second portion of the first elastic member 921 may be rigidly attached to the fourth connector.

In some embodiments, the internal dimension of the groove element may be larger than the outer dimension of the vibrating body 913. In such cases, a cavity may be formed between the vibrating body 913 and the groove element. When the vibrating body 913 and the groove member vibrate, the air in the cavity may begin to vibrate, creating sound. At the same time, a sound channel 940 may be formed between the groove member and the outer wall of the vibrating body 913. For example, in the embodiments shown in FIGS. 9, there may be a gap between the side wall of the groove member and the side plate 9132, and the gap may serve as a sound path 940. The sound generated by the vibration of the air between the vibrating body 913 and the groove piece can be transmitted outward through the sound path 940 and partially received by the human ear. sound, which results in the effect of improving the low frequencies and increasing the volume to some extent.

In some embodiments, the mounting assembly 930 may be configured to maintain the speaker 900 in contact with the front portion of the user's skull. In some embodiments, the mounting assembly 930 may be rigidly coupled to the resonant assembly 920. For example, the mounting assembly 930 may be rigidly coupled to or integrally formed with a mass element 921 (eg, a groove element). In some embodiments, the fastening assembly 930 may be directly rigidly attached to the groove member. In some embodiments, the fastening assembly 930 may be attached to the groove element via a fastening connector.

In some embodiments, the mounting assembly 930 may be a earhook. The two ends of the fastening assembly 930 may respectively be attached to one groove member housing one vibrating body 913, and the two groove members may be suitably secured by the earhook on both sides of the skull. In some embodiments, the mounting assembly 930 may be a single clip for one ear. The fastening assembly 930 may be attached to one groove member housing one vibrating body 913 and secure the groove member to one side of a human skull. The design of the fastening assembly 930 may be the same or similar to the design of fastening assemblies (eg, fastening assembly 830) used in other embodiments of the present disclosure, and the description thereof will not be repeated.

In some embodiments, additional details regarding the resonant frequency of the mass element 923 and the resonant assembly formed by the mass element 923 and the first elastic element 921 can be found in the descriptions of other embodiments of the present disclosure, which are not repeated here.

It should be noted that the one or more embodiments described above are for illustrative purposes only and are not intended to limit the form or parameters of the speaker 900. Once the operating principle of the speaker 900 is fully understood, the speaker 900 may be modified to provide a speaker 900 different from the embodiments of this disclosure. For example, the shape of the mass element may be changed. As another example, the material of the first elastic member 921 may be adjusted so that the first elastic member 921 can have a stronger vibration absorption effect. In some embodiments, the first elastic element 921 may additionally be foam or adhesive. For example, the first elastic member 921 may be an adhesive applied to the outer wall of the back plate 9133, and the groove member may be adhered to the vibrating body 913 through the adhesive. In some embodiments, the adhesive may have a certain damping to be able to further absorb vibration energy from the vibrating body 913 and reduce the amplitude of vibration.

In fig. 10 is a longitudinal sectional view of a speaker with a vibration damping assembly in accordance with certain embodiments of the present disclosure. In fig. 11 is a schematic, from another angle, longitudinal sectional view of the speaker shown in FIG. 10. As shown in FIG. 10 and fig. 11, speaker 1000 may include a vibrating assembly 1010, a vibration damping assembly 1020, and a mounting assembly 1030. The vibrating assembly 1010 may include a vibrating element 1011, a vibrating body 1013, and a second resilient element 1015 (as shown in FIG. 11). The second elastic element 1015 may be configured to elastically connect the vibration element 1011 and the vibrating body 1013. In some embodiments, the vibration element 1011, the second elastic element 1015, and the mounting assembly 1030 may be the same or similar to the vibration element 411, the second elastic element 415 and to the mounting unit 430 in the speaker 400, respectively, and the details of their design are not repeated.

Unlike the speakers (e.g., speaker 400) in previous embodiments, the vibrating body 1013 may be a separate plate-shaped or plate-shaped structure that directly contacts the user's facial skin to transmit vibration, so that the vibrating body 1013 may be equivalent to a vibration plate in previous embodiments. The vibrating body 1013 does not define a housing space, and the vibration element 1011 and the second resilient member 1015 may be directly coupled to the vibrating body 1013. The mass element 1023 may be a groove element and the groove of the mass element 1023 may be used as the housing space, and at least a portion of the assembly 1010 vibration may be placed in the space formed by the mass element 1023. The first elastic element 1021 may connect the mass element 1023 to the vibrating body 1013.

