RU2787811C1 - Impedance device and systems for simulation of head effect on vibration unit vibration - Google Patents

Abstract

FIELD: acoustics.

SUBSTANCE: invention relates to acoustics. The impedance device comprises a mass component, at least one elastic component and a stationary component, wherein the mass component is connected to the stationary component via at least one elastic component; a damping component located between the mass component and the stationary component and providing damping of the movement of the mass component relative to the stationary component. When the mass component contacts the external vibration unit, the mass component receives the vibration of the external vibration unit and moves relative to the stationary component, wherein the mass of the mass component is in the range of 0.5 to 5 g, the elasticity coefficient of at least one elastic component is in the range of 600 to 5000 N/m, the damping factor of the damping component is in the range of 1 to 4, and the impedance device provides the external vibration unit with a mechanical impedance in the range of 6 to 50 dB.

EFFECT: invention provides the possibility of simulating the area of the face in front of the human auricle.

10 cl, 18 dwg

Description

Link to related application

This application claims priority in Chinese Provisional Patent Application No. 202110033059.0 dated January 11, 2021, the entire contents of which are hereby incorporated by reference.

The field of technology to which the invention belongs

The present invention relates to the field of vibration simulation, and more particularly to a system for simulating the impact of a head on vibration of a vibration unit.

State of the art

The vibration unit can generate a vibration signal and transmit this vibration signal to the human head (eg, the bones of the head). In order to simulate the effect of a human head on the vibration of a vibration unit, in order to understand the vibration characteristics of the vibration unit, it is generally necessary to associate the vibration unit with a human head simulator. In some application scenarios, when the vibrating block is used as a bone conduction headset or a bone conduction hearing aid, the vibrating block is placed in the facial region in front of the wearer's pinna, and the bone in that region of the human head is relatively soft compared to the skull, mastoid, and etc. That is, the mechanical impedance of the facial region in front of the wearer's auricle is significantly different from the mechanical impedance of other parts of the human head. However, the existing human head simulator generally simulates the mechanical impedance of the mastoid process behind the user's ear, which obviously cannot match the scenario in which the vibrating unit is placed in the face in front of the human pinna.

Therefore, it is necessary to propose an impedance device for modeling the face area in front of the human auricle and a system for modeling its effect on the vibration of the vibration unit.

Disclosure of the essence of the invention

In some embodiments, implementation of the present invention proposed an impedance device containing: a mass component, at least one elastic component and a stationary component. The mass component is connected to the fixed component by means of at least one elastic component. Between the mass component and the fixed component is a damping component, which provides damping of the movement of the mass component relative to the fixed component. When the mass component contacts the external vibration block, the mass component receives the vibration of the external vibration block and moves relative to the stationary component. The mass of the mass component is in the range of 0.5 g to 5 g, the elasticity coefficient of at least one elastic component is in the range of 600 N/m to 5000 N/m, the damping coefficient of the damping component is in the range of 1 to 4, and The impedance device provides the external vibrator with a mechanical impedance in the range of 6dB to 50dB.

In some embodiments, the mass of the mass component is in the range of 1 g to 3.6 g, the spring rate of at least one elastic component is in the range of 900 N/m to 1700 N/m, and the damping factor of the damping component is in the range of 2 to 3.7.

In some embodiments, the frequency response of the impedance device has a pit, with the pit value being in the range of 6 dB to 15 dB.

In some embodiments, if the frequency is less than the frequency corresponding to the valley value, then the mechanical impedance of the impedance device decreases with increasing frequency; if the frequency is greater than the frequency corresponding to the valley value, then the mechanical impedance of the impedance device increases with increasing frequency.

In some embodiments, the fixed component includes a fixed arm, the mass component is located opposite the fixed arm, one side of the mass component faces the fixed arm, and the other side of the mass component faces away from the fixed arm.

In some embodiments, the damping component is located between the mass component and the fixed arm.

In some embodiments, the damping component includes at least one of a spring damper, a hydraulic damper, a friction damper, a pulsation damper, a rotary damper, a viscous damper, an air damper, a damper joint, or a damper slide.

In some embodiments, said at least one resilient component includes a spring, and the damping component is inserted into or around the spring.

In some embodiments, the fixed component is a housing structure with one open end, and the mass component is suspended in the opening of the housing structure by said at least one resilient component.

In some embodiments, the implementation of the specified at least one elastic component includes a first end part and a second end part, wherein the first end part of the specified at least one elastic component is connected to the side wall of the mass component, and the second end part of the specified at least one elastic component is connected to the inner wall of the housing structure.

In some embodiments, said at least one elastic component may include a plurality of elastic components, and said plurality of elastic components are spaced along the side wall of the mass component.

In some embodiments, said at least one resilient component includes at least one of a compression spring, an extension spring, a torsion spring, a coil spring, or a flat spring.

In some embodiments, said at least one resilient component further includes a mesh structure.

In some embodiments, the damping component is located between the mass component and the bottom wall of the housing structure, with one end of the damping component connected to the side of the mass component and the other end of the damping component connected to the bottom wall of the housing structure.

In some embodiments, an airtight cavity is formed between the mass component and the body structure, and the gas in the airtight cavity forms said at least one resilient component.

In other embodiments, the implementation of the present invention provides a system for simulating the impact of the head on the vibration of the vibration unit. The system includes a vibration unit configured to provide a vibration signal; an impedance device, wherein the impedance device contacts the vibrating block and provides mechanical impedance to the vibrating block; a connector configured to connect the vibration unit to the impedance device; and a sensor configured to collect information about the parameters of the vibration unit during the vibration process.

In some embodiments, the connector provides a pressure in the range of 0.05 N to 3.5 N between the vibrator and the impedance device.

In some embodiments, the area of the junction of the impedance device and the vibration unit is in the range from 0.25 cm ² to 4 cm ² .

In some embodiments, the connector includes a base, a support rod and a locking element, wherein the support rod is connected to the base, the locking element includes a first end and a second end, the first end of the locking element is connected to the support rod, and the second end part of the fixing element is connected to the vibration unit.

In some embodiments, the system also includes a headform and the impedance device is located proximate the tragus region of the headform.

In some embodiments, the connector is a band-like structure, and the band-like structure surrounds the headform and secures the vibratory block to the impedance device.

In some embodiments, the connector is a temple, wherein the temple is adapted to the pinna of the headform, and the temple secures the vibration unit to the impedance device.

Brief description of the drawings

In FIG. 1 is a schematic diagram of an impedance device 100 in accordance with some embodiments of the present invention;

in fig. 2 is a schematic structural diagram of an impedance device 200 in accordance with some embodiments of the present invention;

in fig. 3 is a schematic structural diagram of an impedance device 300 in accordance with some embodiments of the present invention;

in fig. 4 is a schematic structural diagram of an impedance device 400 in accordance with some embodiments of the present invention;

in fig. 5 is a schematic structural diagram of an impedance device 500 in accordance with some embodiments of the present invention;

in fig. 6 is a schematic structural diagram of an impedance device 600 in accordance with some embodiments of the present invention;

in fig. 7 is a schematic structural diagram of an impedance device 700 in accordance with some embodiments of the present invention;

in fig. 8 is a plan view of the construction of an impedance device 800 in accordance with some embodiments of the present invention;

in fig. 9 is a plan view of the construction of an impedance device 800 in accordance with some embodiments of the present invention;

in fig. 10 is a schematic structural diagram of an impedance device 1000 in accordance with some embodiments of the present invention;

in fig. 11 is a diagram of an analog mechanical impedance circuit model of an impedance device in accordance with some embodiments of the present invention;

in fig. 12 is a schematic diagram of a system for simulating the effect of a head on vibration of a vibrating unit, in accordance with some embodiments of the present invention;

in fig. 13 is a diagram of the simulated position of the connection area between the vibration unit and the head, in accordance with some embodiments of the present invention;

in fig. 14 is a schematic structural diagram of a system for simulating the effect of a head on vibration of a vibrating unit, in accordance with some embodiments of the present invention;

in fig. 15 is a schematic diagram of a distribution of sensors in accordance with some embodiments of the present invention;

in fig. 16 is a schematic structural diagram of a connector installation and headform in accordance with some embodiments of the present invention;

in fig. 17 is a schematic structural diagram of a connector installation and headform in accordance with other embodiments of the present invention; and

in fig. 18 shows a frequency response diagram of a system for simulating the effect of a head on the vibration of a vibrating block.

Implementation of the invention

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings to be used in describing the embodiments will be briefly presented below. Obviously, the drawings in the following description are only some examples or embodiments of the invention. For those skilled in the art, without creative work, the invention can be applied to other similar scenarios in accordance with these drawings. Unless it is obvious from the linguistic context or otherwise indicated, the same reference numbers in the drawings represent the same structure or operation.

