RU2773128C2 - Electronic vaping device using jet spray cartridge and method for controlling electronic vaping device - Google Patents

Abstract

FIELD: electronic vaping devices.

SUBSTANCE: inventions relate to an electronic vaping device using an inkjet spray cartridge. An electronic vaping device comprises a housing and an evaporative heater located inside the housing. The cartridge is located inside the device and forms a container containing the pre-evaporator composition. The chip located at the end of the cartridge forms a through hole in fluid communication with the container. The chip contains an ejector in fluid communication with the through hole and configured to eject drops of the pre-evaporator composition towards the evaporative heater. The method for manufacturing the device includes the step of connecting the chip to the end of the cartridge, wherein the ejector ejects drops of the pre-evaporator composition towards the evaporative heater. The method for controlling the device includes a step at which the first electric current is supplied to the evaporative heater to activate the evaporative heater, and a step at which a second electric current is supplied to the ejector to activate the ejector and eject drops of the pre-evaporator composition from the ejector towards the evaporative heater.

EFFECT: providing the ability to precisely control the formation of high-velocity droplets of the pre-vapor composition and their uniform distribution over the heating element in order to accurately control the generation of vapor inside the electronic vaping device.

12 cl, 23 dwg

Description

The exemplary embodiments generally refer to an electronic vaping (e-vaping) device using an inkjet atomizer cartridge.

Electronic vaping (e-vaping) devices are commonly used to heat and vaporize a pre-vaporizer. These devices often use a wick to transfer the preflash composition from a container to a heater, where the heater can heat and thereby vaporize the preflash composition that may be entrained in the airflow within the device.

At least one exemplary embodiment relates to an electronic vaping device.

In one embodiment, an electronic vaping device comprises a device body; an evaporative heater located inside the body of the device; a cartridge located inside the body of the device and forming a container, made with the possibility of accommodating the pre-evaporator composition; and a chip located at the first end of the cartridge, forming at least one through hole in fluid communication with the container, and containing at least one first ejector in fluid communication with said at least one through hole and configured to eject drops of pre-evaporator composition in the direction of the evaporative heater, configured to vaporize the droplets of pre-evaporator composition.

In one embodiment, the electronic vaping device also includes at least one substrate heater located on the chip and configured to heat the chip; source of power; and a control circuit electrically connected to the power source and configured to control the power supply from the power source to said at least one first ejector, the evaporative heater, and said at least one substrate heater to activate the evaporative heater, activate said at least one heater. substrates for heating the chip to the first temperature and activating said at least one first ejector for ejecting droplets of the pre-evaporator composition towards the evaporative heater immediately after the chip reaches the first temperature.

In one embodiment, the control circuitry is also configured to first heat the evaporative heater to a second temperature, which is a preheat temperature of approximately 100-200 degrees Celsius, and then heat the evaporative heater to a third temperature, which is a target jet temperature of approximately 200-400 degrees Celsius, and the activation of said at least one first ejector is carried out immediately after the chip reaches the first temperature and the evaporative heater reaches the third temperature.

In one embodiment, the cartridge is removable from the body of the device.

In one embodiment, said at least one first ejector comprises: a plurality of ejectors arranged in a matrix adjacent to said at least one through hole, each of said plurality of ejectors comprising a nozzle formed by a surface on a chip and a chamber structure, in fluid communication with the nozzle and said at least one through hole; and an ejection heater configured to heat and partially vaporize the pre-flash composition to form droplets that are ejected through the nozzle towards the evaporation heater.

In one embodiment, said plurality of ejectors are configured to eject pre-flash composition droplets with a droplet size of approximately 25 to 29 micrometers in diameter, and the apparatus is configured to generate steam at a generation rate of approximately 6 to 16 milligrams per puff, wherein the particle size of the vapor is approximately 0.4 to 5 micrometers in diameter.

In one embodiment, said at least one through hole comprises a first through hole and a second through hole formed by the chip.

In one embodiment, the pre-flash composition has a viscosity of about 40 centipoise to about 100 centipoise and said first temperature is about 50 to 80 degrees Celsius.

In one embodiment, the cartridge also includes a cartridge body; a protrusion located inside the cartridge body and forming a channel; a substrate holding the chip at the first end of the cartridge and adjacent to said channel; and a porous structure located inside the container and configured to hold the pre-evaporator composition.

In one embodiment, the chip is detachable from the first end of the cartridge and the device is configured to retain the chip when the cartridge is removed from the device housing.

In one embodiment, the electronic vaping device also includes a grip located inside the body of the device and configured to clamp the end of the evaporative heater to suspend the evaporative heater near said at least one first ejector configured to eject droplets of the pre-vapor composition onto or through the evaporative heater.

At least one more exemplary embodiment relates to a method for controlling an electronic vaping device.

In one embodiment, a method for controlling an electronic vaping device includes the steps of: providing an electronic vaping device comprising an evaporative heater located inside the first housing, a cartridge located inside the first housing and forming a container configured to accommodate a pre-vapor composition, a chip located on at the first end of the cartridge and containing at least one first ejector, at least one through hole located inside the chip and in fluid communication with the specified capacity, and the specified at least one first ejector is in fluid communication with the specified at least one through an opening, and a power source electrically connected to said at least one ejector and an evaporative heater; a first electrical current is supplied from the power source to the evaporative heater to activate the evaporative heater; and a second electrical current is supplied from the power source to said at least one first ejector to activate said at least one first ejector and eject pre-evaporative composition droplets from said at least one ejector towards the evaporative heater.

In one embodiment, the step of providing includes providing an electronic vaping device comprising at least one substrate heater coupled to the chip, and the method also includes applying a third electric current from a power source to said at least one substrate heater to activate said at least one substrate heater and heating the chip to a first temperature, wherein the third electric current is applied after the first electric current is applied.

In one embodiment, a second electric current is applied immediately after the chip reaches the first temperature.

In one embodiment, applying a first electrical current to the evaporative heater causes the evaporative heater to be heated to a second temperature, which is a preheat temperature of approximately 100-200 degrees Celsius, the method also comprising the step of applying a fourth electrical current from a power source. to the evaporative heater to heat the evaporative heater to a third temperature of approximately 200-400 degrees Celsius, wherein the fourth electric current is applied after the evaporative heater reaches the second temperature, and the second electric current is applied immediately after the chip reaches the first temperature and the evaporative heater reaches the third temperature , with the first temperature being approximately 50 to 80 degrees Celsius.

On FIG. 1 is a perspective view of an electronic vaping device with an inkjet atomizer according to an exemplary embodiment;

in FIG. 2 is a plan view of the electronic vaping device of FIG. 1 according to an exemplary embodiment;

in FIG. 3 is a cross-sectional view of the electronic vaping device of FIG. 1 according to an exemplary embodiment;

in FIG. 4 is a side view of an inkjet spray cartridge for the device of FIG. 1 according to an exemplary embodiment;

Fig. 5 is a front view of the injector dispensing cartridge of FIG. 4 according to an exemplary embodiment;

in FIG. 6 is a bottom view of the inkjet spray cartridge of FIG. 4 according to an exemplary embodiment;

in FIG. 7 shows the bottom surface of the sputter chip inside the PCB substrate of FIG. 6 according to an exemplary embodiment;

in FIG. 8 is a sectional view of the ejectors of FIG. 7 according to an exemplary embodiment;

in FIG. 9 shows the top surface of the PCB substrate of the inkjet spray cartridge of FIG. 4 according to an exemplary embodiment;

in FIG. 10 is a cross-sectional view of the inkjet spray cartridge of FIG. 4 according to an exemplary embodiment;

in FIG. 11 is an exploded view of the inkjet spray cartridge of FIG. 4 according to an exemplary embodiment;

in FIG. 12 is a plan view of the jet spray cartridge of FIG. 4 according to an exemplary embodiment;

in FIG. 13 is an exploded sectional view of the inkjet spray cartridge of FIG. 4 according to an exemplary embodiment;

in FIG. 14 is an exploded view of the electronic vaping device of FIG. 1 according to an exemplary embodiment;

in FIG. 15 shows another side view of the electronic vaping device of FIG. 1 according to an exemplary embodiment;

in FIG. 16 is a front view of the electronic vaping device of FIG. 1 according to an exemplary embodiment;

in FIG. 17 is a rear view of the electronic vaping device of FIG. 1 according to an exemplary embodiment;

in FIG. 18A is a timing chart for an electronic vaping device with an inkjet atomizer according to an exemplary embodiment;

in FIG. 18B shows an example of sequentially actuated spray chip ejector heaters according to an exemplary embodiment;

in FIG. 19A is a cross-sectional view of an alternative embodiment of the device shown in FIG. 3 according to an exemplary embodiment;

in FIG. 19B is a cross-sectional view of yet another alternative embodiment of the device shown in FIG. 3 according to an exemplary embodiment;

in FIG. 20 shows another alternative embodiment of a cartridge for an electronic vaping device according to an exemplary embodiment; and

in FIG. 21 is a cross-sectional view of an embodiment of the cartridge for the electronic vaping device of FIG. twenty.