As shown in FIG. 11, the vibration element 1011 may include a magnetic circuit assembly. The coil may be located on the vibrating body 1013 and the magnetic circuit assembly may be located around the coil. A second resilient member 1015 may couple the magnetic circuit assembly to the vibrating housing 1013.

In some embodiments, the second elastic element 1015 may be a vibration transmission sheet. In some embodiments, the vibration transmission sheet may be a ring structure. As shown in FIG. 11, the ring structure vibration transmission sheet may be arranged around the outside of the vibrating body 1013, the peripheral side of the ring structure vibration transmission sheet may be attached to the magnetic circuit assembly, and the middle portion of the ring structure vibration transmission sheet may be attached to the vibrating body 1013. When Under the action of the Ampere force, mechanical vibrations occur, the vibrating body 1013 can transmit vibrations to the mass element 1023 through the first elastic member 1021 to cause the mass element 1023 to vibrate, thereby finally realizing the effect of reducing the vibration amplitude of the vibration of the vibration unit 1010. Additional descriptions regarding the transmission plate vibrations can be found in Fig. 2 and its corresponding descriptions.

In some cases, after the speaker is improved as described in the preceding embodiments, not only can the frequency response range of the speaker be expanded, especially in the low-frequency response range of the speaker, but also the magnitude of the resonant low-frequency peak generated by the speaker in the low-frequency range can be significantly reduced , which reduces the vibration sensation experienced by the skin when the user wears the speaker, thereby effectively improving the user experience.

In addition, the speaker may leak sound during operation. Sound leakage can come down to the fact that during the operation of the speaker, the vibrations of the speaker can create sound that is transmitted to the environment, and other people besides the owner of the speaker can hear the sound from the speaker. There are many reasons for the sound leakage phenomenon, including that the vibration of the vibrating element (eg, the transducer) is transmitted to the vibrating body through the second elastic element and causes the vibrating body to vibrate; that the vibrations of the vibration plate are transmitted to the vibrating body through the connector and cause the vibrating body to vibrate; or that the vibration of the vibrating element causes the air inside the vibrating body to vibrate, and the sound generated by the vibration of the air is output from the body through a sound outlet provided on the body.

It should be noted that speaker sound leakage may be due to mechanical vibrations of the vibrating housing. In some cases, the greater the mechanical vibration intensity of the vibrating cabinet, the more significant the speaker's sound leakage will be. The lower the mechanical vibration intensity of the vibrating body, the weaker the speaker's sound leakage. Therefore, in one or more of the preceding embodiments, when the mechanical vibration intensity of the vibrating body is reduced by the vibration damping unit, sound leakage of the speaker can be reduced. In some embodiments, the vibration intensity of the vibrating housing may be reduced by the vibration damping assembly, thereby reducing speaker sound leakage. The vibration damping assembly may be the same or similar to that described in one or more of the preceding embodiments. In some embodiments, the vibration damping assembly may include a first resilient member having a certain damping such that the first resilient member can absorb mechanical energy from a vibrating housing (e.g., a side plate and a back plate), thereby reducing the vibration intensity of the housing and reducing sound leakage dynamics. In some embodiments, the vibration damping assembly may include a first elastic element and a mass element, and mechanical vibrations may be transmitted to the mass element through the first elastic element to cause the mass element to vibrate to absorb mechanical energy from the vibrating body.

In fig. 12 is a longitudinal sectional view of a speaker in which a vibration damping assembly is located in a vibrating housing consistent with certain embodiments of the present disclosure. As shown in FIG. 12, the speaker may include a vibration assembly 1210 and a vibration damping assembly 1220. The vibration assembly 1210 may include a vibration element 1211 and a vibrating body 1213 coupled to the vibration element 1211. The vibration element 1211 may generate mechanical vibrations and transmit mechanical vibrations to the vibrating body 1213, so that the vibrating body 1213 can vibrate. The vibrating body 1213 may contact the user's facial skin to transmit vibrations to the user's auditory nerve via bone conduction.

As shown in FIG. 12, the vibrating body 1213 may include a vibrating plate 12131, a side plate 12132, and a back plate 12133. The back plate 12133 may be positioned opposite the vibrating plate 12131, and the side plate 12132 may be coupled between the back plate 12133 and the vibrating plate 12131. Vibrating plate 1213 1 may come into contact with skin user's face.

