RU2731460C1 - Mosaic photodetector with limiting efficiency of image conversion: structures and methods of its manufacturing (versions) - Google Patents

Abstract

FIELD: electronics.

SUBSTANCE: invention relates to optoelectronics, nano- and microelectronics and can be used to create ultrahigh-dimensional mosaic photodetectors (MPD), including multispectral ones. In MPD of ultrahigh dimension with limiting efficiency of image conversion consisting of matrix n×m uncased photodetector submodules, to reduce the number of lost elements in the "blind zone", ensure compact design and expand field of use, uncased submodules are made with provision of minimum damage areas on jointed edges of crystals of submodules, submodules are arranged on a single carrier plate with minimum gaps or without gaps. Versions of jointing area of adjacent submodules and MPD in general are proposed. In method for manufacturing of ultrahigh-dimensional MPD with limiting efficiency of image conversion to increase accuracy of submodules positioning, improving manufacturability of the manufacturing method and reducing MPD prime cost additional precision formation of jointed edges of crystals of submodules with provision of minimum (5–8 mcm) damage areas is performed in a certain way, installation of submodules on a single carrier plate with holes is performed by means of vacuum grippers and micromanipulators with minimum gaps (≤2 mcm) or without gaps.

EFFECT: disclosed are versions of methods for creating MPD of ultrahigh dimension with limiting efficiency of image conversion; obtained results can be used when creating mosaic emitters consisting of a given combination of submodules-emitters of different ranges.

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Description

TECHNICAL FIELD OF THE INVENTION

The invention relates to optoelectronics, nano- and microelectronics and can be used to create multispectral mosaic photodetectors (MPDs) of ultra-high dimension (wide-format, panoramic, etc.), consisting of a given combination of hybrid or monolithic photodetector submodules, for example, from uncooled matrix microbolometric receivers (MMBP) radiation of both infrared (IR) and terahertz (THz) ranges. The invention can also be used to create multi-color mosaic emitters of ultra-high dimensions (wide-format, panoramic, etc.), consisting of a given combination of submodules of multi-element semiconductor and optoelectronic emitters.

Mosaic receivers / emitters can be used to register or monitor huge information arrays, the so-called big data, as well as to implement distributed technologies for processing and analyzing large information databases, multidimensional signals and ultra-high format images in ultraviolet (UV), visible, IR, THz and other areas of the spectrum, as well as for the registration of images and particles in a wide range of energies with high spatial, temporal and amplitude resolution and the possibility of using it for C - tau factories.

LEVEL OF TECHNOLOGY

MOSAIC PRINCIPLE OF CREATING MFP

The need to increase the range and spatial resolution of thermal imaging systems stimulates the creation of ultra-high-dimensional photodetectors for the corresponding spectral ranges. However, a direct increase in the number of photosensitive elements (PSE) in a photodetector leads to a significant increase in the area of chips of integrated circuits (ICs) for reading photo signals, the so-called silicon multiplexers (CM), and PSE matrix. It is known that with an increase in the area of crystals, the yield of suitable products decreases, which directly determines the high cost of devices.

форматов. МФП создают различными способами прецизионной технологии микросборки стык в стык друг к другу кристаллов фотоприемных субмодулей, приемлемого для изготовления формата. В МФП субмодули могут работать параллельно, обеспечивая тем самым высокую скорость считывания кадров объединенного изображения сверхвысокой размерности при стандартной для субмодулей частоте считывания. Именно этим определяется актуальность мозаичной технологии применительно к неохлаждаемым матричным микроболометричеким приемникам (ММБП) излучения ИК и ТГц диапазонов.Mosaic technology is one of the breakthrough technical solutions to the problem of a dramatic increase in the formats of photodetectors, in particular, with large linear dimensions of the PSE, for example, based on a cadmium-mercury-tellurium (MCT) compound or multilayer structures with quantum wells (LQW). Ultra-high-dimensional MFPs (Full HD, Ultra HD) have a significant, expanding, industrial scope of application in advanced IT industries. MFPs are made with combined PSE matrices and much

formats. MFPs are created by various methods of precision technology of micro-assembly, butt-to-joint, of crystals of photodetector submodules, suitable for the manufacture of the format. In the MFP, the submodules can operate in parallel, thus providing a high read rate of frames of the combined ultra-high-dimensional image at the standard read rate for submodules. This is what determines the relevance of mosaic technology as applied to uncooled array microbolometric detectors (MMBD) of IR and THz radiation.

THE MAIN PROBLEM OF THE MFP

The main problem with MFP is the presence of "blind spots". "Blind spots" are the structural and technological areas of the focal surface of the MFP, located along the lines of joining of adjacent crystals of submodules, in which it is impossible to create a PSE by conventional methods. The focal surface of the MFP is the surface of the location of the PSE matrices of submodules, incl. it can also be the focal plane. The optical system focuses the image on the matrix elements of all submodules at the same time. When projecting the input image - a stream of IR or THz radiation - onto the combined MFP matrix, part of the image is lost in the "blind zones". The use of MFP is limited by the size of the "blind zones" between the edge PSEs of adjacent submodules. Reducing the number of elements lost in the "blind spots" of the MFP, increases the efficiency of image conversion in the MFP and the amount of input data for the video processor of the read signals, as a result, increases the accuracy of processing and, ultimately, improves the quality of rendered images.

The problem of the presence of "blind spots" in the MFP comes to the fore at the high and ultra-high dimensions of the combined photodetector array and the small linear size of the PSE. Hence follows the relevance and practical need to reduce the "blind spots" of the MFP, including the technological part of these zones.

NUMERICAL SIMULATION OF "BLIND SPOTS" OF MFP

To quantify image loss, the term efficiency (η _eff ) of image conversion in MFP can be introduced:

η _eff = 1-ε _mfpa ,

where ε _mfpa is the inefficiency of image conversion in MFP. In the most general form, MFPs consist of 4 types of submodules. The inefficiency ε _{mfpa of} image conversion can be represented as:

ε _mfpa = N ₁ ε ₁ + N ₂ ε ₂ + N ₃ ε ₃ + N ₄ ε ₄ ,

where N ₁ - the number of crystals of submodules, butted on one side (the first type of submodules); N ₂ - the number of crystals of submodules, butted on both sides (second type); N ₃ - the number of crystals of submodules, butted on three sides (third type); N ₄ - the number of crystals of submodules, butted on four sides (fourth type); ε _j is the relative loss of input image elements in the j-th type submodule, reduced to the total number of input image elements on the combined photodetector matrix of the MFP (relative inefficiency of image conversion in the j-th type MFP submodule); ε _j = N _Lj / N _Rma , j = 1, 2, 3, 4; N _Lj is the number of input image elements lost in the submodules of the first (j = 1), second (j = 2), third (j = 3) or fourth (j = 4) types, N _Rma is the total number of input image elements focused to the integrated photodetector matrix of the MFP. There are certain peculiarities of using different types of submodules.

преобразования изображений в произвольном i-ом субмодуле МФП, состоящего из субмодулей одного формата:Theoretical inefficiency

converting images in an arbitrary i-th submodule of the MFP, consisting of submodules of the same format:

where N _Li is the number of input image elements lost in the MPP submodule, N _Ri is the total number of input image elements focused on the PSE matrix of the submodule.

The efficiency of image conversion depending on the format of the combined matrix and the pitch (L _pix ) of the PSE is presented graphically in Fig. 1 (curves 1-4). The number of elements in the "blind zones" increases linearly with an increase in the format of the photodetector array and decreases with an increase in the size of the PSE (curves 5-8). FIG. 1 shows, in particular, that with a high and ultra-high format of the photodetector matrix of the MPA and a large step of the PSE, the efficiency of image conversion in the MPA can remain high, however, the number of PSEs in the "blind zones" can reach critical values.

In simpler cases, when, for example, the MFP consists of unified submodules with the same element pitch, the image loss in the MFP can be characterized by the number of elements (N _L ) of the input image projected onto the “blind spots” of the MFP, or by the image loss coefficient equal to 1 / N _L.