As used herein, the terms "system", "device", "assembly", and/or "module" should be understood to be a way of distinguishing between various components, elements, parts, parts, or subassemblies of different levels. However, if other words can achieve the same goal, these words can be replaced by other expressions.

As shown in the present disclosure and claims, unless the context clearly suggests exceptional circumstances, the singular not only refers specifically to the singular, but also includes the plural. Generally speaking, the terms "comprising" and "comprising" only imply that operations and elements that have been clearly identified are included, and these operations and elements do not constitute an exclusive list, and the method or apparatus may also include other operations or elements. .

Embodiments of the present invention describe an impedance device. In some embodiments, the impedance device may include a mass component, an elastic component, and a fixed component. The mass component may be connected to the fixed component by means of an elastic component. A mass component can be used to provide mass, and when an external vibratory block is connected to the mass component, the mass component can simulate a mass load being applied back to the vibrating block by the head. A vibration block may refer to an element capable of generating a vibration signal. In some embodiments, the vibration unit may be applied to an audio device (eg, speaker, earphone, player, etc.) and the vibration unit converts the audio signal into a vibration signal. In some embodiments, the vibration unit may also be applied to a hearing device (eg, hearing aid, etc.). The resilient component can be used to provide resilience to the movement of the mass component, which can mimic the resilience of the scalp. In some embodiments, the implementation of the impedance device may also include a damping component. The damping component can be used to simulate the damping of the head of the vibration unit. In some embodiments, the implementation of the damping component is located between the mass component and the stationary component and provides damping of the movement of the mass component relative to the stationary component. When the mass component contacts the external vibration block, the mass component receives the vibration of the vibration block and moves relative to the stationary component.

By adjusting the parameters of the mass component, the elastic component and/or the damping component in the impedance device, the impedance device can simulate the impact of different regions of the head on the vibration unit. In some embodiments, to model the impact of the facial region on the anterior side of the pinna of the human head (also referred to as the region near the tragus) on the vibratory block, parameters of the mass component, the elastic component, and/or the damping component in the impedance device can be adjusted as follows: when the pressure between the mass component and the vibration block is in the range from 0.05 to 3.5 N, the impedance device provides the vibration block with a mechanical impedance in the range from 6 to 50 dB. When set daily near the tragus area, a pressure in the range of 0.05 to 3.5 N is a relatively comfortable pressure to which the human body can adapt. The impedance device feeds back to the vibrating block a mechanical impedance in the range of 6dB to 50dB in response to pressure in the above range applied by the vibrating block, thus the actual resistance exerted on the vibrating block formed near the tragus area during actual use can be simulated. . In some embodiments, the frequency response curve of the mechanical impedance of the impedance device has a trough in a certain frequency range (e.g., 50 Hz-500 Hz), i.e., the mechanical impedance of the impedance device has a minimum value (also referred to as the trough value) in a particular frequency range. In addition, if the frequency is less than the frequency corresponding to the valley value, then the mechanical impedance of the impedance device decreases with increasing frequency; if the frequency is greater than the frequency corresponding to the valley value, then the mechanical impedance of the impedance device increases with increasing frequency. In some embodiments, the specific frequency range is not limited to the aforementioned 50 Hz-500 Hz. In some embodiments, the specific frequency range may also be other frequency ranges such as 60 Hz-400 Hz, 70 Hz-300 Hz, 80 Hz-200 Hz, or any frequency within the range. In some embodiments, the parameters of the mass component, the elastic component and/or the damping component of the impedance device can be adjusted so that the mechanical impedance provided by the impedance device matches or approximately matches the mechanical impedance near the tragus region of the head. For example, in some embodiments, the damping of the impedance device may be adjusted such that the mechanical impedance provided by the impedance device matches or approximately matches the mechanical impedance at the tragus of the head. As another example, in some embodiments, the mass of the mass component and the elasticity coefficient of the elastic component can be adjusted such that the frequency corresponding to the trough value is within a certain frequency range.

It should be noted that the pressure between the mass component and the vibrating unit may not be in the above range, for example, it may be less than 0.05 N or more than 3.5 N. In addition, the mechanical impedance provided by the impedance device to the vibrating unit is not limited to the above range. . For example, the impedance device may provide a mechanical impedance to the vibrator of 58 dB. As another example, the impedance device may provide a mechanical impedance of 3 dB to the vibrator. With regard to the pressure between the mass component and the vibrating device, as well as the parameters of the mass component, the elastic component and the damping component, reference should be made to the content described elsewhere in this description.

In FIG. 1 shows a schematic diagram of an impedance device 100 in accordance with some embodiments of the present invention. As shown in FIG. 1, the impedance device 100 may include a mass component 101, an elastic component 102, a damping component 103, and a stationary component 104. In some embodiments, the mass component 10 may be connected to the stationary component 104 via an elastic component 102. In some embodiments, the component 101 mass may be connected to the fixed component 104 by a physical connection through the elastic component 102. The physical connection described in the present description may include welding, snapping, gluing or integral molding or the like, or any combination of them.

In some embodiments, when the mass component 101 contacts or is associated with an external vibration block, the mass component 101 receives the vibration of the vibration block and moves relative to the stationary component 104. In some embodiments, the mass component 101 may be in direct contact or be directly connected to the vibration block , and the vibration block directly pushes the mass component 101 to move when the vibration block generates vibration. In some embodiments, the mass component 101 may be in contact with or directly connected to the vibratory block through other structures or components (eg, protective film, etc.), and the mass component 101 senses the vibration of the vibratory block for movement. In some embodiments, when the pressure between the mass component 101 and the vibrator is in the range of 0.05 N to 3.5 N, the impedance device 100 may provide the vibrator with a mechanical impedance in the range of 6 dB to 50 dB. A pressure in the range of 0.05 N to 3.5 N is a suitable pressure near the tragus region of the head, and a mechanical impedance in the range of 6 dB to 50 dB simulates the actual resistance exerted on the vibrating unit near the tragus region in actual use. In some embodiments, when the impedance device 100 is used to simulate the mechanical impedance of other parts of the human head, the pressure between the mass component 101 and the vibration block may be less than 0.05 N or greater than 3.5 N.

The mass component 101 may refer to an object having a certain weight. In the impedance device 100, the mass component 101 can be used to represent the mass load applied back to the vibrating block near the tragus region of the head. The mass component 101 is also referred to as the inertial component. When the vibration block is connected to the mass component 101, the vibration block pushes the mass component 101 to move with it during the vibration process. At this time, the mass component 101 and the vibration unit maintain the same phase and have the same or approximately the same vibrational acceleration. In some embodiments, the shape of the mass component 101 may include, but is not limited to, a regular structure such as a cylinder, cuboid, cone, frustum, sphere, or the like, or an irregular structure. In some embodiments, the material of the mass component 101 may include, but is not limited to, any rigid material such as plastic, wood, or metal, or the like. In some embodiments, to provide a mechanical impedance of the impedance device in the range of 6 dB to 50 dB, the mass of the mass component 101 may be in the range of 0.5 g to 5 g. Preferably, the mass of the mass component 101 may be in the range of 0.6 to 4.5 g. More preferably, the weight of the mass component 101 may range from 0.8 to 4 g. More preferably, the mass of the mass component 101 may range from 1 to 3.6 g. More preferably, the mass of the mass component 101 may be in the range of 1.5 to 3 g. More preferably, the weight of the mass component 101 may be in the range of 2 to 2.5 g.

The fixed component 104 may be related to the carrier of the impedance device 100 and may be used to carry other components of the impedance device 100 (eg, the mass component 101, the elastic component 102, and the damping component 103). In some embodiments, the design of the fixed component 104 may include, but is not limited to, a plate structure, a housing structure, a block structure, a tabletop structure, or the like. It should be noted that the fixed component 104 is not limited to the above structure, and the fixed component 104 can be any shape structure, as long as it is a structure capable of carrying other components (for example, the mass component 101, the elastic component 102, and the damping component 103) of the impedance device. 100, and there are no additional restrictions.