In some embodiments, the vibration plate 12131 and the side plate 12132 may be connected directly, such as by adhesive, welding, riveting, clamping, integral casting, or the like. In some other embodiments, the vibration plate 12131 and the side plate 12132 may be connected by a connector. In some embodiments, the vibration plate 12131 and the side plate 12132 may be elastically coupled to reduce the intensity of mechanical vibration transmitted to the side plate 12132 and the back plate 12133, thereby reducing sound leakage caused by vibrations of the side plate 12132 and the back plate 12133. In some In other embodiments, the vibration plate 12131 and the side plate 12132 may be rigidly connected. In embodiments, since the vibration plate 1211 is directly connected to the vibration plate 12131, the mechanical vibration generated by the vibration element 1211 can be directly transmitted to the user through the vibration plate 12131. Therefore, the vibration plate 12131 and the side plate 12132 can be elastically connected to reduce the mechanical energy received side plate 12132 and back plate 12133, thereby reducing sound leakage caused by vibrations of the side plate 12132 and back plate 12133.

In embodiments, the vibration element 1211 may be coupled to the vibration plate 12131 and transmit mechanical vibrations to the vibration plate 12131. The vibration plate 12131 may transmit mechanical vibrations to the side plate 12132 and the back plate 12133 to cause them both to vibrate. Therefore, the vibrating body 1213 may continue to vibrate during the operation process of the speaker 1200, and the vibration of the vibrating body 1213 may cause air to vibrate, thereby causing sound leakage.

The vibration damping assembly 1220 may include a first elastic element 1221 and a mass element 1223. The mass element 1223 may be coupled to the side plate 12132 and to the back plate 12133 through the first elastic element 1221. Similar to the above embodiments, when the vibrating body 1213 vibrates, mechanical vibrations of the vibrating body 1213 can be transmitted to the mass element 1223 through the first elastic element 1221, causing Thus, the mass element 1223 vibrates. The vibration damping unit 1220 can absorb mechanical energy of the vibrating body 1213 (mainly the back plate 12133 and the side plate 12132) in a certain frequency band, thereby reducing the vibration amplitudes of the vibrating body 1213 and reducing sound leakage caused by the vibrations. The range of a particular frequency band may be related to factors such as the elasticity coefficient and the mass of the resonant unit formed by the first elastic element 1221 and the mass element 1223. By changing the elasticity coefficient of the resonant unit and the mass of the resonant unit, it is possible to adjust the range of the frequency band in which the resonant unit absorbs vibrations.

In some embodiments, the frequency band range over which the resonant assembly absorbs vibrations may be adjusted by changing the type, hardness, and thickness of the first resilient member 1221 and the contact area between the first resilient member 1221 and the vibrating body 1213, etc.

Let's take glue as an example of the first elastic element. In some embodiments, the Shore hardness of the adhesive can be in the range of 10 - 80. In some embodiments, the Shore hardness of the adhesive can be in the range of 20 - 60. In some embodiments, the Shore hardness of the adhesive can be in the range of 25 - 55. In some In embodiments, the Shore hardness of the adhesive can be in the range of 30 - 50.

After the adhesive is applied to the inner wall of the back plate 12133, an adhesive layer can be formed. In some embodiments, the thickness of the adhesive layer can be in the range of 10 microns - 200 microns. In some embodiments, the thickness of the adhesive layer can be in the range of 20 microns - 190 microns. In some embodiments, the thickness of the adhesive layer can be in the range of 30 microns - 180 microns. In some embodiments, the thickness of the adhesive layer can be in the range of 40 microns - 160 microns. In some embodiments, the thickness of the adhesive layer can be in the range of 50 microns - 150 microns.