The number of elements in the MFP "blind spot" can be expressed as follows:

N _L = k _x M (N / n-1) + k _y (n + k _x ) (M / m-1) (N / n-1) + k _y n (M / m-1),

where n is the number of PSEs along the "X" coordinate of the photodetector matrix of the submodule, m is the number of elements along the "Y" coordinate of the submodule matrix, L _px is the step of the PSEs along the "X" coordinate of the submodule matrix, L _py is the step of the elements along the "Y" coordinate of the matrix submodule, N is the number of PSEs along the X coordinate of the combined PDM matrix, M is the number of elements along the Y coordinate of the PDM matrix, L _bx is the distance along the X coordinate between the edge PSEs of adjacent submodules, L _by is the distance along the Y coordinate "between edge PSEs of adjacent submodules, k _x = L _bx / L _px is the number of elements along the" X "coordinate in the" blind zone "of the MFP, k _y = L _by / L _py is the number of elements along the" Y "coordinate in the" blind zone ".

The distance between the edge PSEs of adjacent submodules (the size of the "blind zone") perpendicular to the joining lines is determined by the size of the damage area of the semiconductor material arising in the process of dividing the wafers into crystals, the technological gaps between the abutting crystals and the structural area of placement of photo signal readout circuits on the crystals. The size of the "blind zone" of the MFP along the lines of joining of adjacent submodules increases with an increase in the format of the combined photodetector array and the PSE pitch. Numerical modeling of the dependencies of the number of elements in the "blind zone" on the MFP format and on the step of elements based on submodules of different formats is shown in Fig. 2-4.

The given mathematical apparatus makes it possible to estimate the number of PSEs in the "blind zones" for different initial data: the size of the "blind zone", the step (L _pix ) of the PSE, the format of the photodetector matrix of the MPP and the dimensions of the submodules.

ANALOGUES OF THE MFP DESIGN

Known MFP format 8192 × 4096 PSE, made on the basis of a matrix of 4 × 2 hybrid submodules with a format of 2048 × 2048 elements (Fig. 5) [Bortoletto F., Bonoli C., D'Alessandro M., Giro E., De Caprio V. , Corcione L., Ligori S., Morgante G. Euclid Near InfraRed Spectrograph (ENIS) Focal Plane Design // Proc. SPIE, 7731, Space Telescopes and Instrumentation 2010: Optical, Infrared, and Millimeter Wave. 77312T. August 09, 2010. doi: 10.1117 / 12.856402]. Crystals of submodules are placed in open cases. The submodule with the format 2048 × 2048 in an open package is a hybrid assembly of two crystals. The PSE matrix crystal and the CM crystal are connected to each other using indium micropillars. As part of the MFP, submodules in open housings are aligned in all coordinates using mechanical elements and fixed in a given position on the carrier.

However, this known MFP (see Fig. 5) has drawbacks: the MFP consists of submodules with crystals of PSE matrices of high dimension, high cost and one spectral range; a further increase in the dimension is possible only with an increase in the linear dimensions of the used crystals of submodules; the alignment of the submodules is carried out with the help of mechanical fastening elements, which defines large "blind zones" of 2.88 mm, which is equivalent to 160 PSEs with a pitch of 18 μm.

Known hybrid MFP based on line crystals PSE, in which the size of the "blind zone" is about ~ 46 microns; the design approaches considered here are applicable for the most part only for linear submodules [Novoselov A.R. Development of highly efficient mosaic photodetectors based on photosensitive element lines // Avtometriya. 2010. T. 46. No. 6. S. 106-115].

Known multichip photodetector device (FPU) containing hybridized crystals of matrices PSE and CM [Yakovleva NI, Boltar KO, Nikonov A. Century. Multicrystal multicolor FPU with extended spectral characteristic of quantum efficiency // Patent of Russia №2564813. 2015]. Photosensitive modules in the form of hybridized crystals of PSE and CM matrices are located on a substrate with minimum gaps between crystals of at least 10-20 microns. A block technological route of manual assembly of PDs of standard (SD) dimensions from 4 modules of 384 × 288 format, placed on a common switching substrate in a single housing, is considered.

The known process of assembling photosensitive modules in the MFP includes the following basic operations: preparing the surfaces of the modules and the switching substrate for gluing; applying vacuum glue; positioning of photosensitive modules with a clamp from above using micromanipulators and control of gaps between crystals using a microscope.

However, there is no specific development of a design and a method for manufacturing a known device for cases of high and ultra-high dimensions, when the PDU includes more than 4 submodules; the gap between the submodules is at least 10-20 microns, which is unacceptable in the case of small PSE sizes, while the image loss in the "blind zone" becomes significant, the amount of data for subsequent processing decreases, the reliability of video signal processing decreases, and the quality of the generated images deteriorates. In addition, in the manufacturing technology of the known device, the submodules are clamped from above, using micromanipulators, which is unacceptable in the case of MBMS and other monolithic photodetectors; even for hybrid micro-assemblies, the top pressure is often unacceptable.

PROTOTYPE OF MFP DESIGN

Known design model MFP format 14336 × 10240 (146800640) PSE, made on the basis of a matrix of 7 × 5 submodules, each format 2048 × 2048 elements (Fig. 6) [Sprafke T., Beletic J.W. High-Performance Infrared Focal Plane Arrays for Space Applications // Optics and Photonics News. 2008. V. 19. No. 6. P. 22-27. Figure in center of p. 27. doi: 10.1364 / OPN.19.6.000022]. This MFP is the closest technical solution and can be taken as a prototype. The submodule with the format 2048 × 2048 is a hybrid assembly of two crystals: a PSE matrix crystal and a CM crystal, which are connected to each other using indium micropillars. Crystals of submodules are placed in open cases. As part of the MFP, submodules in open housings are aligned along the coordinates "X", "Y" and "Z" using mechanical elements and fixed in a given position on the carrier plate.

However, this known MFP (see Fig. 6) has certain disadvantages: the MFP consists of submodules of the same spectral range, high dimension and high cost; the alignment of the submodules is carried out using mechanical fastening elements, which, together with the presence of open housings, determines significant "blind zones" of this known MFP.

PROTOTYPE OF MFP MANUFACTURING METHOD

A known method of manufacturing hybrid photodetectors [Klimenko AG, Nedosekina TN, Karnaeva NV, Marchishin IV, Novoselov AR, Ovsyuk VN, Esaev DE. Assembly technology of large-format infrared photodetector modules on indium micropillars // Optical journal. 2009. T. 76. No. 12. S. 63-68]. The known manufacturing method is the closest technical solution and can be taken as a prototype of a method for manufacturing MFPs of high and ultra-high dimensions (Fig. 7).

A known method of manufacturing a hybrid photodetector consists in the fact that in the manufacturing process on CM crystals topological (crystal) fiducial marks are created, clamps are made, carriers of external fiducial marks are made, external fiducial marks are made, external fiducial marks are placed on carriers of external fiducial marks, CM crystals are installed on the carrier plate, crystals of PSE matrices are oriented in the "XY" plane using flat clamps, epoxy glue is introduced between the clamps along "XY" and the supports of the clamps, the alignment of external and topological reference marks is carried out using a microscope, the orientation of the upper crystal relative to the lower one is carried out using a micromanipulator by shifting the crystal of the PSE matrices until the external reference marks coincide with the topological reference marks on the CM crystal, apply a leveler, install the aligned crystals of the CM and PSE matrices into the experimental assembly installation, increase the vertical load to a predetermined value, remove the finished hybrid photodetector from the assembly installation (see. fig. 7).

The methodological basis for the manufacture of a hybrid photodetector is partially applicable in the development and study of the basic technology for manufacturing high and ultrahigh-dimensional MFPs. However, the method of manufacturing a hybrid photodetector is directly focused only on the microassembly of two crystals: a PSE matrix and a multiplexer, which limits the format of the photodetectors being created; direct application of this method for the manufacture of high and ultrahigh-dimensional MFPs encounters unresolved issues of the formation of extremely flat crystal faces of submodules with minimal areas of damage to semiconductor materials, precision alignment and positioning of crystals during microassembly of submodules in MFP; in practice, pressing from above is a damaging effect even for hybrid submodules, and for monolithic submodules, especially for microbolometric receivers, such a technological operation is generally unacceptable due to the destructive effect on sensitive elements (SE).