The elastic component 102 can be used to provide a certain amount of elasticity to move the mass component 101. The magnitude of the elastic force of the elastic component 102 is proportional to the displacement or displacement amplitude of the mass component 101 . For example, the elastic component 102 deforms during the movement of the mass component, and the elastic force of the elastic component 102 is related to the deformation of the elastic component 102. The larger the deformation, the greater the elastic force generated by the elastic component 102. The elastic coefficient of the elastic component 102 can be used to represent the equivalent coefficient of elasticity near the region of the tragus of the human head. In some embodiments, the spring rate of the elastic component 102 may be set to be approximately equal to the equivalent spring rate in the vicinity of the human tragus region. In some embodiments, the spring rate of the elastic component 102 may be set based on the hardness near the tragus region of the human head, the age of the wearer, the pressure when wearing the vibration unit, and the cell type in place. Specific reasons are as follows: the hardness of different parts of the human head is different, and the equivalent coefficients of elasticity of different parts of the human head are also different. For example, the frontal part of the human head and the mastoid part behind the ear are relatively hard, and their equivalent coefficients of elasticity are relatively large. As another example, the part of the temporal bone in front of the ear of the human head (i.e., near the tragus region) is softer than the part of the forehead and the mastoid part behind the ear, and the equivalent coefficient of elasticity of the part of the temporal bone is relatively small. In addition, the Young's modulus of elastin and collagen in different human head cells is different (for example, Young's modulus of elastin E≈0.3 MPa, Young's modulus of collagen E=100~1000 MPa). Consequently, different cells have different effects on the equivalent elastic coefficients of different areas of the human head. In addition, the same body part of the same person has different equivalent elasticity coefficients at different ages. For example, after the aging of the human body, due to the decrease in the amount of subcutaneous fluid, the equivalent elasticity coefficient may increase accordingly. In some embodiments, the human scalp equivalent skin elasticity coefficient is also related to the pressure between the vibration unit and the scalp when the user wears the vibration unit. For example, when a user wears a device containing a vibration unit (such as a hearing device, an audio device, etc.), after applying pressure between the device and the human scalp, the device compresses the subcutaneous cells of the human body, which may affect the amount of subcutaneous fluid, according to the device. The greater the pressure, the smaller the amount of subcutaneous fluid corresponding to the device, and the greater the corresponding equivalent elastic coefficient. To mimic the characteristic that the equivalent elasticity coefficient of the human scalp changes with pressure, in some embodiments, the elasticity coefficient of the elastic component 102 may be set to change in accordance with the movement or amplitude of movement of the mass component 101. For example, as the displacement amplitude of the mass component 101 increases, the elastic coefficient of the elastic component 102 increases accordingly. In order for the spring rate of the elastic component 102 to be equal to or approximately equal to the equivalent spring rate in the vicinity of the tragus region of the head, in some embodiments, the spring rate of the elastic component 102 may be in the range of 600 N/m to 5000 N/m. Preferably, the elasticity coefficient of the elastic component 102 may be in the range of 700 N/m to 4500 N/m. More preferably, the elasticity coefficient of the elastic component 102 may be in the range of 800 N/m to 4000 N/m. Preferably, the elasticity coefficient of the elastic component 102 may be in the range of 850 N/m to 3500 N/m. Preferably, the elasticity coefficient of the elastic component 102 may be in the range of 900 N/m to 1700 N/m. Preferably, the elasticity coefficient of the elastic component 102 may be in the range of 1000 N/m to 1500 N/m. Preferably, the elasticity coefficient of the elastic component 102 may be in the range of 1100 N/m to 1400 N/m. In some embodiments, the resilient component 102 may include, but is not limited to, a spring, resilient soft rubber or silicone, resilient structure plastic, resilient metal, and so on. or other elastic forms (for example, an air cushion). In some embodiments, the spring includes, but is not limited to, one or more of the following springs: a compression spring, an extension spring, a torsion spring, a coil spring, or a flat spring. In some embodiments, elastic component 102 may also be a fluid (eg, gas, liquid, or a combination of gas and liquid, etc.). When an external force is applied to the fluid (eg, pressure on the fluid when the mass component 101 vibrates), the fluid creates a certain resistance to movement (i.e., viscosity) of the mass component 101 to provide some flexibility to move the mass component 101.

The damping component 103 may be used to provide damping for the movement of the mass component 101. The damping component 103 may represent the equivalent damping of the human body. In order for the damping provided by the damping component 103 to be equal or approximately equal to the equivalent damping near the tragus region of the head, in some embodiments, the damping factor of the damping component 103 may be in the range of 1 to 4. More preferably, the damping factor of the damping component 103 may be 1 to 3. More preferably, the damping factor of damping component 103 may be in the range of 1 to 2. In some embodiments, damping component 103 may include, but is not limited to, one or more of the following: spring damper, hydraulic damper, friction damper , pulsation damper, rotary damper, viscous damper, air damper, damper joint or damper guides, etc. In some embodiments, the implementation of the damping component 103 may be implemented using the properties of a particular medium (for example, a fluid with a certain viscosity, such as ferrofluid).

In some embodiments, the mass component 101 or the resilient component 102 or the damping component 103 may simultaneously provide a mass effect, a resilient effect, or a damping effect. In some embodiments, the mass component 101 and the elastic component 102 may be the same component. For example, an elastic silicone block can serve as the mass component 101 and the elastic component 102 at the same time. In some embodiments, the mass component 101 and the damping component 103 may be the same component. For example, the fixed component 104 has an opening of the same shape as the mass component 101. When the side wall of the mass component 101 is in contact with the inner wall of the stationary component 104, the frictional force between the mass component 101 and the stationary component 104 can be used as damping of the impedance device 100. In some embodiments, the elastic component 102 and the damping component 103 can be made as one or the same component. For example, a foam-filled or wrapped spring acts as both the resilient component 102 and the damping component 103.

It should be noted that the above description of the impedance device 100 is for exemplary illustration only and does not limit the scope of the present invention. For those skilled in the art, various modifications and changes may be made to the impedance device 100 as described herein, such as the elimination of the elastic component 102 or the damping component 103, and these modifications and changes are still within the scope of the present description.

In FIG. 2 is a schematic structural diagram of an impedance device 200 in accordance with some embodiments of the present invention. As shown in FIG. 2, the impedance device 200 may include a mass component 201, an elastic component 202, a damping component 203, and a stationary component 204. component 203) of the impedance device 200. The fixed component 204 may be a plate structure, block structure, housing structure, or other regular and irregular shapes. In some embodiments, the fixed component 204 may include a fixed arm, which may be a partial structure or composite structure of the fixed component 204. For example, if the fixed component 204 is a plate structure, then the plate structure may be a fixed arm. As another example, if the fixed component 204 is a housing structure, then the fixed arm may be a side wall of the housing structure. In some embodiments, the mass component 201 is located opposite the fixed arm, with one side of the mass component 201 facing the fixed arm and the other side of the mass component 201 facing away from the fixed arm. An elastic component 202 may be positioned between the mass component 201 and the stationary arm to support the mass component 201 such that the mass component 201 is moved relative to the stationary component by an external force (eg vibration of a vibrating unit). In some embodiments, resilient component 202 may be a double-ended columnar structure, with a first end of resilient component 202 connected to mass component 210 and a second end of resilient component 202 connected to a fixed arm. In some embodiments, a damping component 203 may be located between the mass component 201 and the fixed arm, with the first end of the damping component 203 connected to the mass component 201 and the second end of the damping component 203 connected to the fixed arm. In some embodiments, the damping component 203 may include at least one of the following: a spring damper, a hydraulic damper, a friction damper, a pulsation damper, a rotary damper, a viscous damper, an air damper, a damper joint, damper guides, and so on.

It should be noted that the above description of the impedance device 200 is for exemplary illustration only, and the number of mass components, elastic components, and damping components of the impedance device 200 is not limited to the above, but there may also be more than one. For example, there may be several elastic components, and several elastic components may be connected in series with each other. In addition, by adjusting the number of elastic components of the impedance device 200, the elastic coefficient of the entire elastic component can be in the range of 600 N/m to 5000 N/m mentioned above.

In FIG. 3 is a schematic structural diagram of an impedance device 300 in accordance with some embodiments of the present invention. The general structure of the impedance device 300 shown in FIG. 3 is substantially the same as the impedance device 200 shown in FIG. 2, and the difference is that in the impedance device 300 shown in FIG. 3, the side of the mass component 301 away from the fixed component 304 has a protective layer 305. The protective layer 305 can prevent the mass component 301 from directly contacting the vibration block, thereby preventing wear of the vibration block. In some embodiments, the backing layer 305 may be a metal backing layer, a fabric backing layer, a silicone backing layer, a soft rubber backing layer, etc. or any combination of them. In addition, the number of elastic components 302 in the impedance device 300 shown in FIG. 3 differs from the number of elastic components 202 in the impedance device 200 shown in FIG. 2. In some embodiments, the number of elastic components 302 may be two or more. If the elastic components 302 include multiple elastic components 302, then the multiple elastic components 302 may be located between the mass component 301 and the stationary component 304. In some embodiments, the multiple elastic components 302 may be elastic elements with the same or different characteristics (e.g., length , coefficient of elasticity, etc.). If the characteristics of the multiple elastic components 302 are the same, then the multiple elastic components 302 can be evenly distributed along the side surface of the mass component 301 facing the stationary component 304. If the characteristics of the elastic components 302 are different, for example, the lengths of the elastic components 302 are different, then the two ends of the elastic component 302 of longer length are connected to the stationary component 304 and the mass component 301, respectively, and the elastic elements of shorter length can be combined in series to form one elastic component 302, and the two ends of the elastic component 302, formed by a number of elastic elements next to each other, are connected to the fixed component 304 and mass component 301, respectively. It should be noted that the number of elastic components 302 is not limited to the two shown in FIG. 3, and may also be three, four, five, or more than five. Other structures and components of the impedance device 300 (eg, damping component 303 and fixed component 304) are the same or similar to those of the impedance device 200 shown in FIG. 2. For more details, please refer to the description of FIG. 2, which we will not repeat here.