In some embodiments, the contact area between the adhesive layer and the inner wall of the backplate 12133 may be 1%-98% of the surface area of the inner wall of the backplate 12133. In some embodiments, the contact area between the adhesive layer and the inner wall of the backplate 12133 may be 5% - 90% of the surface area of the inner wall of the back plate 12133. In some embodiments, the contact area between the adhesive layer and the inner wall of the back plate 12133 may be 10% - 60% of the surface area of the inner wall of the back plate 12133. In some embodiments, the contact area between The adhesive layer and the inner wall of the backplate 12133 may be 20% - 40% of the surface area of the inner wall of the backplate 12133. In some embodiments, the contact area between the adhesive layer and the inner wall of the backplate 12133 may be in the range of 10 mm ² - 200 mm ² . In some embodiments, the contact area between the adhesive layer and the inner wall of the back plate 12133 may be in the range of 20 mm ² - 190 mm ² . In some embodiments, the contact area between the adhesive layer and the inner wall of the back plate 12133 may be in the range of 30 mm ² - 180 mm ² . In some embodiments, the contact area between the adhesive layer and the inner wall of the back plate 12133 may be in the range of 40 mm ² - 170 mm ² . In some embodiments, the contact area between the adhesive layer and the inner wall of the back plate 12133 may be in the range of 50 mm ² - 150 mm ² . In some specific embodiments, the contact area between the adhesive layer and the inner wall of the back plate 12133 may be 10 mm ² .

In fig. 13 shows graphs of speaker sound leakage rates corresponding to some embodiments of the present disclosure. In fig. 13 respectively shows sound leakage rate graphs (i.e., a dotted line in the drawing) of the speaker 200 without vibration damping assembly and a sound leakage rate graph (i.e., solid line in the drawing) of speaker 1200 with vibration damping assembly 1220. In some embodiments, the vibration damping assembly may comprise only a mass element. The mass element may be an internal housing located within the vibrating housing (ie, the housing in FIG. 13). In fig. 13, it can be seen that under the influence of the vibration damping assembly 1220, the sound leakage intensity of the speaker 1200 at a frequency of approximately 10,000 Hz (for example, within the range of 10,000 Hz to 10,300 Hz) is significantly reduced. In embodiments, the first elastic element 1221 of the vibration damping assembly 1220 may be a 30-50 Shore hardness adhesive. The thickness of the adhesive layer formed on the inner wall of the back plate 12133 can be in the range of 50 µm - 150 µm. The contact area between the adhesive layer and the inner wall of the back plate 12133 may be 150 mm ² .

In addition to reducing the sound leakage of the speaker 1200 in the high frequency region (eg, 10000 Hz - 10300 Hz), the vibration damping assembly 1220 of the present disclosure can further reduce the sound leakage of the speaker 1200 in other frequency bands. In some embodiments, foam may be selected as the first elastic element 1221, and the elasticity and attenuation may be varied by varying the thickness of the foam to control the sound leakage reduction frequency band in the mid- and low-frequency regions. In some embodiments, the foam thickness may be in the range of 0.3 mm - 2 mm. In some embodiments, the foam thickness may be in the range of 0.4 mm - 1.9 mm. In some embodiments, the foam thickness may be in the range of 0.5 mm - 1.8 mm. In some embodiments, the foam thickness may be in the range of 0.6 mm - 1.8 mm.

In fig. 14 depicts speaker sound pressure level graphs corresponding to certain embodiments of the present disclosure. In fig. 14 respectively shows a graph of the sound pressure level of speaker 1200 with attenuation unit 1220 using 0.6 mm thick foam as the first elastic element 1221, a graph of the sound pressure level of speaker 1200 with attenuation unit 1220 using 1.2 mm thick foam as the first elastic element element 1221, a plot of the sound pressure level of the speaker 1200 with a damping assembly 1220 using 1.8 mm thick foam as the first elastic element 1221, and a plot of the sound pressure level of the speaker 200 without vibration damping assembly 1220. The SPL (Sound Pressure Level) ordinate can represent the sound pressure level, and the sound pressure level can be equivalent to the mechanical vibration intensity of the speaker 1200, that is, the larger the ordinate value on the graph, the greater the mechanical vibration intensity of the speaker 1200. Due to mechanical vibration dynamics 1200 coming primarily from the vibration of the vibrating body 1213, the ordinate value may represent the intensity of the mechanical vibration of the vibrating body 1213.

