RU2788435C2 - Optical element, system and method for monitoring of optical element, active light-emitting module and terminal device - Google Patents

Abstract

FIELD: optics.

SUBSTANCE: invention relates to an optical element, a method, and a system for monitoring of an optical element. According to the invention, monitoring is carried out in real time to determine, whether the optical element, such as a diffraction optical element or a diffusor in an active light-emitting module, is damaged, and a laser is turned off, when the optical element is damaged or operates inefficiently, thereby avoiding seepage of laser light. The system for monitoring of the optical element includes sequentially connected optical element (11) and microprocessor (13), power supply source (2), and laser (12). In optical element (11), detection line (11-1) is located, and two ends of detection line (11-1) are connected to microprocessor (13). Microprocessor (13) is made with the possibility of: tracking of a resistance value of detection line (11-1) or a voltage value at two ends of detection line (11-1) in real time, determination, based on the tracked resistance value or voltage value, whether optical element (11) is damaged or operates inefficiently, and, when determining that optical element (11) is damaged or operates inefficiently, control of power supply source (2) for termination of power supply to laser (12).

EFFECT: obtainment an optical element and a method and a system for its monitoring.

14 cl, 23 dwg

Description

The field of technology to which the invention belongs

The present invention relates to the field of electronic terminal technology and, in particular, to an optical element, a system and method for monitoring an optical element, an active light emitting module and a terminal device.

State of the art

Currently, 3D recognition technology is the most attractive area of research in an electronic terminal device (for example, a mobile phone). 3D recognition technology is an advanced level recognition technology that can be used to further improve the face recognition or iris recognition function, and improve the face and object recognition function of the endpoint camera, and apply functions such as augmented reality, gaming, and self-driving .

To implement the 3D recognition function, active light emitting modules are integrated into the terminal device, which have the functions to emit structured light and TOF (Time of Flight, signal transit time). This type of active light emitting module typically includes a high power laser. The laser actively emits light and projects light on the human face to realize the face recognition function. Since the laser emits laser light, in order to prevent injury to the human eye caused by laser light, an optical element configured to emit dispersed light or diffuse light, such as a diffractive optical element (Diffractive Optical Element, DOE for short) or diffuser (Diffuser).

However, if an optical element such as a diffractive optical element or a diffuser is damaged or ineffective, laser light may leak out emitted by a powerful laser.

The essence of the invention

The present invention relates to an optical element, an optical element monitoring system and method, an active light emitting module, and a terminal device for real-time monitoring of an abnormal condition in which an optical element such as a diffractive optical element or a diffuser in an active light emitting module is damaged or ineffective, and turns off laser when the optical element is damaged or ineffective, thus avoiding laser light leakage.

To solve the above technical problem in the present invention, the following technical solutions are used.

The first aspect of the present invention provides an optical element including a substrate and a detection line located on a surface on one side of the substrate. The detection line is configured to transmit an electrical signal.

Thus, an optical element is applied to the active light emitting module, the two ends of the detection line are connected to the microprocessor of the active light emitting module using connecting wires, and the microprocessor is used to monitor the resistance value of the detection line or the voltage value of the two ends of the detection line in real time. When the resistance value of the detection line or the voltage value at the two ends of the detection line changes abnormally, this fact indicates that the detection line is faulty, or the connection between the detection line and the connecting wire is open. Therefore, it can be determined that the optical element to which the detection line is attached is damaged or ineffective. In this case, a microprocessor is used to control the laser of the active light emitting unit to effectively prevent injury to the human eye caused by laser light emitted from the laser when the optical element is damaged or ineffective. Additionally, only one optical element and detection line need be used in this solution (that is, only one conductive layer is required). Therefore, the structure is simple, the production process is simple, and the cost is relatively low.

With reference to the first aspect, in a possible implementation, the material of the detection line is a transparent conductive material to prevent shielding of light emitted by the laser.

Optionally, the detection line material includes any one or more of indium tin oxide, indium gallium zinc oxide, zinc indium tin oxide, and the like.

With reference to the first aspect, in a possible implementation, the surface of the substrate and on which the detection line is located is equally divided into a plurality of regions, and each of the regions is covered by at least one segment of the detection line. Thus, the detection line covers all areas of the optical element as much as possible to ensure fault monitoring in each area or even all areas of the optical element, thereby improving monitoring accuracy.

It is possible that the coverage areas of the detection line in the areas are the same. It is possible that the widths of the detection line in the regions are the same. Perhaps the gaps between adjacent parts of the detection line are the same. Thus, monitoring accuracy and sensitivity can be further improved.

With reference to the first aspect, in an exemplary implementation, the detection line extends in a curved line shape or a helical line shape, so that the detection line covers all possible areas of the optical element.

With reference to the first aspect, in a possible implementation, the optical element further includes a conductive spacer located on the surface of the same side of the substrate on which the detection line is located, and the conductive spacer is located at the end of the detection line and is electrically connected to the end of the detection line. Thus, the connecting wire can be electrically connected to the detection line using a conductive gasket.

It is possible that the material of the conductive pad matches the material of the detection line, so that the conductive pad and the detection line are formed at the same time in one step, thereby simplifying the preparation step.

Possibly, the optical element further includes a protective layer covering the detection line, and a hole for exposure of the conductive spacer is located on the protective layer. Thus, the protective layer can protect the detection line and the located opening can facilitate the electrical connection between the end of the detection line or the conductive gasket and the connecting wire.

The second aspect of the present invention provides an active light emitting module. The active light emitting module includes a module housing, a laser, a microprocessor, an optical element, and connecting wires. The module body includes a bottom substrate and a side wall. The laser and microprocessor are mounted on the bottom substrate. The optical element is mounted at one end which has a side wall and is spaced from the bottom substrate, and the optical element is any of the above-mentioned optical elements. The connecting wires are configured to connect the two ends of the detection line of the optical element to the microprocessor. The microprocessor is configured to: monitor the resistance value of the detection line or the voltage value at the two ends of the detection line in real time to determine, based on the monitored resistance value or voltage value, whether the optical element is damaged or does not work effectively, and control, when determining that the optical element damaged or ineffective by turning off the laser to effectively prevent injury to the human eye caused by laser light emitted by the laser when the optical element is damaged or ineffective.

With reference to the second aspect, in a possible implementation, the connecting wire extends from the end of the detection line to the microprocessor inside the side wall. Alternatively, the connecting wire extends from the end of the detection line to the microprocessor on the inner surface of the side wall. Alternatively, a connecting wire extends from the end of the detection line to the microprocessor on the outer surface of the side wall. Thus, the detection line is connected to the microprocessor.

With reference to the second aspect, in a possible implementation, the active light emitting module further includes a conductive electrode disposed at the connection between the detection line end and the connection wire, and the conductive electrode is configured to electrically connect the detection line end to the connection wire for electrically connecting the detection line. with connecting wire.

It is possible that the conductive electrode material is a conductive silver paste or solder tin. Therefore, the production process is simple and easy to implement.

The third aspect of the present invention provides a terminal device. The terminal device includes any of the above active light emitting modules. The active light emitting module can generate the same beneficial effect as the active light emitting module provided in the second aspect of the present invention. The details are again not described.

A fourth aspect of the present invention provides an optical element monitoring system. The optical element monitoring system includes a microprocessor, a power supply, and a laser connected in series. The optical element monitoring system further includes any of the above-mentioned optical elements, and the two ends of the optical element detection line are connected to the microprocessor. The microprocessor is configured to: monitor the resistance value of the detection line or the voltage value at the two ends of the detection line in real time to determine, based on the monitored resistance value or voltage value, whether the optical element is damaged or does not work effectively and, when determining that the optical element is damaged or ineffective, control the power supply to stop powering the laser and turn off the laser accordingly to effectively prevent injury to the human eye caused by laser light when the optical element is damaged or ineffective.

The fifth aspect of the present invention provides a method for monitoring an optical element. The optical element monitoring method is applied to the above-mentioned optical element monitoring system, and the optical element monitoring method includes the following steps: the microprocessor monitors the resistance value of the detection line in real time. The microprocessor determines whether the monitored resistance value exceeds the specified resistance threshold range, and if the monitored resistance value exceeds the specified resistance threshold range, the microprocessor controls the power supply to stop powering the laser; or, if the monitored resistance value does not exceed the specified resistance threshold range, the microprocessor monitors the detection line resistance value at the next instant. The specified resistance threshold range is a numerical range that fluctuates up and down around the resistance value when the detection line is intact. According to the optical element monitoring method, an abnormal state in which an optical element in an active light emitting module is damaged or inefficient is monitored in real time, and the laser can be turned off when the optical element is damaged or inefficient to prevent laser light from leaking out.

With reference to the fifth aspect, in a possible implementation that the microprocessor monitors the resistance value at the two ends of the detection line in real time includes the following steps: the microprocessor monitors the voltage value at the two ends of the detection line in real time. The microprocessor converts the monitored voltage value into a resistance value. Thus, a concrete solution is provided to monitor the resistance value of the detection line in real time.

