RU2791076C1 - Borehole barrier device for use in operations in borehole, method for manufacture of borehole barrier device, and method for use of borehole barrier device for activation of borehole tool - Google Patents

Abstract

FIELD: oil and gas industry.

SUBSTANCE: group of inventions relates to the oil and gas industry, in particular to barrier devices for separation of a borehole. A borehole barrier device for use in operations in a borehole contains a case having a structure, a breaking layer formed with the case and having another structure. The case has the first side containing a hole adjacent to the breaking layer. The first case side and the adjacent breaking layer are made with the possibility of breaking at lower pressure than an opposite case side. The case and the breaking layer are formed as a single whole. For implementation of a method for the manufacture of a borehole barrier device, a case structure is created, a breaking layer structure is created, a cast of the borehole barrier device is created, in which the breaking layer is formed with the case, using the case structure and the breaking layer structure. The case has the first side containing a hole adjacent to the breaking layer. The first case side and the adjacent breaking layer are made with the possibility of breaking at lower pressure than an opposite case side. The case and the breaking layer are formed as a single whole. For implementation of a method for the use of a borehole barrier device, the barrier case and the breaking layer, formed as a single whole, are installed in the borehole. The case has the first side containing a hole adjacent to the breaking layer. The first side of the barrier case and the adjacent breaking layer are broken at lower pressure than an opposite case side. Break of the breaking layer is created in response to application of a force to the breaking layer.

EFFECT: provision of break of a breaking layer at pressure depending on an application direction.

15 cl, 15 dwg

Description

BACKGROUND OF THE INVENTION

[0001] Downhole barrier devices (see, for example, US 2019032451, B22F 3/105, 01/31/2019) are widely used in the oil industry. They can be used to separate sections of a wellbore for downhole operations. Following operations, pressure may be applied to a section of the barrier device called a rupture disk to activate an attached tool, such as a packer or wear sleeve. Conventionally, downhole barrier devices used in downhole wellbore preventive maintenance operations comprise a barrier housing and a fracturing disc in which they are physically connected, for example by means of gaskets and screwed on one another at some point during the preventive maintenance operation. Because the barrier device is made up of separately manufactured parts using a threaded nut/bolt and gasket design, they are inherently leaky or can leak, especially in downhole environments. Joining separate parts in this manner can be very difficult, especially when performed downhole, and can create hazardous downhole conditions and be potentially fatal to those performing operations at the wellsite. In addition, the separate manufacture of the barrier body and the rupture disc often results in the use of different materials for manufacture. The use of various combinations in downhole operations can cause galvanic reactions with other downhole parts, potentially creating maintenance and other safety issues.

[0002] In addition, rupture disks are usually made by rolling metal and cutting rupture disks from sheets by stamping or laser welding. The problem with these methods is that rolled metal is not always guaranteed to fail at a given pressure, since both stamping and welding change the compositional characteristics of the metal. Another problem is that, due to limited design options or rolled metal configurations, the disc often ruptures in such a way that pieces can form that can affect downhole tools such as a valve or simply obstruct the passage. As such, there are additional costs, complexity, quality/reliability issues, and limited design options to manufacture rupture disks separately.

BRIEF DESCRIPTION OF GRAPHICS

[0004] For a more complete understanding of the features and benefits of the present disclosure, reference is now made to the detailed description along with the accompanying figures, in which the corresponding numbers in the various figures refer to the respective parts and in which:

[0005] FIG. 1 is a diagram of a well site in which a barrier device is used in wellbore operations, in accordance with some exemplary embodiments;

[000b] FIG. 2A-2L are views of various rupture layer designs for a barrier device, in accordance with some exemplary embodiments;

[0007] FIG. 3 is a flowchart for controlling a 3D printer to create a body and a tear layer integrally formed, in accordance with some exemplary embodiments; And

[0008] FIG. 4 is a view of a computer and system application module, in accordance with exemplary embodiments.