As shown in FIG. 14, compared to a speaker 1200 without a resonant unit (in the embodiments shown in FIG. 12, the damping unit 1220 may be equivalent to a resonant unit), the vibration intensity of the speaker 1200 in a certain frequency band can be reduced by adding 0.6 mm thick foam. , 1.2 mm and 1.8 mm, respectively, as the first elastic element 1221 of the resonant unit. For example, when the thickness of the foam of the vibration damping unit 1220 of the speaker 1200 is 0.6 mm, the vibration intensity of the speaker 1200 decreases in the frequency range of approximately 180 Hz - 1010 Hz and a dip appears at a frequency of approximately 1000 Hz (the vibration intensity is the smallest in the frequency range of 180 Hz - 1010 Hz) 1010 Hz). As another example, when the thickness of the foam of the vibration damping assembly 1220 of the speaker 1200 is 1.2 mm, the vibration intensity of the speaker 1200 decreases in the frequency range of approximately 170 Hz to 750 Hz and a dip appears at a frequency of approximately 650 Hz (the vibration intensity is the lowest in the frequency range 170 Hz - 750 Hz). As another example, when the thickness of the foam of the vibration damping unit 1220 of the speaker 1200 is 1.8 mm, the vibration intensity of the speaker 1200 decreases in the frequency range of approximately 160 Hz to 350 Hz and a dip appears at a frequency of approximately 300 Hz (the vibration intensity is the lowest in the frequency range 160 Hz - 350 Hz). By reducing vibration intensity, sound leakage generated by the speaker 1200 during operation is reduced.

It should be noted that the one or more embodiments presented above are for illustrative purposes only and are not intended to limit the shapes or dimensions of the speaker 1200. Once the principle of reducing sound leakage of the speaker 1200 is fully understood, the speaker 1200 can be modified to provide a speaker 1200 different from the embodiments implementation of this disclosure. For example, vibration damping assembly 1220 may be modified with reference to previous embodiments. In some embodiments, the vibration damping assembly 1220 may include only the first elastic element 1221 and not the mass element 1223. For example, the first elastic member 1221 may have a certain damping to absorb and dissipate vibration energy of the vibrating body 1213 (e.g., the back plate 12133 and the side plate 12132 of the vibrating body 1213) attached to the first elastic member 1221, thereby achieving the purpose of reducing leakage sound.

In fig. 15 is a longitudinal sectional view of a speaker in which the first resilient member has an opening consistent with some embodiments of the present disclosure. As shown in FIG. 15, speaker 1500 may include a vibration assembly 1510 and a vibration damping assembly 1520. The vibration assembly 1510 may include a vibration element 1511 (eg, a transducer) that generates mechanical vibrations, and a vibrating body 1513 that contacts the user's facial skin. A vibration damping assembly 1520 may be coupled to the vibrating body 1513 to absorb mechanical energy from the vibrating body 1513, thereby reducing the amplitude of vibration of the vibrating body 1513 and thereby ultimately reducing sound leakage caused by vibrations of the vibrating body 1513. In some embodiments, the vibrating body 1513 (comprising a side plate 15132, a back plate 15133, and a housing plate 15131) in the speaker 1500, a vibrating element 1511, a mass element 1523 may be, respectively, the same or similar to the vibrating housing 1213 (including a side plate 12132, a back plate 12133, and a housing plate 12131 ) in the dynamics 1200, the vibration element 1211 and the mass element 1223, the description of which will not be repeated here.

Unlike the speaker 1200, the first elastic element 1521 and the mass element 1523 of the speaker 1500 may not be fully connected. Incomplete connection may refer to the case in which there is free space on the contact surface between the mass element 1523 and the first elastic element 1521, or fillers may be placed in the first elastic element 1521. In some embodiments, the first resilient member 1521 may have an opening 15211 on the side farthest from the back plate 15133. Due to the existence of the opening 15211 when the mass member 1523 is attached to the first resilient member 1521, at the contact surface between the mass member 1523 and the first resilient member 1521 free space may be present. In some cases, the opening 15211 in the first elastic element 1521 may reduce the elasticity of the first elastic element 1521, so that the first elastic element 1521 can still provide a sufficiently low elasticity at a relatively small thickness, and the resonant frequency of the resonant node formed by the first elastic element 1521 and the element 1523 mass can be easily adjusted to the required frequency band. In some alternative embodiments, the opening 15211 may be located in the first resilient member 1521. In some other embodiments, the opening 15211 may be located on the surface and in the first resilient member 1521. In some embodiments, the opening 15211 may be formed by cutting a hole in the first resilient member. element 1521. For example, the first elastic element 1521 may be plastic and the hole 15211 may be formed by cutting a hole on the surface and/or inside the plastic. In some other embodiments, the hole 15211 may be the structure of the first resilient member 1521 itself. For example, the first resilient member 1521 may be foam, and the foam may have a hole structure, and the hole structure may directly serve as the hole 15211. In some embodiments, the hole 15211 may accommodate filler. An exemplary aggregate may be an absorbent aggregate such as an absorbent adhesive, an absorbent lubricant, or the like. In some cases, the positioning of the absorbent core in the opening 15211 may increase the damping of the first resilient member 1521. When the speaker 1500 is operated, the first resilient member 1521 may dissipate the vibration energy of the vibrating body 15133, thereby reducing the amplitude of vibration of the vibrating body 15133 and thereby reducing sound leakage. .