This document discloses some detailed examples of embodiments. However, the specific structural and functional details disclosed herein are for the purpose of describing exemplary embodiments only. The exemplary embodiments may be implemented in many alternative forms and should not be construed as being limited to the embodiments set forth herein.

Accordingly, although the exemplary embodiments may have various modifications and alternative forms, their embodiments are shown as examples in the drawings and will be described in detail herein. However, it should be understood that the exemplary embodiments are not intended to be limited to the specific forms disclosed; rather, the exemplary embodiments are intended to cover all modifications, equivalents, and alternatives within the scope of the exemplary embodiments. Like numbers refer to like elements throughout the description of the figures.

It should be understood that if an element or layer is designated as "located on", "connected to", "associated with", or "covering" another element or layer, it may be directly located on, connected to, associated with, or may cover another element or layer, or intermediate elements or layers may be present. Conversely, if an element is designated as "directly located on", "directly connected to", or "directly connected to" another element or layer, then there are no intermediate elements or layers. Like numbers refer to like elements throughout this specification.

It should be understood that although the terms "first", "second", "third", etc. may be used in this document to describe various elements, components, regions, layers or sections, these elements, components, regions, layers or sections should not be limited to these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, the first element, component, region, layer, or section described below may be referred to as the second element, component, region, layer, or section without departing from the ideas set forth in the exemplary embodiments.

When the term "approximately" is used herein in conjunction with a numerical value, the corresponding numerical value is intended to include an error of ±10 percent of the stated numerical value. In addition, when referring to percentages in the present description, it is understood that these percentages are based on weight, i.e. are percentages by weight.

The terms of relative spatial position (for example, "below", "under", "bottom", "above", "upper", etc.) can be used in this document for the purpose of simplifying the description to disclose the relationship of one element or feature to another. element or feature as shown in the figures. It should be understood that the terms of relative spatial position are intended to cover various orientations of the device during use or operation, in addition to the orientation depicted in the figures. For example, if the device in the figures is reversed, then elements described as located "under" or "below" other elements or features will be located "above" other elements or parts. Therefore, the term "under" can cover both above and below. The device may be oriented in a different way (rotated 90 degrees or positioned with other orientations), and definitions of relative spatial position used in this document will be interpreted accordingly.

The terminology used herein is only intended to describe various embodiments and is not intended to limit exemplary embodiments. As used herein, the singular forms are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the terms "comprises", "including", "comprises" and "comprising" when used in the present description indicate the presence of the specified features, integers, steps, operations, elements or components, but do not exclude the presence or addition one or more other features, integers, steps, operations, elements, components, or groups thereof.

Exemplary embodiments are described herein with reference to cross-sectional illustrations, which are schematic representations of idealized embodiments (or intermediate structures) of exemplary embodiments. Thus, changes in the forms of these illustrations are to be expected as a result of changes, for example, in manufacturing techniques or tolerances. Therefore, exemplary embodiments should not be construed as being limited to the shapes of the regions illustrated herein, and should include shape variations that are due to, for example, the manufacturing process. Therefore, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of the device region, nor are they intended to limit the scope of exemplary embodiments.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meanings as commonly understood by those skilled in the art to which the exemplary embodiments relate. It should also be understood that terms, including those defined in common dictionaries, should be interpreted as having a meaning corresponding to their meaning in the context of the relevant technical field, and should not be interpreted in an idealized or overly formal sense, unless explicitly defined. in this document.

General methodology

In exemplary embodiments, jet atomization is used, which allows precise control of the formation of high-velocity droplets of the pre-vapor composition and their uniform distribution over the heating element in order to precisely control the generation of vapor within the electronic vaping device. The use of inkjet in combination with a temperature-controlled heating element synchronized with the inkjet timing pattern can provide a number of benefits, which include: 1) efficient transfer of pre-vapor composition within the electronic vaping device, 2) precise ejection of the pre-vapor composition jet for sustainable vapor generation, 3) improved "low prevap" detection, 4) avoiding contact between the prevap and the heating element during storage and non-use of the electronic vaping device, 5) enabling the use of a textured heating element heating surface to reduce prevapor splatter (which further contributes to accuracy of generating the pre-evaporator composition inside the device), 6) ensuring the possibility of using a replaceable cartridge that is easily separated from the electrical this vaping device, and 7) enabling the use of a high viscosity and high density pre-vapor composition, which reduces the need for a volumetric amount of pre-vapor composition in relation to the amount of vapor that is generated by an electronic vaping device.

Design Examples

On FIG. 1 shows a perspective view of an electronic vaping device 10 with an inkjet atomizer cartridge 30 (see FIG. 3) according to an exemplary embodiment. The device 10 includes a housing 12. A power switch 18 may be placed on the side of the housing 12 to enable the power to be turned on and off for the device (as described in more detail below). A switch 20 may also be placed on the housing 12 to activate the heating.

The device 10 includes a cartridge body 16 capable of covering the cartridge 30 (see FIG. 3). A tube 15 extends from the cartridge body 16. The mouthpiece 14 may be configured to be connected to the body tube 15, wherein the base 14a of the mouthpiece 14 is fitted onto the tube 15 by means of a friction connection (or, alternatively, the base 14a is fitted onto the tube 15 by means of a threaded, on latches, bayonet connection or other similar design). The cartridge body 16 is connected to the device body 12 via set screws 26, or alternatively, the cartridge body 16 may be connected to the device body 12 by another design (such as a friction connection, snap connection, etc.). In an embodiment, the cartridge body 16 can be easily removed from the main body 12 of the device 10 in order to gain access to the location of the cartridge 30 (described in more detail below).

The power supply connector 22 and/or the Universal Serial Bus (USB) connector 24 may be releasably connected to the back of the device 10 (shown in more detail in FIG. 3 and described below).

On FIG. 2 is a plan view of the electronic vaping device 10 of FIG. 1 according to an exemplary embodiment. On FIG. 3 (described below) shows a sectional view of the device 10 along the line III-III.

On FIG. 3 is a cross-sectional view (along line III-III in FIG. 2) of the electronic vaping device 10 of FIG. 1 according to an exemplary embodiment. A cartridge 30 containing an inner foam insert 43 enclosing the pre-vapor composition 21 is located in the cartridge body 16 . As described in more detail below (particularly with reference to FIGS. 4-13), in an embodiment, cartridge 30 is an inkjet spray cartridge. Specifically, the jet spray cartridge 30 is configured to dispense drops of pre-evaporator composition 21 in the dispensing direction 30z through opening 49 onto the top surface of heater 40 enclosed within heater housing 48 so that pre-evaporator composition 21 is evenly distributed and heated on the surface of the heating element ( heater) 40 of device 10. Ventilation holes 42 are located on the bottom surface of heater body 48 to allow ambient air to enter device 10 and mix with the vaporized pre-vapor composition that is generated inside heater body 48 by heater 40. In an embodiment, heater 40 may have major surfaces (i.e. top and bottom surfaces), which respectively may be approximately perpendicular to the expected direction of ejection of pre-flash composition 21 from cartridge 30 and approximately perpendicular to the expected direction control of the airflow entering the device 10 from the vents 42. The vents 42 can be closed by the airflow damper 72. The airflow flap 72 may be manually slidable along the underside of device 10 to open vents 42 during periods of time when device 10 requires ambient air to enter heater housing 48 to allow heater 40 to vaporize pre-flash composition 21. The heater 40 is referred to herein as the "evaporative heater".

Heater 40 is held in place (between opening 49 and vents 42 inside heater housing 48) by heater grip 44 which assists in electrically connecting heater 40 to heater power connector 64. In particular, the grip 44 protrudes from the heater holder 46, with a conductive heater connector 54 electrically connecting the grip 44 of the heater holder 46 to the heater power connector 64. In an embodiment, grip 44 grips only the end of heater 40 for the purpose of suspending all surfaces of heater 40 (with the exception of the contact surface of heater 40 touching grip 44) within the open space defined by tube 48. Electrodes 28a of power supply 28 (shown in FIG. 14) are electrically connected to a heater power connector 64 electrically connected to a heater connector 54.

Power supply connector 22 may be releasably coupled to the rear of device 10 to provide a source of electrical power to the printed circuit board (PCB) 61 of device 10, wherein the microcontroller (MCU) 63 or field-programmable gate array (field- programmable gate array, FPGA) 68 of the printed circuit board 61 distributes this current to voltage regulators (not shown) located on the board. Voltage regulators may then recharge power supply 28 via battery (power supply) input 66, or microcontroller 63/field programmable gate array 68 may distribute current directly to circuit board connector 62 and heater power connector 64 (as described in more detail below). In an embodiment, power supply connector 22 is electrically coupled to heater power connector 64 and is used to supply electrical current directly to heater power connector 64, thereby bypassing power supply 28. In an embodiment, the power supply connector 22 includes a cable 22b connected to a mains charger 22c. Optionally, a Universal Serial Bus (USB) connector 24 is configured to connect to the rear of the device 10 (or a USB connector 24 is included in place of the power supply connector 22) and supplies DC power to the printed circuit board 61. The USB cable 24b can be configured to connection to the charger 24c, or, if necessary, the cable 24b can be configured to connect to a mobile device (not shown) to supply electrical current to the printed circuit board 61.