DETAILED DESCRIPTION

[0009] While the making and use of various embodiments of the present disclosure is discussed in detail below, it should be appreciated that the present disclosure provides many applicable inventive concepts that may be embodied in a wide variety of specific contexts. The specific embodiments discussed herein are merely illustrative and do not limit the scope of the present disclosure. In the interests of clarity, not all features of an actual implementation may be described in this disclosure. Of course, it will be appreciated that in developing any such actual implementation, many implementation decisions must be made to achieve the developer's specific goals, such as meeting system and business constraints, which will differ from one implementation to another. In addition, it should be understood that such development can be complex and time consuming, but will be a routine task for those skilled in the art who benefit from this disclosure.

[0010] This document provides a disclosure of a downhole barrier device or isolation device that includes a body section and a fracture layer formed as a single unit. Said section and layer are integrally formed using a selective laser melting process. The fracture layer may be formed in a variety of different structural configurations and have different stress concentrations along its surface. The tear layer can be formed such that it has a guaranteed tensile stress, for example, is guaranteed to break between a minimum and maximum pressure. In addition, the barrier device can be formed to have a porosity of less than 2 percent and is efficiently and economically formed using a common metal selected from a variety of metals, such as a metal compatible with other downhole tools. In addition, the laser melting process can be done using a reliable and economical 3D printing process.

[0011] Referring to FIG. 1, which is a diagram of a wellsite, generally designated 10, in which a barrier device is used in wellbore operations, in accordance with some exemplary embodiments. The well site 10 includes a system controller and a pump 12, a coupling or a traction-carrying rope 14, a well head 16, a well casing 18, a tubing section 20, 22, perforations 24 formed in the well casing 18, a barrier device 26 and a downhole tool 28 such as a packer. The barrier device 26 functions to temporarily separate the sections so that work can be done in one section safely without damaging the downhole tool 28 or its components and prevents the downhole tool from adversely interacting with the section being worked on. After completion of the necessary operations, pressure force, such as from pumping fluid into the inner diameter (ID) of the casing string 18 of the well or running a tool into the well, applied to the fracture layer of the barrier device 26, breaks the fracture layer by breaking. Once the fracture layer is broken, the downhole tool 28 can be activated, such as in the case of a packer, to create a permanent seal.

[0012] Referring now to FIG. 2A-2L, which depict various designs of the rupture layer and barrier body of the barrier device 26, in accordance with some of the exemplary embodiments, denoted generally as 30 and 32, respectively, and in particular as an alphanumeric combination in in accordance with the figure. These designs are based on a variety of factors, which may include wellbore operating requirements such as wellbore casing inner diameter (ID), available force, particular operation in the wellbore, and metal used to construct barrier device 26. There may be the need for the fracture layer to break into several small pieces, which greatly reduces the chance of affecting other downhole tools such as a valve or blocking the passage. Alternatively, it may only be necessary for the rupture layer to be torn apart at some locations along the surface so that portions of the pressed rupture layer remain attached to the barrier body structure.

[0013] FIG. 2A-2E, hull structures 32 and rupture layer structures 30 are based on variation in thickness along the radial and diametral sections of barrier device 26. The rupture layer 30a and hull 32b in FIG. 2A contain a thin middle section and a thick outer section, respectively. As such, the barrier device 26 comprises an inner circular surface, i. e. a rupture layer 30a, and an outer ring, wherein the inner circumferential surface has a thickness less than the outer ring, body 32b, and is configured to break at a predetermined pressure value or pressure range. The rupture layer 30a is designed to pierce and rupture a non-part at a predetermined pressure value or pressure range.

[0014] FIG. 2B comprises a pinched structure in which a thinner annulus is formed in the barrier device 26 than in the body 32b to allow the rupture layer 30b to be torn away from the body 32b. In FIG. 2C, a disk is formed in the barrier device 26, similar to that shown in FIG. 2A but includes a dimple that allows the rupture layer 30c to rupture at a lower pressure than for the rupture layer 30a. In FIG. A 2D pin-shaped tool is used to create a pressure point or pressure concentration on the rupture layer 30d, which is pressed from the opposite direction, causing the rupture layer 30d to rupture. As such, pressure applied to the fracture layer 30d, for example using high pressure fluid flow, forces the fracture layer 30 into the pin-shaped tool, which causes pressure concentration. The pen-shaped device may be attached to a barrier housing or some other downhole tool. In FIG. 2E, a pitted disk is formed in the barrier device 26. The shape of this dimple creates a stress concentration that allows the rupture layer 30e to rupture with less pressure.