In some embodiments, the implementation of the elastic component and the damping component of the impedance device can be made in the form of one or the same component. For more details, please refer to Fig. 4 and the corresponding description below. In FIG. 4 is a schematic structural diagram of an impedance device 400 in accordance with some embodiments of the present invention. As shown in FIG. 4, the elastic component 402 may include one or more springs, and the springs are located between the mass component 401 and the stationary component 404 to connect the mass component 401 and the stationary component 404. In some embodiments, a substance with damping properties may be located in or around the spring. , and the damping agent can dampen the spring so that the filled spring can act as both an elastic component and a damping component. In some embodiments, damping component 403 may be a resilient material such as foam, sponge, rubber, silicone, etc. Other structures and components of impedance device 400 (eg, fixed component 404 and protective layer 405) are the same or similar to some of the structures and components of impedance device 300 described in FIG. 3. For more details, please refer to the description of FIG. 3, which we will not repeat here.

In FIG. 5 is a schematic structural diagram of an impedance device 500 in accordance with some embodiments of the present invention. As shown in FIG. 5, the impedance device 500 may include a mass component 501, an elastic component 502, a damping component 503, and a stationary component 504. In some embodiments, the stationary component 504 may be a single open end housing structure, and the mass component 501 is suspended in an opening in the structure. body through the elastic component 502, so that the mass component 501 can connect or contact the vibrating block or the vibrating block through an opening in the stationary component 504.

In some embodiments, the fixed component 504 may include a first side wall, a second side wall, and a third side wall, wherein there is a distance between the first side wall and the second side wall to form an opening in the housing structure, and the third side wall is located opposite the opening. The mass component 501 is a columnar structure, the side wall of the mass component 501 is connected to the first side wall and the second side wall of the stationary component 504 through the elastic component 502, and the side of the mass component 501 facing the third side wall is connected to the third side wall through the damping component 503. In some embodiments, part of the structure of the mass component 501 may protrude from the opening of the stationary component 504, or the entire structure of the mass component 501 is below the plane in which the opening is located, or the side of the mass component 501 facing away from the third side wall is in the same plane that is the plane in which the hole is located. It should be noted that the first side wall, the second side wall, and the third side wall of the fixed component 504 are included here only for convenience in describing the fixed component 504. In some embodiments, the first side wall and the second side wall may be different side walls. For example, if the fixed component 504 has a cubic structure, then the first side wall and the second side wall may be two opposite side walls in the cubic structure. In some embodiments, the first side wall and the second side wall may be the same side wall. For example, if the fixed component 504 is of a cylindrical design, then the first side wall and the second side wall are different components of the side wall of the cylinder. In addition, the side wall of the fixed component 504 is not limited to the aforementioned first side wall and the second side wall, and may also include other side walls such as a fourth side wall, a fifth side wall, etc., and the side wall of the mass component 501 may be connected to other side walls through the elastic component 502, or the side wall of the mass component 501 may not be connected to other side walls.

In some embodiments, elastic component 502 may include a first end and a second end. The first end of the elastic component 502 is connected to the side wall of the mass component 501, and the second end of the elastic component 502 is connected to the inner wall of the housing structure. In some embodiments, there may be multiple elastic components 502, and multiple elastic components 502 may be distributed along the sidewall of the mass component 501 at intervals.

It should be noted that the impedance device shown in FIG. 2-5 is provided for exemplary description only and does not limit the scope of the present invention. For those skilled in the art, various modifications and changes can be made to the impedance device in accordance with the present disclosure, such as changing the implementation of the mass component or changing the implementation of the elastic component, and these modifications and changes are still within the scope of the present invention.

In FIG. 6 is a schematic structural diagram of an impedance device 600 in accordance with some embodiments of the present invention. As shown in FIG. 6, the fixed component 604 may be a single open end housing design. There may be several elastic components 602, and several elastic components 602 are distributed along the side wall of the mass component 601 at intervals.

In some embodiments, the stationary component 604 may be a cylindrical housing structure with one open end. The housing structure has a cavity, and the cavity can accommodate a mass component 601, an elastic component 602, and a damping component 603. The cavity communicates with the opening, and the top of the mass component 601 can be connected to or contact the vibration block through the opening of the fixed component 604. In some embodiments, the distance between the side wall of the mass component 601 and the inner wall of the stationary component 604 may or may not be the same everywhere.

In some embodiments, the damping portion 603 may be located between the mass component 601 and the bottom wall of the housing structure. In some embodiments, one end of the damping component 603 is connected to one side of the mass component 601, and the other end of the damping component 603 is connected to the bottom wall of the housing structure. In some embodiments, the damping component 603 may be a damper that is supported between the bottom of the mass component 601 and the bottom wall of the housing structure.

In some embodiments, the first end of the elastic component 602 is connected to the side wall of the mass component 601, and the second end of the elastic component 602 is connected to the inner wall of the housing structure. In some embodiments, the elastic forces of the multiple elastic components 602 acting on the mass component 601 or the stationary component 604 may be equal or unequal. In some embodiments, the resilient component 602 may include at least one of a compression spring, an extension spring, a torsion spring, a coil spring, a leaf spring, and so on.

To prevent foreign objects from entering the impedance device 600 and interfering with the accuracy of the impedance device 600, in some embodiments, the impedance device 600 may further include a blocking component (not shown in FIG. 6), and the blocking component may be located between the side wall mass component 601 and the inner wall of the fixed component 604. The side wall of the blocking component is connected to the inner wall of the fixed wall. In some embodiments, the blocking component may include an opening corresponding to the shape of the mass component 601, and the mass component 601 may be located in the opening of the blocking component 601. In some embodiments, the size of the opening may be larger than the size of the mass component, so that the mass component 601 may vibrate in the hole of the blocking component. In some embodiments, the shape of the blocking component is adapted to the shape of the space formed by the side wall of the mass component 601 and the stationary component 604. For example, if the stationary component 604 and the mass component 601 are both cylindrical structures, then the blocking component may be an annular structure. As another example, if the fixed component 604 has a cylindrical structure and the mass component 601 has a rectangular parallelepiped structure, then the overall shape of the blocking component may be a cylindrical structure with a rectangular hole. It should be noted that in some embodiments, the mass component 601 may also be connected to the blocking component via the elastic component 602.

In some embodiments, the implementation of the damping part can be any object that has damping properties. In FIG. 7 is a schematic structural diagram of an impedance device 700 in accordance with some embodiments of the present invention. As shown in FIG. 7, the damping component 703 is located between the bottom of the mass component 701 and the bottom of the stationary component 704. The damping component 703 can be any object that has damping characteristics, such as a foam or liquid with a certain viscous drag force (for example, ferrofluid, liquid ) etc. The mass component 701, the elastic component 702, and the stationary component 704 are the same or similar to some of the structures and components of the impedance device shown in FIG. 6. For more details, please refer to the description of FIG. 6, which we will not repeat here.

In order to more clearly describe the distribution and specific structure of the elastic component, the elastic component can now be further described with reference to FIG. 8 and FIG. 9. In FIG. 8 is a plan view of the construction of an impedance device 800 in accordance with some embodiments of the present invention.

As shown in FIG. 8a, in some embodiments, resilient component 802a may include four springs (eg, at least one of a compression spring, an extension spring, a torsion spring, a coil spring, or a leaf spring). Four elastic components 802a are evenly spaced along the side wall of the mass component 801a. In some embodiments, the distance between any portion of the side wall of the mass component 801a and the inner wall of the stationary component 804a may be the same. Here, by using the same elastic component 802a, the elastic force generated by each elastic component 802a can be kept the same during the vibration of the mass component 801a, so that each elastic component 802a can have the same life and improve the accuracy of the impedance measurement device during testing. . Note that the number of elastic components 802a is not limited to the four shown in FIG. 8a, and may also be two, three, five or more. In addition, several elastic components 802a may include different types of springs. For example, among the four springs shown in FIG. 8a, two springs arranged vertically are compression springs and two springs arranged horizontally are coil springs.