PROTOTYPE OF SEMI-AUTOMATIC METHOD OF PRODUCING MFP

Known semi-automatic method for creating MFP models with a dimension of 2 × 2 submodules, which consists in the following. Four crystals of PSE matrices are sequentially transferred to the working surface of the installation using a semi-automatic micromanipulator, CM crystals are sequentially applied to the PSE matrix crystals, CM crystals and PSE matrix crystals are hybridized using indium micropillars, a substrate is installed over the CM, which ensures the strength of the hybrid microassembly as a whole (Fig. 8) [Miller T.M., Jhabvala Ch.A., Leong Ed., Costen NP, Sharp E., Adachi T., Benford DJ Enabling Large Focal Plane Arrays Through Mosaic Hybridization // Proc. of SPIE. High Energy, Optical, and Infrared Detectors for Astronomy, part V. 2012. Vol. 8453. P. 2H-1-2H-7. Fig. 5. doi: 10.1117 / 12.926491]. This known method is adopted as a prototype of a semi-automatic method for manufacturing MFP.

However, this method creates large "blind zones" and is applicable for MFPs consisting of 2x2 submodule matrices, 1x2 submodule or 2x1 submodule, the location of the contact pads on both sides of the submodule chips limits the MFP dimension.

In 2013, a basic technological block of laser scribing operations was developed and studied as part of a prototype of precision technology for microassembly of silicon crystals in MFP [Demyanenko MA, Kozlov AI, Novoselov AR, Ovsyuk V.N. About mosaic uncooled microbolometric receivers of infrared and terahertz ranges // Avtometriya. 2016.Vol. 52.No.2. S. 115-121; Demyanenko M.A., Esaev D.G., Klimenko A.G., Kozlov A.I., Marchishin I.V., Novoselov A.R., Ovsyuk V.N. Research of the technology of creating mosaic uncooled microbolometric receivers of infrared and terahertz spectral ranges with a format up to 3072 × 576 and more // Proceedings of the First Russian-Belarusian Scientific and Technical Conference "Element Base of Domestic Radio Electronics", September 11-14, 2013 Nizhny Novgorod: Scientific and technical society of radio engineering, electronics and communications. A.S. Popova, 2013.S. 30-33; Demyanenko M.A., Esaev D.G., Klimenko A.G., Kozlov A.I., Marchishin I.V., Novoselov A.R., Ovsyuk V.N. Investigation of constructive and technological ways of creating uncooled microbolometric receivers for images of infrared and terahertz spectral ranges up to 3072 × 576 and more // Abstracts of the XI Russian Conference on Semiconductor Physics "Semiconductors-2013", September 16-20, 2013 - St. Petersburg: Physico-Technical Institute named after A.F. Ioffe RAS, 2013.S. 43; Novoselov A.R. Method of reducing the gap between chips in mosaic photodetector modules // Avtometriya. 2016.Vol. 52.No. 1. S. 116-121; Demyanenko M.A., Esaev D.G., Klimenko A.G., Kozlov A.I., Marchishin I.V., Novoselov A.R., Ovsyuk V.N. Converting images in mosaic uncooled microbolometric receivers of infrared and terahertz ranges up to 3072 × 576 and more // Optical Journal. 2014. T. 81. No. 3. S. 35-43; Demyanenko M.A., Esaev D.G., Klimenko A.G., Kozlov A.I., Marchishin I.V., Novoselov A.R., Ovsyuk V.N. Development of mosaic uncooled microbolometric receivers for infrared and terahertz spectral ranges up to 3072 × 576 and more // Uspekhi prikladnoi fiziki. 2014. T. 2. No. 2. S. 123-130]. For the practical implementation of the design of the MFP, the following technological approach was applied with the microassembly of silicon crystals MMBP. Technological holes were created in the plate for vacuum fixation of crystals. The plate was placed under a microscope on a stage with a vacuum line supplied. An MBMP crystal with a minimum thickness glue layer applied to the non-planar (non-working) side was installed in a predetermined place, and then held by vacuum until the glue polymerized. After that, the next crystal MMBP was installed similarly [Demyanenko MA, Kozlov AI, Novoselov AR, Ovsyuk V.N. About mosaic uncooled microbolometric receivers of infrared and terahertz ranges // Avtometriya. 2016.Vol. 52.No.2. S. 115-121; Demyanenko M.A., Esaev D.G., Klimenko A.G., Kozlov A.I., Marchishin I.V., Novoselov A.R., Ovsyuk V.N. Research of the technology of creating mosaic uncooled microbolometric receivers of infrared and terahertz spectral ranges up to 3072 × 576 and more // Proceedings of the First Russian-Belarusian Scientific and Technical Conference "Element Base of Domestic Radio Electronics", September 11-14, 2013 Nizhny Novgorod: Scientific and technical society of radio engineering, electronics and communications. A.S. Popova, 2013.S. 30-33; Demyanenko M.A., Esaev D.G., Klimenko A.G., Kozlov A.I., Marchishin I.V., Novoselov A.R., Ovsyuk V.N. Investigation of constructive and technological ways of creating uncooled microbolometric receivers for images of infrared and terahertz spectral ranges up to 3072 × 576 and more // Abstracts of the XI Russian Conference on Semiconductor Physics "Semiconductors-2013", September 16-20, 2013 - St. Petersburg: Physico-Technical Institute named after A.F. Ioffe RAS, 2013.S. 43; Novoselov A.R. Method of reducing the gap between chips in mosaic photodetector modules // Avtometriya. 2016.Vol. 52.No. 1. S. 116-121; Demyanenko M.A., Esaev D.G., Klimenko A.G., Kozlov A.I., Marchishin I.V., Novoselov A.R., Ovsyuk V.N. Converting images in mosaic uncooled microbolometric receivers of infrared and terahertz ranges up to 3072 × 576 and more // Optical Journal. 2014. T. 81. No. 3. S. 35-43; Demyanenko M.A., Kozlov A.I., Novoselov A.R., Esaev D.G., Ovsyuk V.N. Sviluppo Principio Mosaico di Creare Panoramico con Raffreddamento Microbolometro Detector Immagine a Infrarossi e Terahertz Intervallo Spettrale // Italian Science Review. 2015. No. 7 (28). P. 11-15; Demyanenko M.A., Esaev D.G., Klimenko A.G., Kozlov A.I., Marchishin I.V., Novoselov A.R., Ovsyuk V.N. Development of mosaic uncooled microbolometric receivers for infrared and terahertz spectral ranges up to 3072 × 576 and more // Uspekhi prikladnoi fiziki. 2014. T. 2. No. 2. S. 123-130].

However, when using this technological approach to create a MFP, the total size of the technological part of the "blind zone" between the edge PSEs of adjacent crystals of submodules is about 30 microns [Demyanenko MA, Kozlov AI, Novoselov AR, Ovsyuk V.N. ... About mosaic uncooled microbolometric receivers of infrared and terahertz ranges // Avtometriya. 2016.Vol. 52.No.2. S. 115-121; Demyanenko M.A., Esaev D.G., Klimenko A.G., Kozlov A.I., Marchishin I.V., Novoselov A.R., Ovsyuk V.N. Research of the technology of creating mosaic uncooled microbolometric receivers of infrared and terahertz spectral ranges with a format up to 3072 × 576 and more // Proceedings of the First Russian-Belarusian Scientific and Technical Conference "Element Base of Domestic Radio Electronics", September 11-14, 2013 Nizhny Novgorod: Scientific and technical society of radio engineering, electronics and communications. A.S. Popova, 2013.S. 30-33; Demyanenko M.A., Esaev D.G., Klimenko A.G., Kozlov A.I., Marchishin I.V., Novoselov A.R., Ovsyuk V.N. Investigation of constructive and technological ways of creating uncooled microbolometric receivers for images of infrared and terahertz spectral ranges up to 3072 × 576 and more // Abstracts of the XI Russian Conference on Semiconductor Physics "Semiconductors-2013", September 16-20, 2013 - St. Petersburg: Physico-Technical Institute named after A.F. Ioffe RAS, 2013.S. 43; Novoselov A.R. Method of reducing the gap between chips in mosaic photodetector modules // Avtometriya. 2016.Vol. 52.No. 1. S. 116-121; Demyanenko M.A., Esaev D.G., Klimenko A.G., Kozlov A.I., Marchishin I.V., Novoselov A.R., Ovsyuk V.N. Converting images in mosaic uncooled microbolometric receivers of infrared and terahertz ranges up to 3072 × 576 and more // Optical Journal. 2014. T. 81. No. 3. S. 35-43; Demyanenko M.A., Esaev D.G., Klimenko A.G., Kozlov A.I., Marchishin I.V., Novoselov A.R., Ovsyuk V.N. Development of mosaic uncooled microbolometric receivers for infrared and terahertz spectral ranges up to 3072 × 576 and more // Uspekhi prikladnoi fiziki. 2014. T. 2. No. 2. S. 123-130; Demyanenko M.A., Kozlov A.I., Novoselov A.R., Esaev D.G., Ovsyuk V.N. Sviluppo Principio Mosaico di Creare Panoramico con Raffreddamento Microbolometro Detector Immagine a Infrarossi e Terahertz Intervallo Spettrale // Italian Science Review. 2015. No. 7 (28). P. 11-15].