A sixth aspect of the present invention provides a method for monitoring an optical element. The optical element monitoring method is applied to the above optical element monitoring system, and the optical element monitoring method includes the following steps: the microprocessor monitors the voltage value of the two ends of the detection line in real time. The microprocessor determines whether the monitored voltage value exceeds the specified voltage threshold range, and if the monitored voltage value exceeds the specified voltage threshold range, the microprocessor controls the power supply to stop supplying power to the laser; or, if the monitored voltage value does not exceed the specified voltage threshold range, the microprocessor monitors the voltage value at the two ends of the detection line at the next moment. The specified voltage threshold range is a numerical range that fluctuates up and down around the voltage value at the two ends of the detection line when the detection line is intact. According to the optical element monitoring method, an abnormal state in which an optical element in an active light emitting module is damaged or inefficient is monitored in real time, and the laser can be turned off when the optical element is damaged or inefficient to prevent laser light from leaking out.

Brief description of the drawings

Fig. 1 is a diagram of a terminal device in accordance with an embodiment of the present invention;

2 is a diagram of an implementation scenario for an optical element monitoring system according to an embodiment of the present invention;

Fig. 3 is a partially enlarged diagram of Fig. 2;

Fig. 4a is a diagram of a typical structure of an active light emitting module;

Fig. 4b is a plan view of a support member in an active light emitting module;

Fig. 5a is an architectural diagram of an optical element monitoring system according to an embodiment of the present invention;

Fig. 5b is a diagram of an optical element monitoring system according to an embodiment of the present invention;

6 is a first diagram of a detection line in an optical element monitoring system according to an embodiment of the present invention;

7a to 7c are three design diagrams of detection line patterns in an optical element monitoring system according to an embodiment of the present invention;

8 is a second diagram of a detection line in an optical element monitoring system according to an embodiment of the present invention;

9a to 9c are three diagrams of an active light emitting module according to an embodiment of the present invention;

Fig. 10 is a cross-sectional view of an optical element according to an embodiment of the present invention;

Fig. 11a - Fig. 11d are plan views of film layers in an optical element according to an embodiment of the present invention;

12 is a first flowchart of an optical element monitoring method according to an embodiment of the present invention;

13 is a second flowchart of an optical element monitoring method according to an embodiment of the present invention; and

14 is a third flowchart of an optical element monitoring method according to an embodiment of the present invention.

Description of Embodiments

The following terms "first" and "second" are merely for purposes of description and should not be understood as indicating or meaning the relative importance or implicit indication of the number of said technical features. Therefore, a feature limited to "first" or "second" may explicitly or implicitly include one or more features. In the descriptions of embodiments of the present invention, unless otherwise indicated, "multiple" means two or more than two.

Embodiments of the present invention provide an optical element monitoring system and monitoring method. The optical element monitoring system and monitoring method can be applied to any terminal device such as mobile phone, wearable device, AR (augmented reality)/VR (virtual reality) device, tablet computer, laptop, UMPC (ultra mobile personal computer), netbook or PDA (personal digital assistant). This is not limited in the embodiments of the present invention.

As shown in Fig. 1 and Fig. 2, the terminal device in the embodiments of the present invention may be a mobile phone 100. The following is a detailed description using the embodiments of the mobile phone 100 as an example.

As shown in FIG. 1, mobile phone 100 may specifically include components such as a processor 101, a radio frequency (RF) circuit 102, a memory 103, a touch screen 104, a Bluetooth device 105, one or more sensors 106, Wi- Fi device 107, positioning device 108, audio circuit 109, peripheral interface 110, and power supply device 111. These components may communicate using one or more communication buses or signal cables (not shown in FIG. 2). A person skilled in the art can understand that the equipment structure shown in Fig. 2 is not a limitation of the structure of the mobile phone, and the mobile phone 100 may include more or fewer components than in the drawing, or combine some components or have different component arrangements. .

Next, with reference to FIG. 1, a specific description will be given of each component of the mobile phone 100.

The processor 101 is the control center of the mobile phone 100, which is connected to various parts of the mobile phone 100 using various interfaces and lines, and performs various functions and data processing of the mobile phone 100 by executing an application program (application) stored in the memory 103 and by calling data stored in memory 103. In some embodiments, processor 101 may include one or more processing units. For example, processor 101 may be a Kirin chip manufactured by Huawei Technologies Co., Ltd.

The RF circuit 102 may be configured to receive and send radio signals while receiving and sending information, or during a call. In particular, the RF circuit 102 may receive the downlink data from the base station and then send the downlink data to the processor 101 for processing. Additionally, the RF circuit 102 sends uplink data to the base station. Typically, the RF circuitry includes, but is not limited to, an antenna, at least one amplifier, a transceiver, a coupler, a low noise amplifier, a duplexer, and the like. Additionally, RF circuitry 102 may further communicate with another device via wireless communication. Wireless communications may be implemented using any standard communications or protocol including, but not limited to, Global System for Mobile Communications, Public Packet Radio, Code Division Multiple Access, Wideband Code Division Multiple Access, Long Term Evolution standard. , email, short message service, and the like.

The memory 103 is configured to store an application program and data. The processor 101 performs various functions and data processing of the mobile phone 100 by running an application program and data stored in the memory 103. The memory 103 mainly includes a program storage area and a data storage area. The program storage area may store an operating system, an application program required for at least one function (for example, a sound reproduction function and an image reproduction function). The data storage area may store data (for example, audio data and a phone book) generated during use of the mobile phone 100. Additionally, the memory 103 may include a high-speed random access memory, and may further include a read-only memory such as a magnetic storage device. disk, flash drive, or other permanent solid-state storage device. The memory 103 can store various operating systems, such as an iOS operating system developed by Apple and an Android operating system developed by Google.

The touch screen 104 may include a touch panel 104-1 and a display 104-2. The touch panel 104-1 can receive a touch event performed by a user of the mobile phone 100 on or near the touch panel 104-1 (for example, an operation performed by a user on the touch panel 104-1 or near the touch panel 104-1 using any suitable object such as a finger or a stylus) and send the collected sensory information to another component such as the processor 101.

A touch event performed by a user in the vicinity of the touch pad 104-1 may be referred to as a floating touch. Floating touch may mean that the user does not need to directly touch the touchpad to select whether to move the target object (eg icon), but only needs to be near the terminal device to perform the desired function. In the floating touch application scenario, terms such as "touch" and "contact" do not imply direct contact with the touch screen, but represent contact next to or close to the touch screen.

In particular, two types of capacitive sensors, that is, a mutual capacitance sensor and an intrinsic capacitance sensor, can be disposed on the touch panel 104-1. The two types of capacitive sensors may alternately be located on the touch panel 104-1 in the array. The mutual capacitance sensor is configured to realize conventional multipoint touch detection, that is, to detect a user's gesture when the user contacts the touch panel 104-1. The self capacitance sensor can generate a signal that is stronger than the signal generated by the mutual capacitance sensor to determine the sensitivity of the finger at a distance from the touch panel 104-1. Therefore, when the user's finger is above the screen, since the signal generated by the self capacitance sensor is stronger than the signal generated by the mutual capacitance sensor, the mobile phone 100 can detect the user's gesture above the screen, for example, 20 mm above the touch panel 104-1.

It is possible that the touch panel 104-1 on which the floating touch can be performed can be implemented in capacitive type, infrared type, ultrasonic wave type, or the like. Further, the touch panel 104-1 can be implemented in a variety of types such as resistive type, capacitive type, infrared type, and surface acoustic wave type. The display 104-2 may be configured to display information entered by the user or information provided to the user and various menus of the mobile phone 100. The display 104-2 may be a liquid crystal display, an OLED, or the like. The touch panel 104-1 may cover the display 104-2. Upon detecting a touch event on or near the touch pad 104-1, the touch pad 104-1 transmits the touch event to the processor 101 to determine the type of touch event. The processor 101 may then provide the appropriate visual output on the display 104-2 based on the type of touch event.

1, touch panel 104-1 and display 104-2 are used as two independent components to implement the input and output functions of mobile phone 100. However, in some embodiments, touch panel 104-1 and display 104-2 may be integrated to implementing the I/O functions of the mobile phone 100.

Obviously, the touch screen 104 is formed by stacking multiple layers of materials. In this embodiment of the present invention, only a touch panel (layer) and a display screen (layer) are provided, and there are no other layers in this embodiment of the present invention. Additionally, in some other embodiments of the present invention, the touch panel 104-1 may cover the display 104-2, and the size of the touch panel 104-1 is larger than the size of the display 104-2, such that the display 104-2 is completely covered by the touch panel 104-1 . Alternatively, the touch panel 104-1 may be located on the front side of the mobile phone 100 in full form, that is, any touch of the user on the front side of the mobile phone 100 can be detected. Full touch input on the front side of the mobile phone can be realized. In some other embodiments, the touchpad 104-1 is located on the front side of the mobile phone 100 in full format, and the display 104-2 may also be located on the front side of the mobile phone 100 in full format. It can realize the structure without casing on the front side of the mobile phone.

