RU2772059C2 - Thermoregulating tape, system and method for spacecraft construction - Google Patents

Abstract

FIELD: space industry.

SUBSTANCE: group of inventions relates to multilayer coatings and methods for thermoregulating spacecraft (SC). The thermoregulating tape contains a layer (32) of silicone resin filled with a white inorganic material, as well as a layer (40a) of silicone sticky (pressure-sensitive) glue. The first side of the adhesive layer is attached to the second side of the filled silicone resin layer. The second side of the adhesive layer is made with the possibility of attachment to the surface of the SC. An electrical insulating polyimide film (60) can be fixed between the specified resin layer (32) and the adhesive layer (40a).

EFFECT: provided is thermal regulation of one or several parts SC by means of simple and fast operations that do not require painting, while obtaining a coating with high emissivity and diffuse reflection.

20 cl, 11 dwg

Description

SUPPORT INFORMATION

1) FIELD OF TECHNOLOGY

[001] The present invention generally relates to thermal control coatings, systems and methods for spacecraft, and in particular to thermal control tape, tape systems and methods for applying to spacecraft structures to control temperature by radiating heat from said spacecraft structures.

2) PRIOR ART

[002] Spacecraft, such as satellites, rockets, and other unmanned and manned spacecraft that travel in space, may be exposed to extreme temperatures or environmental events that may adversely affect various surfaces of the spacecraft. In order to provide temperature control for spacecraft structures made from materials such as aluminium, titanium, composite materials or plastics that require optical properties in the form of low solar absorption and high emissivity, one or more surfaces of such spacecraft structures typically must be painted or coated with white organic coatings.

[003] Thermally controlled paint coatings, paint systems and painting methods are known for painting spacecraft structures. However, such prior art temperature control paints, paint systems and painting methods typically require the application of a temporary protective coating, surface preparation, priming, painting, removal of the temporary protective coating, and cleaning. For example, the application of a temporary protective coating is time-consuming, as it takes 80%-90% of the processing time for painting. Priming and painting may require qualified and certified painters to optimize gun settings such as inlet pressure, fan size, air pressure, fluid flow, and other settings. In addition, the thickness of the primer and paint may vary when applied by hand or by spray. For example, a primer layer that is too thin or too thick can affect the adhesion of the top coat, areas of thin paint may not match optical properties such as solar absorption coefficient, and areas of thick paint may have problems with adhesion and adhesion, i.e. paint cracking may occur.

[004] Moreover, priming and painting may require an environment with at least 30% humidity, and painting may require mixing the correct ratios of resin and catalyst and diluting to an acceptable consistency. Such mixing and thinning processes can increase the duration and cost of the entire painting process. In addition, painting typically requires a curing period at room temperature of 7-14 days, which can also increase the length and cost of the entire painting process. In addition, redecorating and accessing areas of missing or removed paint can be difficult, and can add to the length and cost of the entire painting process.

[005] In addition, thermal control metallized tape coatings, such as silver or aluminum vapor deposition coated tapes, are known for temperature control. However, such prior art silver or aluminum vapor deposition coated tapes may have an undesirably low thermal emissivity and may have an undesirable specular reflection rather than the desired diffuse reflection.

[006] Accordingly, there is a need in the art for an improved thermal management tape, tape system, and method for providing temperature control to one or more spacecraft structures that eliminate painting operations, are simple and quick to apply, that provide improved optical properties, and also provide advantages over known systems and methods.

DISCLOSURE OF THE INVENTION

[007] Embodiments of this disclosure provide an improved thermal control tape, tape system, and method for providing temperature control to one or more spacecraft structures. As disclosed in the following detailed description, embodiments of a thermal control tape, tape system, and method for providing temperature control to one or more spacecraft structures can provide significant advantages over known systems and methods.

[008] In one embodiment, a thermal control tape is provided for providing temperature control to a spacecraft structure to which the thermal control tape is applied. The temperature control tape contains a layer of filled silicone resin having a first side and a second side. The filled silicone resin layer contains a silicone resin filled with a white inorganic filler.

[009] The temperature control tape also includes a silicone adhesive layer having a first side and a second side. The first side of the silicone adhesive layer is attached to the second side of the filled silicone resin layer. The filled silicone resin layer and the silicone adhesive layer form a thermal control tape, wherein the second side of the silicone adhesive adhesive layer is configured to be attached to at least one surface of the spacecraft structure to control the temperature of said spacecraft structure by radiating heat from said spacecraft structure .

[0010] In yet another embodiment, a thermal control tape is provided for providing temperature control to a spacecraft structure. The thermoregulating tape contains a layer of filled organosilicon resin having a first side and a second side. The filled silicone resin layer contains a silicone resin filled with a white inorganic filler. The silicone resin and the white inorganic filler are present in a ratio of 1:3 parts by weight to 1:4 parts by weight.

[0011] The temperature control tape also includes a silicone adhesive layer having a first side and a second side. The first side of the silicone adhesive layer is attached to the second side of the filled silicone resin layer. The second side of the organosilicon adhesive adhesive layer is adapted to be attached to said at least one surface of the spacecraft structure to control the temperature of said spacecraft structure by heat radiation from said spacecraft structure.

[0012] In yet another embodiment, a method is provided for using thermal tape to provide temperature control to a spacecraft structure to which the thermal tape is applied. The method includes the stage of assembling a system based on a thermal control tape.

[0013] The thermal tape system comprises a thermal tape. The temperature control tape contains a layer of filled silicone resin having a first side and a second side. The filled silicone resin layer contains a silicone resin filled with a white inorganic filler. The thermal control tape also contains a silicone adhesive layer having a first side and a second side. The first side of the silicone adhesive layer is attached to the second side of the filled silicone resin layer.

[0014] The thermal tape system also includes a first layer of release material removably attached to the first side of the filled silicone resin layer. The thermal tape system also includes a second layer of release material removably attached to the second side of the silicone adhesive layer.

[0015] The method also includes the step of preparing at least one surface of the spacecraft structure to provide at least one prepared surface for application of the thermal control tape. The method also includes the step of removing the second release material from the second side of the silicone adhesive layer.

[0016] The method also includes the step of applying a second side layer of silicone adhesive adhesive to said at least one prepared surface of the spacecraft structure. The method also includes the step of removing the first release material from the first side of the filled silicone resin layer.

[0017] These features, functions, and advantages may be obtained independently in various embodiments or embodiments of the disclosure, or may be combined in other embodiments or embodiments, further details of which may be considered with reference to the following description and figures of the drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The disclosure may be better understood with reference to the following detailed description, taken in conjunction with the accompanying drawings, which illustrate exemplary embodiments or embodiments, but which are not necessarily drawn to scale, wherein:

[0019] in FIG. 1 is a front perspective illustration of an exemplary spacecraft with various surfaces covered with an exemplary thermal control tape according to the disclosure;

[0020] in FIG. 2A is an exploded sectional view of an exemplary thermal tape system that includes an exemplary thermal tape according to the disclosure;

[0021] in FIG. 2B is an assembled sectional view illustration of the thermal tape and thermal tape system of FIG. 2A;

[0022] in FIG. 2C is a cutaway illustration of an exemplary thermal tape for the thermal tape system of FIG. 2B applied to the structure;

[0023] in FIG. 2D is a cutaway illustration of the thermal control tape of FIG. 2C, having a plurality of perforations and applied to said structure;

[0024] in FIG. 3A is an exploded sectional view of another exemplary thermal tape system that includes another exemplary thermal tape according to the disclosure;

[0025] in FIG. 3B is an assembled sectional view illustration of the thermal tape and thermal tape system of FIG. 3A;

[0026] in FIG. 3C is a cutaway illustration of an exemplary thermal tape for the thermal tape system of FIG. 3B applied to the structure;

[0027] in FIG. 3D is a cutaway illustration of the thermal control tape of FIG. 3C, having a plurality of perforations and applied to said structure;

[0028] in FIG. 4A is an exploded sectional view of another exemplary thermal tape system that includes another exemplary thermal tape according to the disclosure;

[0029] in FIG. 4B is an assembled cutaway illustration of the thermal tape and thermal tape system of FIG. 4A;

[0030] in FIG. 4C is a cutaway illustration of an exemplary thermal tape for the thermal tape system of FIG. 4B applied to the structure;

[0031] in FIG. 4D is a cutaway illustration of the thermal control tape of FIG. 4C having a plurality of perforations and applied to said structure;

[0032] in FIG. 5A is an exploded sectional view of another exemplary thermal tape system that includes another exemplary thermal tape according to the disclosure;

[0033] in FIG. 5B is an assembled cutaway illustration of the thermal tape and thermal tape system of FIG. 5A;

[0034] in FIG. 5C is a cutaway illustration of an exemplary thermal tape for the thermal tape system of FIG. 5V applied to the structure;

[0035] in FIG. 5D is a cutaway illustration of the temperature control tape of FIG. 5C, having a plurality of perforations and applied to said structure;

[0036] in FIG. 6 is an illustration of a plot of solar absorption coefficient;

[0037] in FIG. 7 is an illustration of a normal emissivity plot;

[0038] in FIG. 8 is an illustration of a functional diagram showing exemplary embodiments of a system based on a thermal control tape and a thermal control tape according to the disclosure of the invention;

[0039] in FIG. 9 is a flowchart illustration showing an exemplary method of using a thermal control tape to provide temperature control to a spacecraft structure according to the disclosure;

[0040] in FIG. 10 is a flowchart illustration of an exemplary method for manufacturing and maintaining a spacecraft; and

[0041] in FIG. 11 is an illustration of an exemplary spacecraft block diagram.