The inkjet spray cartridge 30 may be held in place in part by the PCB interface 34 located on the lower portion of the cartridge 30 (shown in more detail in FIGS. 4, 7, 9, 10, 11 and 12), with the far end of the PCB interface 34 inserted into the PCB end female connector 58 to securely hold it in place against the relay board housing 50. At the far end of the PCB interface 34 is a row of input/output (I/O) pads 34a (shown in FIG. 9) electrically connecting the PCB interface 34 to the PCB female connector 58. The PCB female connector 58 is housed in a relay card housing 50 protecting and enclosing the relay card 56. The relay card 56 provides a physical mounting location for the PCB female connector 58 and the PCB male connector 60. The PCB male connector 60 is mounted on the surface of the relay board 56, and the PCB female connector 62 is snap-fitted to the PCB male connector 60 to electrically connect the two connectors 60/62. The PCB male connector 60 is electrically connected to the power supply 28 and supplies electrical current from the power supply 28 to the PCB end connector 58 via the relay board 56 and the PCB female connector 62 (as described in more detail below).

In an embodiment, the cartridge 30 is removable from the main body 12 and the cartridge 30 is easily accessible by removing the cartridge body 16 from the main body 12 of the device 10. In this way, the cartridge 30 can be used as a replaceable element of the device 10, which, in turn, it provides the possibility of removing the spent (for example, used) cartridge 30 from the device 10 and replacing it with a cartridge 30 with a container 21a, which is completely filled with pre-evaporator composition 21.

The printed circuit board 61 is located inside the housing 12 (see also Fig. 14). The printed circuit board 61 includes a microcontroller 63 and a user-programmable gate array 68 (whereby the microcontroller 63 and the user-programmable gate array 68 are collectively referred to as a “control circuit”). The microcontroller 63 has three main functions: 1) to provide an interface to the control and configuration application program available through the USB port 24a (Fig. 3), which allows the adult vaper to set device parameters (such as ejection frequency, pulse width, system voltage , preheating temperature, evaporation temperature, etc.); 2) providing an input for the power switch 18 and the heat activation switch 20 to control the basic operations of the device; and 3) activating and transmitting control parameters to a user-programmable gate array 68. In an embodiment, the microcontroller 63 may be a typical low-cost controller that can generate accurate pulses within nanosecond resolution to control the functions of the device 10, such as power supply. per cartridge 30 (as described below). In this case, the user programmable gate array 68 may be a control element that directly interacts with the spray chip 41. In particular, the user programmable gate array 68 provides ejection pulses with a duration ranging from 10 nanoseconds to 50 nanoseconds to precisely control the spray chip 41 (as detailed below). Optionally, microcontroller 63 and field programmable gate array 68 may be a single processor/controller rather than two separate elements.

The power supply connector 22 and/or the USB connector 24 can be configured to be inserted into the rear side of the device 10, the connectors 22/24 being electrically connected to the power supply input 66 which is located on the printed circuit board 61. In particular, to partially form this The electrical connection uses a power input connector 22a or a USB connector, wherein the power supply input 66 is electrically connected to the power supply 28 . In case the power supply 28 is rechargeable (for further use of the device 10 after the initial discharge of the power supply 28), the power supply input 66 allows the power supply 28 to be recharged using the power supply connector 22 or the USB connector 24.

Power source 28 may be a battery. In particular, power supply 28 may be a lithium ion battery or one of its variants, such as a lithium ion polymer battery. Alternatively, the battery may be a nickel metal hydride battery, a nickel cadmium battery, a lithium manganese battery, a lithium cobalt battery, or a fuel cell. In an embodiment, the electronic vaping device 10 can be used until the energy in the power supply 28 is used up. Alternatively, device 10 may be rechargeable and reusable such that power supply 28 is charged via power supply connector 22 or USB connector 24.

In an embodiment, the power switch 18 is connected to the printed circuit board 61 and is moved to the "on" and "off" positions of the device 10. In particular, when switching the switch 18 to the "on" position of the device 10, the microcontroller 63/user-programmable gate array 68 on the printed circuit board 61 initiate the transmission of electric current from the power supply connector 22, the USB connector 24 or the power supply 28 to the circuit board connector 62. PCB connector 62 transmits electrical current through PCB connector 60, relay board 56, and PCB end connector 58 to PCB interface 34 for the purpose of supplying power to spray chip 41 (see FIGS. 7 and 9) of cartridge 30 (as in more detail). described below). With switch 18 in the "on" position, microcontroller 63/field programmable gate array 68 on circuit board 61 further transmits electrical current from power supply connector 22, USB connector 24, or power supply 28 to heater power connector 64. The heater power connector 64 transmits electrical current through the heater connector 54 and the heater grip 44 to the heater 40. When the power switch 18 is turned to the "off" position of the device 10, the circuit board 61 stops the transmission of electrical current to the circuit board connector 62 and the heater power connector 64.

In an embodiment, also connected to circuit board 61 is a heat activation switch 20 that controls the functions of cartridge 30 and heater 40. so as to enable the heating activation switch 20 to be pressed to initiate the delivery of the pre-flasher composition 21 by the cartridge 30 (as described in more detail below in relation to the operation of the cartridge 30) while electrically activating also the heater 40 to initiate heating and vaporization by the heater 40 of the pre-flashes composition 21 , which is ejected as a jet from cartridge 30 onto heater 40. In an embodiment, microcontroller 63/field programmable gate array 68 is configured to electrically activate cartridge 30 and heater 40 (initiated by pressing switch 20 to actuate heating), and this electrical activation occurs for a certain period of time, such as a period of 10 seconds (or other similar period of time, which may be sufficient to enable the pre-flasher composition 21 to be dispensed from the cartridge 30 and the pre-flasher composition 21 to be vaporized by the heater 40 ).

Optionally, instead of the heat activation switch 20 connected to the printed circuit board 61, a sensor 80 and a control circuit 82 are placed on the printed circuit board 61 to automate the activation of the cartridge 30 and the heater 40 immediately after the device 10 is turned on by the power switch 18. Specifically, sensor 80 is in fluid communication with the interior chamber of heater body 48 by having one or more through holes 81 in the rear wall of heater body 48, sensor 80 detecting "vaping conditions" (described below). Once sensor 80 detects vaping conditions, circuit 82 applies electrical current from power source 28 to cartridge 30 (via connectors 60/62) and heater 40 (via heater connector 54) to cause cartridge 30 to dispense pre-vapor composition 21 from cartridge 30 to heater 40 so that so that the heater 40 then vaporises the pre-flash composition 21.

Sensor 80 is configured to generate an output signal indicative of the amount and direction of airflow (flowing through heater body 48), wherein circuit 82 receives the output of sensor 80 and determines whether the following "vaping conditions" are present: puff on the mouthpiece 14 (as opposed to blowing air through the mouthpiece 14), and (2) the amount of airflow exceeds the threshold value. If these internal vaping conditions in device 10 are met, then circuit 82 will electrically connect power supply 28 to cartridge 30 and heater 40, thus activating both of cartridge 30 and heater 40. In an alternative embodiment, sensor 80 generates an output signal indicative of a drop in pressure. inside housing 12 (which is caused by air being drawn into heater housing 48 through vents 42 and out of device 10 through mouthpiece 14), and circuit 82 activates cartridge 30 and heater 40 in response. Sensor 80 may be a sensor as disclosed in U.S. Patent Application "Electronic Smoking Device", No. 14/793,453, filed July 7, 2015, or the sensor disclosed in U.S. Patent "Electronic Smoking", No. 9,072,321, issued July 7, 2015, each of which is fully included in this document by reference.

The power supply 28 may be electrically connected to the sensor 80 and the circuit 82 to automatically control the operation of the device 10 immediately after the device is turned on by the power switch 18 . In an embodiment, device 10 is automatically activated only by sensor 80 and circuit 82, so that power switch 18 does not need to be turned on and off to turn device 10 on and off. In an embodiment, circuit 82 includes a time period limiter. The time period for applying electric current to the cartridge 30 and the heater 40 may be set or preset depending on the amount of pre-evaporator composition 21 required for evaporation.

Even if the optional sensor 80 and circuit 82 are not included in the device 10, it may still include one or more through holes 81 (which may be adjacent to the heater holder 46 if desired) to allow air to enter. from inside housing 12 into tube 48. Through holes 81 provide additional air to tube 48 to replenish the air that is introduced into tube 48 through vent holes 42. In an alternative embodiment, through holes 81 are provided instead of vent holes 42 so that through holes 81 may, if necessary, be the only source of air introduced into the interior of the tube 48 during the operational use of the device 10. In case the device 10 contains through holes 81, the housing 12 should not be airtight in order to allow air to enter the housing 12 without a significant increase in resistance resistance-to-draw (RTD) device 10.