In this embodiment of the present invention, the mobile phone 100 may further have a fingerprint recognition function. For example, the fingerprint collector 112 may be located on the back of the mobile phone 100, or the fingerprint collector 112 may be located on the front side (eg, below the touch screen 104) of the mobile phone 100. In another example, the fingerprint collector 112 may be located on the touch screen 104 to realize the fingerprint recognition function. In other words, the fingerprint collector 112 may be integrated with the touch screen 104 to realize the fingerprint recognition function of the mobile phone 100. In this case, the fingerprint collector 112 is located in the touch screen 104 and may be part of the touch screen 104 or may be located on touch screen 104 in another way. Additionally, the fingerprint collector 112 may alternatively be implemented as a full-length fingerprint collector. Therefore, the touch screen 104 can be considered as a panel on which fingerprint recognition is performed at any position. The fingerprint collector 112 may send the collected fingerprint data to the processor 101 so that the processor 101 processes the fingerprint data (eg, performs fingerprint verification). The main component of the fingerprint collecting device 112 in this embodiment of the present invention is a fingerprint sensor. The fingerprint sensor may use any type of information detection technology, including but not limited to optical sensitivity technology, capacitive touch technology, piezoelectric sensitivity technology, ultrasonic sensitivity technology, or the like.

The mobile phone 100 may further include a Bluetooth device 105 configured to implement data communication between the mobile phone 100 and another terminal device over a short distance (eg, a mobile phone or smartwatch). The Bluetooth device 105 in this embodiment of the present invention may be an embedded circuit, a Bluetooth chip, or the like.

The mobile phone 100 may further include at least one type of sensor 106 such as a light sensor, a motion sensor, an image sensor, and another sensor. In particular, the light sensor may include an ambient light sensor and a proximity sensor. The ambient light sensor may adjust the brightness of the display screen of the touch screen 104 based on the brightness of the ambient light, and the proximity sensor may turn off the display screen when the mobile phone 100 is moved to the ear. As a type of motion sensor, an accelerometer sensor can detect acceleration amounts in various directions (mainly three axes), can detect the magnitude and direction of gravity in a static state, and can be used for an application identifying the position of a mobile phone (such as switching between landscape orientation and portrait orientation, associated magnetometer calibration) and a function associated with vibration identification (eg, pedometer and knock), or the like. Additionally, other sensors such as a gyroscope, a barometer, a hydrometer, a thermometer, and an infrared sensor may be installed in the mobile phone 100. Detailed description omitted.

The Wi-Fi device 107 is configured to allow mobile phone 100 to access a network that conforms to a standard protocol associated with Wi-Fi. Mobile phone 100 can access a Wi-Fi hotspot using Wi-Fi device 107 to enable a user to receive and send e-mail, surf a web page, access streaming media, and the like. The Wi-Fi device 107 provides wireless broadband Internet access to the user. In some other Wi-Fi embodiments, the Wi-Fi device 107 may also serve as a Wi-Fi wireless access point and may provide Wi-Fi access to another terminal device.

The positioning device 108 is configured to provide geographic location data of the mobile phone 100. Obviously, the positioning device 108 may be specifically a positioning system receiver such as a global positioning system (GPS), BeiDou navigation satellite system, or Russian GLONASS. After receiving the geographic location sent by the positioning system, the positioning device 108 sends the information to the processor 101 for processing or sends the information to the memory 103 for storage. In some other embodiments, positioning device 108 may alternatively be an assisted global positioning system (AGPS) receiver. The AGPS serves as an auxiliary positioning server to assist the positioning device 108 in ranging and positioning services. In this case, the auxiliary positioning server provides positioning assistance by communicating with the positioning device 108 (ie, the GPS receiver) of the terminal device such as the mobile phone 100 via a wireless communication network. In some other embodiments, positioning device 108 may alternatively implement positioning technology based on a Wi-Fi access point. Because each Wi-Fi access point has a globally unique Media Access Control (MAC) address, the end device can scan for and receive broadcast signals from surrounding Wi-Fi access points when Wi-Fi is on and therefore can get the MAC address that the Wi-Fi hotspot is broadcasting. The terminal device sends to the location server, via the wireless communication network, data (eg MAC address) that can identify the Wi-Fi access point. The location server retrieves the geographic location data of each Wi-Fi access point, calculates the geographic location of the terminal device with reference to the strength of the Wi-Fi broadcast signal, and sends the geographic location data of the terminal device to the positioning device 108 of the terminal device.

The audio circuit 109, the speaker 113 and the microphone 114 can provide an audio interface between the user and the mobile phone 100. The audio circuit 109 can supply the speaker 113 with an electrical signal converted from the received audio data, and the speaker 113 converts the electrical signal into an audio signal to output sound. Further, the microphone 114 converts the collected audio signal into an electrical signal, and the audio circuit 109 receives the electrical signal, converts the electrical signal into audio data, and then outputs the audio data to the RF circuit 102 to send the audio data to, for example, another mobile phone, or outputs the audio data to the memory 103 for additional processing.

Peripheral interface 110 is configured to provide various interfaces for external input/output devices (eg, keyboard, mouse, external display, external memory, and subscriber identity module). For example, a mouse is connected using a Universal Serial Bus (USB), and a Subscriber Identity Module (SIM) card provided by China Telecom is connected using a metal contact in the Subscriber Identity Module card. Peripheral interface 110 may be configured to connect the aforementioned I/O peripheral to processor 101 and memory 103.

The mobile phone 100 may further include a power supply device 111 (eg, a battery and a power management chip) that supply power to each component. The battery may be logically connected to the processor 101 using the power management chip to implement functions such as charge control, discharge control, and power management using the power supply device 111.

Although not shown in FIG. 1, the mobile phone 100 may further include a camera (front and/or rear camera), a flash, a micro projection device, a near field communication (NFC) device, and the like. Detailed description in the present invention is omitted.

A 3D recognition module, such as the mobile phone 100, may be integrated into the terminal device so that the terminal device implements the 3D recognition function. A conventional digital camera can only capture a flat color image without image depth information. This means that when seeing a photograph, the user only knows the width and height of the person's face, but does not know the 3D structure of the person's face, such as the height of the bridge of the nose relative to the cheek and the depth of the eye socket relative to the cheek. Image depth information is acquired through 3D recognition so that the terminal device can realize face recognition or gesture control. For example, the mobile phone is unlocked by recognizing the user's face, or when the user performs a swipe gesture in front of the mobile phone, the terminal device can be controlled to delete the email message.

The following two technologies are mainly used to implement 3D recognition.

(1) ToF (Time of Flight) technology: A high-power laser, such as VCSEL (Vertical Cavity Surface Emitting Laser) is used to emit infrared laser light to the surface of an object, the laser light is reflected onto surface of the object and the reflected laser light is captured by an infrared image sensor. Since the speed of light of the laser light is known, an infrared image sensor can be used to measure the reflection time of the laser light at different depth locations on the surface of an object, and distances (depths) of various locations on the surface of the object can be obtained by calculation.

(2) Structured Light Technology: A laser is used to obtain different patterns of light (where light with a specific structure is called structured light). After being projected onto the surface of an object, the light patterns are reflected at different depth locations on the surface of the object, and the reflected light patterns are distorted. For example, the light of a linear strip that is emitted by a laser is projected onto a finger. Since the surface of the finger has a three-dimensional arcuate shape, the strip reflected by the arcuate surface of the finger is an arcuate strip. After the arcuate strip is captured by the infrared image sensor, the terminal can deduce the three-dimensional structure of the finger based on the reflected arcuate strip.

As shown in FIG. 2, in an example of mobile phone 100, a 3D ToF or structured light recognition module may be located at the top of mobile phone 100, for example, at a "notch" location (namely, the AA area shown in FIG. 2) mobile phone 100.

Fig. 3 shows an example of the 3D structured light recognition module 115 in the mobile phone 100. The 3D structured light recognition module 115 is located in the mobile phone 100 in the following form. The 3D structured light recognition module 115 includes modules such as an infrared camera 115-1, a flood light device 115-2, a short distance sensor 115-3, an infrared image sensor 115-4, and a dot matrix projector 115-5. The flood light device 115-2 includes a low power laser (eg, VCSEL), a diffuser, and the like. The dot matrix projector 115-5 includes a high power laser (eg, VCEL), a diffractive optical element, and the like.