In fig. 16 is a longitudinal sectional view of a speaker comprising two resonant units, corresponding to certain embodiments illustrating the present disclosure. As shown in FIG. 16, speaker 1600 may include a vibration assembly 1610 and a vibration damping assembly 1620. The vibration assembly 1610 may include a vibration element 1611 (eg, a transducer) that generates mechanical vibrations, and a vibrating body 1613 that contacts the user's facial skin. A vibration damping assembly 1620 may be coupled to the vibrating body 1613 to absorb mechanical energy of the vibrating body, thereby reducing the amplitude of vibration of the vibrating body 1613 and, accordingly, ultimately reducing sound leakage caused by vibrations of the vibrating body 1613. In some embodiments, the vibrating body 1613 (comprising a side plate 16132, a back plate 16133, and a housing plate 16131) in the speaker 1600, a vibrating element 1611, a first resilient member 1621, a mass element 1623 may be the same or similar to the vibrating housing 1213 (comprising a side plate 12132, a back plate 121 33 and body plate 12131), vibration element 1211, first elastic element 1221 and mass element 1223 in dynamics 1200, the description of which will not be repeated here.

Unlike speaker 1200 shown in FIG. 12, the vibration damping assemblies 1620 of the speaker 1600 may include two resonant assemblies. For convenience of description, a resonant unit located on the upper side of the inner wall of the back plate 16133 may be a first resonant unit 1620-1, and a resonant unit located on the lower side of the inner wall of the back plate 16133 may be a second resonant unit 1620-2. The mass element in each of the resonant units may be connected to the inner wall of the back plate through the first elastic element. The first elastic element 1621-1 of the first resonant assembly 1620-1 may be attached to the inner wall of the back plate 16133 and the upper side plate 16132. The first elastic element 1621-2 of the second resonant assembly 1620-2 may be attached to the inner wall of the back plate 16133 and to the lower side plate 16132. As shown in FIG. 16, all the first elastic elements of the two resonant units can be made of the same material and have the same thickness. For example, two resonant units use adhesive as first elastic elements, and the thickness of the adhesive layers formed by coating the inner wall of the back plate with adhesive may be the same or similar. In some alternative embodiments, the first elastic elements of the two resonant units may be made of different materials or have different thicknesses. For example, the first elastic element 1621-1 of the first resonant unit 1620-1 may be foam, and the first elastic element 1621-2 of the second resonant unit 1620-2 may be adhesive.

As shown in FIG. 16, the first resonant unit 1620-1 and the second resonant unit 1620-2 may be spaced apart by a predetermined distance. For example, the edges of the first elastic elements 1621 of two resonant nodes may be spaced apart by a predetermined distance. The specified distance can meet actual needs.

The first resonant unit 1620-1 and the second resonant unit 1620-2 may not be limited to the arrangement method and location shown in FIG. 16. In some embodiments, the first resonant assembly 1620-1 and the second resonant assembly 1620-2 may be located in any area on the inner wall of the backplate 16133. The inner wall of the backplate 16133 may include an edge region and a center region. The edge region may refer to the region proximal to the housing side plate 16132. In some embodiments, the first resonant node 1620-1 and the second resonant node 1620-2 may be located in the edge region. For example, in FIG. 16, the first elastic elements of the two resonant assemblies may be attached to the side plate 16132. In some other embodiments, the first resonant assembly 1620-1 and the second resonant assembly 1620-2 may be located in the central region. For example, the first elastic elements of the two resonant units cannot be attached to the side plate 16132 and can be separated from the side plate 16132 by a predetermined threshold distance. The specified distance threshold can meet the actual needs. In some alternative embodiments, the first resonant node 1620-1 and the second resonant node 1620-2 may be located in the edge region and the central region, respectively. For example, the first resonant assembly 1620-1 may be located in the edge region and the first elastic element 1621-1 may be coupled to the upper side plate 16132. The second resonant assembly 1620-2 may be located in the central region and the first elastic element 1621-2 may attach only to the inner wall of the back plate 16133. As another example, the first resonant node 1620-1 may be located in the edge region and form a ring structure around the entire back plate 16133 to enclose the second resonant node 1620-2. For example, a circle formed by the foam may be arranged around the edge region of the back plate 16133 as the first elastic member 1621-1, and then a mass member 1623-1 of a ring shape corresponding to the shape of the foam may be attached to the foam. The first elastic element 1621-2 and the mass element 1623-2 of the second resonant unit 1620-2 may be located in the central region.