[0042] Each drawing figure shown in this disclosure shows a change in aspect of the embodiments shown, and only the differences will be detailed.

IMPLEMENTATION OF THE INVENTION

[0043] The disclosed embodiments or embodiments will now be described in more detail below with reference to the accompanying drawings, which show some but not all of the disclosed embodiments. In fact, several different implementations or implementations may be provided, which should not be construed as being limited to the implementations or implementations set forth herein. On the contrary, these embodiments or embodiments are provided so that this disclosure is complete and fully conveys the scope of the disclosure of the invention to those skilled in the art.

[0044] With reference to the drawings, FIG. 1 is a front perspective illustration of an exemplary space vehicle 12, such as a satellite 12a, with one or more surfaces 54 covered with an exemplary thermal control tape 10 according to the disclosure. As shown in FIG. 1, spacecraft 12, such as satellite 12a, includes solar panels 14. Each solar panel 14 (see FIG. 1) has a first side 16a (see FIG. 1) and a second side 16b (see FIG. 1). As shown in FIG. 1, the second side 16b of the solar panel 14 is covered or covered with thermal management tape 10 as disclosed herein, and the first side 16a of the solar panel 14 is not covered or covered with thermal management tape 10. As also shown in FIG. 1, the spacecraft 12, for example in the form of a satellite 12a, contains four antennas 18. Each antenna 18 (see FIG. 1) has a first reflective side 20a (see FIG. 1) and a second non-reflective side 20b (see FIG. 1 ). As shown in FIG. 1, the first reflective side 20a of each antenna 18 is covered or covered with thermal management tape 10 as disclosed herein, and the second non-reflective side 20b is not covered or covered with thermal management tape 10.

[0045] As also shown in FIG. 1, the spacecraft 12, for example in the form of a satellite 12a, contains a radiator 22, one or more cross members 24, one or more brackets 26 and one or more fittings 28. One or more surfaces 54 (see FIG. 1, 8) of the radiator 22 (see FIG. 1), said one or more crossbars 24 (see FIG. 1), said one or more brackets 26 (see FIG. 1) and said one or more fittings 28 (see FIG. 1) are covered or closed with thermal tape 10.

[0046] As used herein, the term "spacecraft" may include, but is not limited to, satellite 12a (see FIGS. 1, 8), unmanned spacecraft 12b (see FIG. 8), manned spacecraft 12c (see FIG. 8), rocket 12d (see FIG. 8), reentry vehicle 12e (see FIG. 8), reusable launch vehicle 12f (see FIG. 8), or other suitable space vehicle or object, which or which moves in space. As used herein, the term "reentry vehicle" may include, but is not limited to, satellites, rockets, manned and unmanned space vehicles and capsules, ballistic missile payloads, or other parts of a spacecraft capable of reentry from space through the Earth's atmosphere. and capable of withstanding very high temperatures and very high speeds or line speeds in the Earth's atmosphere, as well as capable of protecting crew members and/or instruments and equipment on the vehicle. As used herein, the term "reusable launch vehicle" means a vehicle that is launched into space more than once or is capable of launching a payload into space more than once.

[0047] In one embodiment of the present disclosure, a thermal control tape 10 (see FIG. 2A-5D) is provided to provide temperature control 11 (see FIG. 8) of structure 52 (see FIG. 8), for example, in the form of space apparatus (see FIG. 8), on which the thermostatic tape 10 is applied.

[0048] With reference to FIG. 2A-2D show an exemplary thermal tape 10 that may be part of an exemplary thermal tape system 30 (see FIGS. 2A-2B). FIG. 2A is an exploded sectional view of an exemplary thermal tape system 30, such as a thermal tape system 30a, which includes an exemplary thermal tape 10, such as a thermal tape 10a, according to the disclosure. . FIG. 2B is an assembled, sectional illustration of the thermal tape system 30, such as the thermal tape system 30a of FIG. 2A with a thermal control tape 10, for example in the form of a thermal control tape 10a. FIG. 2C is an illustration of a sectional view of an exemplary thermal tape 10, such as thermal tape 10a, of the thermal tape system 30 of FIG. 2B applied to structure 52, such as spacecraft structure 52a. FIG. 2D is an illustration of a sectional view of a thermal control tape 10, such as a thermal control tape 10a, of FIG. 2C, having a plurality of perforations 56, or holes, and applied to said structure 52.

[0049] As shown in FIG. 2A-2D, a thermal tape system 30, such as a thermal tape system 30a, comprises a thermal tape 10, such as a thermal tape 10a. Thermal control tape 10 (see FIG. 2A-2D), for example in the form of thermal control tape 10a (see FIG. 2A-2D), contains a layer 32 filled with organosilicon resin (see FIG. 2A-2D) having a first side 38a ( see FIG. 2A, 2C, 2D) and the second side 38b (see FIG. 2A).

[0050] The filled silicone resin layer 32 (see FIGS. 2A-2D) may comprise an unperforated filled silicone resin layer 32a (see FIGS. 2A-2C) or may include a perforated filled silicone resin layer 32b (see FIG. 2D) . As shown in FIG. 2A-2D, the filled silicone resin layer 32 comprises silicone resin 34 filled with white inorganic filler 36. Silicone resin 34 (see FIGS. 2A-2D) and white inorganic filler 36 (see FIGS. 2A-2D) are preferably present in a ratio of from 1:3 mass parts to 1:4 mass parts based on the total weight of the layer 32 filled with silicone resin.

[0051] Silicone resin 34 (see FIG. 2A-2D) may contain silicone polymer resin 34a (see FIG. 8) or other suitable silicone resin 34. White inorganic filler 36 (see FIG. 2A-2D) layer 32 The filled silicone resin preferably contains doped zinc oxide pigment particles 36a (see FIG. 8) formed from zinc oxide pigment particles 37 (see FIG. 8) doped with an alloying element 39 (see FIG. 8). As shown in FIG. 8, which is discussed in more detail below, the alloying element 39 may consist of one or more of the following: aluminum 39a, gallium 39b, indium 39c, boron 39d, zinc 39e, tin 39f, hydrogen 39g, or other suitable alloying element 39. Example of preparation method white inorganic filler 36 is disclosed in US Pat. No. 5,094,693, which is incorporated herein by reference in its entirety. An example of a method for preparing a filled silicone resin layer 32 is disclosed in US Pat. No. 5,770,269, which is incorporated herein by reference in its entirety.

[0052] The filled silicone resin layer 32 (see FIGS. 2A-2D) preferably has a thickness in the range of about 2 mils (0.002 inches (0.0508 mm)) to about 5 mils (0.005 inches (0.127 mm)). The thicker the layer 32 filled with organosilicon resin, the more reflective it can be, and the lower coefficient of absorption of solar radiation 71 (see FIG. 6, 8) it can have. The filled silicone resin layer 32 (see FIGS. 2A-2D) with white inorganic filler 36 (see FIGS. 2A-2D) preferably has a low solar absorption coefficient 71 (see FIGS. 6, 8) and preferably has a high coefficient 84 thermal radiation (see FIG. 8).

[0053] As shown in FIG. 2A-2D, thermal tape 10, such as thermal tape 10a, also includes a silicone adhesive layer 40 having a first side 44a (see FIG. 2A) and a second side 44b (see FIG. 2A). The first side 44a (see FIG. 2A) of the silicone adhesive layer 40 (see FIG. 2A) is attachable and attached to the second side 38b (see FIG. 2A) of the filled silicone resin layer 32 (see FIG. 2A ). In a preferred embodiment, the silicone tack layer 40 (see FIGS. 2A-2D) contains silicone tack 42 (see FIGS. 2A-2D) or other suitable tack. The silicone adhesive layer 40 preferably has superior adhesion over a wider temperature range than acrylic adhesives or rubber adhesives. In addition, the silicone adhesive layer 40 can be superior in terms of radiation degradation compared to other types of adhesives.

[0054] The silicone adhesive layer 40 (see FIGS. 2A-2D) preferably has a thickness in the range of about 2 mils (0.002 inches (0.0508 mm)) to about 5 mils (0.005 inches (0.127 mm)), and more preferably has a thickness of about 4 mils (0.004 inches (0.1016 mm)). The thickness of the silicone adhesive layer 40 can be determined by its strength in terms of adhesion in the space environment.

[0055] In one embodiment of the thermal control tape 10 shown in FIG. 2A-2D and FIG. 4A-4D, the silicone adhesive layer 40 includes an unfilled silicone adhesive layer 40a. In yet another version of the temperature control tape 10 shown in FIG. 3A-3D and FIG. 5A-5D and described in more detail below, the silicone adhesive layer 40 comprises a filled silicone adhesive layer 40b.

[0056] As shown in FIG. 2A-2B, thermal tape system 30, such as thermal tape system 30a, also includes a first release material layer 46a having a first side 48a and a second side 48b (see FIG. 2A). The second side 48b of the first layer 46a of the release material is preferably removably attached to the first side 38a of the layer 32 filled with silicone resin.

[0057] As shown in FIG. 2A-2B, thermal tape system 30, such as thermal tape system 30a, also includes a second release material layer 46b having a first side 50a (see FIG. 2A) and a second side 50b. The first side 50a of the second release layer 46b is preferably removably attached to the second side 44b of the silicone adhesive layer 40 .