For example, the process in which the 3D structured light recognition module 115 performs the face recognition operation is as follows: when an object (for example, a face) approaches the mobile phone 100, the short distance sensor 115-3 will detect the proximity of the object to the mobile phone 100, so that the short distance sensor 115-3 sends to the processor 101 of the mobile phone 100 a signal indicating the proximity of an object. The processor 101 receives a signal indicating the approach of an object and causes the flood light device 115-2 and the low-power laser in the flood light device 115-2 to project infrared laser light onto the surface of the object. The infrared laser light projected by the flood light device 115-2 is reflected on the surface of the object, and the infrared camera 115-1 captures the infrared laser light reflected by the object surface to obtain image information of the object surface, and then downloads the acquired image information to the processor. 101. The processor 101 determines, based on the downloaded image information, whether the object approaching the mobile phone 100 is a face.

Upon determining that the object approaching the mobile phone 100 is a face, the processor 101 initiates the dot matrix projector 115-5. The high power laser in the dot matrix projector 115-5 emits infrared laser light, and a structure such as a diffractive optical element in the dot matrix projector 115-5 performs an operation on the infrared laser light to form a plurality (eg, about 30,000) of patterned light points and projects structured points of light onto the surface of the face. An array formed by structured light points is reflected in different places on the surface of the face. The infrared camera 115-1 captures patterned light points reflected by the face surface to obtain depth information of different locations on the face surface, and then downloads the acquired depth information to the processor 101. The processor 101 compares and calculates the downloaded depth information and the facial feature data of the user previously stored in the mobile phone 100 and identifies whether the face of the user of the mobile phone 100 is the person approaching the mobile phone 100, and if the person approaching the mobile phone 100 is the face of the user of the mobile phone 100, then the processor 101 unlocks the mobile phone. one hundred; or, if the person approaching the mobile phone 100 is not the face of the user of the mobile phone 100, the processor 101 leaves the mobile phone 100 in a locked state.

The 3D structured light or TOF recognition module 115 includes a module that can emit laser light, for example, a module that is in the 3D TOF recognition module that includes a high power laser, or a dot matrix projector 115-5 and a floodlight illumination device 115-2 that are in the 3D structured light recognition module 115 . This type of module is hereinafter referred to as an active light emitting module.

4a shows a typical structure of an active light emitting unit 1. The active light emitting unit 1 mainly includes an optical element 11, a laser 12, a microprocessor (MCU, Microcontroller Unit) 13, and a module case 14. The module case 14 includes a bottom substrate 14-2, a side wall 14-1, and a support member 14-3. Referring to Fig. 4b, the support member 14-3 has an annular structure and is arranged around the inner surface of the side wall 14-1 to form the hole GG. The laser 12 and the microprocessor 13 are mounted on the bottom substrate 14-2. The microprocessor 13 is connected to a processor built into the motherboard of the terminal device. For example, if the active light emitting module 1 is applied to the mobile phone 100, the microprocessor 13 of the active light emitting module 1 is connected to the processor 101 of the mobile phone 100. adhesive material 17. The microprocessor 13 is connected to the laser 12 and controls the laser 12 to emit laser light. The laser light is emitted by the active light emitting unit 1 using the optical member 11 through the hole GG. When the active light emitting module 1 is installed in the terminal device such as the mobile phone 100, the side (namely, the light emitting side) of the laser 12 in the active light emitting module 1 is close to the inside of the terminal device, and the side (namely, the light output side) of the optical element 11 faces the outer side of the terminal device for projecting laser light outward.

In the active light emitting module 1, the laser 12 may specifically be a VCSEL, a DFB (Distributed Feedback Laser), an edge emitting laser, or the like. The optical element 11 may be specifically a diffuser, a diffractive optical element, a Fresnel lens, or the like. For example, if the active light emitting module 1 is a module which is in the TOF 3D recognition module and which includes a high power laser, the optical element 11 may be specifically a diffuser. If the active light emitting module 1 is a dot matrix projector in the 3D structured light recognition module, the optical element 11 may be a special diffractive optical element (DOE). If the active light emitting module 1 is a flood light illumination device in a structured light 3D recognition module, the optical element 11 may be specifically a diffuser.

In the actual process of using the terminal device for a long time, the reliability of the active light emitting module 1 in the terminal device deteriorates over time, and the optical member 11 in the active light emitting module 1 may be damaged or may not operate effectively due to water penetration, erosion, or the like. In this case, the laser light emitted from the laser 12 in the active light emitting unit 1 is directed to the human eye, and therefore the human eye may be damaged. If the laser 12 in the active light emitting module 1 emits powerful laser light, damage to the human eye can be significant.

To solve the above problem, an embodiment of the present invention provides an optical element monitoring system. As shown in FIG. 5a, the optical element monitoring system includes an optical element 11, a laser 12, a microprocessor 13, and a power supply 2. The microprocessor 13, the power supply 2, and the laser 12 are connected in series, and the power supply 2 supplies power to the laser 12 under control. of the microprocessor 13. Note that, in the optical element monitoring system provided in this embodiment of the present invention, the "power supply 2" may be the power supply of the terminal device, such as the power supply device 111 in the mobile phone 100.

The conductive detection line 11-1 is located on the surface of the optical element 11. The two ends of the detection line 11-1 are connected to the microprocessor 13 by connecting wires 15. The microprocessor 13 monitors the resistance value of the detection line 11-1 or the voltage value at the two ends of the line 11- 1 real-time detection. The detection line 11-1, the connecting wire 15 and the microprocessor 13 form a monitoring circuit.

When the resistance value of the detection line 11-1 or the voltage value of the two ends of the detection line 11-1 changes abnormally, for example, if the resistance value of the detection line 11-1 exceeds the specified resistance threshold value range or the voltage value of the two ends of the detection line 11-1 exceeds specified voltage threshold range, it indicates that the monitoring circuit including the detection line 11-1, the connecting wire 15 and the microprocessor 13 is open, that is, the detection line 11-1 may be broken or the connection between the detection line 11-1 and connecting wire 15 is open. The detection line 11-1 may be defective because the optical member 11 to which the detection line 11-1 is attached is damaged. The connection between the detection line 11-1 and the connecting wire 15 may be broken because the optical element 11 to which the detection line 11-1 is connected does not work effectively. Upon determining that the optical element 11 is damaged or inefficient, the microprocessor 13 cuts off the power supply 2 of the laser 12, and therefore the laser 12 is turned off to effectively prevent damage to the human eye caused by the laser light emitted by the laser 12. Additionally, only one optical fiber is required in this solution. element 11 and detection line 11-1 (that is, only one conductive layer is required). Therefore, the structure is simple, the production process is simple, and the cost is relatively low.

It should be noted that when the optical element 11 is damaged or ineffective, the detection line 11-1 is damaged or the connection between the detection line 11-1 and the connecting wire 15 is broken. Therefore, in this case, the resistance value that the detection line 11-1 has and that is monitored by the microprocessor 13 becomes extremely large or even infinite (∞), or the voltage value at the two ends of the detection line 11-1 is close to or equal to the voltage value provided by microprocessor 13 for the entire monitoring circuit. The above "specified resistance threshold value range" can be set to a numerical range that fluctuates up and down around the resistance value R when the detection line 11-1 is intact. For example, the "specified resistance threshold value range" may be greater than or equal to 80% R and less than or equal to 120% R. For example, if the resistance value R obtained when the detection line 11-1 is intact is 10 kilo ohms, the "specified range resistance threshold value" can be greater than or equal to 8 kilo-ohms and less than or equal to 12 kilo-ohms. The above "specified voltage threshold range" can be set to a numerical range that fluctuates up and down around the voltage value obtained in the entire monitoring circuit when the detection line 11-1 is intact. For example, the "specified voltage threshold range" can be set to be greater than or equal to 80% U and less than or equal to 120% U. For example, if the voltage value U is obtained in the entire monitoring circuit when the detection line 11-1 is intact, is 0.8V, the "Specified Voltage Threshold Range" may be greater than or equal to 0.64V and less than or equal to 0.96V.

Based on the above technical solutions provided in the embodiments of the present invention, in some embodiments, the material of the detection line 11-1 may be a transparent conductive material, such as ITO, IZO (Indium Zinc Oxide), Igzo (Indium Gallium Zinc Oxide), or ITZO (zinc indium tin oxide) to avoid shielding the light emitted by the laser 12. The material of the detection line 11-1 may alternatively be a metallic conductive material such as argentum (Ag), copper (Cu) or chromium (Cr). In some embodiments, in order to prevent the metal material detection line 11-1 from shielding light, a relatively small width and a relatively small thickness of the metal material detection line 11-1 can be set to reduce the shielding area of the detection line 11-1, and improve the light transmission of the optical element 11.

In some embodiments, the detection line 11-1 can cover all areas of the optical element 11 as much as possible to enable damage monitoring in each area or even all areas of the optical element 11, thereby improving monitoring accuracy. In an exemplary implementation, the optical element 11 is equally divided into a plurality of areas so that areas of the detection line 11-1 are covered in areas within the same specified range. In addition, the coverage areas of the detection line 11-1 in the areas are the same to ensure monitoring in all areas of the optical element 11. It can be assumed that the number of areas into which the optical element 11 is divided is increased, and the detection line 11-1 is located in accordance with the above principle of the detection line 11-1, so that monitoring accuracy and sensitivity can be further improved.