[0015] In FIG. 2F, barrier device 26 is designed to burst at various pressures or pressure ranges depending on the direction of pressure applied to housing 32f. The tear layer 30f is formed in the form of a hollow disk formed inside the body 32f. The barrier device 26 includes a flow port integrated with the body 32f and the rupture layer 30f, which allows an applied force having a certain pressure or pressure range to be concentrated on the rupture layer 30f and hence cause the body 32f and the rupture layer 30f to rupture at a pressure much lower than than the force applied in the opposite direction. In the opposite direction, the pressure from the applied force is not the concentration, and therefore the value of the force required to break the body 32f and the fracture layer 30f is higher.

[0016] FIG. 2G and 2H, rupture layers 30g and 30h are defined by strain patterns compared to housings 32g and 32h that create stress concentrations. These variants of deformations are defined as a set of at least one of the various levels of thicknesses and shapes. For example, the tear layer 30g may have a thickness level less than the thickness of the body 32d, or it may have different thickness levels that are less than the thickness of the body 32g. In addition, the variant of the tear layer 30g may have shapes similar to those in FIG. 2C and 2E. In FIG. 2I, the construction is similar to that in FIG. 2C except that the fracture layer 30i is formed with a different type of stress concentration that the fracture layer 30i can cause to fracture in response to a force applied at a different pressure or pressure range. In FIG. 2J, a wedge is formed in the body 32J causing the rupture layer 30j to break in a certain way. In FIG. The 2K rupture layer 30k is formed to include a box-shaped or rectangular pit shape, where the pit sections are shaped to have different thickness levels with respect to each other and to the body 32K. Again, this is necessary to ensure that the barrier device 26 breaks in a certain way or in a certain configuration. In FIG. 2L, the barrier device 26 includes a body 32l and a rupture layer 30l, which are designed and formed in the form of an outer shell and an inner tube. The body 32l has a selected thickness, and a tear layer 30l, also of a selected thickness, is formed along the ID wall as shown. The tear layer 30l can tear inward or outward and open new flow paths. For example, a flow path may be formed within the wall thickness that is not in fluid communication with the ID of said tubing prior to rupture of the fractured section. This single fracturing section may feed one or more combined flow paths.

[0017] In any of the above embodiments, the composition of the material, i.e. the metallurgy for the fractured surface, for example 30a, may be sequential and continuous, and the metallurgy for the associated body 32b, however, may vary. For example, the welding energy used in this additive manufacturing process can be varied such that the fracture surface 30a has a lower strain to break than the body 30b. The welding energy can be changed by adjusting the laser speed, laser energy, laser spot size, number of laser passes, and other parameters of the printing process. Controlling these manufacturing parameters is a process that is easily accomplished within an additive manufacturing process, but would be extremely difficult to achieve with other manufacturing processes. In one case, manufacturing parameters are changed such that the porosity of the fracture face increases, and the increased porosity correlates with a reduction in strain to fracture in some metals. In another example, the manufacturing parameters are changed such that the powder grains are poorly bonded to each other so that the tensile strength of said part is reduced. In another example, the manufacturing parameters are changed such that the powder grains are loosely bonded to each other so that the grain size of the metal is controlled. Changes in metallurgy can occur over the entire surface for the fracture surface (eg, 30a) or along sections of the fracture surface, such as circular or radial options (eg, options in Fig. 2G and 2H).