As shown in FIG. 8b, in some embodiments, resilient component 802b may be an arcuate leaf spring, and multiple resilient components 802b are evenly spaced along the side wall of mass component 801b. It should be noted that the shape of the leaf spring is not limited to the aforementioned arcuate shape, but may also have other shapes such as straight, triangular, V-shaped, Z-shaped, helical, or other regular and irregular shapes. Other structures and components of the impedance device 800 are the same or similar to some of the structures and components of the impedance device 600 described in FIG. 6. For more details, please refer to the description of FIG. 6, which we will not repeat here.

In FIG. 9 is a plan view of the construction of an impedance device 800 in accordance with some embodiments of the present invention. As shown in FIG. 9, the elastic component 902 of the impedance device 900 may be a mesh structure, and the mesh structure may include several elastic elements 9021 (for example, springs, spring plates, etc.) and several annular structures 9022. Several elastic elements 9021 are distributed along side wall of the mass component 901 at intervals, and several ring structures 9022 are distributed at intervals around the mass component 901, with several ring structures 9022 connected to the elastic element 9021. The mesh structure suspends the mass component 901 from the opening of the fixed component 904. the mesh ring is connected to the side wall of the mass component 901, and the outer ring of the mesh structure is connected to the inner wall of the stationary component 904. The inner ring of the mesh structure refers to the side of the mesh structure close to the side wall of the mass component 901, and, accordingly, the outer ring o mesh structure refers to the side of the mesh structure remote from the side wall of the mass component 901. In some embodiments, the shape of the resilient member 9021 in the mesh structure may be regular or irregular, such as rectangular, triangular, arcuate, V-shaped, and so on. It should be noted that the ring structure 9022 in the mesh structure may also have other shapes, such as any shape such as square, triangle, pentagon, and hexagon, etc. In addition, the number of ring structures 9022 is not limited to the two shown in FIG. 9, but can also be one, three or more. If there are multiple ring structures 9022, then the shapes of the ring structures 9022 may be the same or different. Other structures and components of the impedance device 900 are the same or similar to some of the structures and components of the impedance device 800 described in FIG. 8. For more details, please refer to the description of FIG. 8, which we will not repeat here. In addition, the partial structures in the mesh structure shown in FIG. 9 (eg, elastic member 9021 and ring structure 9022) can also be applied to the impedance device shown in FIG. 5-8.

In the impedance devices shown in FIG. 2-9, parameters of the mass component, the elastic component, and the damping component may be specified with reference to FIG. 1 and its associated description. For example, the parameters of the mass component, elastic component, and damping component can be adjusted such that if the external force applied to the mass component is 0.05 to 3.5 N, the mechanical impedance of the impedance device is in the range of 6 dB to 50 dB. For example, the mechanical impedance of the impedance device under the action of a certain external force can be changed by adjusting the number of springs and the elasticity coefficient of the elastic component, the number and coefficient of damping of the damping elements of the damping component, and the mass of the mass component.

In FIG. 10 is a schematic structural diagram of an impedance device 1000 in accordance with some embodiments of the present invention. As shown in FIG. 10, the fixed component 1004 may be a housing design with one open end. The sealed cavity 1007 may be enclosed between the mass component 1001 and the body structure, and the gas in the sealed cavity 1007 may form an elastic component. In some embodiments, a friction force occurs between the side wall of the mass component 1001 and the inner wall of the housing structure. The frictional force may form a damping component, and the frictional force between the housing structure and the mass component 1001 provides a certain damping to move the mass component 1001.

In the impedance device 1000 shown in FIG. 10, if the external force acting on the mass component 1001 is in the range of 0.05 to 3.5 N, then the mass of the mass component 1001, the coefficient of friction between the mass component 1001 and the housing structure, or the pressure of the gas inside the sealed cavity 1007, can be adjusted so that the mechanical impedance of the impedance device 1000 is within the target range (eg, 6 dB to 50 dB). In some embodiments, a resilient element (e.g., a spring) may also be added to the sealed cavity 1007 to connect the bottom wall of the housing structure to the mass component 1001 to adjust the mechanical impedance of the impedance device 1000.

It should be noted that the impedance devices shown in FIG. 6-10 are provided for exemplary description only and do not limit the scope of the present invention. For those skilled in the art, various modifications and changes can be made to the impedance device as described herein, such as reshaping the mass component and the stationary component, or wrapping the elastic component on the side wall of the mass component with foam, etc. These modifications and changes remain within the scope of this manual.

In some embodiments, an impedance device may be used to model mechanical impedance in the vicinity of the tragus region of the head. Mechanical impedance near the tragus region of the head refers to the response to movement near the tragus region of the head when excited by an external force. The motion response may include at least one of a displacement response, a velocity response, an acceleration response, and so on. For purposes of illustration, the external force may be an excitation force generated by the vibrating block when the vibrating block vibrates, and the movement response is a velocity response. In some embodiments, the mechanical impedance in the vicinity of the tragus region of the head can be represented as the ratio of the driving force to the magnitude of the velocity response expressed as follows:

, (1)

, (1)

where F is the excitation force generated by the vibration unit, v is the velocity response, and Z is the mechanical impedance near the tragus region. The greater the mechanical impedance in the region of the tragus of the head, the lower the magnitude of the velocity response.

In FIG. 11 is a diagram of an analog mechanical impedance circuit model of an impedance device in accordance with some embodiments of the present invention. In the mechanical impedance circuit model, the analog of the excitation force F can be voltage, the analog of velocity v can be current, the analog of inertia m (provided by the mass component) can be inductance, the analog of elastic deformation c (c=1/k, k is the coefficient of elasticity provided by the elastic damping component) can be a capacitor, and the counterpart of the damping r (provided by the damping component) can be a resistor, thus producing an analog circuit of the mechanical impedance model of the impedance device. As shown in FIG. 11, the analog circuit model is a series circuit of an inductor, a capacitor, and a resistor. Thus, the mechanical impedance Z is expressed as:

, (2)

, (2)

where m is the inertia, k is the elasticity coefficient, r is the damping, and ω is the angular velocity of the vibration block. Mechanical impedance is a complex number and can be written as a real part with an imaginary part. In addition, the frequency response of the magnitude of the mechanical impedance can be expressed as:

, (3)

, (3)

where the reference value of 0 dB represents 1 V s/m.

In combination with formulas (1), (2) and (3) above, it can be known that the impedance device can be tuned by adjusting the mass of the impedance device, the spring rate of the elastic component, or the damping of the damping component. Thus, the mechanical impedance provided by the impedance device approximately corresponds to the mechanical impedance near the tragus region of the head. The frequency response curve of the mechanical impedance near the tragus region has a trough in a certain frequency range (e.g., 50 Hz to 500 Hz), i.e., the mechanical impedance of the tragus region has a minimum value (also known as the trough value) in a certain frequency range. In addition, when the frequency is less than a certain frequency range, the mechanical impedance near the tragus region decreases as the frequency increases, and when the frequency exceeds a certain frequency range, the mechanical impedance near the tragus region increases as the frequency increases. In some embodiments, the implementation of a particular frequency may not be limited to the aforementioned range of 50 Hz-500 Hz. In some embodiments, the specific frequency may also be other frequencies, such as frequencies in the 60 Hz-400 Hz range, in the 70 Hz-300 Hz range, or in the 80 Hz-200 Hz range, or any frequency value in the range.

In some embodiments, the damping of the impedance device may be adjusted such that the mechanical impedance value provided by the impedance device matches or approximately matches the mechanical impedance value near the tragus region of the head. In some embodiments, the damping component damping factor may be adjusted to be in the range of 1 to 4 such that the mechanical impedance value of the impedance device is in the range of 0 dB to 15 dB. Preferably, the damping factor of the damping component can be adjusted to be in the range of 1.5 to 3.9, so that the mechanical impedance value of the impedance device is in the range of 2 dB to 13 dB. More preferably, the damping factor of the damping component can be adjusted to be in the range of 2 to 3.7 so that the mechanical impedance value of the impedance device is in the range of 3 dB to 12 dB. More preferably, the damping factor of the damping component may be adjusted to be in the range of 2.4 to 3.2 such that the mechanical impedance value of the impedance device is in the range of 6 dB to 10 dB.