Cartridge 30 provides stable and uninterrupted delivery of preflash composition 21 to heater 40 by jet spraying preflash composition 21 onto heater 40 (as detailed below). Due to the use of the cartridge 30, the device 10 does not require the pre-vapour composition 21 or any structure to be in continuous or direct contact with the heater 40, especially during periods of extended storage or non-use of the electronic vaping device 10.

Pre-evaporator composition

The inkjet spray cartridge 30 of device 10 contains and dispenses a pre-flash composition 21. In an embodiment, the pre-flash composition 21 is a relatively high viscosity and high density composition that is a material or combination of materials that is vaporized. For example, the pre-vapor formulation 21 may be at least one of a liquid, solid, or gel formulation, including, but not limited to, water, granules, solvents, active ingredients, ethanol, plant extracts, natural or artificial flavors, vaporizers such as glycerin and propylene glycol, and combinations of the above. In an embodiment, the pre-flash composition 21 has a viscosity in the range of about 1 centipoise to 100 centipoise (or preferably 40 centipoise to 100 centipoise, or more preferably 40 centipoise to 80 centipoise) and a density in the range of about 1.0 g/mm ³ up to 1.3 g / mm ³ (at a temperature of 25 degrees Celsius).

In an embodiment, the pre-flavour composition 21 contains volatile tobacco flavor compounds that are released when heated. The pre-flash composition 21 may also contain tobacco elements dispersed throughout the composition 21. If the tobacco elements are dispersed in the pre-flash composition 21, then the physical integrity of the tobacco element is maintained. For example, said tobacco element may comprise approximately 2-30 percent by weight of the pre-flavour composition 21. Alternatively, the pre-flavour composition 21 may be flavored with other flavors in place of or in addition to tobacco flavor.

In an embodiment, said at least one vaporizer of the pre-flasher composition 21 may be selected from the group consisting of a diol (such as propylene glycol and/or 1,3-propanediol), glycerol, and combinations thereof. Said at least one vaporizer is included in an amount ranging from about 20 percent by weight, based on the weight of pre-flasher 21 to about 90 percent by weight, based on the weight of pre-flasher 21 (for example, the amount of vaporizer is in the range of about 50 percent to about 80 percent, more preferably about 55 percent to about 75 percent, or most preferably about 60 percent to about 70 percent). In addition, in one embodiment, the pre-flash composition 21 contains a diol and glycerol in a weight ratio ranging from about 1:4 to 4:1, where the diol is propylene glycol or 1,3-propanediol, or combinations thereof. This ratio is preferably about 3:2.

The pre-evaporator composition 21 also contains water. Water may be included in an amount ranging from about 5 wt. 10 percent by weight based on the weight of pre-vapor composition 21 to about 15 percent by weight based on the weight of pre-vapor composition 21. In one embodiment, the remainder of pre-vapor composition 21 that is not water (and nicotine or flavor compounds) is a substance (described above), the amount of which is from 30 percent by weight to 70 percent by weight of propylene glycol, and the rest of the vaporizing substance is glycerol.

The pre-flash composition 21 may optionally contain at least one flavor in an amount ranging from about 0.2 percent to about 15 percent by weight (for example, the amount of flavor can be in the range from about 1 percent to about 12 percent, more preferably from about 2 percent to about 10 percent, and most preferably from about 5 percent to about 8 percent). Said at least one flavor may be a natural flavor or an artificial flavor. For example, said at least one flavor may be selected from the group consisting of tobacco flavor, menthol, wintergreen, peppermint, herbal flavors, fruit flavors, nut flavors, liquor flavors, roasted, mint, and spicy flavors, cinnamon, clove, and combinations of the foregoing. .

In an embodiment, the pre-vapor composition 21 contains nicotine. Nicotine is included in the pre-vapor composition 21 in an amount ranging from about 1 percent by weight to about 10 percent by weight (for example, the amount of nicotine is in the range from about 2 percent to about 9 percent, or more preferably from about 2 percent to about 8 percent, or most preferably from about 2 percent to about 6 percent). In an embodiment, the portion of the pre-vapor composition 21 that is not nicotine or flavor contains 10-15 percent by weight of water, and the remainder of that portion of the composition that is not nicotine and flavor is a mixture of propylene glycol and vaporizer in a ratio that is in range from 60:40 to 40:60 by weight.

Heater

In an embodiment, heater 40 has a major surface or axis that is approximately perpendicular to the dispensing direction 30z (shown in FIG. 3) of pre-flash composition 21 that is dispensed from cartridge 30. Heater 40 may be in the form of a planar body or a ceramic body. In an alternative embodiment, heater 40 may also be in the form of a wire coil, single wire, resistive wire mesh, or any other suitable shape that is configured to vaporize pre-flash composition 21. In an embodiment, heater 40 has a rough or textured surface that provides a large area contact between the heater 40 and the dispersed pre-vapor composition 21 dispensed over the top surface of the heater 40 by the cartridge 30. In an embodiment, the heater 40 is a planar heater such as the heater disclosed in the following patent application: "Three-Component Planar Heater Electronic Vaping Device" , U.S. Patent Application No. 15/457,917, filed March 13, 2017, the entire contents of which are hereby incorporated by reference in their entirety. In yet another embodiment, heater 40 has a non-planar surface and is, for example, a printed heater on a flexible substrate.

In at least one exemplary embodiment, heater 40 is made from any suitable electrically resistive materials. Examples of suitable electrically resistive materials include, but are not limited to, copper, titanium, zirconium, tantalum, and platinum group metals. Examples of suitable metal alloys include, but are not limited to, alloys containing stainless steel, nickel-, cobalt-, chromium-, aluminum-, titanium-, zirconium-, hafnium-, niobium-, molybdenum-, tantalum-, tungsten-, tin -, gallium-, manganese- and iron-containing alloys and superalloys based on nickel, iron, cobalt and stainless steel. For example, the heater 14 may be made of nickel aluminides, a material with a layer of alumina on the surface, iron aluminides and other composite materials, while the electrically resistive material may, if necessary, be embedded in, encapsulated in or coated with an insulating material, or vice versa, depending on the kinetics of energy transfer and the required external physical and chemical properties. Heater 40 may comprise at least one material selected from the group consisting of stainless steel, copper, copper alloys, chromium-nickel alloys, superalloys, and combinations thereof. In an exemplary embodiment, heater 40 may be made of aluminum nitride, ceramic, chromium-nickel alloys, or iron-nickel alloys. In an exemplary embodiment, heater 40 may be a ceramic heater having an electrically resistive layer on the inner surface of heater 40 and/or on the outer surface of heater 40.

In yet another embodiment, heater 40 is made of iron aluminide (eg, FeAl or Fe ₃ Al). The use of iron aluminides may be preferred as they exhibit high resistivity. FeAl exhibits a resistivity of approximately 180 micro ohms while stainless steel exhibits approximately 50 to 91 micro ohms. The higher the resistance, the lower the current required to activate the heater 40.

Heater 40 or heating element provides and maintains a temperature for vaporization of pre-flasher 21 that is applied to heater 40. The optimum temperature varies depending on the chemical properties and composition of pre-flasher 21. In an embodiment, the preferred temperature range for vaporization of pre-flasher 21 is between about 220 up to 360 degrees Celsius. In yet another embodiment, a closed-loop control mechanism is used to maintain heater 40 within the preferred temperature range to vaporize pre-vapor composition 21 (as described below in the Operational Use of an Electronic Vaping Device section of this document).

Inkjet Spray Cartridge - Examples of Structural Embodiments

Jet spray cartridge 30 (detailed in FIGS. 4-13 and described below) uses jet spray to eject fine droplets of pre-flash composition 21 onto heater 40 (see FIG. 3). Specifically, cartridge 30 uses "bubble jet" atomization of pre-flasher 21 to create fine droplets, in which cartridge 30 heats and vaporizes pre-flasher 21 to create fine bubbles, and the expansion of these bubbles creates droplets that are ejected from cartridge 30. In particular, the cartridge 30 can be considered as a "bubble jet cartridge using thermal drop-on-demand technology" in which the pre-flasher composition 21 is thermally activated to cause the pre-flasher composition 21 to rapidly evaporate, forming bubbles, and the subsequent significant pressurization (due to bubble formation) is used to deliver high velocity droplets of preflash composition 21 that are ejected from cartridge 30. In an embodiment, cartridge 30 uses a relatively high viscosity preflash composition 21 because the high surface tension e preflash composition 21 (created due to the highly viscous properties of preflash composition 21), as well as the forces associated with condensation and the resulting compression of the vaporized bubbles in the cartridge 30, act in such a way as to draw a portion of the preflash composition 21 through one or more through holes 41a (see. Fig. 7-9) communicating with the container 21a for the pre-evaporator composition (inside the cartridge 30), for the purpose of precise and uninterrupted ejection of droplets onto the surface of the heater 40.