[0018] Referring now to FIG. 3, which depicts a block diagram of a computer algorithm for controlling a 3D printer in accordance with some of the exemplary embodiments, indicated generally as 50. The design of the body and tear layer, as well as manufacturing parameters, can be selected and determined to create a particular manufacturing process, block 52. For example, the user may select and/or define a plurality of designs and select and/or define manufacturing parameters for a particular manufacturing process. The designs/characteristics may include the configurations, shapes, sizes, materials, composition of such materials, and the laser operations used to form the barrier device 26. Once the design is created, the algorithm 50 instructs the 3D printer to integrally form the body and rupture layer in accordance with the design of the body and break layer.

[0019] Referring now to FIG. 4, which depicts a computer 100 and a system application module 200 in accordance with exemplary embodiments. Computer 100 may correspond to any of the various computers, mobile devices, laptops, servers, embedded systems, or computing systems provided herein. The module 200 may include one or more hardware or software elements, such as other OS application and user and kernel space applications, designed to facilitate the computer 100 to perform the various processing methods and functions presented herein. The computer 100 may include various internal or attached components such as a processor 110, a system bus 120, a system memory 130, a storage medium 140, an input/output interface 150, and a network interface 160 for communicating with a network 170, such as loopback, LAN, WAN, Cellular/GPS, Bluetooth, WIFI and WIMAX. The computer 100 further comprises a 3D printer for processing instructions to create barrier devices 2 6 using a laser melting process.

[0020] The computer 100 may be implemented as a conventional computer system, an embedded controller, a laptop computer, a server, a mobile device, a smartphone, a wearable computer, a dedicated machine, any other hardware platform, or any combination or plurality thereof. Computer 100 and its associated logic and modules may be a distributed system configured to operate using a plurality of computers interconnected via a data network and/or a system bus.

[0021] The processor 110 may be configured to execute code instructions to perform the operations and functionality described herein, organize the flow of requests and map addresses, and perform calculations and generate instructions. Processor 110 may be configured to monitor and control the operation of components in computing machines. Processor 110 may be a general purpose processor, a processor core, a multiprocessor, a reconfigurable processor, a microcontroller, a digital signal processor ("DSP"), an application specific integrated circuit ("ASIC"), a controller, a state machine, gated logic, discrete hardware components, any other processing device, or any combination or multitude of them. Processor 110 may be a single processor unit, multiple processor units, a single processor core, multiple processor cores, special purpose processor cores, coprocessors, or any combination thereof. In some embodiments, processor 110, along with other components of computer 100, may be a software or hardware virtualized computer running within one or more other computers.

[0022] System memory 130 may include non-volatile memory devices such as read-only memory ("ROM"), programmable read-only memory ("PROM"), erasable programmable read-only memory ( "EPROM, erasable programmable read-only memory"), flash memory, or any other device capable of storing program instructions or data, either with or without power. System memory 130 may also include volatile memory devices such as random access memory ("RAM"), static random access memory ("SRAM"), dynamic random access memory ("DRAM") ) and synchronous dynamic random access memory ("SDRAM, synchronous dynamic random access memory"). Other types of RAM may also be used to implement system memory 130. System memory 130 may be implemented using a single memory module or multiple memory modules. Although system memory 130 is depicted as part of a computer, one skilled in the art will appreciate that system memory 130 can be separated from computer 100 without going beyond the scope of the subject matter. It should also be understood that system memory 130 may comprise or operate in conjunction with a non-volatile storage device such as storage medium 140.

[0023] The storage medium 140 may include a hard disk, a floppy disk, a compact disc read-only memory ("CD-ROM"), a digital versatile disc ("DVD, digital versatile disc"), a Blu -ray, magnetic tape, flash memory, other non-volatile storage device, solid state drive ("SSD"), any magnetic storage device, any optical storage device, any electrical storage device, any semiconductor storage device , any physical storage device, any other storage device, or any combination or plurality of them. Storage medium 140 may store one or more operating systems, application programs and program modules, data, or any other information. The storage medium 140 may be part of or connected to a computer. The storage medium 140 may also be part of one or more other computers that are associated with the computer, such as servers, database servers, cloud storage, network storage, and so on.