In some embodiments, the mass of the mass component and the spring rate of the elastic component may be adjusted such that the frequency corresponding to the trough value may be within a certain frequency range. In some embodiments, the weight of the mass component may be adjusted to be in the range of 0.5 to 5 g, and the elasticity coefficient of the elastic component may be adjusted to be in the range of 600 to 5000 N/m, such that the value of the valley of the impedance device can be in the range from 50 Hz to 500 Hz. Preferably, the weight of the mass component can be adjusted to be in the range of 0.8 to 4.5 g, and the elasticity coefficient of the elastic component can be adjusted to be in the range of 700 to 3500 N/m, so that the value of the valley of the impedance device can be in the range from 60 Hz to 320 Hz. More preferably, the mass of the mass component may be adjusted to be in the range of 1 to 3.6 g, and the elasticity coefficient of the elastic component may be adjusted to be in the range of 900 to 1700 N/m, so that the value The trough of the impedance device can range from 80 Hz to 200 Hz.

In FIG. 12 is a schematic diagram of a system for simulating the effect of a head on vibration of a vibrating unit, in accordance with some embodiments of the present invention. As shown in FIG. 12, system 1400 includes vibrator 1410, impedance device 1420, connector 1430, and sensor 1440.

In some embodiments, the implementation of the vibration unit 1410 may be configured to provide a vibration signal. In some embodiments, the implementation of the vibration unit 1410 may convert a signal containing audio information into a vibration signal. In some embodiments, the audio information may include a video file, an audio file with a specific data format, or data or a file that can be converted to audio using a specific approach. The signal containing audio information may come from a storage component that interacts with or is connected to the vibration unit 1410. In some embodiments, a signal containing audio information may include an electrical signal, an optical signal, a magnetic signal, a mechanical signal, and so on. or any combination of them. In some embodiments, the vibration unit 1410 may receive a signal containing audio information in a variety of different ways. Signal acquisition methods include, but are not limited to, wired or wireless acquisition, and may also include real-time acquisition or delayed acquisition. For example, the vibration unit 1410 may receive an electrical signal containing audio information by wire or wireless, or may directly receive data from a carrier to generate a signal. In some embodiments, the vibration unit 1410 may convert a signal containing audio information into mechanical vibration, and the conversion process may include the coexistence and conversion of several different types of energy. For example, an electrical signal can be directly converted into a mechanical vibration using a sound transducer. For example, sound information may be contained in an optical signal, and the process of converting the optical signal into a vibration signal may be implemented by a converting device. Other forms of energy that may coexist and be converted during operation of the conversion device may include heat energy, magnetic field energy, and so on. In some embodiments, the energy conversion method of the conversion device may include a moving coil, an electrostatic type, a piezoelectric type, a moving iron tip cartridge, a pneumatic type, an electromagnetic type, and so on. or any combination of them.

In some embodiments, the impedance device 1420 may be in contact with the vibration block 1410 and provide mechanical impedance to the vibration block 1410. In some embodiments, there is a certain amount of pressure between the impedance device 1420 and the vibration block 1410. The mechanical impedance provided by the impedance device 1420 can simulate head resistance against vibration unit 1410 during actual use, and the mechanical impedance vibration unit 1410's vibration state matches or substantially matches the vibration characteristic when it is actually used on the head, so as to allow the system to simulate the effect of the head's mechanical impedance on the vibration state of the vibration unit 1410, when the vibration block 1410 is connected to the head and vibrates. For information on the specific contents of the impedance device, please refer to the respective descriptions and descriptions in FIGS. 1-10, which will not be repeated here.

In some embodiments, the connector 1430 may be configured to connect the vibrator 1410 to the impedance device 1420. In some embodiments, the connector 1430 may provide a pressure of 0.05 to 3.5 N between the vibrator 1410 and the impedance device 1420. Preferably, the connector 1430 may provide a pressure between the vibrator 1410 and the device 1420 in the range of 0.1 to 3 N. Preferably, the connector 1430 may provide a pressure between the vibrator 1410 and the device 1420 in the range of 0.3 to 2.5 N. Preferably, the connector 1430 may provide pressure between vibrator 1410 and device 1420 in the range of 0.5 to 2 N. Preferably, connector 1430 may provide pressure between vibrator 1410 and device 1420 in the range of 0.8 to 1.8 N. Preferably, connector 1430 can provide pressure between the vibrating block 1410 and the device 1420 in the range from 1 to 1.5 N In some embodiments, connector 1430 may be coupled to vibrator 1410 and may apply pressure to vibrator 1410 such that vibrator 1410 may be coupled to impedance device 1420. In some embodiments, connector 1430 may be coupled to vibrator 1410 and fixed in contact with other fixed structures. For example, connector 1430 may be a connector that may connect vibration block 1410 to other fixed structures, and other fixed structures include, but are not limited to, headforms or fixtures, etc. In some embodiments, the connector 1430 may be integral with the vibration block 1410 and secured in contact with other fixed structures. For example, connector 1430 may be an integral earpiece for a headset, an integral ear-retaining structure for hearing aids, an integral spectacle-frame structure for audio glasses, and so on. In some embodiments, the connector material 1430 may include, but is not limited to, plastic and metal with a certain hardness and shape, as well as silicone and fabric with a certain resiliency.

In some embodiments, when connector 1430 provides pressure between vibrator 1410 and impedance device 1420 in the range of 0.05 to 3.5 N, impedance device 1420 provides mechanical impedance to vibrator 1410 in the range of 6 dB to 50 dB. The mechanical impedance in the range of 6 dB to 50 dB simulates the actual resistance exerted on the vibrator 1410 near the tragus region in actual use, so that when the vibrator 1410 and the impedance device 1420 are connected to vibrate, the effect of the mechanical impedance on the vibration of the vibrator 1410 can simulate the effect of the actual resistance of the head on the vibration of the vibration unit 1410 when the vibration unit 1410 is connected to the vibration head, thereby facilitating the development and production of related products for testing or calibration.

To ensure that vibrator 1410 and impedance device 1420 are fully installed, in some embodiments, the area of the connection area between impedance device 1420 and vibrator 1410 may be in the range of 0.25 cm ² to 4 cm ² . In some embodiments, the area of the connection area between the impedance device 1420 and the vibrator 1410 may range from 0.5 cm ² to 3.8 cm ² . In some embodiments, the area of the connection area between the impedance device 1420 and the vibrator 1410 may range from 1 cm ² to 3.6 cm ² . In some embodiments, the area of the connection area between the impedance device 1420 and the vibrator 1410 may range from 1.5 cm ² to 3.4 cm ² . In some embodiments, the area of the connection area between the impedance device 1420 and the vibrator 1410 may range from 2 cm ² to 3.2 cm ² . It should be noted that the area of the connection area between the impedance device 1420 and the vibration unit 1410 is not limited to the above range, and may also be in other ranges. For example, the joint area is greater than ⁴ cm2 or less ^than 0.25 cm2, and the specific joint area may be adaptively adjusted according to the size of the vibration block 1410.

In some embodiments, the sensor 1440 may be configured to collect parameter information during the vibrating process of the vibrating unit 1410. In some embodiments, the sensor 1440 may also be configured to collect parameter information during the vibrating process of the vibrating unit 1410 when the vibrating unit 1410 is connected to the impedance device 1420. In some embodiments, the information about the parameters during the vibration process can be used to characterize the vibrational impact of the vibration unit 1410. In some embodiments, the information about the parameters during the vibration process may include vibration characteristics data, and vibration performance data may include, but is not limited to, at least one of vibration displacement, vibration velocity, vibration acceleration, and so on. In some embodiments, parameter information during the vibration process may include vibration-generated airborne acoustic performance data and airborne acoustic performance data may include, but is not limited to, one or more of the following: sound level pressure, frequency response, etc. air conduction of sound. In some embodiments, the sensor 1440 may be located in the vibration unit 1410, for example, the sensor 1440 may be mounted directly on the surface or within the vibration unit 1410. In some embodiments, the sensor 1440 may be indirectly connected to the vibration unit 1410, for example, the sensor 1440 may be mounted on or within the impedance device 1420, such as a mass component of the impedance device 1420. In some embodiments, the sensor 1440 may also be located on the connector 1430. In some embodiments, the type and/or shape of the sensor 1440 may be non-limiting, for example , sensor 1440 may be a non-contact laser sensor (such as a vibrometer, Doppler tester) that can detect vibrational acceleration (velocity or displacement). The sensor 1440 may also be a contact sensor such as an acceleration sensor, a bone conduction sensor, a piezoelectric sensor, a MEMS sensor, and so on.

In some embodiments, the system may also include a test system, and the test system may be connected to at least one sensor 1440 to collect and/or process detection signals from at least one sensor 1440. In some embodiments, the test system may be connected with a vibration unit 1410 for supplying a control signal to the vibration unit 1410 to drive the vibration unit 1410 to generate a mechanical vibration signal. In some embodiments, the test system connects at least one sensor 1440 and a vibration unit 1410, drives the vibration unit 1410 to generate mechanical vibration signals, and collects and processes the signals collected by the at least one sensor 1440.