As described in the previous embodiments, the resonant frequency of the first resonant unit 1620-1 and the resonant frequency of the second resonant unit 1620-2 may be the same or different. When the resonant frequency of the first resonant unit 1620-1 is different from the resonant frequency of the second resonant unit 1620-2, a vibration reducing effect can be generated in a frequency band near their respective resonant frequencies, thereby expanding the vibration absorption frequency band. When the resonant frequency of the first resonant unit 1620-1 matches the resonant frequency of the second resonant unit 1620-2, the vibration reducing effect in a frequency band near the resonant frequency can be further improved.

In fig. 17 is a longitudinal sectional view of a speaker comprising two resonant units corresponding to some embodiments of the present disclosure. As shown in FIG. 17, speaker 1700 may include a vibration assembly 1710 and a vibration damping assembly 1720. The vibration assembly 1710 may include a vibration element 1711 (eg, a transducer) that generates mechanical vibrations, and a vibrating body 1713 that contacts the user's facial skin. A vibration damping assembly 1720 may be coupled to the vibrating body 1713 to absorb mechanical energy of the vibrating body 1713, thereby reducing the amplitude of vibration of the vibrating body 1713 and, accordingly, ultimately reducing sound leakage caused by vibrations of the vibrating body 1713. In some embodiments, the vibrating housing 1713 in speaker 1700 (including housing plate 17131, side plate 17132, and back plate 17133), vibration element 1711, first elastic element (e.g., first elastic element 1721-1, first elastic element 1721-2), mass element (e.g., mass element 1723-1, mass element 1723-2) may be the same as or be similar to the vibrating body 1613 in the speaker 1600 (including body plate 16131, side plate 16132, and back plate 16133), vibrating element 1611, first elastic element (e.g., first elastic element 1621-1, first elastic element 1621-2), mass element (eg, mass element 1623-1, mass element 1623-2), the description of which is not repeated here.

Unlike speaker 1600 shown in FIG. 16, the two resonant units (eg, the first resonant unit 1720-1 and the second resonant unit 1720-2) of the speaker 1700 may not be directly connected to the vibrating body 1713, but may be connected by stacking on each other. For example, one side of the first elastic element 1721-1 of the first resonant assembly 1720-1 may be attached to the inner wall of the vibrating body 1713 and the edge of the first elastic element 1721-1 may be attached to the side plate 17132. The mass element 1723-1 may be attached to the other side of the first elastic element 1721-1. One side of the first elastic element 1721-2 of the second resonant assembly 1720-2 may be attached to the side of the mass element 1723-1 of the first resonant assembly 1720-1 farthest from the back plate 17133, and the edge of the elastic element may not be attached to the side plate 17132, but the other side may be attached to the mass element 1723-2. In some embodiments, during actual manufacturing, adhesive (as the first elastic member 1721-1 of the first resonant assembly 1720-1) may coat the inner wall of the backplate 17133, and the adhesive may coat the inner wall of the backplate 17133, and the mass member 1723-1 may stick to the surface of the adhesive. Additionally, adhesive (as the first elastic element 1721-2 of the second resonant assembly 1720-2) may be applied to the side of the mass element 1723-1 farthest from the back plate 17133, and another mass element 1723-2 may be adhered to the surface of the adhesive.

In some cases, when at least two resonant nodes are connected in series in a layered manner, a complex resonant system can be formed, which can have multiple resonant modes, that is, have multiple resonant frequencies. At resonant frequencies, the resonant system can absorb vibration energy from the vibrating body 1713, thereby reducing sound leakage caused by vibrations of the vibrating body 1713.

Thus, having described the basic concepts, after reading this detailed disclosure it should be fairly obvious to those skilled in the art that the preceding detailed disclosure is intended to be exemplary only and not limiting. Various changes, improvements and modifications may occur and are intended for those skilled in the art although not expressly stated herein. These changes, improvements, and modifications are intended to be suggested by this disclosure and are within the spirit and scope of the exemplary embodiments of this disclosure.