[0058] The first release material layer 46a (see FIGS. 2A-2B) and the second release material layer 46b (see FIGS. 2A-2B) may each comprise a fluoropolymer film, such as a polyvinyl fluoride (PVF) film, or other suitable polymer. In a preferred embodiment, the first release material layer 46a (see FIGS. 2A-2B) and the second release material layer 46b (see FIGS. 2A-2B) do not include a plasticizer to avoid degradation of the whiteness of the white inorganic filler 36 (see FIG. .2A-2B) layer 32 filled with silicone resin (see FIG. 2A-2B).

[0059] The first layer 46a of the release material (see FIGS. 2A-2B) preferably has a thickness in the range of about 1 mil (0.001 inch (0.0254 mm)) to about 4 mil (0.004 inch (0.1016 mm)) , and more preferably has a thickness in the range from about 1 mil (0.001 inch (0.0254 mm)) to about 2 mil (0.002 inch (0.0508 mm)). The second layer 46b of release material (see FIGS. 2A-2B) preferably has a thickness in the range of about 3 mils (0.003 inches (0.0762 mm)) to about 4 mils (0.004 inches (0.1016 mm)), and more preferably has a thickness of 4 mils (0.004 inches (0.1016 mm)). In the preferred embodiment, the second release material layer 46b is thicker than the first release material layer 46a because the silicone adhesive layer 40 tends to be tacky, and the thicker the second release material layer 46b is near the silicone adhesive layer 40, the easier the second layer can be removed. a release layer 46b from a silicone adhesive layer 40 .

[0060] As shown in FIG. 2C-2D, the filled silicone resin layer 32 and the unfilled silicone adhesive layer 40a form a thermal control tape 10, for example in the form of a thermal control tape 10a, wherein the second side 44b (see FIG. 2C) of the unfilled silicone adhesive layer 40a is attachable to at least one surface 54 of the structure 52, such as the structure 52a, of the spacecraft 12 (see FIGS. 1, 8) to control the temperature AND (see FIG. 8) of the structure 52a of the spacecraft by means of heat radiation 66 (see FIG 8) from said spacecraft structure 52a.

[0061] As shown in FIG. 2D, the silicone resin filled layer 32 of the temperature control tape 10, such as the temperature control tape 10a applied to the structure 52, has a plurality of perforations 56, or holes, to form a perforated silicone resin layer 32b. The perforations 56 (see FIG. 2D), or holes, form a perforated surface 55 (see FIG. 2D) that can provide an outlet or outlet for any escaping gas in the space environment. In addition, the perforated surface 55 (see FIG. 2D) may allow any air to escape or exit during application of the thermal control tape 10 (see FIG. 2D) to the structure 52 (see FIG. 2D).

[0062] With reference to FIG. 3A-3D show another exemplary thermal tape 10 that may be part of another exemplary thermal tape system 30 (see FIGS. 3A-3B). FIG. 3A is an exploded sectional view illustration of another exemplary thermal tape system 30, such as a thermal tape system 30b, which includes another exemplary thermal tape 10, such as a thermal tape 10b , according to the disclosure of the invention. FIG. 3B is an assembled, sectional illustration of the thermal tape system 30, such as the thermal tape system 30b of FIG. 3A with a thermal control tape 10, for example in the form of a thermal control tape 10b. FIG. 3C is a sectional illustration of an exemplary thermal tape 10, such as thermal tape 10b, of the thermal tape system 30 of FIG. 3B applied to structure 52, such as spacecraft structure 52a. FIG. 3D is an illustration of a sectional view of a thermal control tape 10, such as a thermal control tape 10b, of FIG. 3C having said plurality of perforations 56, or holes, and applied to the structure 52.

[0063] In this implementation of the thermal tape system 30, such as the thermal tape system 30b shown in FIG. 3A-3D, the silicone adhesive layer 40 comprises a filled silicone adhesive layer 40b instead of an unfilled silicone adhesive layer 40a (see FIGS. 2A-2D).

[0064] As shown in FIG. 3A-3D, thermal tape 10, such as thermal tape 10b, thermal tape system 30, such as thermal tape system 30b, comprises a filled silicone resin layer 32 having a first side 38a (see FIG. 3A, 3C, 3D) and the second side 38b (see FIG. 3A). As disclosed above, the filled silicone resin layer 32 (see FIGS. 3A-3D) may comprise an unperforated filled silicone resin layer 32a (see FIGS. 3A-3C) or may comprise a perforated filled silicone resin layer 32b (see FIG. 3D). ). As shown in FIG. 3A-3D, the filled silicone resin layer 32 comprises a silicone resin 34 filled with a white inorganic filler 36. The silicone resin 34 (see FIGS. 3A-3D) may contain a silicone polymer resin 34a (see FIG. 8) or other suitable silicone resin. 34, and the white inorganic filler 36 (see FIGS. 3A-3D) is the same as disclosed above with respect to FIG. 2A-2D. The filled silicone resin layer 32 (see FIGS. 3A-3D) preferably has a thickness in the range of about 2 mils (0.002 inches (0.0508 mm)) to about 5 mils (0.005 inches (0.127 mm)).

[0065] As shown in FIG. 3A-3D, thermal tape 10, such as thermal tape 10b, also includes a silicone adhesive layer 40 having a first side 44a (see FIG. 3A) and a second side 44b (see FIG. 3A). The first side 44a (see FIG. 3A) of the silicone adhesive layer 40 (see FIG. 3A) is attachable and affixed to the second side 38b (see FIG. 3A) of the filled silicone resin layer 32 (see FIG. 3A). ). In a preferred embodiment, the silicone tack layer 40 (see FIGS. 3A-3D) contains silicone tack 42 (see FIGS. 3A-3D) or other suitable tack. As disclosed above, the silicone adhesive layer 40 (see FIGS. 3A-3D) preferably has a thickness in the range of about 2 mils (0.002 inches (0.0508 mm)) to about 5 mils (0.005 inches (0.127 mm)), and more preferably has a thickness of about 4 mils (0.004 inches (0.1016 mm)).

[0066] In this embodiment, shown in FIG. 3A-3D, the silicone adhesive layer 40 comprises a filled silicone adhesive layer 40b. In a preferred embodiment, the silicone adhesive layer 40 is a filled silicone adhesive layer 40b. As shown in FIG. 3A-3D, the silicone tack layer 40, such as filled silicone tack layer 40b, comprises an electrostatic dissipative filler 58. The electrostatic dissipative filler 58 (see FIGS. 3A-3D) may comprise one of metal filler 58a (see FIG. 8), carbon filler 58b (see FIG. 8), or other suitable electrostatic dissipative filler 58 . The metal filler 58a (see FIG. 8) may comprise nickel particles, copper particles, nickel-plated glass spheres, copper-plated glass spheres, or other suitable metal filler 58a. In a preferred embodiment, the electrostatic dissipative filler 58 is carbon filler 58b (see FIG. 8).

[0067] As shown in FIG. 3A-3B, thermal tape system 30, such as thermal tape system 30b, also includes a first release material layer 46a having a first side 48a and a second side 48b (see FIG. 3A), with the second side 48b of the first the release layer 46a is preferably removably attached to the first side 38a of the filled silicone resin layer 32. As shown in FIG. 3A-3B, thermal tape system 30, such as thermal tape system 30b, also includes a second release material layer 46b having a first side 50a (see FIG. 3A) and a second side 50b, with the first side 50a of the second the release layer 46b is preferably removably attached to the second side 44b of the silicone adhesive layer 40 . The thicknesses and preferred materials of the first release material layer 46a (see FIGS. 3A-3B) and the second release material layer 46b (see FIGS. 3A-3B) are the same as disclosed above with respect to FIGS. 2A-2B.

[0068] As shown in FIG. 3C-3D, the filled silicone resin layer 32 and the filled silicone adhesive layer 40b form a thermal control tape 10, for example in the form of a thermal control tape 10b, while the second side 44b (see FIG. 3A) of the filled silicone adhesive layer 40b is attachable to at least one surface 54 of the structure 52, such as the structure 52a, of the spacecraft 12 (see FIG. 1, 8) with the provision of temperature control 11 (see FIG. 8) of the structure 52a of the spacecraft by means of heat radiation 66 (see FIG 8) from said spacecraft structure 52a.

[0069] As shown in FIG. 3D, the silicone resin-filled layer 32 of the temperature control tape 10, such as the temperature control tape 10b applied to the structure 52, has said plurality of perforations 56, or holes, to form a perforated silicone resin-filled layer 32b. The perforations 56 (see FIG. 3D), or openings, form a perforated surface 55 (see FIG. 3D) which may provide an outlet or outlet for any escaping gas in the space environment, or may provide an outlet or outlet for any air. during application of the thermal control tape 10 (see FIG. 3D) to the structure 52 (see FIG. 3D).

[0070] With reference to FIG. 4A-4D show another exemplary thermal tape 10 that may be part of another exemplary thermal tape system 30 (see FIGS. 4A-4B). FIG. 4A is an exploded sectional view of another exemplary thermal tape system 30, such as a thermal tape system 30c, which includes another exemplary thermal tape 10, such as a thermal tape 10c. , according to the disclosure of the invention. FIG. 4B is an assembled, sectional illustration of the thermal tape system 30, such as the thermal tape system 30c of FIG. 4A with a thermal control tape 10, for example in the form of a thermal control tape 10c. FIG. 4C is an illustration of a sectional view of an exemplary thermal tape 10, such as thermal tape 10c, of the thermal tape system 30 of FIG. 4B applied to structure 52, such as spacecraft structure 52a. FIG. 4D is an illustration of a sectional view of a thermal control tape 10, such as a thermal control tape 10c, of FIG. 4C having said plurality of perforations 56, or holes, and applied to the structure 52.