DISADVANTAGES OF KNOWN CONSTRUCTIONS AND METHODS FOR MANUFACTURING MFP:

1. The main disadvantage of the known MFP designs is the presence of significant "blind spots" between the edge PSEs of adjacent submodules. The size of the technological part of the "blind zone" of the MFP is the minimum distance between the edge PSEs of adjacent submodules. The size of the technological part of the "blind zone" of the MFP is determined by the size of the areas of damage to semiconductor materials and multilayer structures, the unevenness of the abutting edges of the crystals and the gaps between the crystals of adjacent submodules. MFP manufacturers are striving to reduce the size of blind spots.

In 2003, the "blind zone" of the MFP was 7641 microns, which is equivalent to 283 PSE [Finger G., Beletic J.W. Review of the State of Infrared Detectors for Astronomy in Retrospect of the June 2002 // Proc. of SPIE. Workshop on Scientific Detectors for Astronomy. 2003. Vol. 4841. P. 839-852], in 2004 - 7128 microns or 264 PSE [Dorn RJ, Finger G., Huster G., Hans-Ulrich K., Jean-Louis L., Leander M., Manfred M. , Jean-Francois P., Armin S., Stegmeier J., Moorwood AF-M. The CRIRES InSb Megapixel Focal Plane Array Detector Mosaic // Proc. of SPIE. 2004. Vol. 5499. P. 510-517] and in 2009 - about 367 microns or 35 PSE [Scowen PA, Jansen RH, Beasley MN, Macenka SA, Shaklan SB, Calzetti D., Desch S., Fullerton AW, Gallagher JS, Malhotra S., McCaughrean MJ, Nikzad S., O'Connell RW, Oey S., Padgett DL, Rhoads JE, Roberge A., Siegmund OHW, Smith N., Stern D., Tumlinson J., Windhorst R., Woodruff RA, Spergel D., Sembach K. Design and Implementation of the Widefield High-Resolution UV / Optical Star Formation Camera for the THEIA Mission // Proc. of the 213 Conference of American Astronomical Society. January, 2009. Vol. 41. No. 1. P. 361]. In 2010, the value of the size of the "blind zone" ≥46 microns was reached [Novoselov A.R. Development of highly efficient mosaic photodetectors based on photosensitive element lines // Avtometriya. 2010. T. 46. No. 6. S. 106-115]. LSST Corporation (USA), when creating a MFP, consisting of 568 photodetectors with a format of 2048 × 2048 with a step of 10 μm, expects to reduce the size of the "blind zone" to 100 μm (10 PSE).

Since 2013, research and optimization of a prototype of the technology for creating a MFP with a total size of the technological part of the "blind zone" between the edge PSEs of adjacent MMBP crystals is about 30 microns, including areas of unevenness of the edge of the crystals and the gap between adjacent crystals about 20 microns in size [Demyanenko M.A. ., Kozlov A.I., Novoselov A.R., Ovsyuk V.N. About mosaic uncooled microbolometric receivers of infrared and terahertz ranges // Avtometriya. 2016.Vol. 52.No.2. S. 115-121; Demyanenko M.A., Esaev D.G., Klimenko A.G., Kozlov A.I., Marchishin I.V., Novoselov A.R., Ovsyuk V.N. Research of the technology of creating mosaic uncooled microbolometric receivers of infrared and terahertz spectral ranges with a format up to 3072 × 576 and more // Proceedings of the First Russian-Belarusian Scientific and Technical Conference "Element Base of Domestic Radio Electronics", September 11-14, 2013 Nizhny Novgorod: Scientific and technical society of radio engineering, electronics and communications. A.S. Popova, 2013.S. 30-33; Demyanenko M.A., Esaev D.G., Klimenko A.G., Kozlov A.I., Marchishin I.V., Novoselov A.R., Ovsyuk V.N. Investigation of constructive and technological ways of creating uncooled microbolometric receivers for images of infrared and terahertz spectral ranges up to 3072 × 576 and more // Abstracts of the XI Russian Conference on Semiconductor Physics "Semiconductors-2013", September 16-20, 2013 - St. Petersburg: Physico-Technical Institute named after A.F. Ioffe RAS, 2013.S. 43; Novoselov A.R. Method of reducing the gap between chips in mosaic photodetector modules // Avtometriya. 2016.Vol. 52.No. 1. S. 116-121; Demyanenko M.A., Esaev D.G., Klimenko A.G., Kozlov A.I., Marchishin I.V., Novoselov A.R., Ovsyuk V.N. Converting images in mosaic uncooled microbolometric receivers of infrared and terahertz ranges up to 3072 × 576 and more // Optical Journal. 2014. T. 81. No. 3. S. 35-43; Demyanenko M.A., Kozlov A.I., Novoselov A.R., Esaev D.G., Ovsyuk V.N. Sviluppo Principio Mosaico di Creare Panoramico con Raffreddamento Microbolometro Detector Immagine a Infrarossi e Terahertz Intervallo Spettrale // Italian Science Review. 2015. No. 7 (28). P. 11-15; Demyanenko M.A., Esaev D.G., Klimenko A.G., Kozlov A.I., Marchishin I.V., Novoselov A.R., Ovsyuk V.N. Development of mosaic uncooled microbolometric receivers for infrared and terahertz spectral ranges up to 3072 × 576 and more // Uspekhi prikladnoi fiziki. 2014. T. 2. No. 2. S. 123-130]. Since 2014, JSC "NPO" Orion "" intends to bring the size of the gap to a value of at least 10-20 microns [Yakovleva NI, Boltar KO, Nikonov A.The. Multicrystal multicolor FPU with extended spectral characteristic of quantum efficiency // Patent of Russia №2564813. 2015].

If the gap between crystals of adjacent submodules is 10-20 microns or more, then for the case when CM crystals are decisive, the size of the technological part of the "blind zone" of the MFP, i.e. the distance between the edge PSEs of adjacent submodules will be 21-31 μm, which corresponds to a loss of 2-3 PSEs with a step of 10 μm in each row or column (with photosensitivity correction in a video processor or CM). In the case when other semiconductor materials are decisive, for example, for heteroepitaxial HgCdTe layers on a GaAs substrate, the distance between the edge PSEs of adjacent submodules will be 27-37 μm, which corresponds to a loss in each row or column of 3-4 PSEs with the same pitch (Table .).

If the gap between the crystals of adjacent submodules is absent or is no more than 2 microns, as in the present invention, then with the precision formation of abutting edges of CM crystals with a minimum area of damage, the distance between PSEs of adjacent submodules will be 11-13 microns, which corresponds to the loss of one PSE with a step 10 µm in each row or column. In the case of other semiconductor materials, the distance between the PSEs of adjacent submodules will be 17-19 μm, which corresponds to the loss of two PSEs in each row or column (see table).

When applying in MFP technical solutions from paragraphs. 9-12 of the claims, when the "blind zones" are virtually or physically overlapped by the edge PSEs of adjacent submodules, the distance between PSEs of adjacent submodules will be 1-3 microns and will ensure the absence of loss of elements in each row or column, i.e. photo signals will be read without loss of information in each frame of the image, which corresponds to the achievement of the maximum (100%) efficiency of image conversion in MFP (see table).

The presence of a more complete volume of initial data during the subsequent processing of signals in the video processor, other things being equal, increases the reliability of processing and, ultimately, improves the quality of the rendered images.