In some embodiments, the detection line widths 11-1 in different regions of the optical element 11 may be the same or different. In addition, the widths of the detection line 11-1 in different regions of the optical element 11 are the same. For example, as shown in FIG. 6, the widths d ₁ and d ₂ of the detection line 11-1 in different areas of the optical element 11 are the same. Additionally, the distances between adjacent portions of the detection line 11-1 may be the same or different. In addition, the distances between adjacent portions of the detection line 11-1 are the same. For example, as shown in FIG. 6, the distances h ₁ and h ₂ between adjacent portions of the detection line 11-1 are the same. The widths of the detection line 11-1 in different areas of the optical element 11 are the same, and the distances between adjacent parts of the detection line 11-1 are the same, so that the detection line 11-1 can have the same width and the same arrangement density in all areas of the optical element 11 for additional improvement in monitoring accuracy and sensitivity.

The width of the detection line 11-1 should not be excessively large. Otherwise, when the optical element 11 is partially damaged, the detection line 11-1 11-1 cannot be damaged in the appropriate arrangement, or only a part of the detection line 11-1 is damaged and a part of the detection line 11-1 remains connected. Therefore, a significant change in the resistance value of the detection line 11-1 cannot affect the monitoring accuracy. The width of the detection line 11-1 should not be excessively small. Otherwise, the detection line 11-1 may be easily damaged, and a case may occur in which the detection line 11-1 is damaged due to a factor other than damage to the optical member 11, such as electrostatic destruction, thus causing an erroneous determination of the damage. or inefficient operation of the optical element 11.

In some embodiments, the width value of the detection line 11-1 is in the range of 1 µm to 500 µm (includes 1 µm and 500 µm), for example, the range is 30 µm to 100 µm (includes 30 µm and 100 µm) .

The gap between adjacent portions of the detection line 11-1 should not be excessively large. Otherwise, when the optical element 11 is partially damaged, the corresponding location cannot be covered by the detection line 11-1. Therefore, damage cannot be detected, which affects the sensitivity of the monitoring. The gap between adjacent portions of the detection line 11-1 should not be excessively large. Otherwise, when the detection line 11-1 is formed by etching, the conductive material of the detection line easily remains between adjacent portions of the detection line 11-1. Therefore, adjacent portions of the detection line 11-1 are connected, thereby affecting the monitoring sensitivity.

In some embodiments, the distance between adjacent parts of the detection line 11-1 is 1 µm to 500 µm (including 1 µm and 500 µm), for example, is 30 µm to 100 µm (including 30 µm to 100 µm) .

The specific pattern of the detection line 11-1 is not limited in the embodiments of the present invention. Below are a few specific detection line patterns 11-1. (1) As shown in Figs. 7a and 7b, the main part of the detection line 11-1 is shaped like a fold line. (2) As shown in Fig. 7c, the main part of the detection line 11-1 is in the form of a spiral. Additionally, the shape of the detection line 11-1 is not limited to a straight line shape, and may further be in a continuous line shape such as a wave line shape or a dotted line shape.

In a possible implementation with reference to Fig. 5a, Fig. 5b, Fig. 6 and Fig. 7a - Fig. 7c, there can be only one detection line 11-1. In this implementation, the resistance value monitored by the microprocessor 13 is the impedance of the detection line 11-1, or the voltage value monitored by the microprocessor 13 is the voltage at the two ends of the detection line 11-1. When the optical element 11 is damaged or ineffective, the detection line 11-1 is damaged, or the connection between the detection line 11-1 and the connection wire 15 is open. Therefore, the microprocessor 13 can monitor that the resistance value becomes infinite, or the voltage value becomes close to or equal to the voltage value provided by the microprocessor 13 for the entire monitoring circuit to determine that the optical element 11 is damaged or inefficient.

In another possible implementation, with reference to FIG. 8, there may be a plurality of detection lines 11-1, such as two or more detection lines 11-1. The two ends of each detection line 11-1 are connected to the microprocessor 13, so that a plurality of detection lines 11-1 are in parallel connection. In this implementation, the resistance value monitored by the microprocessor 13 is the parallel connection resistance value obtained after the plurality of detection lines 11-1 when connected in parallel, or the voltage value monitored by the microprocessor 13 is the voltage dividing value of the parallel resistance obtained after the parallel connection multiple detection lines 11-1 throughout the monitoring circuit. When the optical element 11 is damaged, one or more detection lines 11-1 are damaged. Therefore, the parallel resistance becomes larger and the microprocessor 13 monitors that the resistance value becomes larger or the voltage value becomes larger to determine that the optical element 11 is damaged. When the optical element 11 is inefficient, the entire monitoring circuit is broken. Therefore, the microprocessor 13 can monitor that the resistance value becomes infinite, or the voltage value becomes close to or equal to the voltage value provided by the microprocessor 13 for the entire monitoring circuit to determine the inefficient operation of the optical element 11.

On figa shows the location of the line 11-1 detection. In a possible implementation, the detection line 11-1 may be located on the surface on the side that has the optical element 11 and opposite the laser 12, so that the detection line 11-1 is electrically connected to the connecting wire 15. Of course, the detection line 11-1 can be alternatively located on the surface on the side that has the optical element 11 and faces the laser 12. This is not limited in embodiments of the present invention.

In some embodiments, detection line 11-1 may be obtained using a photo-etch process. The specific process may include: a film made of a detection line material (eg, ITO, IZO, or IGZO) is first formed on the substrate of the optical element 11 using the detection line material. The film made from the detection line material can be formed using a process such as CVD (Chemical Vapor Deposition), spraying, coating or printing. Then, the formed film is coated with a photoresist layer, and a mask having a detection line pattern 11-1 is used to expose the photoresist layer to form a photoresist layer having a detection line pattern 11-1. Subsequently, the photoresist layer having the detection line pattern 11-1 is used as a mask for a film made from the detection line material to form the detection line 11-1 having the detection line. A film made from the detection line material can be etched using a process such as dry etching or laser etching.

In some other embodiments, detection line 11-1 may be obtained using a magnetron sputtering process. The specific process may include: using a mask having a pattern of the detection line 11-1 to protect the substrate of the optical element 11, and the material of the detection line is deposited on the substrate of the optical element 11 to form the detection line 11-1 having the specified pattern.

In yet another embodiment, the detection line 11-1 may be obtained using a printing process. Printing is directly performed on the substrate of the optical member 11 to form a detection line 11-1 having the specified pattern.

Refer to Fig.5a, Fig.6 and Fig.7a - Fig.7c again. The two ends of the detection line 11-1 can respectively be provided with a conductive pad (PAD) 11-2, and each of the two ends of the detection line 11-1 is electrically connected to the corresponding connection wire 15 by the corresponding conductive pad 11-2, so that the line 11-1 detection is electrically connected to the connecting wire 15.

Optionally, two conductive spacers 11-2 can be respectively located at the edges or corners of the optical element 11. Additionally, two conductive spacers 11-2 can be located at two corners on the same side of the optical element 11 to facilitate connection to the connecting wire 15.

In some embodiments, the material of the conductive pad 11-2 is the same as the material of the detection line 11-1, so that the conductive pad 11-2 and the detection line 11-1 are formed simultaneously in the same step, thereby simplifying the preparation step.

Additionally, in a possible implementation, the width of the conductive pad 11-2 is greater than the width of the detection line 11-1, so that the detection line 11-1 is electrically connected to the connecting wire 15.

Figure 9a shows the layout of the connecting wire 15, in some embodiments, the implementation of the connecting wire 15 extends inside the side wall 14-1 of the housing 14 of the active light emitting module 1. One end of the connecting wire 15 extends to the optical element 11 and is connected to the detection line 11-1 ( one end of the connection wire 15 can be connected to the detection line 11-1 using the conductive gasket 11-2) and the other end of the connection wire 15 extends into the bottom substrate 14-2 of the module case 14 and is connected to the microprocessor 13. The connection wire 15 is located inside the side walls 14-1, so that in addition to connecting the detection line 11-1 to the microprocessor 13, the connecting wire 15 can be protected from erosion due to the action of water vapor and oxygen in the environment, thereby protecting the connecting wire 15.

In the above implementation shown in FIG. 9a, the connecting wire 15 and the module case 14 can be integrated using an Insert Molding technique. Alternatively, a channel may be formed on the side wall 14-1 of the module case 14, and then the connection wire material solution is introduced into the channel to form the conductive connection wire of the connection wire 15.