On FIG. 4 is a side view of an inkjet spray cartridge 30 for the apparatus of FIG. 1 according to an exemplary embodiment. The cartridge 30 includes a housing 31 with a head 36 sealing the end of the cartridge 30. From the underside of the housing 31 protrudes the PCB interface 34. Although in Fig. 4 shows a cylindrical body 31, it should be understood that the body 31 may also have other shapes, including, but not limited to, a cubic shape, a rectangular shape, a square shape, and so on.

On FIG. 5 is a front view of the inkjet spray cartridge 30 of FIG. 4 according to an exemplary embodiment. The head 36 of the cartridge 30 includes a raised edge 36a that extends from the underside of the housing 31 to protect and cover the PCB interface 34 as well as the rest of the PCB substrate 32 (as shown in at least FIGS. 6, 9 and 11).

On FIG. 6 is a bottom side view or a bottom view of the inkjet spray cartridge 30 shown in FIG. 4 according to an exemplary embodiment. The PCB substrate 32 is held at the end of the cartridge 30 with the ejection nozzles 41c2 of the ejectors 41c located on the chip 41 (see FIGS. 7 and 8) facing down to eject the bubbles (i.e. whole droplets) of the pre-evaporator composition 21 to the side. from cartridge 30 (as described in more detail herein). In other words, in an embodiment, the ejection nozzles 41c are located below the cartridge 30 for the purpose of allowing, if necessary, the ejection of bubbles of the pre-flasher composition 21 by the cartridge 30 in a direction that is approximately parallel to the longitudinal length of the cartridge 30 (as shown in Fig. 3 as the outlet direction 30z of the cartridge thirty).

The printed circuit board substrate 32 is held within the guard boundaries of the raised edge 36a of the head 36 of the cartridge 30, with the projection 36c on the edge 36a mating with the notch 32a of the substrate 32 for the purpose of holding the substrate 32 in constant orientation on the underside of the cartridge 30. In addition, the substrate 32 is attached to the underside of cartridge 30 within the boundaries of lip 36a by any of the well-known means, which may include an adhesive (such as a silicone-based adhesive, for example), welding, screws, retainers, physical stoppers, or any other suitable construction, adhesive, etc. P. On FIG. 10 (described below) shows a sectional view of the cartridge 30 along the line X-X.

On FIG. 7 shows the bottom surface (active member side 41g) of the sputter chip 41 which is held within the circuit board substrate 32 of FIG. 6 according to an exemplary embodiment. Chip 41 may include a number of I/O pads 41b that electrically connect ejector heaters 41c1 (FIG. 8), wafer heaters 41d (FIG. 8), and circuits of chip 41 (i.e., I/O control logic 41e and circuit 41f heat control shown in Fig. 7) with input/output pads 34a (Fig. 9) of the PCB substrate 32. Chip 41 contains one or more ejectors 41c (also shown in Fig. 8) which dispense bubbles of pre-flasher composition 21 through nozzles 41c2 towards heater 40. Ejector 41c and openings 41a of ejector 41c can be made using the processes described in the following patents: "Inkjet Printheads and Related Methods" US Pat. No. 6,902,867; and "Methods for Improving Flow Through Fluid Channels" US Pat. No. 7,041,226, the entire contents of each of which are incorporated herein by reference in their entirety. In an embodiment, chip 41 comprises two through holes 41a arranged such that the longitudinal lengths of holes 41a are parallel to each other on chip 41. It should be understood that, in addition to the exemplary processes described above, any other well-known method of making through holes can also be used. 41a in chip 41.

The rows of ejectors 41c extend in line on the sides of the through holes 41a along the longitudinal length of the through holes 41a. An array of ejectors 41c thermally excites and rapidly vaporizes the pre-flash composition 21 from the cartridge container 21a to form bubbles, the subsequent significant increase in pressure (due to bubble formation and growth) forcibly moving the pre-flash composition 21 out of the channel 33 into the fluid ejection chambers 41c3 of the ejection heaters 41c1 ( see Fig. 8) for the purpose of expelling the high velocity droplets of preflash composition 21 from the nozzles 41c2 towards the heater 40. In response to said bubble formation and expulsion, additional preflash composition 21 is drawn through channel 33 under positive displacement force. In an embodiment, rows of 32 ejectors 41c extend in a line on both sides of each of the through holes 41a (so that there are 128 ejectors 41c on the chip 41), with a total of 8 ejection heaters 41c1 can be activated simultaneously for each through hole 41a (at a frequency of ejection of 2 kilohertz), so that all 128 ejectors 41c are combined to eject up to about 10 microliters per second of pre-flash composition 21, or preferably about 3-6 microliters per second of pre-flash composition 21, or most preferably about 3.2 microliters per second of pre-flash composition 21 In an embodiment, the heaters 41c1 (also shown in Fig. 8) provide rapid heating and reach a temperature of approximately 320 degrees Celsius in less than 1 microsecond. The mass of vapor that is generated by the heater 40 of the electronic vaping device 10 as a result of said vaporization of the pre-vapor composition 21 by the ejectors 41c is approximately 2 to 3 milligrams per puff of vapor from the device 10.

In an embodiment, a significant portion of the upper surface of the active element side 41g of the chip 41 is covered by the nozzle plate 102 (also shown in FIG. 8), so that the input/output pads 41b and the nozzle holes 41c2 (of the ejectors 41c) are the only elements that are open on the side 41g active element of the chip 41.

In an embodiment, the ejector means 41c (FIG. 8) and the heater 40 (FIG. 3) create a steam outlet temperature from the device 10 (at the mouthpiece 14) that is approximately 100°C. The ejector extracts 41c can be formed by the processes described in the following patents: "Inkjet Printing Heating Chip and Related Method", US Pat. No. 6,951,384, and "Microfluid Ejection Device Having a High Resistance Heating Film", US Pat. the entire contents of which are incorporated herein by reference in their entirety. The nozzles 41c2 of the ejectors 41c, which may be referred to as "micro nozzles", can be made using the processes described in the following patents: "Nozzle elements, compositions and methods for microfluidic ejection heads", US patent No. 7,364,268, "Microfluidic ejection head and designed its Stress Relieved Diaphragm Plate", U.S. Patent No. 8,109,608, "Composition for PhotoDeveloped Dry Film", U.S. Patent No. 8,292,402, and "Hydrophobic Nozzle Plate Designs for Microfluidic Ejection Heads", U.S. Patent No. 7,954,926, all contents of which are fully incorporated to this document by reference. In an embodiment, each of the ejectors 41c contains one nozzle 41c2. It should be understood that in addition to the process examples described above, any well-known methods of forming the ejectors 41c on the bubble jet chip 41 and forming the micronozzles 41c2 within the ejectors 41c can also be used.

The sputter chip 41 also includes one or more substrate heaters 41d. The substrate heaters 41d are used to heat the spray chip 41 in periods just before or during the activation and use of the ejection heaters 41c1. In an embodiment, the chip 41 has four substrate heaters 41d spaced apart on the chip 41. The chip 41 may also include I/O control logic 41e that controls the overall operation of the chip 41, including the activation control of the heaters 41c1/41d. and controlling the transmission and reception of control signals between the I/O pads 41b of the chip 41 and the I/O pads of the PCB substrate 32. The spray chip 41 may also include a heat control circuit 41f that actively controls the temperature of the substrate heaters 41d during start-up and operational use of the chip 41. It should be understood that any well-known bubble jet spray chip configuration can be used in conjunction with the spray chip 41 shown. in FIG. 7 and described above, or instead of it.

On FIG. 8 is a cross-sectional view of the two ejectors 41c of FIG. 7 according to an exemplary embodiment. The ejectors 41c are placed on the chip 41, and each of the ejectors 41c includes an ejector heater 41c1, an ejector fluid chamber 41c3, and a nozzle 41c2. The ejector fluid chamber 41c3 is a chamber-like structure which is formed by the nozzle plate 102, the thick film layer 100, and the active element side 41g of the chip 41. The chamber 41c3 is in fluid communication with a passage 41a, where through 41a it is in fluid communication with the channel 33 of the cartridge 30 (see Fig. 10). The ejectors 41c are configured to rapidly vaporize the pre-flash composition 21, which is drawn through the through hole 41a into the ejector fluid chamber 41c3 where vaporization takes place under the action of the ejector heaters 41c1. The rapid evaporation of the pre-flash composition 21 inside the ejector fluid chamber 41c3 results in the formation of whole bubbles of the pre-flash composition 21 inside the chamber 41c3 and their subsequent ejection through the nozzle 41c2, resulting in the retraction of additional pre-flash composition 21 through the through hole 41a into the ejector fluid chamber 41c3 as a result of direct displacement of the pre-evaporator composition 21. In the embodiment, the nozzle 41c2 has a conical outlet end (as shown in Fig. 8), and thus this outlet end is narrowed. In yet another embodiment, the nozzles 41c2 have a straight nozzle wall outlet end (in other words, the nozzle 41c2 has a constant orifice diameter), and thus the outlet end of the nozzle 41c2 does not taper.