[0024] The application module 200, which contains the algorithm 50, may include one or more hardware or software elements configured to facilitate the computer to perform the various processing methods and functions presented herein. Application module 200 and other OS application modules may comprise one or more algorithms or instruction sequences stored in software or firmware in combination with system memory 130, storage medium 140, or both. Thus, storage medium 140 may represent examples of computer-readable or computer-readable media that may store instructions or code for execution by processor 110. Computer-readable or computer-readable media can generally refer to any medium or medium used to provide instructions to processor 110. Such computer-readable or computer-readable media associated with application module 200 and other OS application modules may comprise a computer program product. It should be understood that the computer program product containing the application module 200 and other OS application modules may also be associated with one or more processes or methods for delivering the application module 200 and other OS application modules to a computer via a network, any signaling media, or any other communication or delivery technology. Application module 200 and other OS application modules may also contain hardware circuits or information for configuring hardware circuits, such as microcode or configuration information for an FPGA or other PLD. In one exemplary embodiment, application module 200 and other OS application modules may contain algorithms capable of performing the functional operations described by the flowcharts and computer systems presented herein.

[0025] The I/O, input/output interface 150 may be configured to connect to one or more external devices to receive data from one or more external devices and to send data to one or more number of external devices. Such external devices, together with various internal devices, may also be referred to as peripheral devices. I/O interface 150 may include both electrical and physical connections for connecting various peripherals to computer or processor 110. I/O interface 150 may be configured to transfer data, addresses, and control signals between peripherals, computer, or processor 110. I/O interface 150 may be configured to implement any standard interface such as small computer system interface ("SCSI"), serial-attached SCSI ("SAS, serial-attached SCSI"), fiber optic channel, connection of peripheral components ("PC1, peripheral component interconnects, PCI express (PCIe, PCI express), serial bus, parallel bus, peripheral interface for AT-compatible computers ("ATA, advanced technology attached"), serial ATA ( "SATA, serial ATA"), universal serial bus ("USB, universal serial bus"), Thunderbolt, FireWire, various video buses, etc. I/O interface 150 may be configured to implement only one interface or bus technology. Alternatively, I/O interface 150 may be configured to implement multiple interfaces or bus technologies. Interface 150 I/O can be implemented as part of the system bus 12 0 as a whole or work in conjunction with it. I/O interface 150 may include one or more buffers for buffering transmissions between one or more external devices, internal devices, computer, or processor 120.

[0026] The I/O interface 120 may connect the computer to a variety of input devices, including mice, touch screens, scanners, electronic digitizers, sensors, receivers, touchpads, trackballs, cameras, microphones, keyboards, any other pointing devices, or any of them. combinations. The 120 I/O interface can connect the computer to a variety of output devices, including video displays, speakers, printers, projectors, tactile feedback devices, automation, robotic components, actuators, motors, fans, electromagnets, valves, pumps, transmitters, signal emitters , lamps, etc.

[0027] Computer 100 may operate in a networked environment using logical connections through NIC 160 to one or more other systems or computers on the network. Said network may include wide area networks (WANs), local area networks (LANs, local area networks), intranets, the Internet, wireless access networks, wired networks, mobile networks, telephone networks, optical networks, or combinations thereof. The network can be packet-switched, circuit-switched, any topology, and can use any communication protocol. Communication channels within a network may include various digital or analog communications media such as fiber optic cables, free space optics, waveguides, electrical conductors, wireless links, antennas, RF communications, and so on.

[0028] The processor 110 may be connected to other elements of the computing machine or various peripheral devices discussed herein through the system bus 120. It should be understood that the system bus 120 may be inside the processor 110, outside the processor 110, or both. . In some embodiments, any of the processors 110, other elements of the computer, or various peripherals discussed herein may be integrated into a single device, such as a system on a chip ("SOC, system on chip"), system in a package ( "SOP, system on package") or an ASIC device.