[0071] In this implementation of the thermal tape system 30, such as the thermal tape system 30c shown in FIG. 4A-4D, thermal tape 10, such as thermal tape 10c, also includes a film layer 60 added between filled silicone resin layer 32 and silicone adhesive layer 40, such as unfilled silicone adhesive layer 40a. In the embodiment shown in FIG. 4A-4D, the film layer 60 includes a non-conductive film layer 60a. In yet another embodiment shown in FIG. 5A-5D, the film layer 60 includes a conductive film layer 60b.

[0072] The non-conductive film layer 60a (see FIGS. 4A-4D, 8) preferably comprises an electrically insulating polyimide film 60c (see FIG. 8) or other suitable non-conductive polyimide or polymer film. Film layer 60 (see FIGS. 4A-4D), such as non-conductive film layer 60a (see FIGS. 4A-4D), preferably has a thickness in the range of about 1 mil (0.001 inch (0.0254 mm)) to about 3 mils (0.003 inches (0.0762 mm)), and more preferably has a thickness of about 1 mil (0.001 inches (0.0254 mm)).

[0073] As shown in FIG. 4A, the film layer 60 has a first side 62a and a second side 62b. When assembled, the first side 62a (see FIG. 4A) of the film layer 60 (see FIG. 4A) is near the second side 38b (see FIG. 4A) of the filled silicone resin layer 32, and the second side 62b (see FIG. 4A ) film layer 60 (see FIG. 4A) is near the first side 44a (see FIG. 4A) of the silicone adhesive layer 40, such as unfilled silicone adhesive layer 40a (see FIG. 4A). If the non-conductive film layer 60a (see FIGS. 4A-4D) is added to the thermal control tape 10, for example in the form of a thermal control tape 10c, an unfilled silicone adhesive layer 40a is preferably used.

[0074] The addition of the non-conductive film layer 60a (see FIGS. 4A-4D, 8) to the thermal tape 10 (see FIGS. 4A-4D) preferably improves the processing stability of the tape. Thus, thermal tape 10 (see FIGS. 4A-4D), for example in the form of thermal tape 10c (see FIG. 4A-4D), can provide improved tape processing stability 92 (see FIG. 8).

[0075] As shown in FIG. 4A-4D, thermal tape 10, such as thermal tape 10c, thermal tape system 30, such as thermal tape system 30c, comprises a silicone resin filled layer 32 having a first side 38a (see FIG. 4A). , 4C, 4D) and the second side 38b (see FIG. 4A). As disclosed above, the filled silicone resin layer 32 (see FIGS. 4A-4D) may comprise an unperforated filled silicone resin layer 32a (see FIGS. 4A-4C) or may include a perforated filled silicone resin layer 32b (see FIG. 4D). ).

[0076] As shown in FIG. 4A-4D, the filled silicone resin layer 32 comprises a silicone resin 34 filled with a white inorganic filler 36. The silicone resin 34 (see FIGS. 4A-4D) may contain a silicone polymer resin 34a (see FIG. 8) or other suitable silicone resin. 34, and the white inorganic filler 36 (see FIGS. 4A-4D) is the same as disclosed above with respect to FIG. 2A-2D. The filled silicone resin layer 32 (see FIGS. 4A-4D) preferably has a thickness in the range of about 2 mils (0.002 inches (0.0508 mm)) to about 5 mils (0.005 inches (0.127 mm)).

[0077] As shown in FIG. 4A-4D, thermal tape 10, such as thermal tape 10c, also comprises a silicone adhesive layer 40 in the form of an unfilled silicone adhesive layer 40a having a first side 44a (see FIG. 4A) and a second side 44b (see FIG. FIG 4A). The first side 44a (see FIG. 4A) of the silicone adhesive layer 40 (see FIG. 4A) is attachable and attached to the second side 38b (see FIG. 4A) of the filled silicone resin layer 32 (see FIG. 4A). ). In a preferred embodiment, the silicone tack layer 40 (see FIGS. 4A-4D) contains silicone tack 42 (see FIGS. 4A-4D) or other suitable tack. As disclosed above, the silicone adhesive layer 40 (see FIGS. 4A-4D) preferably has a thickness in the range of about 2 mils (0.002 inches (0.0508 mm)) to about 5 mils (0.005 inches (0.127 mm)), and more preferably has a thickness of about 4 mils (0.004 inches (0.1016 mm)).

[0078] As shown in FIG. 4A-4B, thermal tape system 30, such as thermal tape system 30c, also comprises a first layer 46a of release material having a first side 48a and a second side 48b (see FIG. 4A), with the second side 48b The first layer 46a of the release material is preferably removably attached to the first side 38a of the filled silicone resin layer 32. As shown in FIG. 4A-4B, thermal tape system 30, such as thermal tape system 30c, also includes a second release material layer 46b having a first side 50a (see FIG. 4A) and a second side 50b, with the first side 50a the second layer 46b of the release material is preferably removably attached to the second side 44b of the silicone adhesive layer 40 . The thicknesses and preferred materials of the first release material layer 46a (see FIGS. 4A-4B) and the second release material layer 46b (see FIGS. 4A-4B) are the same as disclosed above with respect to FIGS. 2A-2B.

[0079] As shown in FIG. 4C-4D, the filled silicone resin layer 32 and the unfilled silicone adhesive layer 40a form a thermal control tape 10, for example in the form of a thermal control tape 10c, while the second side 44b (see FIG. 4A) of the filled silicone adhesive layer 40b is attachable to at least one surface 54 of the structure 52, such as the structure 52a, of the spacecraft 12 (see FIG. 1, 8) with the provision of temperature control 11 (see FIG. 8) of the structure 52a of the spacecraft by means of heat radiation 66 (see FIG 8) from said spacecraft structure 52a.

[0080] As shown in FIG. 4D, the silicone resin filled layer 32 of the temperature control tape 10, for example in the form of a temperature control tape 10c applied to the structure 52, has said plurality of perforations 56, or holes, to form a perforated silicone resin layer 32b. The perforations 56 (see FIG. 4D), or openings, form a perforated surface 55 (see FIG. 4D) which may provide an outlet or outlet for any escaping gas in the space environment, or may provide an outlet or outlet for any air. during application of the thermal control tape 10 (see FIG. 4D) to the structure 52 (see FIG. 4D).

[0081] With reference to FIG. 5A-5D show another exemplary thermal tape 10 that may be part of another exemplary thermal tape system 30 (see FIGS. 5A-5B). FIG. 5A is an exploded sectional view of another exemplary thermal tape system 30, such as a thermal tape system 30d, which includes another exemplary thermal tape 10, such as a thermal tape 10d. , according to the disclosure of the invention. FIG. 5B is an assembled sectional illustration of the thermal tape system 30, such as the thermal tape system 30d of FIG. 5A with a thermal control tape 10, for example in the form of a thermal control tape 10d. FIG. 5C is an illustration of a sectional view of an exemplary thermal tape 10, such as thermal tape 10d, of the thermal tape system 30 of FIG. 5B applied to structure 52, such as spacecraft structure 52a.

FIG. 5D is an illustration of a sectional view of a thermal control tape 10, such as a thermal control tape 10d, of FIG. 5C having said plurality of perforations 56, or holes, and applied to the structure 52.

[0082] In this implementation of the thermal tape system 30, such as the thermal tape system 30d shown in FIG. 5A-5D, thermal tape 10, such as thermal tape 10d, also has a film layer 60 added between the filled silicone resin layer 32 and the silicone adhesive layer 40, such as filled silicone adhesive layer 40b.

[0083] In this embodiment, shown in FIG. 5A-5D, the film layer 60 includes a conductive film layer 60b. The conductive film layer 60b (see FIGS. 5A-5D, 8) preferably comprises an electrically conductive polyimide film 60d (see FIG. 8), an electrically conductive carbon-filled polyimide film 60e (see FIG. 8), or other suitable conductive polyimide or polymer film. In a preferred embodiment, the conductive film layer 60b remains stable over a wide temperature range, such as -269 degrees Celsius to +400 degrees Celsius (-452 degrees Fahrenheit to +752 degrees Fahrenheit). Film layer 60 (see FIGS. 4A-4D), such as conductive film layer 60b (see FIGS. 5A-5D), preferably has a thickness in the range of about 1 mil (0.001 inch (0.0254 mm)) to about 3 mils (0.003 inches (0.0762 mm)), and more preferably has a thickness of about 1 mil (0.001 inches (0.0254 mm)).

[0084] As shown in FIG. 5A, the film layer 60 has a first side 62a and a second side 62b. When assembled, the first side 62a (see FIG. 5A) of the film layer 60 (see FIG. 5A) is near the second side 38b (see FIG. 5A) of the filled silicone resin layer 32, and the second side 62b (see FIG. 5A ) of the film layer 60 (see FIG. 5A) is near the first side 44a (see FIG. 5A) of the silicone adhesive layer 40, such as the filled silicone adhesive layer 40b (see FIG. 5A). If the conductive film layer 60b (see FIGS. 5A-5D) is added to the thermal management tape 10 (see FIGS. 5A-5D), for example in the form of a thermal management tape 10d (see FIGS. 5A-5D, layer 40b filled with silicone adhesive adhesive (see FIG. 5A-5D) filled with an electrostatic dissipative filler 58 (see FIG. 5A-5D), such as a metal filler 58a (see FIG. 8), or preferably a carbon filler 58b is used (see FIG. . eight).