2. In addition, linear and matrix photodetectors in open cases or on their own carrier plates are used as submodules of known analogs of MFPs. The photodetector submodules are monolithic CM crystals with additionally integrated PSE arrays, or in a hybrid version - hybrid microassemblies of two crystals: a PSE matrix crystal and a CM crystal, connected by indium micropillars. The photodetector submodules are placed in open housings, or on their own carrier plates, then the microassembly is installed on a common substrate. Due to the presence of housings, mechanical connectors, additional substrates and carriers for submodules, designs and methods of manufacturing known analogs of MFPs are based on mechanical fasteners and mechanical assembly operations, which fundamentally limits the possibilities of minimizing a significant "blind zone" of known MFPs, as well as the possibility of automating assembly processes and testing submodules in the process of manufacturing MFP.

3. Due to the large overall dimensions and significant weight, there are also restrictions on the widespread use of well-known MFPs for the breakthrough industrial development of such branches of the Russian economy as modern machine tool building and instrument making, automation and robotics, high-tech medicine of the future, geoinformation and telecommunication technologies, and the study of natural resources.

DISCLOSURE OF THE INVENTION

Purpose and proposed technical solutions.

In order to reduce the number of lost elements in the "blind zones" and to maximize the efficiency of image conversion in the MFP, the submodules are manufactured with the provision of minimal (5-8 microns) areas of damage to multilayer microstructures and semiconductor materials at the abutting edges of the crystals and are placed on a single carrier plate without gaps or with minimal (no more than 2 microns) gaps between submodules.

At the same time, in the proposed nano- and microelectronic designs of MPPs and methods of their manufacture, linear and matrix photodetecting submodules are used: in a monolithic version, frameless CM crystals with additionally integrated PSE arrays on them, in a hybrid version - frameless hybrid assemblies of two crystals: matrix crystal PSE and crystal CM.

From the following detailed description, it should be clear that other embodiments of the present invention are possible, with the various embodiments shown below by way of example. It is clear that the invention is applicable to other different implementations, and its various details may be modified in various aspects, but without departing from the spirit and scope of the present invention. Accordingly, the drawings and detailed description are substantially illustrative and not meant to be limiting. Possible embodiments of the present invention and limitations are included in the claims of the present invention.

The technical results of the invention on the design of an ultra-high-dimensional MFP with the limiting efficiency of image conversion are:

1.Achieving the ultimate efficiency of image conversion in MFP by eliminating the "blind spots" between the edge elements of adjacent submodules or reducing the number of lost elements in the "blind spot", as well as ensuring a compact design and expanding the scope;

2. increasing the probability of detecting visualized objects and improving the quality of images by creating a combined spectral characteristic of the photosensitivity of the MFP, combining the broadband and narrowband parts;

3. preservation of the given step of the PSE in the region of the submodule crystals joining and reduction (elimination) of the loss of the visualized information;

4. an increase in the collection area of the radiation flux entering the reduced edge PSEs of adjacent submodules, up to the size of the PSE collection area inside the matrix.

The technical results of the invention on the methods of manufacturing ultra-high-dimensional MFPs with the limiting efficiency of image conversion are: expanding the technological scope of the manufacturing method options, simplifying the manufacturing technology, reducing the labor intensity of manufacturing, increasing the yield, reducing the cost of MFPs, expanding the scope of the created MFPs and maximizing the efficiency converting images in MFPs by reducing the number of lost elements in the "blind zone" by achieving a minimum area of damage at the edges of the crystals, increasing the positioning accuracy of submodules, miniaturization of the MFP design and micro-assembly of submodule chips with minimal or no gaps.

The generalized technical results of the invention are:

1. Reducing the size of the "blind zone" and the number of lost elements and, consequently, increasing the efficiency of image conversion in the MFP is achieved by reducing the damage areas at the abutting edges of the crystals during scribing and dividing the instrument plates into crystals, as well as during the precision formation of abutting crystal faces of submodules, by eliminating or a fundamental reduction in the gaps between the submodules to a value of no more than 2 microns, providing a minimum distance between the edge PSEs of adjacent crystals of submodules for different limiting materials.

When using precision formation of abutting crystal faces with a minimum area of damage to the edges of CM crystals, the gap between crystals of adjacent submodules is absent or is no more than 2 μm, the distance between PSEs of adjacent submodules will be 11-13 μm, which corresponds to the loss of one PSE with a step of 10 μm in each row or column. In the case of other semiconductor materials, the distance between PSEs of adjacent submodules will be about 11-13 μm for GaAs / AlGaAs photodetectors and no more than 17-19 μm for HgCdTe photodiodes, which corresponds to the loss of two PSEs in each row or column.

2. The use of technical solutions in the MFP, in which the "blind zones" are virtually or physically covered by the photosensitivity regions of adjacent PSEs, will ensure the distance between PSEs of adjacent submodules ≤1-3 μm and the absence of element losses in each row or column, i.e. photo signals will be read without loss of information in each image frame, which corresponds to the achievement of the maximum (100%) efficiency of image conversion in MFP. A more complete volume of initial data with subsequent signal processing, all other things being equal, increases the reliability of processing and, ultimately, improves the quality of the rendered images.

3. An increase in the accuracy of alignment of submodules associated with the elimination or reduction of gaps between adjacent submodules to a value of no more than 2 microns, preservation of a given PSE pitch in the areas of junction of crystals of submodules and in most cases complete elimination of the loss of visualized information in the MFP provide the maximum efficiency of image conversion and increase MFP formats up to ultra-high dimensions, determined only by technical requirements and economic opportunities.

4. Formation of the combined spectral characteristics of the photosensitivity of the MFP, combining the broadband and narrowband parts, through the use of different crystals of submodules based on different PSEs: for example, MCT photodiodes and MSQW photodetectors of different IR spectral ranges, or microbolometers operating in the IR and THz ranges.

5. Increasing focusing accuracy due to alignment of submodules along the "Z" coordinate on the focal surface of the combined photodetector array with a height inhomogeneity value less than the permissible depth of field of the optical system, which is ensured by: sorting crystals by thickness, using a given amount of holding material and vacuum for fixation crystals of submodules, and, if necessary, limiters of crystal alignment in height. The amount of material in the retaining layers is determined by calculation and experiment.

6. Increasing the manufacturability of the method for manufacturing MFP, simplifying the manufacturing technology, reducing the complexity of manufacturing; simplification of the MFP design, reduction of weight and size characteristics; increase in the percentage of output of suitable MFPs, including due to the possibility of replacing failed submodules with obviously suitable crystals during the manufacturing process; reducing the cost and expanding the scope of the MFP.

THE ESSENCE OF THE PROPOSED SUPER-HIGH DIMENSIONAL MFP DESIGNS WITH THE ULTIMATE IMAGE CONVERSION EFFICIENCY

The technical result is achieved by eight main variants of the invention.

The technical result of the first embodiment of the invention is achieved by the fact that in an ultra-high-dimensional MFP with a limiting image conversion efficiency, consisting of a matrix of n × m photodetecting submodules, where n = 1, 2, 3, 4, 5, 6, 7, 8, ... ∞, m = 1, 2, 3, 4, 5, 6, 7, 8, ... ∞, (n ≠ m at n = 1 or at m = 1), photodetector submodules are installed butt-to-end on the carrier plate, photodetector monolithic submodules are manufactured as unpackaged monolithic photodetectors in the form of CM crystals with additionally integrated PSE arrays on them, and in a hybrid version as unpackaged hybrid microassemblies from a PSE matrix crystal and a CM crystal, if necessary, provide a gap between the rows of the n × m matrix of submodules for placing micro-loops with metal wiring and electrical connection of micro-loops with the contact pads of submodules and with the contact pads of the carrier plate,

frameless monolithic or hybrid photoreceiving submodules of the MFP are manufactured with the provision of minimal (5-8 microns) areas of damage to multilayer microstructures and semiconductor materials at the abutting edges of the crystals of submodules,

Unpackaged monolithic or hybrid photodetector submodules with minimal areas of damage to semiconductor materials at the abutting edges of the crystals are directly placed with the photodetector side up on a single carrier plate without gaps or with minimal (no more than 2 μm) gaps between adjacent crystals of submodules (Fig. 9).