[0029] Embodiments may comprise a computer program that performs the functions described and illustrated herein, the computer program embodied on a computer system that contains instructions stored on a computer-readable medium, and a processor that executes those instructions. However, it should be apparent that there may be many different ways to implement the embodiments in computer programming, and the embodiments should not be construed as being limited to any one set of computer program instructions unless otherwise disclosed for the exemplary embodiment. In addition, an experienced programmer will be able to write such a computer program to implement an embodiment of the disclosed embodiments based on the accompanying block diagrams, algorithms, and associated description in the application text. Therefore, disclosure of a specific set of program code instructions is not considered necessary for an adequate understanding of how to create and use embodiments. In addition, those skilled in the art will appreciate that one or more aspects of the embodiments described herein may be implemented in hardware, software, or combinations thereof, which may be implemented on one or more computing systems. Also, any reference to an action performed by a computer should not be construed as being performed by a single computer, since an action may be performed by more than one computer.

[0030] The exemplary embodiments described herein may be used with computer hardware and software that perform the processing methods and functions described previously. The systems, methods, and procedures described herein may be embodied in a programmable computer, computer-executable software, or digital circuitry. Said software may be stored on a computer-readable medium. For example, computer-readable media may include floppy disk, RAM, ROM, hard disk, removable media, flash memory, memory card, optical media, magneto-optical media, CD-ROM, and so on. Digital circuits may include integrated circuits, gate arrays, building block logic, field programmable gate arrays (FPGAs), etc.

[0031] The exemplary systems, methods, and actions described in the embodiments presented above are illustrative, and in alternative embodiments, certain actions may be performed in a different order, parallel to each other, omitted entirely, and/or combined between the various representations. exemplary embodiments, and/or certain additional actions may be performed without departing from the scope and spirit of the various embodiments. Accordingly, such alternative embodiments are included in the description herein.

[0032] As used herein, the singular forms "a", "an", and "the" are intended to include plural forms as well, unless the context clearly indicates otherwise. In addition, it will be understood that the terms "comprises" and/or "comprising", when used in this specification, determine the presence of the claimed features, integers, steps, operations, elements and/or components, but do not exclude the presence or addition of one or more other functions, integers, steps, operations, elements, components, and/or groups thereof. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items. As used herein, phrases such as "in the range of X to Y" and "in the range of about X to Y" should be interpreted to include X and Y. As used herein, phrases such as "in the range of about X to Y" means "in the range from about X to about Y". As used herein, phrases such as "from about X to about Y" mean "from about X to about Y".

[0033] As used herein, the term "hardware" may include a combination of discrete components, an integrated circuit, an ASIC, a field programmable gate array, or other suitable hardware. As used herein, the term "software" may include one or more objects, agents, threads, lines of code, routines, individual software applications, two or more lines of code, or other suitable software structures operating in two or more software applications, on one or more processors (where the processor contains one or more microcomputers or other suitable data processing units, memory devices, input/output devices, displays, data input devices such as a keyboard or mouse, peripheral devices such as printers and speakers, associated drivers, control cards, power supplies, networking devices, docking stations or other suitable devices running software systems in conjunction with a processor or other devices), or other suitable software structures. In one exemplary embodiment, the software may include one or more lines of code or other suitable program structures running on a general purpose software application, such as an operating system, and one or more lines of code or other suitable program structures. running in a special purpose software application. As used herein, the term "connect" and related terms such as "connect" and "connected" may include a physical connection (e.g., a copper conductor), a virtual connection (e.g., through randomly assigned memory locations of a data storage device) , a logical connection (for example, through the logic gates of a semiconductor device), other suitable connections, or a suitable combination of such connections. The term "data" may refer to a suitable structure for using, transmitting, or storing data, such as a data field, a data buffer, a data message having a data value and sender/destination address data, a control message having a data value, and one or more statements. that cause the receiving system or component to perform a function using that data, or other suitable electronic data processing hardware or software components.