The active element side 41g of the chip 41 may be substantially coated with the thick film layer 100, in which case the nozzle plate 102 covers the thick film layer 100. The nozzle plate 102 and the thick film layer 100 jointly contribute to the formation of the ejector fluid chamber 41c3 and/or the nozzle 41c2. In an embodiment, the design of the ejectors 41c can be made according to the invention "Microfluidic ejector devices", US patent No. 7,165,831, issued January 23, 2007, the entire content of which is fully incorporated herein by reference.

On FIG. 9 shows the top surface of the PCB substrate 32 of the inkjet spray cartridge 30 and the side 41h of the inactive element of the chip 41 (see also FIG. 7) according to an exemplary embodiment. PCB substrate 32 may include I/O pads 34a at the far end of interface 34 of substrate 32. I/O pads 34a electrically connect cartridge 30 to connector 58 within relay board housing 50, where I/O control logic 41e ensures that through the pads 34a, information and commands were also exchanged with the spray chip 41 and the field programmable gate array 68 to control the operation of the cartridge 30 and heater 40 as described herein.

The spray chip 41 is held within the chip window 37 in the substrate 32. In particular, during the assembly of the cartridge 30, the substrate 32 is attached to the cartridge head 36 (also see Figs. 6 and 11), after which the chip 41 is inserted into the chip window 37 and fixed on in place with adhesive (sealant) 37a. Adhesive 37a may be a silicone-based adhesive or any other suitable liquid-impervious sealant applied to at least the junction between chip window 37 and spray chip 41. Adhesive 37a may also be used to adhesively attach the top surface of chip 41 to the underside of the die. 36. Atomizer chip 41 (shown in more detail in Fig. 7) contains ejectors 41c which dispense pre-vapor composition 21 from container 21a when cartridge 30 is activated.

On FIG. 10 is a cross-sectional view of the inkjet spray cartridge 30 of FIG. 6 (along the line X-X in FIG. 6) according to an exemplary embodiment. The container 21a is formed by the body 31 of the cartridge 30, and inside the container 21a is a foam insert 43. The foam insert 43 may be a low-density foam insert that encloses the pre-evaporator composition 21. The foam insert 43 may be a porous structure containing internal voids that create capillary forces to provide suction pressure that promotes stable delivery pre-evaporator composition 21, which is issued from the tank 21a on the spray chip 41 (see at least Fig. 7 and 9 described above). It should be understood that other designs, such as microfluidic channels within the vessel 21a, may be used in conjunction with or instead of the foam insert 43. Between the bottom of the tank 21a and the top side of the head 36 is a channel 33. The ejectors 41c (shown in Fig. 7 and 8) are arranged in a matrix and eject the pre-flash composition 21 from the channel 33 to eject the pre-flash composition bubbles 21 towards the heater 40, as described in more detail below.

On FIG. 11 is an exploded view of the inkjet spray cartridge 30 of FIG. 4 according to an exemplary embodiment. For the sake of brevity, the elements of the cartridge 30 already described above in this document will not be described again. The cartridge 30 includes a cap 35 with a vent 35a which seals the upper end of the cartridge 30. The vent 35a provides one-way ventilation to allow ambient air to enter the container 21a during spraying of the pre-flash composition 21 from the cartridge 30. The top portion of the head 36 includes a cylindrical protrusion 36b , which forms a channel 33 (FIG. 10) adjacent to the bottom of the container 21a. Between the head 36 and the container 21a may be a filter 39, which is a high efficiency filter suitable for fine filtering impurities in the pre-flasher composition 21 during ejection of the pre-flasher composition 21 from the cartridge 30.

In an embodiment, the circuit board substrate 32 forms a chip window 37 holding the spray chip 41. The spray chip 41 is inserted into the chip window such that the inactive element side 41h shown in detail in FIG. 9 facing upwards (i.e., towards the container 21a), and the active member side 41g shown in detail in FIG. 7 faces down (ie, away from cartridge 30).

Although the inkjet cartridge 30 of FIG. 4-11 may combine the pre-flasher container 21a and the atomizer chip 41 within a single cartridge unit, alternatively the container 21a and the atomizer chip 41 may be separated to allow multiple containers 21a to be used with a single atomizer chip 41 (as shown for example , in Fig. 20). In other words, within the device 10, at least one of the container 21a and the body 31 of the cartridge 30 is removable from the device 10, at least one of the container 21a and the body 31 being replaceable and/or rechargeable. At least one of the container 21a and the housing 31 is insertable into the device 10 to come into contact with and work with the spray chip 41 (where the spray chip 41 is fixed inside the device 10 in a permanent or semi-permanent manner).

On FIG. 12 is a plan view of the inkjet spray cartridge 30 of FIG. 4 according to an exemplary embodiment. As described above, the cover 35 of the cartridge 30 includes an air vent 35a. The one-way vent 35a allows ambient air to enter the body 31 of the cartridge 30 to displace the volume of fluid that is consumed from the container 21a during the release of the pre-flash composition 21 from the cartridge 30.

On FIG. 13 is an exploded sectional view of the inkjet spray cartridge 30 of FIG. 4 according to an exemplary embodiment. For the sake of brevity, the elements of the cartridge 30 already described above will not be described again in this document. The width of the high efficiency filter 39 may be somewhat larger than the width of the cylindrical projection 36b of the head of the cavity 36 of the cartridge 30 so that the filter 39 closes the channel 33 which is partly defined by the cylindrical projection 36b. When the cartridge 30 is assembled, the PCB substrate 32 is inserted under the head 36 so that the raised edge 36a of the head 36 extends below the bottom surface of the PCB substrate 32 and below the bottom surface of the spray chip 41, and thus the edge 36a protects the bottom surfaces of the substrate 32 and the chip 41 ( as shown in Fig. 10).

On FIG. 14 is an exploded view of the electronic vaping device 10 of FIG. 1 and 3 according to an exemplary embodiment. For brevity, the elements of apparatus 10 already discussed above with respect to FIG. 3 (above) will not be reconsidered. In an embodiment, the device 10 includes a body 50 of the printed part having an opening 53. The proximal end 48b of the heater body 48 may pass through the opening 53 to allow the proximal end 48b of the heater body 48 to contact the distal end of the mouthpiece 14 when the device 10 is assembled. ) 51 of the cartridge body is fitted around the outer periphery of the relay board body 50 to enable the cartridge body 16 to be pressed against the gasket 51 to provide a liquid-tight seal between the cartridge body 16 and the relay board body 50. The relay board housing 50 also includes a slot 55. The slot 55 accommodates the distal end of the PCB interface 34 of the cartridge 30 when the cartridge 30 is inserted into the cartridge housing 16. The relay board 56 includes a female end connector 58 adjacent to the slot 55 of the relay board housing 50, thus allowing the PCB interface 34 to be placed within the PCB end connector 58. Due to this, the PCB end connector 58 firmly holds the PCB interface 34 of the cartridge 30 to hold the cartridge 30 against the relay board housing 50 when the cartridge 30 is installed inside the cartridge housing 16 .

The upper surface of the heater body 48 defines a fluid opening (diaphragm) 49. The opening 49 allows the cartridge 30 to dispense the pre-evaporator composition 21 to the heater 40 within the heater body 48. The distal end 48a of the body 48 of the heater 48 includes a thread that is configured to engage threads on the inner surface of the base 52 of the heater body. The heater connector 54 is configured to be inserted into the heater housing base 52 to allow the distal end of the heater holder 46 to contact the heater connector 54. Heater connector 54 is electrically conductive for the purpose of delivering electrical current from heater power connector 64 to heater holder 46 via electrical contacts 70. Electrical current from heater holder 46 passes through heater grip 44 to heater 40 to electrically activate heater 40 to allow vaporization by heater 40 pre-flash composition 21 (as described in more detail below).

On FIG. 15 is a side view of the electronic vaping device 10 of FIG. 1 according to an exemplary embodiment. More specifically, in FIG. 15 shows the general layout of device 10, in which the mouthpiece 14, mouthpiece tube 15, and cartridge body 16 are located at one end of device 10, and two power inputs (power supply connector 22 and USB connector 24) are located at the other end of device 10.

On FIG. 16 is a front view of the electronic vaping device 10 of FIG. 1 according to an exemplary embodiment. In particular, in FIG. 16 shows the arrangement of the end of the device 10, in which the mouthpiece 14 protrudes from the lower end of the cartridge body 16. Set screws 26 may be used to connect cartridge body 16 to device 10 body 12.

On FIG. 17 is a rear view of the electronic vaping device 10 of FIG. 1 according to an exemplary embodiment. In particular, in FIG. 17 shows the layout of the other end of the device 10, in which the power inputs (power supply connector 22 and USB connector 24) are located near the top end of the device 10.

Working use of electronic vaping device

On FIG. 18A shows a timing chart for an electronic vaping device 10 with an inkjet atomizer cartridge 30 according to an exemplary embodiment. Although this timing is described (below) in relation to the device 10 of FIG. 1, it should be understood that the timing chart, discharge rate values, temperature values, and other parameters described with respect to FIG. 18 are equally applicable to other electronic vaping device embodiments also described herein.