In addition, certain terminology has been used to describe embodiments of the present disclosure. For example, the terms “one embodiment,” “an embodiment,” and/or “certain embodiments” mean that a particular feature, structure, or function described in connection with an embodiment is contained in at least one embodiment of the present disclosure. It is emphasized and understood that two or more references to “embodiment,” “one embodiment,” or “alternative embodiment” in different parts of this disclosure do not necessarily all refer to the same embodiment. In addition, specific features, structures, or functions may be combined as appropriate in one or more embodiments of the present disclosure.

Likewise, it should be understood that in the above description of embodiments of the present disclosure, various features are sometimes grouped together in a single embodiment, drawing, or description thereof in order to streamline the disclosure for understanding one or more different embodiments. This manner of disclosure, however, should not be interpreted as indicating that the claimed subject matter requires more features than are expressly set forth in each claim. Rather, the claimed subject matter may utilize less than all of the features of the single embodiment disclosed above.

In some embodiments, numbers expressing quantities or properties used to describe and claim certain embodiments of the application are to be understood as being modified in some cases by the term “about,” “approximately,” or “substantially.” For example, “about,” “approximately,” or “substantially” may indicate a ±20 percent change from the value it describes unless otherwise noted. Accordingly, in some embodiments, the numerical parameters given in the written description and in the appended claims are approximations that may vary depending on the desired properties desired in a particular embodiment. In some embodiments, numeric parameters may be interpreted in light of the number of significant digits reported using conventional rounding techniques. Although the numerical ranges and parameters representing the broad scope of some embodiments of the application are approximations, the numerical values given in the specific examples are reported to be as accurate as practicable.

Finally, it should be understood that the embodiments disclosed herein are illustrative of the principles of the embodiments of the application. Other modifications that may be used may be within the scope of the application. Thus, by way of example, and not by way of limitation, alternative configurations of embodiments of the application may be used in accordance with the principles set forth herein. Accordingly, embodiments of the present application are not limited solely to what has been shown and described.

Claims (26)

1. Speaker containing: a vibration unit comprising a vibration element and a vibrating body, wherein the vibration element is configured to convert an electrical signal into mechanical vibration, and the vibrating body is in contact with the user's facial skin; And a first elastic element elastically connected to the vibrating body, wherein the speaker further comprises a mass element connected to the vibrating body through a first elastic element, the mass element being connected to the first elastic element to form a resonant unit, and the vibration unit forms the first resonant peak at the first frequency, Moreover, in the frequency range below the first frequency, the amplitude of oscillations of the resonant unit exceeds the amplitude of oscillations of the vibrating body. 2. The speaker according to claim 1, wherein the vibrating body includes a vibration plate in contact with the skin of the user's face, and the first elastic element is elastically connected to the vibration plate. 3. The speaker according to claim 2, wherein the mass element is a groove element, the vibrating element is located at least partially in the groove element, and the first elastic element is connected to the vibration plate and the inner wall of the groove element. 4. Speaker according to claim 2 or 3, in which the vibration unit forms the first resonant peak at the first frequency, the resonant node generates a second resonant peak at a second frequency, and the ratio of the second frequency to the first frequency is in the range of 0.5-2. 5. The speaker according to claim 4, wherein the first frequency and the second frequency are less than 500 Hz. 6. Speaker according to claim 2 or 3, in which the vibrating body includes a vibration plate and a back plate located opposite the vibration plate, the vibration plate being in contact with the user's facial skin, the mass element is connected to the back plate through the first elastic element, and the first elastic element is located on the surface of the back plate, and the contact area between the first elastic element and the back plate is greater than 10 mm ² . 7. The speaker of claim 6, wherein the first resilient member comprises at least one of silica gel, plastic, adhesive, foam or spring. 8. The speaker according to claim 7, in which Shore hardness of the glue is in the range of 30-50, tensile strength of the adhesive is not less than 1 MPa, the elongation of the adhesive before breaking is in the range of 100-500%, the adhesive strength between the adhesive and the back plate is in the range of 8-14 MPa, the thickness of the adhesive layer formed by coating the surface of the back plate with glue is in the range of 50-150 microns, the contact area of the adhesive and the backplate is 1-98% of the area of the inner wall of the backplate, or The contact area of the glue and the back plate is in the range of 100-200 mm ² .