[0034] In general, a software system is a system that runs on a processor to perform predetermined functions in response to predetermined data fields. For example, a system may be defined by the function it performs and the data fields for which it performs the function. As used herein, the NAME system, where NAME is typically the name of a generic function that is performed by the system, refers to a software system that is configured to run on a processor and to perform the disclosed function on the disclosed data fields. Unless a specific algorithm is disclosed, then any suitable algorithm that would be known to a person skilled in the art for performing a function using the associated data fields is considered to fall within the scope of this disclosure. For example, a messaging system that generates a message that includes a sender address field, a recipient address field, and a message field would include software running on a processor that can derive the sender address field, the recipient address field, and the message field from a suitable processor system or device, such as a buffer device or buffer system, can assemble the sender address field, the recipient address field, and the message field into a suitable electronic message format (e.g., an email message, a TCP/IP message, or any other suitable message format that has sender address field, recipient address field, and message field) and can transmit an electronic message using electronic messaging systems and processor devices through a communication medium such as a network. A person skilled in the art will be able to provide specific coding for a specific application based on the foregoing disclosure, which is intended to set forth exemplary embodiments of the present disclosure, and not to provide a tutorial for someone with less than normal skill in the art. e.g. someone who is not familiar with programming or processors in a suitable programming language. The specific algorithm for executing a function may be provided in flowchart or other suitable formats, where data fields and related functions may be set out in an exemplary order of operations, where the order may be changed as appropriate and is not intended to be limiting if this is not explicitly listed as a limitation.

[0035] The embodiments disclosed above have been presented for purposes of illustration and to enable one of ordinary skill in the art to practice the disclosure, but the disclosure is not intended to be exhaustive or limited to the forms disclosed. Many minor modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the disclosure. The scope of the claims is intended to broadly cover the disclosed embodiments and any such modifications. In addition, the following paragraphs represent additional embodiments of the present disclosure and are to be construed within the scope of this disclosure:

[0036] Claim 1, a downhole barrier device for use in wellbore operations, said device comprising: a housing having a structure; and a tear layer formed with the body and having a different structure;

[0037] Claim 2, the downhole barrier device of claim 1, wherein the body and fracture layer are integrally formed using a laser melting process;

[0038] Item 3, the downhole barrier device according to item 2, characterized in that the body and the fracture layer are formed having a density of more than 98 percent;

[0039] Claim 4, the downhole barrier device of claim 2, wherein the laser melting process is performed using a 3D printing process;

[0040] Item 5, the downhole barrier device according to item 2, characterized in that other designs are selected from a plurality of designs;

[0041] Item 6, the downhole barrier device according to item 5, characterized in that the set of structures includes at least two of the following: at least one fabricated stress concentration; at least one thickness option less than the thickness of the structure; sealing layer, support layer and flow hole; and at least one shape selected from a disc shape, a pinched shape, a wrinkled shape, and a curved shape;

[0042] Item 7, the downhole barrier device according to item 1, characterized in that it is formed using a metal selected from a combination of metals;

[0043] Claim 8, the downhole barrier device of claim 7, wherein the metal is selected based on the operational application of the downhole barrier device;

[0044] Claim 9, a method of manufacturing a downhole barrier device for use in wellbore operations, the method including: providing a housing structure; creation of a discontinuous layer structure; and creating a downhole barrier device casting, in which the fracture layer is formed with the body using the structure of the body and the structure of the fracture layer;

[0045] Item 10, the method according to item 9, characterized in that the body and the tear layer are formed as a whole using a laser melting process;

[0046] Item 11, the method according to item 10, characterized in that the body and the tear layer are designed and formed having a density of more than 98 percent;

[0047] Item 12, the method of item 10, wherein the laser melting process is performed using a 3D printing process;

[0048] Claim 13, the method of claim 9, wherein creating a casting using a body structure and a tear layer design includes creating at least two of the following: at least one stress concentration; at least one thickness option for the rupture layer, wherein at least one thickness option is less than the body thickness; sealing layer, support layer and flow hole; and at least one shape selected from a disc shape, a pinched shape, a wrinkled shape, and a curved shape;

[0049] Item 14, the method according to item 9, characterized in that the downhole barrier device is formed using a metal selected from a combination of metals;

[0050] Claim 15, the method of claim 14, wherein the metal is selected based on the operational application of the downhole barrier device;