With regard to the timing diagram of FIG. 18A, the device 10 is turned on by pressing the power switch 18 as shown in step S100. Once the device 10 is turned on, it is considered to be in "standby" mode. In standby mode, the microcontroller 63/field programmable gate array 68 initiates the transfer of electrical current from the power supply 28 through the heater power connector 64, the heater connector 54 and the gripper 44 to the heater 40, causing the heater 40 to be electrically activated in the “high power” setting mode in for a "preheat" period of approximately 3 to 5 seconds (in step S102).

By the time the "high power" period of the heater 40 has elapsed, which lasts for the preheating of the heater 40, the temperature of the heater 40 rises to a preheating temperature of approximately 100 to 200 degrees Celsius (in step S102a), which temperature controlled by the microcontroller 63. For example, in an embodiment, the microcontroller 63 is configured to measure the amount of electrical current that is transmitted to the heater 40 in order to measure the resistance of the heater 40, and the microcontroller 63 may contain an internal lookup table in which the temperature of the heater 40 is assigned to the resistance heater 40. Alternatively, any well known temperature measurement method or sensor may be used. After the initial "high power" period has elapsed, the microcontroller 63 reduces the electric current supplied to the heater 40 so that the electric current is maintained in the "medium power" range (in step S104). It should be understood that since the actual duration of the "standby" mode may vary, the microcontroller 63 continues to regulate the electrical current supplied to the heater 40 by cycling the heater 40 between the "high power" range and the "medium power" range in order to maintain the "standby" temperature. (preheat) of the heater 40 within the desired range of 100-200. degrees Celsius.

In step S106, the device 10 enters a “heating mode”, which mode can start in one of two ways: 1) the heater switch 20 can be turned on manually, or 2) the sensor 80 can optionally detect air flow through the device 10, which corresponds to "soaring conditions" (described above). In particular, in the "heat" mode, the microcontroller 63 increases the electric current supplied to the heater 40 as a result of pressing the heater switch 20, or, if necessary, the microcontroller 63 increases the electric current supplied to the heater 40 due to the circuit 82 notifying the microcontroller 63 that the sensor 80 detects the air flow passing through the tube 48 and satisfies the "vaping conditions". In the event that sensor 80 and circuit 82 are used to trigger a "heating" mode, sensor 80 is configured to assist in the detection of "vaping conditions" (described above). More specifically, sensor 80 generates an output indicating the amount and direction of airflow, and circuit 82 receives the sensor's output and determines whether "vaping conditions" are met. If these internal "vaping conditions" are met within the device 10, the circuit 82 causes the microcontroller 63 to increase the electrical power supplied from the power supply 28 to the heater 40.

Once the device 10 has entered the “heating” mode, the microcontroller 63 increases the electric current supplied from the power supply 28 to the heater 40 so that the heater again enters the “high power” setting mode (step S106a), resulting in an increase in temperature heater 40 from about 100-200 degrees Celsius to a target "jet" temperature range of about 200-400; degrees Celsius (in step S106b). The length of time between the start of the "heat" mode and the start of the "jet" mode (described below) is approximately 3 to 5 seconds.

At step S108, the device 10 enters the jet mode. The "jet" mode is initiated in response to the microcontroller 63 detecting that the heater 40 has reached the target temperature of 200-400 degrees Celsius, in connection with which the microcontroller 63 initiates the supply of electric current by the power source 28 through connectors 60/62, printed circuit board 56 , a connector 58, and a PCB interface 34 to electrically activate the substrate heaters 41d inside the cartridge 30 (in step S108a). Specifically, under said electrical current, the control logic 41e of the cartridge 30 activates the substrate heaters 41d to cause the chip 41 to reach a preheat temperature of approximately 50 to 80 degrees Celsius (in step S108a), or preferably the preheat temperature , which is approximately 80 degrees Celsius, since this temperature helps to reduce the effective viscosity of the pre-evaporator composition 21, which will be issued during the "jet ejection" mode. It should be understood that this decrease in viscosity of preflash composition 21 at the time the preflash composition contacts and passes through the through holes 41a in chip 41 helps control the accuracy of the amount of preflash composition 21 that is dispensed to heater 40. Once chip 41 has reached the "pre-heat" temperature (as confirmed by the heat control circuit 41f), the control logic 41e of the spray chip 41 causes the cartridge 30 to spray the pre-flash composition 21 during the rest of the "jet ejection mode".

The output of pre-flash composition 21 is handled by control logic 41e ensuring that successive pairs of ejection heaters 41c1 (in one embodiment, a total of up to eight ejection heaters 41c1 on chip 41 can be activated for injection at a time, i.e. in in this embodiment, up to four ejection heaters 41c1 per through hole 41a are activated at one time) to continuously eject drops of pre-flash composition 21 through each of the ejectors 41c until all ejectors 41c have discharged composition 21 for each through hole 41a. In other words, the ejection heaters 41c1 may be activated individually or in groups so that each of the ejection heaters 41c1 of each of the through holes 41a is activated before repeating the ejection sequence with the ejection heaters 41c1 (wherein the ejection sequence with the ejection heaters 41c1 is controlled by a control logic). circuit 41e in response to inputs from the microcontroller 63/field programmable gate array 68).

On FIG. 18B shows an example of sequentially activated ejection heaters 41c1 of the spray chip 41 according to the exemplary embodiment. In this example, two pairs of ejection heaters 41c1a are initially activated for each of the through holes 41a (with a total of 8 ejection heaters 41c1 being initially activated in the first sequence), followed by activation of another group of heaters 41c1b immediately after the activation of the initially activated ejection heaters 41c1a. In an embodiment, the sequential activation of the ejection heaters 41c1 continues until each of the ejection heaters 41c1 delivers composition 21, after which the activation sequence of the ejection heaters 41c1 is repeated. The precise timing and sequence of activation of the ejection heaters 41c1 can be achieved using any well known jet spray technique.

Referring again to Fig. 18A, wherein during the "jet" mode, the microcontroller 63 continues to maintain the heater 40 in the "high power" setting mode (as shown in step S108b), which in turn maintains the temperature of the heater in the target temperature range of approximately 200-400 degrees Celsius (in step S108c). At this desired temperature, the heater 40 is expected to vaporize the pre-flash composition 21 droplets that are on the heater 40, causing the droplets to vaporize into vapor particles with a diameter of approximately 0.4 to 5 micrometers, or preferably with a diameter of approximately 1 micrometer.

In an embodiment, during the "jet" mode, cartridge 30 ejects droplets of pre-flash composition 21 (i.e., bubbles), with each droplet having a diameter in the range of 25 to 29 micrometers or a volume of 8 to 13 picolitres, and these dimensions droplets are larger than the typical vapor particle sizes seen in conventional e-vaping devices (with conventional devices that do not use jet atomization often generating vapor with a particle diameter of approximately 1 micrometer). In a single stream or jet, a larger droplet of the pre-flash composition 21 follows a series of smaller droplets that successively decrease in size. In other words, the droplets in the jet are not sprayed continuously, but are subject to pulsations. In an embodiment, the frequency of the pulsations or ejection of the jet is in the range from 1 to 4 kilohertz, and the time interval between bubbles ejected in the form of a jet is approximately 31.25 μs. In an embodiment, the average rate of delivery of the pre-flash composition 21 during the entire "jet" mode is in the range of approximately 0.5 to 3.5 microliters per second (with this range representing the entire composition 21 issued by the spray chip 41 of the cartridge 30, provided that the number of ejectors 41c for chip 41 is 128). In addition, the spray rate range for each individual ejector 41c is approximately 3.9 to 27.3 picoliters per second. The exit temperature of the steam when the ambient air and the steam is exhausted through the mouthpiece 14 of the apparatus 10 is approximately 40 to 50 degrees Celsius.

It should be understood that the amount of pre-flash composition 21 ejected as a jet can be affected by the viscosity of the composition 21, which in turn depends on the temperature of the spray chip 41 (which is maintained by the substrate heaters 41d) controlled by the heating controller 41f. In particular, the heating controller 41f includes a temperature sensor or a temperature indicator that is configured to transmit a signal indicative of the temperature of the chip 41 to the control logic 41e to maintain a closed control loop that is configured to provide the desired temperature of the substrate heater 41d and provide accurate and a stable spray amount of the pre-flash composition 21 even during those periods of time when the spray jet chip 41 is heated during normal or prolonged operation of the device 10.

In step S110, a new standby mode is started. In the "standby" mode, the device is turned off again (see step S110a), as a result of which the microcontroller 63 interrupts the supply of electric current to the heater 40 (see step S110b). In case the device 10 is turned on again (step S112), steps (S100 to S108) are repeated again to ensure that the device 10 dispenses and vaporizes more of the pre-evaporator composition 21 from the cartridge 30.

In an embodiment, the USB connector 24 is used to allow adjustment of device 10 parameters by an adult vaper by adjusting the programming of the microcontroller 63/user-programmable gate array 68. These adjustable parameters include e.g. evaporation, etc. In an embodiment, setting up programming in the microcontroller 63/field-programmable gate array 68 is accomplished by using a mobile device or computer (not shown) that communicates with the microcontroller 63/field-programmable gate array 68 via connector 24 to change said parameters within predetermined ranges.