The technical result of the second embodiment of the invention is achieved by the fact that in an ultra-high-dimensional MFP with a maximum image conversion efficiency (according to the first design option)

a single large CM crystal was used as the MPP carrier plate,

as submodules, crystals of PSE matrices are used, placed on a single carrier plate - a KM crystal,

the signal contact pads (pos. 36) of the CM are electrically connected to the contact pads (pos. 38) of the submodules - crystals of the PSE matrices using micropillars (Fig. 10).

The technical result of the third embodiment of the invention is achieved by the fact that in an ultra-high-dimensional MFP with an ultimate image conversion efficiency (according to the first design option)

the only large crystal of the PSE matrix is used as the MPP carrier plate,

CM crystals are used as submodules placed on a single carrier plate - a PSE matrix crystal,

while the signal and control contact pads (item 38) of the submodules - CM are electrically connected to the contact pads (item 36) of the PSE matrix crystal using micropillars (Fig. 11).

The technical result of the fourth embodiment of the invention is achieved by the fact that in an ultra-high-dimensional MFP with an ultimate image conversion efficiency (according to the first design option)

The unified principle of photo signal reading and addressing to PSE is ensured by the use of microconductors or micro loops connecting the corresponding signal and control (including address) contact pads of adjacent crystals of submodules (Fig. 12).

The technical result of the fifth embodiment of the invention is achieved by the fact that in an ultra-high-dimensional MFP with a maximum image conversion efficiency (according to the first design option)

MFP submodules are made in a monolithic design as unpackaged monolithic photodetectors in the form of CM crystals with additionally integrated PSE arrays,

monolithic photodetector submodules are directly placed on a single carrier plate,

fastening of unpackaged monolithic submodules on a carrier plate is made using micropillars (Fig. 13) or a small predetermined amount (layers) of vacuum heat-conducting retaining material under each submodule,

if necessary, the carrier plate is made of a material that is transparent in a given operating spectral range.

The technical result of the sixth embodiment of the invention is achieved by the fact that in an ultra-high-dimensional MFP with the maximum image conversion efficiency (according to the first design option)

Cooled hybrid submodules based on PSEs of various types, for example, MCT photodiodes and MSCF photodetectors, photosensitive in different specified spectral ranges, are placed simultaneously and in specified combinations on a single carrier plate (Fig. 14).

An additional technical result of the sixth embodiment of the invention is achieved by the fact that the MFP in this case has a combined, i.e. combining broadband (MCT photodiodes) and narrowband (MCQP photodetectors) parts, spectral characteristic of photosensitivity due to the use of different photodetector crystals of submodules based on PSEs of various types: MCT photodiodes and MCQP photodetectors operating in different IR spectral ranges.

The technical result of the seventh embodiment of the invention is achieved by the fact that in an ultra-high-dimensional MFP with the maximum image conversion efficiency (according to the first design option)

uncooled monolithic submodules based on microbolometric elements of various types, sensitive in different specified IR and THz ranges, are placed simultaneously and in specified combinations on a single carrier plate (Fig. 15).

An additional technical result of the seventh embodiment of the invention is achieved in that the MFP in this case has a combined, i.e. combining broadband and narrowband parts, spectral characteristic of sensitivity due to the use of different crystals of submodules based on microbolometric elements of various types, operating in different IR and THz ranges.

The technical result of the eighth variant of the invention is achieved by the fact that in the MFP of ultra-high dimension with the limiting efficiency of image conversion (according to the first variant of the design)

edge PSEs of submodules are made smaller in area relative to the dimensions of PSEs placed inside the matrix,

and the corresponding correction of the PSE signals is provided in the video processor and / or in the CM.

An additional technical result of the eighth embodiment of the invention is achieved by the fact that in the MFP in the areas of joining of adjacent crystals, the predetermined PSE pitch is preserved and the loss of the visualized information is reduced.

In the case of using the first seven variants of the invention together with the eighth variant, it may be impossible to ensure the subsequent correction of PSE signals in the video processor and / or in the CM according to the requirements of standardization or according to system requirements. In this case, it is necessary to ensure the alignment of the PSE signals in the MFP by increasing the collection area of the radiation flux entering the reduced edge PSEs of the crystals of adjacent submodules, up to the size of the PSE collection area inside the matrix.

The technical result in this case is achieved by six additional variants of the invention.

The technical result of the ninth embodiment of the invention is achieved by the fact that in an ultra-high-dimensional MFP with a maximum image conversion efficiency (according to 1-7 design options)

above each edge PSE of a smaller area, an individual integral bifocal lens of the corresponding spectral range is placed, focusing on each reduced edge element of the submodule radiation from a larger area equivalent to the PSE area inside the matrix (Fig. 16).

The technical result of the tenth embodiment of the invention is achieved by the fact that in an ultra-high-dimensional MFP with a maximum image conversion efficiency (according to 1-7 design options)

above the "blind zones" are placed optical prisms of the corresponding spectral ranges, transmitting to each reduced edge element of the submodules radiation from a larger area equivalent to the PSE area inside the matrix,

the linear dimensions of the optical prisms correspond to the dimensions of the "blind zones" (Fig. 17 a ).

The technical result of the eleventh embodiment of the invention is achieved by the fact that in an ultra-high-dimensional MFP with a maximum image conversion efficiency (according to the 10th generalized design option)

optical prisms of specified spectral ranges, located above the "blind zones", are made in the form of various structures of different (simple and complex) shapes to collect the radiation flux by reduced edge PSEs of the MPP submodules with a larger area equivalent to the PSE area inside the matrix;

the specified optical prisms are made in the form of rotary and fixed structures of triangular, diamond-shaped, trapezoidal, complex trapezoidal, angular, simple and complex "M" - and "Δ" -shaped; in the form of optical wave channels, transmitting radiation from an area equal to the PSE area inside the matrix to the reduced edge elements of the submodules;

the corresponding optical prisms are made of various materials, transparent in the given spectral ranges, having different refractive indices and having in their composition translucent and opaque mirror surfaces for the corresponding spectral ranges (Fig. 17 a -c).

The technical result of the twelfth embodiment of the invention is achieved by the fact that in an ultra-high-dimensional MFP with the limiting efficiency of image conversion (for 1-7 design options)

edge, sensitive in the IR or THz ranges, microbolometric elements are made so that parts of the microbolometric elements overlap areas of damage to multilayer microstructures and semiconductor materials at the abutting edges of adjacent submodules, and in some cases, the area of gaps between submodules, thereby eliminating the "blind zone" (Fig. . 18 a- h).

The technical result of the thirteenth embodiment of the invention is achieved by the fact that in an ultra-high-dimensional MFP with a maximum image conversion efficiency (according to 1-7 variants of the invention)

Edge microbolometric elements with antennas sensitive in the THz range are made so that parts of the antennas that are asymmetric with respect to the microbolometric elements overlap areas of damage to multilayer microstructures and semiconductor materials at the abutting edges of adjacent submodules, thereby eliminating the "blind zone" (Fig. 19).

The technical result of the fourteenth embodiment of the invention is achieved by the fact that in an ultra-high-dimensional MFP with a maximum image conversion efficiency (according to the first design option)

As SE, individual antenna structures are used, the radiation pattern and transmission coefficient of which in a given range are optimized by equalizing the sensitivity to radiation of edge elements and elements located inside the receiving matrix of submodules.

THE ESSENCE OF THE PROPOSED METHODS FOR MANUFACTURING MFP OF SUPERHIGH DIMENSION WITH THE ULTIMATE EFFICIENCY OF IMAGE CONVERSION

The developed versions of methods for creating ultra-high-dimensional MPCs with the limiting image conversion efficiency include laser scribing of instrument plates, separation of plates into working crystals and precision formation of abutting crystal edges with a minimum (≥5-8 μm) area of damage to semiconductor material and multilayer microstructures, frameless (hybrid and / or monolithic) submodules are placed on a single carrier plate without gaps or with minimum gaps (no more than 2 μm). Variants of the manufacturing method proposed by the authors imply a denser microassembly of submodules in an ultra-high-dimensional MFP with an ultimate image conversion efficiency in comparison with analogs and the prototype, and, accordingly, provide a more complete volume of initial data during subsequent signal processing, which, other things being equal, increases the reliability of processing and ultimately improves the quality of the rendered images. FIG. 20 is an example illustrating a method for manufacturing an ultra-high-dimensional MFP using fiducial marks. The number (one, two or more) of fiducial marks per one submodule is determined by the linear dimensions of the submodules.