As shown in Fig.9b, in some other embodiments, the implementation of the connecting wire 15 extends on the inner surface of the side wall 14-1 of the housing 14 of the active light emitting module 1. One end of the connecting wire 15 extends to the optical element 11, and is connected to the detection line 11-1 (one end of the connecting wire 15 can be connected to the detection line 11-1 with the conductive gasket 11-2) and the other end of the connecting wire 15 extends to the bottom substrate 14-2 of the module case 14 and connects to the microprocessor 13.

As shown in FIG. 9c, still in some other embodiments, the connection wire 15 extends on the outer surface of the side wall 14-1 of the housing 14 of the active light emitting module 1. One end of the connection wire 15 extends to the optical element 11 and is connected to the line 11 -1 detection (one end of the connecting wire 15 can be connected to the detection line 11-1 using a conductive gasket 11-2) and the other end of the connecting wire 15 extends to the bottom substrate 14-2 of the module case 14 and connects to the microprocessor 13.

In the above implementations shown in FIGS. 9b and 9c, the connecting wire 15 may be formed on the inner surface or the outer surface of the side wall 14-1 of the module housing 14 by coating, printing, inserting, or the like.

Additionally, in the above implementations shown in FIGS. 9b and 9c, a protective layer can additionally be formed on the connection wire 15 to cover the connection wire 15 to further protect the connection wire 15 from breaking. The protective layer material may be an organic or inorganic material that has a water and oxygen barrier and an erosion resistance feature.

The material of the connecting wire 15 may be a material having a conductivity, such as a metallic conductive material such as argentum (Ag), copper (Cu) or chromium (Cr), a semiconductor conductive material, or an oxide conductive material.

For the method of connecting the detection line 11-1 to the connection wire 15, a conductive electrode may be attached to the connection between the detection line 11-1 and the connection wire 15, so that the detection line 11-1 is connected to the connection wire 15. Further, with reference to FIG. .9a to Fig.9, for the structure in which the detection line 11-1 is connected to the connection wire 15 by the conductive gasket 11-2, the conductive electrode 16 can be attached to the connection between the conductive gasket 11-2 and the connection wire 15, so that the conductive pad 11-2 is connected to the connection wire 15, and therefore the detection line 11-1 is connected to the connection wire 15.

In some embodiments, the material of the conductive electrode 16 may be a conductive adhesive, and additionally may be a conductive silver adhesive. During preparation, the conductive adhesive is allowed on the connection between the detection line 11-1 and the connection wire 15 or the connection between the conductive gasket 11-2 and the connection wire 15 through adhesive dispensing. The material of the conductive electrode 16 may alternatively be solder tin. During preparation, a soldering iron can be used to solder with a soldering tin the connection between the detection line 11-1 and the connection wire 15 or the connection between the conductive pad 11-2 and the connection wire 15.

Based on the above descriptions of the optical element monitoring system provided in the embodiments of the present invention, an embodiment of the present invention further provides an optical element 11. As shown in Fig. 10 and Fig. 11a, the optical element 11 includes a substrate 11-4 and a line 11 -1 detection located on the surface on one side of the substrate 11-4.

Description of the implementations of the function of the detection line 11-1, connection with another component, material, width, gap between adjacent parts, specific pattern, layout, arrangement, preparation process, and the like can be understood from the description of the detection line 11-1 in the optical element monitoring system. provided in the embodiments of the present invention. The details are again not described.

In a possible implementation, the optical element 11 further includes a conductive spacer 11-2. The conductive pad 11-2 and the detection line 11-1 are arranged in the same layer. Realizations of the function of the conductive gasket 11-2, connection with another component, material, layout, arrangement, preparation process, and the like can be described by the conductive gasket 11-2 in the optical element monitoring system provided in the embodiments of the present invention. The details are again not described.

Possibly, the optical element 11 further includes a first alignment mark 11-3. The first alignment mark 11-3 is located on the same layer as the detection line 11-1 and the conductive pad 11-2. When the optical element 11 is assembled in the active light emitting module, the first alignment mark 11-3 is configured to mark the location of the optical element 11 to precisely locate the optical element 11 in the active light emitting module. The material of the first alignment mark 11-3 can be the same as the material of the detection line 11-1 and the material of the conductive pad 11-2, so that the first alignment mark 11-3, the detection line 11-1 and the conductive pad 11-2 can be formed at one stage, thereby simplifying the cooking process. For example, two first alignment marks 11-3 are used, which are respectively located at two corner locations on the same side of the rectangular substrate 11-4, for example, respectively located at the upper left corner and upper right corner of the rectangular substrate 11-4.

As shown in Fig.10 and Fig.11b, in some embodiments, the implementation of the optical element 11 further includes a microstructure layer 11-5. The microstructural layer 11-5 is located on the other side that the substrate 11-4 has and is opposite to the side on which the detection line 11-1 is located. Specifically, the substrate 11-4 includes an A side and a B side that are opposite to each other, a detection line 11-1 is located on the surface on the A side of the substrate 11-4, and the microstructure layer 11-5 is also located on the surface on the B side of the substrate 11 -four.

In a possible implementation, the microstructural layer 11-5 is located on the surface on the A side of the substrate 11-4 and the detection line 11-1 is located on the surface on the B side of the substrate 11-4. Of course, the microstructure layer 11-5 and the detection line 11-1 may alternatively be located on the surface on the same side of the substrate 11-4, for example, the surface on side A or the surface on side B. If the microstructure layer 11-5 and line 11- 1 detections are located on the surface on the same side of the substrate 11-4, the detection line 11-1 can be located on the side that has the microstructured layer 11-5 and is opposite to the substrate 11-4, or the detection line 11-1 can be located between the microstructured layer 11-5 and substrate 11-4.

Microstructural layers 11-5 of various types of optical elements 11 include various microstructures. For example, if the optical element 11 is a diffractive optical element, the microstructure contained in the microstructure layer 11-5 is a diffractive microstructure. If the optical element 11 is a diffuser, the microstructure contained in the microstructure layer 11-5 is a diffusion microstructure such as a dot.

In a possible implementation, referring to Figs. 11b and Figs. 9a to Figs. 9c, when the optical element 11 is installed in the active light emitting module, the edge of the optical element 11 is attached to the surface which has the support element 14-3 of the module housing 14 and which is opposite to the laser 12 using adhesive 17. The microstructure layer 11-5 of the optical element 11 is located on a surface which has a substrate 11-4 that faces the laser 12, and the orthographic projection area of the microstructure layer 11-5 on the substrate 11-4 is smaller than the area of the substrate 11 -4, to reserve the edge area on the surface that has the substrate 11-4, and which faces the laser 12. Thus, the adhesive 17 is directly connected to the surface that has the substrate 11-4, and which faces the laser 12, and a surface that has the reference member 14-3 and is opposite to the laser 12, so as to avoid contact with the microstructure layer 11-5, so that the optical member 11 is more firmly connected to the reference member. ntom 14-3.

As shown in FIGS. 10 and 11c, in some embodiments, the optical element 11 further includes a second alignment mark 11-6. The second alignment mark 11-6 is located on the side that has the substrate 11-4 and on which the detection line 11-1 is located, and the second alignment mark 11-6 is formed after the detection line 11-1 is formed. Specifically, since the second alignment mark 11-6 and the detection line 11-1 are located on the A side or the B side of the substrate 11-4, the second alignment mark 11-6 is formed after the detection line 11-1 is formed. When the optical element 11 is assembled in the active light emitting module, the second alignment mark 11-6 is configured to mark the location of the optical element 11 to precisely locate the optical element 11 in the active light emitting module.

It should be noted that the above description is merely an example for describing the location at which the second alignment mark 11-6 is located on each film layer of the optical element 11, and the location at which the second alignment mark 11-6 is located on each film layer of the optical element 11 is not limited in this embodiment of the present invention. The second alignment mark 11-6 may be located anywhere on each film layer of the optical element 11, provided that the second alignment mark 11-6 can mark the location of the optical element 11. For example, the second alignment mark 11-6 is located between the line 11- 1 detection and substrate 11-4. Alternatively, the second alignment mark 11-6 is located between the microstructured layer 11-5 and the substrate 11-4. Alternatively, the second alignment mark 11-6 is located on the side that has the microstructure layer 11-5 and is opposite to the substrate 11-4.

In this embodiment of the present invention, the number of the second alignment marks 11-6 is not limited. Additionally, the second alignment mark 11-6 may be located at the edge or corner of the optical member 11. Specifically, the orthographic projection of the second alignment mark 11-6 on the substrate 11-4 may be located at the edge or corner of the substrate 11-4. For example, for a rectangular optical element 11, the second alignment mark 11-6 may be located at each of the four corners of the optical element 11.

In some other possible implementations, if both the first alignment mark 11-3 and the second alignment mark 11-6 are located in the optical element 11, the orthographic projection of the first alignment mark 11-3 and the second alignment mark 11-6 at the same location of the optical element 11 overlaps on substrate 11-4. For example, if both the first alignment mark 11-3 and the second alignment mark 11-6 are located in the upper left corner (or the upper right corner or the lower left corner or the lower right corner) of the rectangular optical element 11, the orthographic projection of the first alignment mark 11-3 and the second alignment mark 11-6 in the upper left corner (or upper right corner or lower left corner or lower right corner) overlaps on the substrate 11-4.

