RU2744994C1 - Беспроводное межплатное соединение для высокоскоростной передачи данных - Google Patents

Беспроводное межплатное соединение для высокоскоростной передачи данных Download PDF

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Publication number
RU2744994C1
RU2744994C1 RU2020134900A RU2020134900A RU2744994C1 RU 2744994 C1 RU2744994 C1 RU 2744994C1 RU 2020134900 A RU2020134900 A RU 2020134900A RU 2020134900 A RU2020134900 A RU 2020134900A RU 2744994 C1 RU2744994 C1 RU 2744994C1
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RU
Russia
Prior art keywords
printed circuit
ebg
circuit board
waveguide
antennas
Prior art date
Application number
RU2020134900A
Other languages
English (en)
Russian (ru)
Inventor
Антон Сергеевич Лукьянов
Михаил Николаевич Макурин
Original Assignee
Самсунг Электроникс Ко., Лтд.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Самсунг Электроникс Ко., Лтд. filed Critical Самсунг Электроникс Ко., Лтд.
Priority to RU2020134900A priority Critical patent/RU2744994C1/ru
Priority to KR1020210028200A priority patent/KR20220054156A/ko
Application granted granted Critical
Publication of RU2744994C1 publication Critical patent/RU2744994C1/ru
Priority to US17/235,278 priority patent/US11870507B2/en
Priority to PCT/KR2021/004916 priority patent/WO2022085881A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0236—Electromagnetic band-gap structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/12—Coupling devices having more than two ports
    • H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/16—Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole
    • H01Q9/28—Conical, cylindrical, cage, strip, gauze, or like elements having an extended radiating surface; Elements comprising two conical surfaces having collinear axes and adjacent apices and fed by two-conductor transmission lines
    • H01Q9/285—Planar dipole
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
RU2020134900A 2020-10-23 2020-10-23 Беспроводное межплатное соединение для высокоскоростной передачи данных RU2744994C1 (ru)

Priority Applications (4)

Application Number Priority Date Filing Date Title
RU2020134900A RU2744994C1 (ru) 2020-10-23 2020-10-23 Беспроводное межплатное соединение для высокоскоростной передачи данных
KR1020210028200A KR20220054156A (ko) 2020-10-23 2021-03-03 고속 무선 데이터 송신을 위한 무선 기판 대 기판 상호 연결
US17/235,278 US11870507B2 (en) 2020-10-23 2021-04-20 Wireless board-to-board interconnect for high-rate wireless data transmission
PCT/KR2021/004916 WO2022085881A1 (en) 2020-10-23 2021-04-20 Wireless board-to-board interconnect for high-rate wireless data transmission

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
RU2020134900A RU2744994C1 (ru) 2020-10-23 2020-10-23 Беспроводное межплатное соединение для высокоскоростной передачи данных

Publications (1)

Publication Number Publication Date
RU2744994C1 true RU2744994C1 (ru) 2021-03-18

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
RU2020134900A RU2744994C1 (ru) 2020-10-23 2020-10-23 Беспроводное межплатное соединение для высокоскоростной передачи данных

Country Status (2)

Country Link
KR (1) KR20220054156A (ko)
RU (1) RU2744994C1 (ko)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180108964A1 (en) * 2016-10-17 2018-04-19 The Regents Of The University Of California Integrated antennas and phased arrays with mode-free electromagnetic bandgap materials
WO2018209422A1 (en) * 2017-05-15 2018-11-22 Valorbec Societe En Commandite Contactless air-filled substrate integrated waveguide devices and methods
RU2696676C1 (ru) * 2018-12-06 2019-08-05 Самсунг Электроникс Ко., Лтд. Гребневый волновод без боковых стенок на базе печатной платы и содержащая его многослойная антенная решетка
RU2703604C1 (ru) * 2016-02-12 2019-10-21 Телефонактиеболагет Лм Эрикссон (Пабл) Переходное устройство, содержащее бесконтактный переход или соединение между siw и волноводом или антенной

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2703604C1 (ru) * 2016-02-12 2019-10-21 Телефонактиеболагет Лм Эрикссон (Пабл) Переходное устройство, содержащее бесконтактный переход или соединение между siw и волноводом или антенной
US20180108964A1 (en) * 2016-10-17 2018-04-19 The Regents Of The University Of California Integrated antennas and phased arrays with mode-free electromagnetic bandgap materials
WO2018209422A1 (en) * 2017-05-15 2018-11-22 Valorbec Societe En Commandite Contactless air-filled substrate integrated waveguide devices and methods
RU2696676C1 (ru) * 2018-12-06 2019-08-05 Самсунг Электроникс Ко., Лтд. Гребневый волновод без боковых стенок на базе печатной платы и содержащая его многослойная антенная решетка

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
FREDERIC PARMENT, High performance multilayer Substrate Integrated Waveguide (SIW) technics for low-cost millimeter-wave circuits, Optics/Photonic, Universite Grenoble Alpes, 2016. *
NHU-HUAN NGUYEN et al., Dielectric Slab Air-Filled Substrate Integrated. Waveguide (SAFSIW) Bandpass Filters, IEEE Microwave and Wireless Components Letters, vol.30, NO.4, April 2020. *

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KR20220054156A (ko) 2022-05-02

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