It should be understood that the system for simulating the effect of the head on the vibration of the vibration unit 1410 shown in FIG. 12 is for illustration and description only and does not limit the scope of the present invention. For those skilled in the art, various modifications and changes can be made to the system for simulating the effect of the head on the vibration of the vibration unit 1410 in accordance with the present description. For example, many different types or forms of sensors 1440 are provided to monitor more and more complete parameter information. As another example, connector 1430 is removed and vibrator 1410 and impedance device 1420 are connected directly by magnetic attraction or coupling. These modifications and changes are still within the scope of the present invention.

In FIG. 13 is a diagram of the simulated position of the connection area between the vibration unit and the head, in accordance with some embodiments of the present invention. As shown in FIG. 13, when the vibration block 110 is connected to the head, the vibration block 110 is connected to the front side of the human tragus (called the region near the tragus) along the cross section as viewed from above the head. In some embodiments, the vibration unit 110 passes through the tympanic membrane and transmits a vibration signal directly to the ossicles of the middle ear and cochlea of the inner ear, primarily by vibrating the temporal bone in front of the tragus. In some cases, the vibration of the vibrating unit 110 may also vibrate the surrounding air to generate a portion of the air conduction sound, and the portion of the air conduction sound is transmitted to the eardrum through the external auditory canal. The impedance devices shown in some embodiments of the present invention are used to simulate the actual resistance generated in the vicinity of the tragus region to which the vibration unit 110 is attached, and the system for simulating the effect of the head on the vibration of the vibration unit 110 is used to simulate the vibrational effect of the actual resistance in the vicinity of the tragus region. on the vibrating block 110 when the vibrating block 110 vibrates near the tragus region. The connection between the vibrating unit 110 and the tragus area may be suitable for use with most bone conduction headphones, and may also be suitable for use with some hearing aids. Therefore, the system for simulating the impact of the head on the vibration of the vibration unit 110 can objectively measure the vibration impact of the vibration unit 110 and model and characterize the actual frequency response of the vibration unit 110 when the vibration unit 110 vibrates near the tragus region, which can be used as a test or calibration device. for research, development and production.

To facilitate adjustment of the connection pressure between the vibrating unit 110 and the impedance device provided by the connector, the connector may be of an independent design with respect to the impedance device. In FIG. 14 is a schematic structural diagram of a system for simulating the effect of a head on vibration of a vibrating unit, in accordance with some embodiments of the present invention. As shown in FIG. 14, the connector may include a support rod 122 and a locking member 123.

In some embodiments, the implementation of the locking element 123 may include a first end portion and a second end portion. The first end of the locking element 123 is connected to the support rod 122, and the second end of the locking element 123 is connected to the vibration assembly 110. In some embodiments, the implementation of the support rod 122 is used to support the locking element 123. In some embodiments, the support rod 122 may be located vertically , and the locking member 123 may be positioned horizontally. In some embodiments, the implementation of the force of the locking element 123 in relation to the vibrating block 110 may create pressure between the vibrating block 110 for connection with the impedance device. In some embodiments, by fine-tuning the distance between the support rod 122 and the damping device, the amount of pressure for connection between the vibration block 110 and the impedance device provided by the connector can be controlled. In some embodiments, by fine-tuning the length of the locking element 123, the amount of pressure provided to the connection between the vibration block 110 and the impedance device provided by the connector can be controlled. In some embodiments, the first end portion of the locking element 123 may be connected to move along the support rod 122, which may facilitate adjustment of the height of the locking element 123 so that the vibration block 110 can match the height of the impedance device.

In some embodiments, the connector may also include a base 121. A support rod 122 may be connected to the base 121, and the base 121 is used to stabilize the overall construction of the connector. In some embodiments, the first end of the support rod 122 is connected to the base 121, and the second end of the support rod 122 is connected to the first end of the locking element 123.

In some embodiments, the system may also include a head model 140. The head model 140 is used to simulate a real head, and the connector is positioned relative to the head model 140. In some embodiments, the implementation of the impedance device is located near the tragus region of the head model 140, and the vibration block 110, connected to the connector, is connected to the impedance device under pressure from the connector. In some embodiments, the implementation of the impedance device may be placed on the surface of the model 140 head. In some embodiments, the implementation of the impedance device may be built into the model 140 head.

In some embodiments, the sensor may be located anywhere in the system where parameter information can be monitored during the vibration process of the vibrating unit 110. FIG. 15 is a schematic diagram of the distribution of sensors in accordance with some embodiments of the present invention.

As shown in FIG. 15(a), in some embodiments, connector 120 may connect vibrator 110 to an impedance device (not shown), and sensor 151 may be placed inside or on the surface of the impedance device. The sensor 151 obtains information about the parameters during the vibration of the vibrating block 110 by collecting information about the parameters of the impedance device vibrating from the vibration of the vibrating block 110. In some embodiments, the implementation of the sensor 151 is installed on the mass component of the impedance device. The mass component contacts the vibrating block 110, the vibrating block 110 causes the mass component to vibrate, and the mass component directly responds to the vibration frequency of the vibrating block 110. The sensor 151 can obtain information about the parameters during the vibration process of the vibrating block 110 by obtaining information about the parameters during the process vibration of the mass component.

As shown in FIG. 15(b), in some embodiments, connector 120 may connect vibrator 110 to an impedance device (not shown), and sensor 152 may be positioned independently of impedance device, vibrator 110, and connector 120. For example, sensor 152 may be integrated into the main system controller, and the sensor 152 can obtain information about the parameters during the vibration process by collecting data on the acoustic characteristics of air conduction generated by the vibration of the vibration unit 110. As another example, the sensor 152 can be a laser speed meter to measure the speed/acceleration of the surface vibration block or mass component.

As shown in FIG. 15(c), in some embodiments, a connector 120 may connect the vibrator 110 to an impedance device (not shown), and a sensor 153 may be placed inside or on the surface of the vibrator 110. The sensor 153 may directly collect parameter information during vibrating block 110. In some embodiments, sensor 153 may be incorporated into a device including vibrating block 110, and the sensor may be used to collect parameter information during the vibration process of vibrating block 110 for headset debugging and calibration. In addition, the sensor can also be used to determine if the headset is fully worn by monitoring the frequency response, for example, if it is fully worn on the face.

It should be noted that the system diagrams shown in Figs. 14 and 15 are provided for exemplary description only and do not limit the scope of the present invention. For those skilled in the art, various modifications and changes can be made to the system for simulating the effect of the head on the vibration of the vibration unit 110 in accordance with the present description. For example, the base may be missing. As another example, the specific design of the connector has been changed, and these modifications and changes are still within the scope of the present invention. The structures and components of the vibration unit 110 and the impedance device shown in FIG. 14 and FIG. 15 are the same or similar to the structures and components of the vibration unit and impedance device shown in FIG. 12 and FIG. 1-10, and for more details, please refer to their description. In some embodiments, to further mimic the fitting of the device and the head through the connector during actual use, the connector may be directly fitted to the head. In FIG. 16-18 are schematic structural diagrams of a connector installation and a headform in accordance with some embodiments of the present invention.

In some embodiments, as shown in FIG. 16, the connector may be a band structure 124, and the band structure 124 surrounds the headform 140 and secures the vibrator 110 to the impedance device. In some embodiments, the band structure 124 may be implemented in option I. The band structure 124 circumnavigates the back of the head and the two sides are respectively connected to the vibration blocks 110 located at the left ear and the right ear of the head model 140, and the vibration block structure 110 is supported by the top of the head. , serving as a fulcrum for realizing the connection of the vibration unit 110 and the model 140 of the head. In some embodiments, the implementation of the tape-like structure 124 may be implemented in option II. The band structure 124 goes around the top of the head, and the two sides are respectively connected to the vibration blocks 110 located at the left ear and the right ear of the head model 140, and the whole structure of the vibration block 110 is supported by the top of the head serving as a fulcrum to realize the connection of the vibration block 110 and 140 head models. In some embodiments, the implementation of the tape-like structure 124 may be implemented in option III. The band structure 124 goes around the face and the two sides are respectively connected to the vibration blocks 110 located at the left ear and the right ear of the head model 140, for example in the form of glasses, and the entire structure of the vibration block 110 is supported by the bridge of the nose, serving as a fulcrum to realize the connection. vibrating block 110; and head model 140. In some embodiments, the implementation of the tape-like structure 124 may be implemented in option IV. The band structure 124 circumnavigates the forehead and the back of the head, that is, the band structure 124 circumnavigates the head at least once, and the two sides are respectively connected or pressed by vibration blocks 110 located at the left ear and right ear of the head model 140. In some embodiments, a hole may be drilled into the head model 140 near the impedance device. The band structure 124 is inserted through the hole and fixed, and the band structure 124 presses the vibration block 110 against the impedance device. In some embodiments, the band-like structure 124 may be an elastic structure such as an elastic band, rubber band, etc. The band structure 124 may also be of an inelastic, length-adjustable design.