The material of the second alignment mark 11-6 may be a relatively low transmission material such as metal, so that the second alignment mark 11-6 can be more clearly observed when the optical element 11 is assembled in the active light emitting module.

As shown in Fig.10 and Fig.11d, in some embodiments, the implementation of the optical element 11 further includes a protective layer 11-7. The protective layer 11-7 is located on the side that has the substrate 11-4 and on which the detection line 11-1 is located. Namely, both the protective layer 11-7 and the detection line 11-1 are located on the A side or the B side of the substrate 11-4. Additionally, the protective layer 11-7 covers the detection line 11-1. The protective layer 11-7 covers the detection line 11-1 to protect the detection line 11-1. The material of the protective layer 11-7 may be an organic or inorganic material that is waterproof and oxygen-proof and has an anti-erosion feature.

It should be noted that in a possible implementation with reference to FIG. 10, if both the detection line 11-1 and the second alignment mark 11-6 are located on the A side or the B side of the substrate 11-4, and the second alignment mark 11-6 is made of a material which is easily oxidized and destroyed, such as metal, the protective layer 11-7 may cover the detection line 11-1 and the second alignment mark 11-6 to protect the detection line 11-1 and the second alignment mark 11-6.

In a possible implementation, in order to provide an electrical connection between the end part of the detection line 11-1 11-1 or the conductive gasket 11-2 and the connecting wire 15, a hole 11-8 is located on the protective layer 11-7 to expose the end part of the detection line 11-1 or conductive gasket 11-2. The location of the hole 11-8 is determined based on the determination of the position of the end portion of the detection line 11-1 or the connecting gasket 11-2.

Based on the above descriptions of the monitoring system of the optical element and the optical element provided in the embodiments of the present invention, an embodiment of the present invention also provides an active light emitting module 1. As shown in Figs. 9a to 9c, the active light emitting module 1 includes an optical element 11, connecting wire 15, laser 12, microprocessor 13 and module case 14. The module case 14 includes at least a bottom substrate 14-2 and a side wall 14-1. The optical element 11 is mounted at one end which has a side wall 14-1 and is spaced from the bottom substrate 14-2. The module case 14 further includes a support member 14-3. Referring to FIG. 4b, the support member 14-3 is in an annular structure and is positioned around the inner surface of the side wall 14-1 to form a hole GG. The edge of the optical element 11 is attached to the surface that has the support element 14-3 and is opposite to the laser 12 using adhesive 17. The laser 12 and the microprocessor 13 are mounted on the bottom substrate 14-2 and connected to each other. The microprocessor 13 controls the laser 12 to emit laser light. Laser light is emitted from the active light emitting module 1 by the optical member 11 through the hole GG.

The optical element 11 includes a detection line 11-1. The two ends of the detection line 11-1 are connected to the microprocessor 13 by using connecting wires 15. The microprocessor 13 monitors the resistance value of the detection line 11-1 or the voltage value of the two ends of the detection line 11-1 in real time. When the resistance value of the detection line 11-1 exceeds the specified resistance threshold value range, or when it is determined that the voltage value at the two ends of the detection line 11-1 exceeds the specified voltage threshold range, the optical element 11 is damaged or inefficient. In this case, the microprocessor 13 controls the power supply 2 to stop powering the laser 12, which turns off the laser 12 to effectively protect against injury to the human eye caused by the laser light emitted by the laser 12. Additionally, only one optical element 11 needs to be used in the active light emitting module 1 and detection line 11-1 (that is, only one conductive layer is required). Therefore, the structure is simple, the production process is simple, and the cost is relatively low.

In the active light emitting module 1, a description of the connection of the detection line 11-1 with the connection wire 15 and the method of arranging the connection wire 15 on the side wall 14-1 of the module case 14 can be described with reference to the descriptions of the connection wire 15 in the optical element monitoring system provided in the embodiments. implementation of the present invention. The details are again not described.

Note that the active light emitting module 1 provided in this embodiment of the present invention is any module that can emit laser light, such as a module that is a 3D ToF recognition module that includes a high power laser, or a dot matrix projector 115-5 and a flood light device 115-2, which are in the 3D structured light recognition module 115 .

Based on the above descriptions of the active light emitting module 1 provided in this embodiment of the present invention, the embodiment of the present invention also provides a terminal device. The terminal device includes an active light emitting module 1 provided in this embodiment of the present invention, configured to provide said laser light (for example, if the active light emitting module 1 is a dot matrix projector 115-5, then said light, which is provided by the active light emitting module 1 is structured light) to help the terminal device realize the 3D recognition function. When the active light emitting module 1 is installed in a terminal device such as a mobile phone 100, the side (namely, the light emitting side) of the laser 12 in the active light emitting module 1 is close to the inside of the terminal device, and the side (namely, the outgoing light side) of the optical element 11 facing towards the outside of the terminal device to project said laser light outward.

Based on the foregoing descriptions of the optical element monitoring system provided in the embodiments of the present invention, an embodiment of the present invention further provides a method for monitoring an optical element. The optical element monitoring method is applied to the optical element monitoring system provided in the embodiments of the present invention. As shown in FIG. 12, referring to FIGS. 5a and 5b, the optical element monitoring method includes the following steps.

S1: The microprocessor 13 monitors the resistance value of the real-time detection line 11-1.

In an exemplary implementation, as shown in FIG. 13, step S1 may specifically include the following steps.

S11: The microprocessor 13 monitors the voltage value of the two ends of the detection line 11-1 in real time. At this stage, if the optical element 11 is not damaged or works effectively, the monitored voltage value is close to or equal to the voltage value obtained in the entire monitoring circuit (namely, the monitoring circuit including the detection line 11-1, the connecting wire 15 and the microprocessor 13) when the detection line 11-1 is intact. If the optical element 11 is damaged or inefficient and the monitoring circuit is open, the monitored voltage value is close to or equal to the voltage value provided by the microprocessor 13 for the entire monitoring circuit.

It should be noted that the microprocessor 13 monitors the voltage value at the two ends of the detection line 11-1 by applying voltage to the detection line 11-1. In particular, the microprocessor 13 provides a specific voltage to the entire monitoring circuit, and the detection line 11-1 in the monitoring circuit receives a part of the voltage, so that the microprocessor 13 applies a voltage to the detection line 11-1. The voltage provided by the microprocessor 13 to the entire monitoring circuit may be a continuous voltage signal, or may be an intermittent voltage signal, such as a pulsed voltage signal to reduce power consumption and reduce voltage signal erosion of the detection line 11-1. The voltage provided by the microprocessor 13 to the entire monitoring circuit is supplied by the power supply (for example, the power supply device 111 of the mobile phone 100) of the terminal device. For example, the voltage value provided by the microprocessor 13 to the entire monitoring circuit is 2.85 V, and the resistance value obtained when the detection line 11-1 is intact is 10 kilo ohms. When the entire monitoring circuit is closed, a voltage of 0.8 V is applied to the detection line 11-1, in other words, the voltage value at the two ends of the detection line 11-1 is 0.8 V.

S12: The microprocessor 13 converts the monitored voltage value into a resistance value.

In this step, the microprocessor 13 converts the monitored voltage value in real time into a resistance value. If the monitored voltage value is close to the voltage value obtained in the entire monitoring circuit when the detection line 11-1 is intact, the resistance value obtained by conversion should be close to or equal to the resistance value obtained when the detection line 11-1 is intact. . If the monitored voltage value is close to the voltage value provided by the microprocessor 13 to the entire monitoring circuit, the resistance value obtained by the conversion is infinite.

S2: the microprocessor 13 determines whether the monitored resistance value exceeds the resistance threshold range, and if the monitored resistance value exceeds the specified resistance threshold range, the microprocessor 13 controls the power supply 2 to stop supplying power to the laser 12; or, if the monitored resistance value does not exceed the specified resistance threshold range, the microprocessor 13 returns to step S1.

In step S2, the indicated resistance threshold value range may be set to a numerical range that fluctuates up and down around the resistance value R when the detection line 11-1 is intact. For example, the specified resistance threshold range may be greater than or equal to 80% R and less than or equal to 120% R. If the resistance value obtained in step S1 exceeds the specified resistance threshold range, indicating that the monitoring circuit is open, then is, the detection line 11-1 may be damaged, or the connection between the detection line 11-1 and the connecting wire 15 may be open. This indicates that the optical element 11 is damaged or not working effectively. In this case, the microprocessor 13 sends an interrupt signal to the power supply 2 and controls the power supply 2 to stop supplying power to the laser 12, and therefore the laser 12 is turned off to prevent injury to the human eye, since the laser light is directed to the human eye when the optical element 11 is damaged. or not working effectively. If the resistance value obtained in step S1 does not exceed the specified resistance threshold range, indicating that the monitoring circuit is working normally, the optical element 11 is normal, the power supply 2 can continue to supply power to the laser 12 and the microprocessor. 13 may return to step S1 to monitor the resistance value of the detection line 11-1 at the next moment.