[0085] Adding the conductive film layer 60b (see FIGS. 5A-5D, 8) to the thermal tape 10 (see FIGS. 5A-5D) can increase the electrical stability of electrostatic charge dissipation and can improve the processing stability of the tape. Thus, thermal control tape 10 (see FIGS. 5A-5D), for example in the form of thermal control tape 10d (see FIG. 5A-5D), can provide improved electrical stability 90 (see FIG. 8) and improved processing stability 92 tape (see FIG. 8).

[0086] As shown in FIG. 5A-5D, thermal tape 10, such as thermal tape 10d, thermal tape system 30, such as thermal tape system 30d, comprises a silicone resin filled layer 32 having a first side 38a (see FIG. 5A, 5C, 5D) and the second side 38b (see FIG. 5A).

[0087] As discussed above, the filled silicone resin layer 32 (see FIGS. 5A-5D) may comprise an unperforated filled silicone resin layer 32a (see FIGS. 5A-5C) or may comprise a perforated filled silicone resin layer 32b (see FIGS. FIG 5D). As shown in FIG. 5A-5D, the filled silicone resin layer 32 comprises a silicone resin 34 filled with a white inorganic filler 36.

[0088] As shown in FIG. 5A-5D, the filled silicone resin layer 32 comprises a silicone resin 34 filled with a white inorganic filler 36. The silicone resin 34 (see FIGS. 5A-5D) may contain a silicone polymer resin 34a (see FIG. 8) or other suitable silicone resin. 34 and the white inorganic filler 36 (see FIGS. 5A-5D) is the same as disclosed above with respect to FIG. 2A-2D. The filled silicone resin layer 32 (see FIGS. 5A-5D) preferably has a thickness in the range of about 2 mils (0.002 inches (0.0508 mm)) to about 5 mils (0.005 inches (0.127 mm)).

[0089] As shown in FIG. 5A-5D, thermal tape 10, such as thermal tape 10d, also comprises a silicone adhesive layer 40, such as a filled silicone adhesive layer 40b, having a first side 44a (see FIG. 5A) and a second side 44b (see Fig. 5A). First side 44a (see FIG. 5A) of silicone adhesive layer 40 (see FIG. 5A) is attachable and affixed to second side 38b (see FIG. 5A) of filled silicone resin layer 32 (see FIG. 5A). ). In a preferred embodiment, the silicone tack layer 40 (see FIGS. 5A-5D) contains silicone tack 42 (see FIGS. 5A-5D) or other suitable tack. As disclosed above, the silicone adhesive layer 40 (see FIGS. 5A-5D) preferably has a thickness in the range of about 2 mils (0.002 inches (0.0508 mm)) to about 5 mils (0.005 inches (0.127 mm)), and more preferably has a thickness of about 4 mils (0.004 inches (0.1016 mm)).

[0090] As shown in FIG. 5A-5B, thermal tape system 30, such as thermal tape system 30d, also includes a first layer 46a of release material having a first side 48a and a second side 48b (see FIG. 5A), with the second side 48b of the first the release layer 46a is preferably removably attached to the first side 38a of the filled silicone resin layer 32. As shown in FIG. 5A-5B, thermal tape system 30, such as thermal tape system 30d, also includes a second release material layer 46b having a first side 50a (see FIG. 5A) and a second side 50b, with the first side 50a of the second the release layer 46b is preferably removably attached to the second side 44b of the silicone adhesive layer 40 . The thicknesses and preferred materials of the first release material layer 46a (see FIGS. 5A-5B) and the second release material layer 46b (see FIGS. 5A-5B) are the same as disclosed above with respect to FIGS. 2A-2B.

[0091] With reference to FIG. 6 is an illustration of a solar absorption coefficient graph 70 for checking solar absorption coefficient 71 on a thermal control surface 64 (see FIG. 8), such as a white thermal control surface such as a silicone resin filled layer 32 (see FIGS. 2A-5D), filled with white inorganic filler 36 (see FIG. 2A-5D) cited as an example of embodiments of thermal control tape 10 (see FIG. 2A-5D) according to the disclosure of the invention. As used herein, the term "solar absorption coefficient" means a measure of the ability or efficiency of a material surface to absorb radiant energy, and is the ratio of total absorbed radiant energy to incident radiant energy, measured as a dimensionless factor between 0 and 1.

[0092] To obtain the solar absorption coefficient 71 (see FIG. 6) of a surface or material, the total reflectance coefficient 72 is measured as a percentage (%) as a function of the wavelength (nm - nanometer) 74, from which the absorption coefficient 71 is then calculated solar radiation. FIG. 6 shows a plot 76 of solar absorption coefficient. The average solar absorption coefficient obtained from solar absorption coefficient plot 76 was 0.2027. In a preferred embodiment, the thermal control tape 10 (see FIGS. 2A-5D) disclosed herein has a solar absorption factor 71 in the range of 0.16 to 0.30. The filled silicone resin layer 32 (see FIGS. 2A-5D) functioning as thermal control layer 64 (see FIG. 8) preferably has a low solar absorption coefficient 71 and a high reflectance.

[0093] With reference to FIG. 7 is an illustration of a normal emissivity graph 78 for checking the normal emissivity 79 (or emissivity or thermal emissivity) on a temperature control surface 64 (see FIG. 8), such as a white temperature control surface such as a filled silicone resin layer 32 (see FIG. FIGS. 2A-5D) filled with white inorganic filler 36 (see FIGS. 2A-5D) of exemplary embodiments of thermal control tape 10 (see FIGS. 2A-5D) according to the disclosure. As used herein, the term "normal emissivity" or "emissivity" or "thermal emissivity" means a measure of the energy radiated by the surface of a body per second per unit area, and is the ratio of the radiated specific surface heat to that of a standard black body , measured as a dimensionless factor between 0 and 1.

[0094] To obtain the normal emissivity 79 (see FIG. 7) of a surface or material, the directional reflectance 80 is measured as a function of the wavelength (µm - micrometer) 82, from which the normal 79 emissivity is then calculated. FIG. 6 shows a plot 84 of the normal emissivity. The average normal emissivity obtained from the normal emissivity plot 84 was 0.93. The normal emissivity 79 (see FIG. 7) is measured at a higher wavelength 82 than the solar absorption coefficient 71 (see FIG. 6). In a preferred embodiment, the thermal control tape 10 (see FIGS. 2A-5D) disclosed herein has a thermal emissivity 84 (see FIG. 8) of greater than 0.88. In a more preferred embodiment of the invention, the thermal control tape 10 (see FIGS. 2A-5D) has a thermal emissivity 84 (see FIG. 8) in the range of 0.88 to 0.96.

[0095] With reference to FIG. 8 is a block diagram illustration showing exemplary embodiments of a thermal tape system 30 and a thermal tape 10 according to the disclosure. As shown in FIG. 8 and as detailed above, thermal tape 10 (see FIGS. 2A-5D) is intended for use on one or more surfaces 54 of structure 52, such as structure 52a, of spacecraft 12. As also shown in FIG. 8, spacecraft 12 may include a satellite 12a, an unmanned spacecraft 12b, a manned spacecraft 12c, a rocket 12d, a reentry vehicle 12e, a reusable launch vehicle 12f, or other suitable spacecraft 12. In the preferred embodiment, surface 54 (see FIG. 8) is prepared surface 54a (see FIG. 8) and thermostatic surface 54b (see FIG. 8). In some implementations, surface 54 may include a perforated surface 55 (see FIGS. 2D, 3D, 4D, 5D, 8).

[0096] As also shown in FIG. 8, the thermal tape system 30 comprises a first release material layer 46a and a second release material layer 46b, as detailed above. As also shown in FIG. 8, thermal tape system 30 includes thermal tape 10 for providing temperature control 11 to one or more surfaces 54 of structure 52, such as spacecraft structure 52a. Thermal control tape 10 (see FIG. 8) comprises a filled silicone resin layer 32 (see FIG. 8) in the form of an unperforated filled silicone resin layer 32a (see FIG. 8) or a perforated filled silicone resin layer 32b (see FIG. 8). FIG. 8) having the specified set of perforations 56 (see FIG. 8).

[0097] As shown in FIG. 8, the filled silicone resin layer 32 contains a silicone resin 34, for example in the form of a silicone polymer resin material 34a, a white inorganic filled material 36 containing zinc oxide pigment particles 37 doped with an alloying element 39. As also shown in FIG. 8, alloying element 39 consists of one of aluminum 39a, gallium 39b, indium 39c, boron 39, zinc 39e, tin 39f, hydrogen 39g, or other suitable alloying element 39 forming doped zinc oxide pigment particles 36a.

[0098] As shown in FIG. 8, the temperature control tape 10 also comprises a silicone adhesive layer 40, preferably made of silicone adhesive 42 and bonded to a filled silicone resin layer 32, whereby the silicone adhesive layer 40 may be in the form of an unfilled silicone adhesive layer 40a or a layer 40b. filled with organosilicon tacky adhesive. The silicone adhesive layer 40 (see FIG. 8), such as the filled silicone adhesive layer 40b (see FIG. 8), preferably also contains an electrostatic dissipative filler 58 (see FIG. 8) containing one of metal filler 58a (see FIG. 8), carbon filler 58b (see FIG. 8) or other suitable filler 58 that dissipates an electrostatic charge. Layer 40b filled silicone adhesive adhesive (see FIG. 8) forms a system 59 that dissipates the electrostatic charge (see FIG. 8).