The technical results of the invention of the variants of the method for manufacturing MFPs are: the limiting increase in the efficiency of image conversion in the MFPs of ultra-high dimensions by ensuring the minimum damage area at the edges of the crystals, precision microassembly of the crystals of submodules in the MFPs without gaps or with minimal (no more than 2 μm) gaps, increasing the positioning accuracy submodules as part of the MFP, ensuring microminiaturization of the design, expanding the technological scope of the manufacturing method options, improving the manufacturability of the MFP manufacturing method, simplifying the manufacturing technology, increasing the yield of products and reducing the cost of MFP, expanding the scope of the created MFPs.

The technical result is achieved in the first variant of the method for manufacturing an ultra-high-dimensional MFP with the limiting efficiency of image conversion, which consists in the fact that

make a carrier plate of appropriate dimensions with external fiducial marks,

make (hybrid and / or monolithic) submodules with topological and additional topological reference marks,

investigate the performance and sort the submodules according to their parameters, including the roughness of the edges and the thickness of the crystals,

prepare the surfaces of crystals of hybrid or monolithic submodules for fixation on the surface of the carrier plate,

prepare the surface of the carrier plate for fixing crystals of hybrid or monolithic submodules,

make carriers of fiducial marks with external fiducial marks,

carry out the application of layers (or drops) of the retention material in the places of the intended placement of the submodules,

installation, positioning and fixation of crystals of submodules is performed in the form of a matrix of n × m submodules on a carrier plate, where n = 1, 2, 3, 4, 5, 6, 7, 8, ... ∞, m = 1, 2, 3, 4, 5, 6, 7, 8,… ∞, (n ≠ m for n = 1 or m = 1),

at n = 1, m = 2 or at n = 2, m = 1, the edge is formed on one face of the crystals, at n = 2, m = 2 - on two faces of the crystals, at n = 3, 4, 5, 6, 7, 8,… ∞ and m = 2, 3, 4, 5, 6, 7, 8,… ∞ - on two faces of crystals placed in the corners of the matrix of n × m submodules, on three faces of crystals of submodules placed on the edges of the matrix n × m submodules (excluding corner ones), on four crystal faces placed inside a matrix of n × m submodules,

positioning of submodules is performed using micromanipulators,

control gaps between crystals using a microscope and / or a video camera,

the submodules are held in place until the layers of retention material polymerize / solidify;

additional precision formation of abutting crystal edges of all submodules recognized as suitable and necessary for MFP assembly, ensuring a minimum area of damage to the crystal edges is performed as follows:

a protective layer of photoresist is applied to the front (working) surface of the submodule crystal,

a groove and abutting edges of the crystal are formed on the front side by laser radiation with a given wavelength in a multipass mode with a given angle of inclination of the optical axis of radiation to the normal of the surface of the crystal being processed,

splitting off the edge of the crystal using a wedge shifted under the crystal,

additionally, the abutting edges of the crystal are formed by repeated removal (evaporation) by laser radiation of the inclined part (former groove) and the protrusion (in the region of the bottom of the former groove) on the lateral surface of the crystal from the back, non-working side of the crystal,

performing a technological operation of removing the photoresist layer from the processed crystal;

holes are created in the carrier plate at the places where the submodules are supposed to be located, the number of holes per submodule is determined in each case individually by calculation and experiment,

vacuum lines are brought to each hole in the carrier plate corresponding to the location of the installed submodule,

precise positioning and fixation of submodules is carried out with the help of micromanipulators and vacuum grippers, butt-to-end to each other on a single heat-conducting plate-carrier without gaps or with minimum (no more than 2 μm) gaps between adjacent crystals of submodules,

in this case, the positioning of the submodules is carried out until the topological fiducial marks and / or additional topological fiducial marks coincide on the installed submodules with external fiducial marks on the carrier plate or on the carriers of the fiducial marks, if necessary, use crystal height alignment limiters,

vacuum is applied to the vacuum gripper for a time to polymerize / solidify the layers of the retaining material under each installed submodule on the carrier plate,

in the process of installing and fixing submodules on the carrier plate, an additional study of the operability is carried out and grading according to the parameters of the submodules, including the roughness of the edges and the thickness of the crystals,

if necessary, replace submodules that have failed in the process of manufacturing the MFP by removing the rejected submodules and installing in their place obviously suitable submodules in the manner described above (Fig. 20).

In the second version of the method for manufacturing ultra-high-dimensional MFPs with the limiting image conversion efficiency

positioning of the submodules on the surface of the carrier plate (pos. 33) is performed using micromanipulators;

orientation of the submodules during positioning is carried out using a microscope and / or a video camera until the topological reference marks on the installed submodule coincide with external reference marks on a carrier of reference marks that is individual for each submodule (item 52);

in comparison with the first variant of the method, individual carriers of fiducial marks (item 52), for example, for the first row of submodules, are fixed on one support bar (item 51) (Fig. 21 a ), or for the second and subsequent rows of submodules - on crystals previous lines of submodules (Fig. 21b).

In the third version of the method for manufacturing ultra-high-dimensional MFPs with the limiting image conversion efficiency

positioning of the submodules on the surface of the carrier plate (pos. 33) is performed using micromanipulators;

orientation of the submodules during positioning is carried out using a microscope and / or a video camera until the topological fiducial marks on the installed submodule coincide with external fiducial marks on a carrier of fiducial marks common for the entire row of submodules (item 52);

in comparison with the first variant of the method, the carrier of fiducial marks, which is uniform for the entire row of submodules (pos. 52), is fixed on two support bars (pos. 51) (Fig. 22).

In the fourth variant of the method for manufacturing ultra-high-dimensional MFPs with the limiting image conversion efficiency

positioning of the submodules on the surface of the carrier plate (pos. 33) is performed using micromanipulators;

in comparison with the first variant of the method, the orientation of the submodules during positioning is carried out using a vision system made on the basis of a video camera and ensuring the alignment of the corresponding fiducial marks (pos. 54-55) of crystals of adjacent rows of submodules (Fig. 23).

In the fifth version of the method for manufacturing ultra-high-dimensional MFPs with the limiting image conversion efficiency

in comparison with the first variant of the method, the support bar is made in the form of a rectangular frame, the internal dimensions of which correspond to the dimensions of the created MFP,

the number of holes in the carrier plate per submodule is determined in each case individually by calculation and experiment,

submodules are installed on the specified places of the carrier plate,

if necessary, use limiters for aligning the crystals of submodules in height,

fixation of all submodules is carried out simultaneously by connecting vacuum lines to a vacuum pump temporarily for polymerization / hardening of layers of retaining material under the installed submodules on the carrier plate (Fig. 24).

In the sixth version of the method for manufacturing ultra-high-dimensional MFPs with the limiting image conversion efficiency

in comparison with the fifth variant of the method, inside the support strip made in the form of a corresponding rectangular frame, along the edges on each side there are four additional support strip-inserts with dimensions corresponding to the dimensions of the MFP being created;

the internal dimensions of the support strip in the form of a rectangular frame correspond to the dimensions of the created MFP, taking into account the placement of additional support tabs-inserts;

the formation of the inner edges of the additional support strips-liners is carried out with precision, ensuring the edge roughness of no more than 1 μm (Fig. 25).

In the seventh version of the method for manufacturing ultra-high-dimensional MFPs with the limiting image conversion efficiency

in comparison with the first version of the method, positioning, installation and fixation of submodules with precision microassembly of the MFP without gaps or with minimal (no more than 2 microns) gaps between crystals of adjacent submodules, and, if necessary, the alignment of external reference marks on the carrier plate or on the carrier of external reference marks and topological reference marks on the installed submodules are produced using a semi-automatic micromanipulator.