[0051] Claim 16, a method of using a downhole barrier device to activate a downhole tool, including: installing an integrally formed barrier body and a fracture layer in a wellbore; creating a break in the tear layer in response to the application of force to the tear layer;

[0052] Claim 17, the method of claim 16, wherein the barrier body and the rupture layer are integrally formed using a laser melting process;

[0053] Item 18, the method of item 16, wherein the laser melting process is performed using a 3D printing process;

[0054] Claim 19, the method of claim 16, wherein the downhole barrier device is formed using a metal selected from a plurality of metals and selected based on the operational application of the downhole barrier device; And

[0055] Item 20, the method of item 16, wherein the downhole tool is one of a packer and a replaceable sleeve.

Claims (36)

1. Downhole barrier device for use in operations in the wellbore, containing: a body having a structure; And a rupture layer formed with the body and having a different design, while the body has a first side containing an opening adjacent to the rupture layer, and the first side of the body and the adjacent rupture layer are made with the possibility of breaking at a lower pressure than the opposite side of the body, while the body and the tear layer are formed as a single unit. 2. Downhole barrier device according to claim 1, characterized in that the body and the fracture layer are formed as a whole using a laser melting process; and optionally characterized in that the body and the fracture layer are formed having a porosity of less than 2 percent; and optionally characterized in that the laser melting process is performed using a 3D printing process; and optionally characterized in that other designs are selected from a set of designs. 3. Downhole barrier device according to claim 2, characterized in that the set of structures includes at least two of the following: at least one fabricated stress concentration; at least one thickness option less than the thickness of the structure; sealing layer, support layer and flow hole; And at least one shape selected from a disc shape, a pinched shape, a wrinkled shape, and a curved shape. 4. Downhole barrier device according to claim 1, characterized in that it is formed using a metal selected from a combination of metals; and optionally characterized in that the metal is selected based on the operational application of the downhole barrier device. 5. A method of manufacturing a downhole barrier device for use in operations in a wellbore, including: creation of the hull structure; creation of a discontinuous layer structure; And creating a casting of a downhole barrier device, in which the fracture layer is formed with the body using the structure of the body and the design of the fracture layer, while the body has a first side containing an opening adjacent to the fracture layer, moreover, the first side of the body and the adjacent rupture layer are made with the possibility of rupture at a lower pressure than the opposite side of the body, while the body and the rupture layer are formed as a whole. 6. The method according to claim 5, characterized in that the body and the tear layer are formed as a single unit using a laser melting process. 7. The method of claim 6, wherein the body and fracture layer are designed and formed to have a porosity of less than 2 percent. 8. The method according to claim 6, characterized in that the laser melting process is performed using a 3D printing process. 9. The method of claim. 5, characterized in that the creation of a casting using the design of the body and the design of the tear layer includes the creation of at least two of the following: stress concentrations; at least one thickness option for the rupture layer, wherein at least one thickness option is less than the body thickness; sealing layer, support layer and flow hole; And at least one shape selected from a disc shape, a pinched shape, a wrinkled shape, and a curved shape. 10. The method according to p. 5, characterized in that the downhole barrier device is formed using a metal selected from a combination of metals; and optionally characterized in that the metal is selected based on the operational application of the downhole barrier device. 11. A method of using a downhole barrier device to activate a downhole tool, including: installation of integrally formed barrier housing and fracture layer in the wellbore, wherein the housing has a first side containing an opening adjacent to the fracture layer, the first side of the barrier body and the adjacent rupture layer being ruptured at a lower pressure than the opposite side of the body; creating a tear in the tear layer in response to the application of force to the tear layer. 12. The method of claim. 11, characterized in that the barrier body and the tear layer are formed as a whole using a laser melting process. 13. The method of claim. 11, characterized in that the laser melting process is performed using a 3D printing process. 14. The method of claim. 11, characterized in that the downhole barrier device is formed using a metal selected from a combination of metals, and selected based on the operational use of the downhole barrier device. 15. The method of claim. 11, characterized in that the downhole tool is one of a packer and a replaceable sleeve.

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