Additional performance characteristics of the electronic vaping device

The device 10 of FIG. 1 (as well as other disclosed devices described below) has an overall resistance-to-draw (RTD) of approximately 30 to 45 inches (76 to 114 cm) of water. In an embodiment, power supply 28 has a life of approximately 1200 puffs before power supply 28 is recharged or replaced. In an embodiment, the expected vapor production is approximately 6-16 milligrams per puff (where the duration of each puff is approximately 5 seconds), with the expected delivery rate of pre-vapour composition 21 being approximately 0.5-4.0 microliters per second for device 10.

Additional Structural Embodiments

On FIG. 19A is a cross-sectional view of an alternative embodiment of the device 10 of FIG. 3 according to an exemplary embodiment. In an embodiment, the device 10a of FIG. 19A includes a heater 40a that is oriented somewhat differently than in the device 10 shown in FIG. 3. In particular, the heater 40a has major surfaces that are not perpendicular to at least one of the incoming pre-flash composition jet 21b and the inlet air 42a (passing through the vents 42). In an embodiment, heater 40a has major surfaces that are located at an angle of approximately 45 degrees with respect to at least one of the incoming pre-flash composition jet 21b and the inlet air 42a. Entrained vapor 21c exiting heater 40a also passes at an angle of approximately 45 degrees relative to the main (top and bottom) surfaces of heater 40a. In yet another embodiment, heater 40a is oriented such that the major surfaces of heater 40a are at an angle somewhat different from a right angle (as shown in FIG. 3) or a 45 degree angle (as shown in FIG. 19A) to at least one of the pre-evaporator composition 21b ejected in the form of a jet and the entrained vapor 21c.

On FIG. 19B is a cross-sectional view of yet another alternative embodiment of the device 10 shown in FIG. 3 according to an exemplary embodiment. In an embodiment, device 10b includes a heater 40b that is oriented somewhat differently than in device 10 shown in FIG. 3. In particular, the heater 40b has major surfaces that are approximately parallel to at least one of the incoming pre-flash composition jet 21b and the inlet air 42a (passing through the vents 42). Entrained vapor 21c exiting heater 40a runs approximately perpendicular to the major (top and bottom) surfaces of heater 40b.

On FIG. 20 and 21 show yet another alternative embodiment of an electronic vaping device cartridge 30a according to an exemplary embodiment. In this embodiment, the head 36 and the spray chip 41 can be separated from the body 31 of the cartridge 30a. Thus, in this embodiment, the atomizing chip 41 (on the substrate 32) can be permanently or semi-permanently retained within the electronic vaping device while the cartridge 30a is replaceable and/or refillable. By separating the atomizer chip 41 from the head 36 and cartridge 30a, the overall cost of the electronic vaping device is reduced because this embodiment reduces the total number of atomizer chips 41 that must be provided and consumed during the life of the e-vaping device.

In an embodiment, head 36 and atomizer chip 41 are permanently held within the electronic vaping device in such an orientation that head 36 and chip 41 contact the underside of cartridge 30a when cartridge 30a is inserted into and mounted within the electronic vaping device. After installing the cartridge 30a inside the device, the head 36 of the cartridge 30a ensures the correct orientation of the spray chip 41 relative to the cartridge body 31. After the head 36 and chip 41 are connected to the body 31 of the cartridge 30a, the cartridge 30a and atomizer chip 41 perform the ejection functions in the same manner as described above (referring to the operation functions of the cartridge 30 in relation to Figs. 18A and 18B).

In an embodiment, the design of the cartridge 30a with separation of the head 36 and chip 41 from the cartridge body 31 (i.e. "two-piece construction" of the cartridge) can be made according to the invention "Feeding means for a steam generating device", US patent application No. 15/336,863 , filed October 28, 2016, the entire content of which is hereby incorporated by reference in its entirety.

Examples of embodiments have been described above, and it is obvious that the same examples may vary in different ways. Such variations should not be construed as a departure from the intended scope of the exemplary embodiments, and all such modifications, as will be apparent to those skilled in the art, are intended to be included within the scope of the following claims.

Claims (46)

1. An electronic vaping device, comprising: body of the device; an evaporative heater located inside the body of the device; a cartridge located inside the body of the device and forming a container, made with the possibility of accommodating the pre-evaporator composition; and a chip located at the first end of the cartridge and forming at least one through hole in fluid communication with the container, wherein the chip comprises at least one first ejector in fluid communication with said at least one through hole and configured to eject droplets of pre-flash composition towards an evaporative heater configured to vaporize said droplets of pre-flash composition; at least one substrate heater placed on the chip and configured to heat the chip; source of power; and a control circuit electrically connected to the power source and configured to control the power supply from the power source to said at least one first ejector, an evaporative heater, and said at least one substrate heater to: activation of the evaporative heater, activating said at least one substrate heater to heat the chip to a first temperature, and activating said at least one first ejector to eject droplets of the pre-flash composition towards the flash heater as soon as the chip reaches the first temperature. 2. Electronic vaping device according to claim. 1, in which the control circuit is configured to: first heating the evaporative heater to a second temperature, which is a preheating temperature of about 100-200 degrees Celsius, and then heating the evaporative heater to a third temperature, which is a target jet discharge temperature of approximately 200-400 degrees Celsius, moreover, activation of said at least one first ejector is carried out as soon as the chip reaches the first temperature and the evaporative heater reaches the third temperature. 3. An electronic vaping device according to claim 1 or 2, wherein the cartridge is removable from the body of the device. 4. An electronic vaping device according to any one of the preceding claims, wherein said at least one first ejector comprises a plurality of ejectors in the form of a matrix adjacent to said at least one through hole, each of said plurality of ejectors comprising: the nozzle formed by the surface on the chip, a chamber structure in fluid communication with the nozzle and said at least one through hole, an ejection heater placed on the surface of the chamber and configured to heat and partially vaporize the pre-evaporator composition to form droplets that are ejected through a nozzle towards the evaporative heater. 5. The electronic vaping device of claim 4, wherein said plurality of ejectors are configured to eject droplets of the pre-vapor composition with a droplet size of approximately 25 to 29 micrometers in diameter, wherein the device is configured to generate vapor at a generation rate of approximately 6 to 16 milligrams. per puff with a puff duration of approximately 5 seconds, with a vapor particle diameter of 0.4 to 5 micrometers. 6. An electronic vaping device according to any one of the preceding claims, wherein said at least one through hole comprises a first through hole and a second through hole formed by the chip. 7. An electronic vaping device according to any one of the preceding claims, wherein the pre-vapor composition has a viscosity of about 40 to 100 centipoise and the first temperature is about 50 to 80 degrees Celsius. 8. An electronic vaping device according to any one of the preceding claims, wherein the cartridge further comprises: cartridge body; a protrusion located inside the cartridge body and forming a channel; a substrate holding the chip at the first end of the cartridge and adjacent to said channel; and a porous structure located inside the container and configured to hold the pre-evaporator composition. 9. The electronic vaping device of claim 3, wherein the chip is detachable from the first end of the cartridge and the device is configured to retain the chip when the cartridge is removed from the device body. 10. An electronic vaping device according to any of the preceding claims, further comprising: a grip located inside the body of the device and configured to clamp the end of the evaporative heater to suspend said evaporative heater near said at least one first ejector, wherein said at least one first ejector is configured to eject drops of the pre-evaporative composition onto or through the evaporative heater. 11. A method for controlling an electronic vaping device, in which: provide an electronic vaping device comprising: - an evaporative heater located inside the first housing, - a cartridge located inside the first housing and forming a container made with the possibility of accommodating the pre-evaporator composition, - a chip located at the first end of the cartridge and containing at least one first ejector, at least one through hole extending inside the chip and in fluid communication with said container, said at least one first ejector in fluid communication with said at least one through hole, and - a power source electrically connected to said at least one first ejector and evaporative heater; and - at least one substrate heater connected to the chip, additionally according to the method: supplying a first electrical current from the power source to the evaporative heater to activate the evaporative heater; supplying a second electric current from a power source to said at least one first ejector to activate said at least one first ejector and eject droplets of the pre-evaporator composition from said at least one first ejector towards the evaporative heater; and a third electric current is supplied from a power source to said at least one substrate heater to activate said at least one substrate heater and heat the chip to a first temperature, wherein the third electric current is supplied after the first electric current is supplied, and the second electric current is supplied immediately after the chip reaches the first temperature. 12. The method of claim 11, wherein applying a first electric current to the evaporative heater causes the evaporative heater to be heated to a second temperature, which is a preheat temperature of approximately 100-200 degrees Celsius, wherein the method further: supplying a fourth electrical current from the power source to the evaporative heater to heat the evaporative heater to a third temperature of approximately 200-400 degrees Celsius, wherein the fourth electrical current is applied after the evaporative heater reaches the second temperature, and the second electric current is applied immediately after the chip reaches the first temperature and the evaporative heater reaches the third temperature, the first temperature being approximately 50 to 80 degrees Celsius.

Images