In some embodiments, as shown in FIG. 17, the connector may be a temple 125, and the temple 125 secures the vibration unit 110 to the impedance device 100. In some embodiments, the temple 125 is adapted to the ear of the head model 140. In some embodiments, the temple 125 is adapted to the pinna of the head model 140. In some embodiments, earpiece 125 may be a single-sided earhook 125, and earpiece 125 may be positioned on either side of the ear to secure vibration unit 110 to impedance device 100 corresponding to the ear. In some embodiments, earpiece 125 may be a reversible earpiece 125, and two vibrating blocks 110 may be respectively attached to the ear impedance device 100 on either side.

It should be noted that the connector design shown in Fig. 16-17 is for exemplary description only and does not limit the scope of the present invention. For those skilled in the art, the connector design may be modified or changed in accordance with the teachings of this specification. For example, there may be more than one band-like structure, and the band-like structure may cover the entire head. As another example, the earpiece may be in the form of an all-ear earpiece. These modifications and changes are still within the scope of the present invention.

In FIG. 18 shows the frequency response curve of the system for modeling the impact of the head on the vibration of the vibration unit. The dotted curve represents the measured frequency response curve 2101 of the vibration unit when the vibration unit is suspended, the dashed curve represents the measured vibration frequency curve 2102 after connecting the vibration unit and the tragus region of a real person's face, and the solid curve represents the measured frequency response curve 2103 after connecting the impedance device and the vibration block. As shown in FIG. 18, by comparing the frequency response curve 2101 and the frequency response curve 2102, it can be seen that the difference between the frequency response curve of the vibration unit when the vibration unit is suspended and the vibration frequency curve after the vibration unit is connected to the tragus region of a real person's face is indeed significant. When comparing the frequency response curve 2102 and the frequency response curve 2103 in the range of 25 Hz to 100 Hz, the frequency response after the connection of the impedance device and the vibration unit is basically consistent with the frequency response after the connection of the vibration unit and the tragus region of the face of a real person; in the range of 100 Hz to 1000 Hz, the difference between the frequency response after connecting the impedance device and the vibration unit and the frequency response after connecting the vibration unit and the tragus region of the face of a real person is small, that is, the frequency response curve 2102 and the frequency response curve 2103 are basically the same. It can be seen that the impedance device described in this disclosure generally matches the mechanical impedance of the real face, which may reflect the mechanical characteristics of the real face.

It should be noted that the beneficial effects produced by different embodiments may be different. In various embodiments, beneficial effects that may be obtained may be any of the above or other combinations, or it may be any other beneficial effect that may be obtained.

Having thus described the basic concepts, it may be apparent to those skilled in the art upon reading this detailed description that the foregoing detailed description is intended to be presented by way of example only and is not limiting. There may be various changes, improvements and modifications, which are intended for specialists in this field, although not expressly stated here. These changes, improvements, and modifications are intended to be provided for in this specification and to be within the spirit and scope of the exemplary embodiments of this invention.

Moreover, certain terminology has been used to describe embodiments of the present invention. For example, the terms "one embodiment," "an embodiment," and/or "some embodiments" mean that a particular feature, structure, or characteristic described in connection with an embodiment is included in at least one embodiment of the present invention. Therefore, it is emphasized and should be taken into account that two or more references to "an embodiment", "one embodiment" or "alternative embodiment" in different parts of this specification do not necessarily refer to the same embodiment. In addition, specific features, designs, or characteristics may be combined as appropriate in one or more embodiments of the present invention.

In addition, the order of elements or sequences of processing, or the use of numbers, letters, or other designations, is thus not intended to limit the claimed processes and methods in any order that may be indicated in the claims. While the above disclosure discusses what is now considered to be a variety of useful embodiments of the invention by various examples, it should be understood that such detailing is for that purpose only, and that the appended claims are not limited to the disclosed embodiments, but rather are intended to to cover modifications and equivalent devices that fall within the spirit and scope of the disclosed embodiments. For example, while the various components described above may be implemented in a hardware device, it may also be implemented as a software solution, such as installation on an existing server or mobile device.

Likewise, it should be understood that in the above description of the embodiments of the present invention, various features are sometimes grouped together in one embodiment, figure, or description thereof for the purpose of simplifying the disclosure to aid understanding of one or more of the various embodiments. However, it should not be assumed that the manner of disclosure reflects the intent that the claimed entity requires more features than are clearly stated in each claim. Rather, the claimed entity may not be in all features of one previously disclosed embodiment.

In some embodiments, numbers expressing quantities or properties used to describe and claim certain embodiments of the invention should be understood to be modified in some instances by the terms "about", "about", or "substantially". For example, "about", "approximately", or "substantially" may indicate a deviation of ±20% from the value it describes, unless otherwise indicated. Accordingly, in some embodiments, the implementation of the numerical parameters set forth in the written description and the accompanying claims are approximate and may vary depending on the desired properties to be obtained in a particular embodiment. In some embodiments, the numerical parameters should be interpreted in light of the number of significant digits reported and by applying conventional rounding techniques. Although the numerical ranges and parameters that define the broad scope of some embodiments of the invention are approximate, the numerical values given in specific examples are given as precisely as possible.

Each of the patents, patent applications, patent application publications, and other materials such as articles, books, specifications, publications, documents, things, and/or the like, referenced in this document are incorporated herein by this reference in their entirety. for all purposes, except for any litigation relating thereto, any inconsistent with or contrary to this document, or any which may have a limiting effect on the broadest scope of the claims now or later bound with this document. By way of example, in the event of any inconsistency or conflict between the descriptions, definition and/or use of a term associated with any of the included materials and the term associated with this document, the description, definition and/or use of the term in this document shall prevail.

In conclusion, it should be understood that the embodiments of the application disclosed in this document illustrate the principles of the embodiments of the application. Other modifications that may be used may be within the scope of the invention. Thus, by way of example, and not limitation, alternative configurations of embodiments of the invention may be used in accordance with the ideas set forth in this document. Accordingly, the embodiments of the present invention are not limited to those specifically shown and described.

Claims (13)

1. An impedance device, comprising: a mass component, at least one elastic component, and a stationary component, wherein the mass component is connected to the stationary component via at least one elastic component; damping component located between the mass component and the fixed component and providing damping of the movement of the mass component relative to the fixed component, and when the mass component is in contact with the external vibration unit, the mass component receives the vibration of the external vibration unit and moves relative to the stationary component, while the mass of the mass component is in the range from 0.5 to 5 g, the elasticity coefficient of the specified at least one elastic component is in the range from 600 to 5000 N/m, the damping factor of the damping component is in the range of 1 to 4, and the impedance device provides the external vibrating unit with a mechanical impedance in the range of 6 to 50 dB. 2. The impedance device according to claim 1, in which the mass of the mass component is in the range from 1 to 3.6 g, the coefficient of elasticity of the specified at least one elastic component is in the range from 900 to 1700 N/m, and the damping coefficient of the damping component is in the range from 2 to 3.7. 3. The impedance device according to claim 1, wherein the frequency response of the impedance device has a pit, the pit value being in the range of 6 to 15 dB. 4. The impedance device of claim 1, wherein the fixed component includes a fixed arm, with the mass component located opposite the fixed arm, one side of the mass component facing the fixed arm, and the other side of the mass component facing away from the fixed arm. 5. The impedance device of claim 4, wherein the damping component is located between the mass component and the fixed arm. 6. Impedance device according to any one of paragraphs. 1-5, wherein said at least one resilient component includes a spring, wherein the damping component is inserted into or around the spring. 7. Impedance device according to any one of paragraphs. 1-5, wherein the fixed component is a housing structure with one open end, wherein the mass component is suspended in an opening of the housing structure by said at least one resilient component. 8. The impedance device of claim 7, wherein said at least one resilient component includes a plurality of resilient components, the plurality of resilient components being spaced along the side wall of the mass component. 9. The impedance device of claim 7, wherein said at least one resilient component further includes a mesh structure. 10. The impedance device of claim 7 wherein the damping component is located between the mass component and the bottom wall of the housing structure, wherein one end of the damping component is connected to the side of the mass component and the other end of the damping component is connected to the bottom wall of the housing structure.

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