For example, if the resistance value obtained when the detection line 11-1 is intact is 10 kilo ohms, the specified resistance threshold value range is set to be greater than or equal to 8 kilo ohms and less than or equal to 12 kilo ohms. The voltage value provided by the microprocessor 13 to the entire monitoring circuit is 2.85 V. When the entire monitoring circuit is not open, a voltage of 0.8 V is applied to the detection line 11-1.

At the time t1, the microprocessor 13 monitors that the voltage value U at the two ends of the detection line 11-1 is 2.85 V, obtains, according to the resistance voltage division principle, an infinite resistance value R by converting the voltage value U, and determines that the resistance value R , obtained through the conversion, already exceeds the predetermined resistance threshold range of 8 kilo ohms to 12 kilo ohms. In this case, the microprocessor 13 determines that the optical element 11 is damaged or inefficient, and controls the power supply 2 to stop supplying power to the laser 12.

At the time t2, the microprocessor 13 monitors that the voltage value U of the two ends of the detection line 11-1 is 0.8 V, obtains, according to the resistance voltage division principle, a resistance value of 10 kilo ohms by converting the voltage value U, and determines that the value R the resistance obtained through the conversion is within the specified resistance threshold range of 8 kilohms to 12 kilohms. In this case, the microprocessor 13 determines that the optical element 11 is normal and the power supply 2 can continue to supply power to the laser 12.

In some embodiments, the microprocessor 13 may further determine, by monitoring the voltage value at the two ends of the detection line 11-1, in real time, whether the monitored voltage value exceeds the specified voltage threshold range for detecting damage to the optical element 11. As shown in FIG. Referring to FIGS. 5a and 5b, the optical element monitoring method includes the following steps.

S1': the microprocessor 13 monitors the voltage value at the two ends of the detection line 11-1 in real time.

For detailed descriptions of step S1', refer to the above descriptions of step S11. The details are again not described.

S2': the microprocessor 13 determines whether the monitored voltage value has exceeded a specific voltage threshold range, and if the monitored voltage value exceeds the specified voltage threshold range, the microprocessor 13 controls the power supply 2 to stop powering the laser 12; or, if the monitored voltage value does not exceed the specified voltage threshold range, the microprocessor 13 returns to step S1'.

In step S2', the specified voltage threshold range can be set to a numerical range that fluctuates up and down around the voltage value obtained in the entire monitoring circuit when the detection line 11-1 is intact. For example, the specified voltage threshold range may be set to be greater than or equal to 80% U and less than or equal to 120% U. If the voltage value monitored in step S1' exceeds the specified voltage threshold range, then indicates that the monitoring circuit open, that is, the detection line 11-1 may be damaged, or the connection between the detection line 11-1 and the connecting wire 15 may be damaged. This indicates that the optical element 11 is damaged or not working effectively. In this case, the microprocessor 13 sends an interrupt signal to the power supply 2, and controls the power supply 2 to stop supplying power to the laser 12, and therefore the laser 12 is turned off, which prevents damage to the human eye due to laser light directed into the human eye when the optical element 11 damaged or not working effectively. If the voltage value monitored in step S1' does not exceed the specified voltage threshold value, then indicates that the monitoring circuit is working normally, the optical element 11 is normal, the power supply 2 can continue to supply power to the laser 12 and the microprocessor 13 can return to step S1 ' to monitor the voltage value at the two ends of the detection line 11-1 at the next moment.

For example, the voltage value provided by the microprocessor 13 to the entire monitoring circuit is 2.85 V. When the entire monitoring circuit is closed, the detection line 11-1 receives a voltage of 0.8 V, and therefore the specified voltage threshold range is set to greater than or equal to 0, 64 V and less than or equal to 0.96 V.

At time t1', the microprocessor 13 monitors that the voltage value U at the two ends of the detection line 11-1 is 2.85 V and the voltage value U is already above the specified voltage threshold range of 0.64 V to 0.96. B. In this case, the microprocessor 13 determines that the optical element 11 is damaged or inefficient, and controls the power supply 2 to stop supplying power to the laser 12.

At time t2', the microprocessor 13 monitors that the voltage value U at the two ends of the detection line 11-1 is 0.8 V, and the voltage value U is within the specified voltage threshold range of 0.64 V to 0.96. B. In this case, the microprocessor 13 determines that the optical element 11 is normal and the power supply 2 can still supply power to the laser 12.

Obviously, in order to implement the above functions, a terminal device or the like includes appropriate hardware structures and/or software modules to perform the functions. One skilled in the art will appreciate that the blocks, algorithms, and steps in the examples described with reference to the embodiments disclosed in this specification may be implemented in hardware or a combination of hardware and computer software in embodiments of the present invention. Whether the function will be performed by hardware or by hardware controlled by computer software depends on particular applications and design constraints. A person skilled in the art may use various methods to implement the described functions for each particular implementation, but it should be understood that the implementation should not go beyond the embodiments of the present invention.

The above descriptions are merely specific implementations of the present invention, but are not intended to limit the protection scope of the present invention. Any modification or replacement in the technical scope disclosed in the present invention should be within the protection scope of the present invention. Therefore, the scope of legal protection of the present invention is determined by the claims.

Claims (14)

1. An optical element containing a substrate, in which the optical element further comprises a detection line located on the substrate, and the detection line is configured to transmit an electrical signal; in which the detection line extends in the form of a curving line or the form of a spiral line located on the substrate; the value of the detection line width is in the range from 1 to 500 µm; the distance between two adjacent and parallel segments of the detection line varies from 1 to 500 µm. 2. An optical element according to claim 1, wherein the detection line material is a transparent conductive material. 3. An optical element according to claim 2, wherein the detection line material comprises indium tin oxide, or indium zinc oxide, or indium gallium zinc oxide, or indium tin zinc oxide. 4. The optical element according to claim 1, wherein the optical element further includes a microfabric layer, the microfabric layer and the detection line are located on the same side of the substrate, or the microfabrication layer and the detection line are located on opposite sides of the substrate. 5. The optical element of claim 1, wherein the detection line includes a first line segment and a second line segment parallel to the first line segment, the width of the first line segment and the width of the second line segment are the same. 6. The optical element of claim 5, wherein the detection line further includes a third line segment parallel to the second line segment, the distance between the first line segment and the second line segment is the same as the distance between the second line segment and the third line segment. 7. The optical element of claim 1, wherein the optical element further comprises a conductive spacer located on the same side of the substrate as the detection line, wherein the conductive spacer is electrically connected to the end portion of the detection line. 8. An optical element according to claim 7, wherein the material of the conductive spacer matches the material of the detection line. 9. The optical element according to claim 7, wherein the optical element further comprises a protective layer covering the detection line and an opening located on the protective layer for exposing the conductive spacer. 10. An active light emitting module, comprising a module housing, in which the module housing includes a bottom substrate and a side wall, and the active light emitting module further comprises: a laser and a microprocessor mounted on the bottom substrate; an optical element mounted at one end, which has a side wall and is spaced from the bottom substrate, in which the optical element is an optical element according to any one of claims 1 to 9; and connecting wires configured to connect the two ends of the detection line of the optical element to the microprocessor, in which the microprocessor is configured to: monitor the resistance value of the detection line or the voltage value at the two ends of the detection line in real time, determine based on the monitored resistance value, or voltage values, whether the optical element is damaged or inefficient, and to control, when determining that the optical element is damaged or ineffective, turning off the laser. 11. Active light emitting module according to claim 10, in which the connecting wire extends from the end of the detection line to the microprocessor inside the side wall; or a connecting wire extends from the end of the detection line to the microprocessor on the inner surface of the side wall; or a connecting wire extends from the end of the detection line to the microprocessor on the outer surface of the side wall. 12. The active light emitting module of claim 10, wherein the active light emitting module further comprises a conductive electrode disposed at the connection between the end portion of the detection line and the connection wire, and the conductive electrode is configured to electrically connect the end portion of the detection line to the connection wire. 13. The active light emitting module of claim 11, wherein the conductive electrode material is conductive silver paste or solder tin. 14. An optical element monitoring system, in which the optical element monitoring system comprises: a microprocessor, a power supply and a laser connected in series; and an optical element according to any one of claims 1 to 9, wherein the two ends of the detection line of the optical element are connected to a microprocessor, in which the microprocessor is configured to: monitor the resistance value of the detection line or the voltage value at the two ends of the detection line in real time, determine, based on the monitored resistance value or voltage value, whether the optical element is damaged or inefficient; and, upon determining that the optical element is damaged or inefficient, control the power supply to stop supplying power to the laser.

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