[0099] In some embodiments, the thermal control tape 10 (see FIG. 8) may optionally include a film layer 60 (see FIG. 8) attached between the filled silicone resin layer 32 (see FIG. 8) and the silicone adhesive layer 40 glue (see FIG. 8). As shown in FIG. 8, in one embodiment, the film layer 60 includes a non-conductive film layer 60a comprising an electrically insulating polyimide film 60c or other suitable non-conductive polyimide or polymer film. As also shown in FIG. 8, in yet another embodiment, the film layer 60 comprises a conductive film layer 60b comprising one of an electrically conductive polyimide film 60d, an electrically conductive carbon-filled polyimide film 60e, or other suitable conductive polyimide or polymer film.

[00100] Thermal control tape 10 (see FIG. 8) is configured to attach to at least one surface 54 (see FIG. 8) of structure 52 (see FIG. 8), such as structure 52a (see FIG. 8), the spacecraft 12 (see FIG. 1, 8) with temperature control 11 (see FIG. 8) of the spacecraft structure 52a by heat radiation 66 (see FIG. 8) from said spacecraft structure 52a. The filled silicone resin layer 32 (see FIG. 8) functions as a temperature control layer 64 (see FIG. 8). Thermal control tape 10 (see FIG. 8) functions as a heat radiant tape 86a (see FIG. 8) containing cured heat radiant paint 86b (see FIG. 8) adhered to a silicone self-adhesive layer 40 (see FIG. 8), while the temperature control tape 10 (see FIG. 8) has a uniform thickness 88 with improved quality (see FIG. 8), improved electrical stability 90 and improved tape processing stability 92 (see FIG. 8).

[00101] The thermal control tape 10 (see FIG. 8) preferably matches the optical properties 68 (see FIG. 8) when the solar absorption coefficient 71 (see FIG. 8) is low (for example, 0.18 to 0, 30) and the thermal emissivity 84 (see FIG. 8) is high (eg, greater than 0.9). When applying the temperature control tape 10 (see FIG. 8), the robotic assembly 96 (see FIG. 8) using a variety of robot parameters 97 (see FIG. 8) can preferably be used to accurately control the thickness and optimize the uniform thickness 88 (see FIG. 8) of the thermal control tape 10. Various parameters 97 of the robot (see FIG. 8) may include, but are not limited to, positioning the robotic assembly 96 (see FIG. 8) ninety (90) degrees to the surface 54 ( see FIG. 8) designed to apply thermal tape 10, using the optimum spray angle of 94 (see FIG. 8) for a spray nozzle of six (6) +/- 0.25 inches (152, 4 +/- 6, 35 mm) relative to structure 52 (see FIG. 8), spraying four (4) inches (10.16 cm) beyond the edges of structure 52 (see FIG. 8), using a flow rate of two hundred (200) cu. cm/min (cubic centimeters per minute), using a head speed of three hundred (300) mm/s (millimeters per second), using a rasterization index of 37.5 mm (millimeters), and other suitable robot parameters 97 . In a preferred embodiment of the invention, application using robotic assembly 96 is performed at a temperature of about seventy-five (75) +/- 10 degrees Fahrenheit (24 +/- 5.6°C).

[00102] As also shown in FIG. 8, the thermal control tape 10 can be obtained by thermal control tape processing 98, including vacuum bag processing 98a or other suitable processing techniques. Thermal control tape layers 10 (see FIG. 8), such as filled silicone resin layer 32 (see FIG. 8), silicone adhesive adhesive layer 40 (see FIG. 8), and optionally film layer 60 (see FIG. FIG. 8) may be compressed together using the vacuum bag treatment 98a (see FIG. 8) or other suitable processing techniques.

[00103] During one exemplary thermal tape treatment 98, a filled silicone resin layer 32 (see FIG. 8) may be applied, such as by spraying, to the first release material layer 46a (see FIG. 8). The silicone adhesive layer 40 (see FIG. 8) having the second release material layer 46b (see FIG. 8) applied to the silicone adhesive layer 40 can then be applied over the filled silicone resin layer 32 (see FIG. eight). The filled silicone resin layer 32 with the first release layer 46a and the silicone adhesive layer 40 with the second release layer 46b can then be vacuum sealed by vacuum bagging 98a or other suitable sealing process to compress the filled silicone layer 32 together. resin and a layer 40 silicone adhesive adhesive. When the thermal control tape 10 is finished and ready to be applied to one or more surfaces 54 (see FIG. 8) of the structure 52 (see FIG. 8), the second layer 46b of the release material can be removed from the silicone adhesive layer 40 and the layer 40 silicone adhesive applied to the surface 54 and the first layer 46a release material can be removed from the layer 32 filled with silicone resin.

[00104] With reference to FIG. 9 is an illustration of an exemplary flowchart showing a method 100 of using thermal tape 10 (see FIGS. 2A-5D) to provide temperature control 11 (see FIG. 8) of structure 52 (see FIGS. 2C, 3C, 4C, 5C, 8), such as the spacecraft structure 52a (see FIGS. 2C, 3C, 4C, 5C, 8) to which the thermal control tape 10 (see FIGS. 2A-5D) is applied according to an embodiment of the disclosure. . As shown in FIG. 9, method 100 includes the step 102 of assembling a thermal tape system 30 (see FIG. 8). Thermal control tape system 30 (see FIG. 8) includes thermal control tape 10 (see FIGS. 2A-3D, 8) as detailed above.

[00105] As detailed above, the temperature control tape 10 (see FIGS. 2A-5D) comprises a filled silicone resin layer 32 (see FIGS. 2A-5D) having a first side 38a (see FIG. 2A) and a second side 38b (see FIG. 2A). The filled silicone resin layer 32 (see FIGS. 2A-5D) contains silicone resin 34 (see FIGS. 2A-5D) filled with white inorganic filler 36 (see FIGS. 2A-5D). Thermal control tape 10 (see FIG. 2A-5D) contains a layer 40 of organosilicon adhesive adhesive (see FIG. 2A-5D) having a first side 44a (see FIG. 2A) and a second side 44b (see FIG. 2A) . The first side 44a of the silicone adhesive layer 40 is attached to the second side 28b of the filled silicone resin layer 32 .

[00106] As detailed above, the thermal tape system 30 (see FIGS. 2A, 3A, 4A, 5A) also includes a first layer 46a of release material (see FIGS. 2A, 3A, 4A, 5A) attached with the possibility of removing to the first side 38a layer 32 filled with organosilicon resin. The thermal tape system 30 (see FIGS. 2A, 3A, 4A, 5A) also includes a second layer 46b of release material (see FIGS. 2A, 3A, 4A, 5A) removably attached to the second side 44b of layer 40 silicone adhesive.

[00107] Step 102 (see FIG. 9) of assembling the thermal tape system 30 (see FIG. 3A, 5A) may also include adding silicone adhesive layer 40 (see FIG. 3A, 5A) of thermal tape 10 (see FIG. 3A, 5A), electrostatic dissipative filler 58 (see FIG. 3A, 5A), containing one of the metal filler 58a (see FIG. 8), carbon filler 58b (see FIG. 8) or other suitable filler 58 that dissipates electrostatic charge.

[00108] Step 102 (see FIG. 9) of assembling the thermal tape system 30 (see FIGS. 4A-5D) may also include, if necessary, adding a film layer 60 (see FIG. 4A-5D) between the filled layer 32 silicone resin (see FIGS. 4A-5D) and a layer 40 of silicone adhesive adhesive (see FIGS. 4A-5D). As disclosed above, the film layer 60 may include a non-conductive film layer 60a (see FIGS. 4A-4D) or may include a conductive film layer 60b (see FIG. 5A-5D).

[00109] Step 102 (see FIG. 9) of assembling the thermal tape system 30 (see FIGS. 2A-5D) may also include forming a white inorganic filler 36 (see FIG. 2A-5D) of a filled silicone resin layer 32 (see FIGS. 2A-5D) of a temperature control tape 10 (see FIGS. 2A-5D) containing doped zinc oxide pigment particles 36a (see FIG. 8) formed from zinc oxide pigment particles 37 (see FIG. 8 ), doped with an alloying element 39 (see FIG. 8). As shown in FIG. 8, alloying element 39 may be aluminum 39a, gallium 39b, indium 39c, boron 39d, zinc 39e, tin 39f, hydrogen 39g, or other suitable alloying element 39.

[00110] As shown in FIG. 9, method 100 also includes a step 104 of preparing at least one surface 54 (see FIGS. 2C, 3C, 4C, 5C, 8) of structure 52 (see FIGS. 2C, 3C, 4C, 5C, 8), such as spacecraft structure 52a (see FIG. 8) to provide at least one prepared surface 54a (see FIG. 8) for applying thermal control tape 10 (see FIGS. 2C, 3C, 4C, 5C, 8).

[00111] As shown in FIG. 9, the method 100 also includes the step 106 of removing the second layer 46b of the release material (see FIGS. 2A, 3A, 4A, 5A) from the second side 44b (see FIGS. 2A, 3A, 4A, 5A) of the silicone adhesive layer 40 ( see FIGS 2A, 3A, 4A, 5A).

[00112] As shown in FIG. 9, the method 100 also includes the step of applying the second side 44b (see FIGS. 2A, 3A, 4A, 5A) of the silicone adhesive adhesive layer 40 (see FIGS. 2A, 3A, 4A, 5A) to said at least one prepared surface 54a (see FIG. 8) of spacecraft structure 52a (see FIG. 8).

[00113] As shown in FIG. 9, the method 100 also includes the step 110 of removing the first layer 46a of the release material (see FIGS. 2A, 3A, 4A, 5A) from the first side 38a (see FIGS. 2A, 3A, 4A, 5A) of the filled silicone resin layer 32 ( see FIGS 2A, 3A, 4A, 5A).

[00114] The method 100 may be partially or completely implemented on a manual basis or on an automated basis. If the method 100 (see FIG. 9) is implemented on an automated basis, at least step 104 of preparing said at least one surface 54 (see FIG. 1, 2C, 3C, 4C, 5C), step 106 of removing the second layer 46b release material (see FIG. 2A, 3A, 4A, 5A), step 108 of applying the second side 44b (see FIG. 2A, 3A, 4A, 5A) layer 40 silicone adhesive adhesive (see FIG. 2A, 3A, 4A , 5A) and the step 110 of removing the first layer 46a of the release material is preferably performed using a robotic assembly 96 (see FIG. 8).

[00115] FIG. 10 is a flowchart illustration of an exemplary method 200 for manufacturing and maintaining a spacecraft. FIG. 11 is an illustration of an exemplary block diagram of spacecraft 216. Referring to FIG. 10-11, embodiments of the disclosure may be described in the context of a spacecraft manufacturing and maintenance method 200 as shown in FIG. 10 and spacecraft 216 as shown in FIG. eleven.

[00116] During pre-manufacturing, an exemplary spacecraft fabrication and maintenance method 200 may include specification and design 202 of spacecraft 216 and procurement 204. During manufacturing, components and assemblies are fabricated 206 and systems are integrated 208 spacecraft 216. Thereafter, spacecraft 216 may go through certification and delivery 210 for commissioning 212. During customer operation 212, spacecraft 216 may be subject to routine maintenance and repair 214 (which may also include upgrades, reconfigurations, refurbishments, and other maintenance).

[00117] Each of the processes of the spacecraft fabrication and maintenance method 200 may be performed or performed by a system integrator, a third party, and/or an operator (eg, a customer). For the purposes of this disclosure, a system integrator may include, but is not limited to, any number of spacecraft manufacturers and major system subcontractors. The third party may include, but is not limited to, any number of vendors, subcontractors and suppliers. An operator may include an aerospace company, a leasing company, a military organization, a service organization, and other suitable operators.

[00118] As shown in FIG. 11, a spacecraft 216 obtained by the exemplary spacecraft fabrication and maintenance method 200 may include a body 218 with a plurality of systems 220 and an interior 222. Examples of a plurality of systems 220 may include one or more of a propulsion system 224 and electrical system 226. Any number of other systems may be included. Although an example from the aerospace industry is shown, the principles of the disclosure may be applied to other industries such as the automotive industry.

[00119] The methods and systems embodied herein may be used during any one or more steps of the method 200 for manufacturing and maintaining a spacecraft. For example, components or subassemblies corresponding to component and subassembly fabrication 206 may be manufactured or obtained in a manner similar to the components or subassemblies being produced when spacecraft 216 is in service 212. In addition, one or more device embodiments, embodiments method, or a combination thereof, may be used during component and subassembly fabrication 206 and system integration 208, for example, to significantly speed up assembly or reduce spacecraft 216 cost. be used when the spacecraft 216 is in service 212, for example and without limitation, for routine maintenance and repairs 214.

[00120] Disclosed Embodiments of Thermal Tape 10 (See FIGS. 2A-5D, 8), Thermal Tape System 30 (See FIGS. 2A-2B, 3A-3B, 4A-4B, 5A-5B, 8) and method 100 (see FIG. 9) provide a novel solution for obtaining a thermostatic surface 54b (see FIG. 8) that radiates heat 66 (see FIG. 8) from spacecraft 12 (see FIG. 8), by means of using a heat radiant tape 86a (see FIG. 8) containing a filled silicone resin layer 32 (see FIG. 8) and a silicone adhesive layer 40 (see FIG. 8) instead of covering structures such as heatsinks and other components, only with thermal paint. All processes associated with painting, including temporary protective coating, priming, painting, temporary protective coating removal and cleaning, are eliminated and replaced with thermal control and heat radiant tape 86a, made with the possibility of peeling and sticking (see FIG. 8). Moreover, as these painting processes are eliminated, the need for painting venues such as the spray booth is also eliminated, the need for qualified and certified painters is eliminated, the environmental impact and safety concerns of painting are eliminated, and the lead time is eliminated. in 7-14 days for curing and reduce overall processing and cycle time. Thus, the simplicity of the thermostatic tape 10 (see FIGS. 2A-5D, 8), the thermal tape system 30 (see FIGS. 2A-2B, 3A-3B, 4A-4B, 5A-5B, 8) and the method 100 (see FIG. 9) reduces costs and cycle times by eliminating painting operations and providing paint replacement while being economical and practical.

[00121] In addition, the thermal control layer 64 (see FIG. 8) can be applied at the end of the spacecraft/hardware integration step or during final spacecraft integration, as opposed to being painted early due to the painting process itself, which may increase the risk of scratching or damaging the white thermal control layer during processing. Moreover, there is no need to transfer hardware or sensitive electronic equipment to the painting site. Thus, the thermal tape 10 (see FIGS. 2A-5D, 8), the thermal tape system 30 (see FIGS. 2A-2B, 3A-3B, 4A-4B, 5A-5B, 8), and the method 100 (see FIG. 9) provide faster hardware integration due to the integration point when applying the white self-adhesive material (eg, no need to transfer to the painting site).

[00122] In addition, the disclosed embodiments of the thermostatic tape 10 (see FIGS. 2A-5D, 8), the thermal tape system 30 (see FIGS. 2A-2B, 3A-3B, 4A-4B, 5A-5B , 8) and method 100 (see FIG. 9) provide optimized optical properties 68 (see FIG. 8), such as low solar absorption coefficient 71 (see FIG. 8) and high thermal emissivity 84 (see Fig. 8). Compared to known thermal control tapes such as known silver and aluminum foil tapes, the thermal emissivity 84 of the thermal control tape 10 disclosed herein is much higher and the reflection is a desirable diffuse reflection rather than an unwanted specular reflection. In addition, the disclosed embodiments of thermal control tape 10 (see FIGS. 2A-5D, 8) provide a thermal control layer 64 (see FIG. 8) having a uniform thickness 88 (see FIG. 8) and uniform coverage without changing thickness or coating layer 32 filled with silicone resin (see FIG. 2A-5D) and, in turn, temperature control tape 10 (see FIG. 2A-5D). Moreover, the disclosed embodiments of thermal control tape 10 (see FIGS. 2A-5D) with diffuse reflection provide electrostatic charge dissipation, simplicity and ease of redecoration, if it is necessary to reapply or fix part of the thermal control tape 10, save seven (7) days or more to cure, provide improved adhesion over a wide temperature range, provide the ability to maintain adhesion to a substrate in harsh space environments (i.e., large temperature changes and radiation exposure), and provide survival in the event of radiation damage.

In addition, the disclosure of the invention contains embodiments according to the following paragraphs:

Item 1. Thermal control tape for providing temperature control of the spacecraft structure, on which the thermal control tape is applied, containing:

a filled silicone resin layer having a first side and a second side and containing a silicone resin filled with a white inorganic filler; and

a silicone adhesive layer having a first side and a second side, wherein the first side of the silicone adhesive layer is attached to the second side of the filled silicone resin layer,

moreover, the layer of filled silicone resin and the layer of silicone adhesive glue form a thermal control tape, while the second side of the layer of silicone adhesive adhesive is made with the possibility of attaching to at least one surface of the specified structure of the spacecraft with the provision of temperature control of the specified structure of the spacecraft by radiation of heat from the specified structure spacecraft.

Claim 2. The thermal control tape of Claim 1, also comprising a first layer of release material removably attached to the first side of the filled silicone resin layer and a second layer of release material removably attached to the second side of the silicone adhesive layer.

Claim 3. The thermal control tape of Claim 1, also comprising a film layer added between the filled silicone resin layer and the silicone adhesive adhesive layer.

Claim 4. The thermal control tape as claimed in claim 3, wherein the film layer comprises a conductive film layer.

Item 5. The thermal control tape of item 3, wherein the film layer comprises a non-conductive film layer.

Claim 6. The temperature control tape of claim 1, wherein the white inorganic filler comprises doped zinc oxide pigment particles formed from zinc oxide pigment particles doped with an alloying element including one of aluminium, gallium, indium, boron, zinc, tin and hydrogen.

Item 7. The thermal control tape of item 1, wherein the layer of silicone adhesive adhesive also contains an electrostatic dissipative filler comprising one of a metal filler and a carbon filler.

Item 8. The thermal control tape according to item 1, wherein the thermal control tape has a solar absorption coefficient in the range of 0.16 to 0.30.

Claim 9. The thermal control tape according to claim 1, wherein the thermal control tape has a thermal emissivity in the range of 0.88 to 0.96.

Claim 10 The thermal control tape as claimed in Claim 1, wherein the filled silicone resin layer has a plurality of perforations.

Item 11. Thermal control tape for providing temperature control of the spacecraft structure, comprising:

a layer of filled silicone resin having a first side and a second side and containing a silicone resin filled with a white inorganic filler, while the silicone resin and the white inorganic filler are present in a ratio of 1:3 mass parts to 1:4 mass parts, and the white inorganic filler contains zinc oxide pigment particles doped with an alloying element containing one of aluminium, gallium, indium, boron, zinc, tin and hydrogen to form doped zinc oxide pigment particles; and

a silicone adhesive layer having a first side and a second side, wherein the first side of the silicone adhesive adhesive layer is attached to the second side of the filled silicone resin layer, and the second side of the silicone adhesive adhesive layer is configured to be attached to said at least one surface of the spacecraft structure with providing control of the temperature of the structure of the spacecraft by radiation of heat from the specified structure of the spacecraft.

Item 12. The temperature control tape of item 11, also comprising a first layer of release material removably affixed to the first side of the filled silicone resin layer and a second layer of release material removably attached to the second side of the silicone adhesive layer.

Claim 13. The thermal control tape of claim 11, wherein the silicone adhesive adhesive layer also contains an electrostatic dissipative filler comprising one of a metal filler and a carbon filler.

Item 14. The temperature control tape of item 12, also comprising a film layer bonded between the filled silicone resin layer and the silicone adhesive adhesive layer, the film layer comprising a conductive film layer comprising one of an electrically conductive polyimide film and an electrically conductive carbon-filled polyimide film.

Claim 15. The temperature control tape of Claim 11, also comprising a film layer bonded between the filled silicone resin layer and the silicone adhesive adhesive layer, the film layer comprising a non-conductive film layer containing an electrically insulating polyimide film.

Item 16. A method of using a thermal control tape to provide temperature control for a spacecraft structure on which a thermal control tape is applied, including the steps:

assembling a system based on a thermal control tape containing:

thermoregulating tape containing:

a filled silicone resin layer having a first side and a second side and containing a silicone resin filled with a white inorganic filler; and

a silicone adhesive layer having a first side and a second side, the first side of the silicone adhesive layer being attached to the second side of the filled silicone resin layer;

a first layer of release material removably attached to a first side of the filled silicone resin layer; and

a second layer of release material removably affixed to a second side of the silicone adhesive layer;

preparing at least one surface of the spacecraft structure to obtain at least one prepared surface for applying a thermal control tape;

removing the second layer of release material from the second side of the silicone adhesive layer;

applying the second side of a layer of organosilicon adhesive adhesive to said at least one prepared surface of the spacecraft structure and

removing the first layer of release material from the first side of the filled silicone resin layer.

Item 17. The method of item 16, wherein assembling the thermal tape system also includes adding an electrostatic dissipative filler comprising one of a metal filler and a carbon filler to the silicone adhesive layer of the thermal control tape.

Claim 18. The method of Claim 17, wherein assembling the thermal tape system also includes adding a film layer between the filled silicone resin layer and the silicone adhesive adhesive layer, the film layer comprising a conductive film layer.

Item 19. The method of item 16, wherein assembling the thermal tape system also includes adding a film layer between the filled silicone resin layer and the silicone adhesive adhesive layer, the film layer comprising a non-conductive film layer.

Item 20. The method of item 16, wherein at least preparing said at least one surface, removing the second layer of release material, applying the second side of the silicone adhesive adhesive layer, and removing the first layer of release material are performed using a robotic assembly.

Many modifications and other embodiments of the disclosure will be apparent to those skilled in the art to which this disclosure pertains, taking advantage of the ideas presented in the above descriptions and associated drawings. The embodiments described herein are intended to be illustrative and are not intended to be limiting or exhaustive. While specific terms are used in this document, they are used in a general and descriptive sense only, and not for purposes of limitation.

Claims (35)

1. Thermal control tape (10) to ensure temperature control of the structure (52a) of the spacecraft, on which the thermal control tape is applied, containing a filled silicone resin layer (32) having a first side (38a) and a second side (38b) and containing a silicone resin (34) filled with a white inorganic filler (36), and a silicone adhesive layer (40) having a first side (44a) and a second side (44b), wherein the first side of the silicone adhesive layer is attached to the second side of the filled silicone resin layer, wherein the layer of filled organosilicon resin and the layer of organosilicon sticky glue form a thermal control tape, wherein the second side of the layer of organosilicon sticky glue is adapted to be attached to at least one surface (54) of said spacecraft structure (12) to control the temperature of said spacecraft structure by radiating heat from said spacecraft structure. 2. Thermal control tape (10) according to claim 1, further comprising a first layer (46a) of release material attached with the possibility of removal to the first side (38a) of the layer (32) filled with silicone resin, and the second layer (46b) of release material attached with the possibility of removal to the second side (44b) layer (40) silicone adhesive adhesive. 3. Thermal control tape (10) according to claim 1, further comprising a film layer (60) added between the filled silicone resin layer (32) and the silicone adhesive adhesive layer (40). 4. Thermal control tape (10) according to claim 3, wherein the film layer (60) comprises a conductive film layer (60b). 5. Thermal control tape (10) according to claim 3, wherein the film layer (60) comprises a non-conductive film layer (60a). 6. Thermal control tape (10) according to claim 1, wherein the white inorganic filler (36) contains doped zinc oxide pigment particles (36a) formed from zinc oxide pigment particles (37) doped with an alloying element (39) comprising one of elements: aluminum, gallium, indium, boron, zinc, tin and hydrogen. 7. Thermal control tape (10) according to claim 1, in which the layer (40) of organosilicon adhesive adhesive additionally contains a filler (58) that dissipates an electrostatic charge, containing one of the fillers: metal (58a) or carbon (58b). 8. Thermal control tape (10) according to claim 1, having a coefficient (71) of absorption of solar radiation in the range from 0.16 to 0.30. 9. Thermal control tape (10) according to claim 1, having a thermal radiation coefficient (84) in the range from 0.88 to 0.96. 10. Thermal control tape (10) according to claim 1, in which the filled silicone resin layer (32) has a plurality of perforations (56). 11. Thermal control tape (10) to ensure temperature control of the structure (52a) of the spacecraft, containing a layer (32) filled with silicone resin having a first side (38a) and a second side (38b) and containing a silicone resin (34) filled with a white inorganic filler (36), while the silicone resin and the white inorganic filler are present in a ratio of 1: 3 mass parts to 1:4 mass parts, and the white inorganic filler contains pigment particles (37) of zinc oxide doped with an alloying element (39) containing one of the elements: aluminum, gallium, indium, boron, zinc, tin and hydrogen, with the formation of pigment particles (36a) doped zinc oxide, and a layer (40) of silicone adhesive adhesive having a first side (44a) and a second side (44b), wherein the first side of the layer of silicone adhesive adhesive is attached to the second side of the layer of filled silicone resin, and the second side of the layer of silicone adhesive adhesive is configured to be attached to the specified at least one surface (54) of spacecraft structure (52a) to control the temperature of said spacecraft structure by heat radiation from said spacecraft structure. 12. Thermal control tape (10) according to claim 11, further comprising a first layer (46a) of release material attached with the possibility of removal to the first side (38a) of the layer (32) filled with silicone resin, and the second layer (46b) of release material attached with the possibility of removal to the second side (38b) layer (40) silicone adhesive adhesive. 13. Thermal control tape (10) according to claim 11, in which the layer (40) of organosilicon adhesive adhesive additionally contains a filler (53) that dissipates an electrostatic charge, containing one of the fillers: metal (58a) or carbon (58b). 14. Thermal control tape (10) according to claim 12, further comprising a film layer (60) attached between a layer (32) of filled silicone resin and a layer (40) of silicone adhesive adhesive, and the film layer contains a conductive film layer (60b) containing one of the electrically conductive films: polyimide (60d) or carbon-filled polyimide (60e). 15. Thermal control tape (10) according to claim 11, further comprising a film layer (60) attached between a layer (32) of filled silicone resin and a layer (40) of silicone adhesive adhesive, and the film layer contains a non-conductive film layer (60a) containing electrical insulating polyimide film (60s). 16. A method (100) for using a thermal control tape (10) to provide temperature control for a spacecraft structure (52a) on which the thermal control tape is applied, comprising the steps: - assembly (102) of the system (30) based on a thermoregulating tape containing thermal control tape, including a filled silicone resin layer (32) having a first side (38a) and a second side (38b) and containing a silicone resin (34) filled with a white inorganic filler (36), and a silicone adhesive layer (40) having a first side (44a) and a second side (44b), the first side of the silicone adhesive layer being attached to the second side of the filled silicone resin layer; a first layer (46a) of release material removably attached to the first side of the filled silicone resin layer, and a second layer (46b) of release material removably attached to a second side of the silicone adhesive layer; - preparation (104) of at least one surface (54) of the structure (52a) of the spacecraft to obtain at least one prepared surface (54a) for applying a thermal control tape; removing (106) the second layer of release material from the second side of the silicone adhesive layer; - applying (108) the second side of a layer of organosilicon adhesive adhesive to said at least one prepared surface of the spacecraft structure, and - removing (110) the first layer of release material from the first side of the filled silicone resin layer. 17. The method (100) according to claim 16, according to which the assembly (102) of the system (30) based on the thermal control tape further comprises adding to the layer (40) of silicone adhesive adhesive of the thermal control tape (10) a filler (58) that dissipates an electrostatic charge, containing one of the fillers: metal (58a) or carbon (58b). 18. The method (100) according to claim 17, according to which the assembly (102) of the system (30) based on thermal control tape further includes adding a film layer (60) between the layer (32) filled with silicone resin and the layer (40) silicone adhesive adhesive, wherein the film layer comprises a conductive film layer (60b). 19. The method (100) according to claim 16, wherein the assembly (102) of the thermal tape system (30) further comprises adding a film layer (60) between the filled silicone resin layer (32) and the silicone adhesive adhesive layer (40), wherein the film layer comprises a non-conductive film layer (60a). 20. The method (100) according to claim 16, according to which at least the preparation (104) of the specified at least one surface (54), the removal of the second layer (46b) of the anti-adhesive material, the application of the second side (44b) of the layer (40) of organosilicon sticky adhesive and removal of the first layer of release material (46a) is performed using a robotic node (96).

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