In a semi-automatic version of the method for manufacturing ultra-high-dimensional MFPs with the limiting efficiency of image conversion, which consists in the fact that

a carrier plate of appropriate dimensions is made with topological reference marks corresponding to the location of each submodule in the MFP,

submodules of appropriate formats are manufactured in the form of unpackaged monolithic or hybrid photodetectors with topological reference marks,

investigate the performance and sort the submodules according to their parameters, including the roughness of the edges and the thickness of the crystals,

installation, positioning and fixation of submodules is performed sequentially, crystal by crystal, butt-to-side to each other in the form of a matrix of n × m submodules on a carrier plate, where n = 1, 2, 3, 4, 5, 6, 7, 8, ... ∞, m = 1, 2, 3, 4, 5, 6, 7, 8,… ∞, (n ≠ m for n = 1 or m = 1),

at n = 1, m = 2 or at n = 2, m = 1, the edge is formed on one face of the crystals, at n = 2, m = 2 - on two faces of the crystals, at n = 3, 4, 5, 6, 7, 8,… ∞ and m = 2, 3, 4, 5, 6, 7, 8,… ∞ - on two faces of crystals placed in the corners of the matrix of n × m submodules, on three faces of crystals of submodules placed on the edges of the matrix n × m submodules (excluding corner ones), on four crystal faces placed inside a matrix of n × m submodules,

fixing the submodules on the surface of the carrier plate is performed using micropillars or a small predetermined amount (layers) of vacuum heat-conducting retaining material under each submodule,

orientation control and positioning of the installed submodules is carried out using a system of bilateral visualization and alignment based on a microscope and / or a video camera, each time performing precision microassembly of submodules with already installed submodules until the MFP of the required dimension n is assembled on the carrier plate × m submodules,

moreover, in the case of m = 2, the first and last submodules in each row are installed with close joining on two sides, the second and subsequent submodules (except for the last one) in each row are installed with close joining on three sides,

and in the case of m> 2, corner submodules are installed with close docking on two sides, edge submodules (except for corner ones) are installed with close docking on three sides, and submodules placed inside the matrix of submodules are installed with close docking on four sides,

if necessary, a gap is provided between the rows of the n × m matrix of submodules to accommodate micro-loops with metal wiring and electrical connection of micro-loops with the contact pads of the submodules and with the contact pads of the carrier plate;

additional precision formation of abutting crystal edges of all submodules recognized as suitable and necessary for MFP assembly, ensuring a minimum area of damage to the crystal edges is performed as follows:

a protective layer of photoresist is applied to the front surface of the crystal of the submodule,

a groove and abutting edges of the crystal are formed on the front side by laser radiation with a given wavelength in a multipass mode with a given angle of inclination of the optical axis of radiation to the normal of the surface of the crystal being processed,

splitting off the edge of the crystal using a wedge shifted under the crystal,

additionally, abutting edges of the crystal are formed by repeated removal of the inclined part and the protrusion on the lateral surface of the crystal from the back, non-working side of the crystal, by laser radiation,

performing a technological operation of removing the photoresist layer from the processed crystal;

the MFP manufacturing process is performed cyclically, within each cycle:

place and fix the submodule with a vacuum suction cup on the upper part of the micro-assembly unit,

place the MFP carrier plate on the lower, movable (along "Z") part of the microassembly unit and fix it with a vacuum gripper,

by lifting the lower movable part of the microassembly to a predetermined height, the submodule is placed and fixed on the carrier plate without gaps or with minimum (no more than 2 μm) gaps between adjacent crystals of submodules,

after the final fixing of the submodule on the carrier plate, the lower movable part of the micro-assembly unit is lowered to the lower position,

the vacuum is turned off at the vacuum gripper of the lower part of the micro-assembly unit,

carry out movement (along "X" and / or "Y") of the carrier plate at a distance equal to the dimensions of the installed submodules,

fix the carrier plate by applying a vacuum at the new predetermined place of the lower part of the micro-assembly unit,

perform the next cycle to install the next submodule;

in the process of installing and fixing submodules on the carrier plate, an additional study of the operability is carried out and grading according to the parameters of the submodules, including the roughness of the edges and the thickness of the crystals,

if necessary, replace submodules that have failed in the process of manufacturing MFP by removing the rejected submodules and installing in their place obviously suitable submodules in the manner described above.

In the automatic version of the method for manufacturing ultra-high-dimensional MFPs with the limiting efficiency of image conversion, which consists in the fact that

make a carrier plate of appropriate dimensions with external reference marks corresponding to the locations of each submodule in the MFP,

submodules of appropriate formats are manufactured in the form of unpackaged monolithic or unpackaged hybrid photodetectors with topological reference marks,

investigate the performance and sort the submodules according to their parameters, including the roughness of the edges and the thickness of the crystals,

installation, positioning and fixing of submodules is performed sequentially, crystal by crystal, butt-to-side to each other in the form of a matrix of n × m submodules on a carrier plate, where n = 1, 2, 3, 4, 5, 6, 7, 8, ... ∞, m = 1, 2, 3, 4, 5, 6, 7, 8,… ∞, (n ≠ m for n = 1 or m = 1),

at n = 1, m = 2 or at n = 2, m = 1, the edge is formed on one face of the crystals, at n = 2, m = 2 - on two faces of the crystals, at n = 3, 4, 5, 6, 7, 8,… ∞ and m = 2, 3, 4, 5, 6, 7, 8,… ∞ - on two faces of crystals placed in the corners of the matrix of n × m submodules, on three faces of crystals of submodules placed on the edges of the matrix n × m submodules (excluding corner ones), on four crystal faces placed inside a matrix of n × m submodules,

fixing the submodules on the surface of the carrier plate is performed using micropillars or a small predetermined amount (layers) of vacuum heat-conducting retaining material under each submodule,

the orientation control and positioning of the installed submodules is carried out using a system of bilateral visualization and alignment based on a microscope and / or a video camera, while each time precision close docking of submodules with already installed submodules is performed until the MFP of the required dimension is assembled on the carrier plate n × m submodules,

moreover, in the case of m = 2, the first and last submodules in each row are installed with close joining on two sides, the second and subsequent submodules (except for the last one) in each row are installed with close joining on three sides,

and in the case of m> 2, corner submodules are installed with close docking on two sides, edge submodules (except for corner ones) are installed with close docking on three sides, and submodules placed inside the matrix of submodules are installed with close docking on four sides,

if necessary, a gap is provided between the rows of the n × m matrix of submodules to accommodate micro-loops with metal wiring and electrical connection of micro-loops with the contact pads of the submodules and with the contact pads of the carrier plate;

additional precision formation of abutting crystal edges of all submodules recognized as suitable and necessary for MFP assembly, ensuring a minimum area of damage to the crystal edges is performed as follows:

a protective layer of photoresist is applied to the front surface of the crystal of the submodule,

a groove and abutting edges of the crystal are formed on the front side by laser radiation with a given wavelength in a multipass mode with a given angle of inclination of the optical axis of radiation to the normal of the surface of the crystal being processed,

splitting off the edge of the crystal using a wedge shifted under the crystal,

additionally, abutting edges of the crystal are formed by repeated removal (evaporation) by laser radiation of the inclined part and the protrusion on the side surface of the crystal from the back, non-working side of the crystal,

performing a technological operation of removing the photoresist layer from the processed crystal;

positioning, installation and fixing of submodules during precision microassembly of MFP without gaps or with minimal (no more than 2 μm) gaps between adjacent crystals of submodules, and, if necessary, alignment of external fiducial marks on the carrier plate or on the carrier of external fiducial marks and topological fiducial marks on the installed submodules are produced using an automatic micromanipulator-robot;

in the process of installing and fixing submodules on the carrier plate, an additional study of the operability is carried out and grading according to the parameters of the submodules, including the roughness of the edges and the thickness of the crystals,

if necessary, replace submodules that have failed in the process of manufacturing MFP by removing the rejected submodules and installing in their place obviously suitable submodules in the manner described above.

BRIEF DESCRIPTION OF DRAWINGS (and other materials)

The essence of the variants of the invention is illustrated by the following description and the accompanying drawings.

FIG. Figure 1 shows the dependences of the image conversion efficiency (curves 1-4) in the MFP and the number (curves 5-8) of elements in the "blind zones" on the format and pitch (L _pix ) of the photodetector matrix: 1 - the dependence of the image conversion efficiency (curve 1) in MPP at L _pix = 102 μm; 2 - the dependence of the efficiency of image conversion (curve 2) in the MFP at L _pix = 51 μm; 3 - the dependence of the efficiency of image conversion (curve 3) in the MPP at L _pix = 17 μm; 4 - the dependence of the efficiency of image conversion (curve 4) in the MFP at L _pix = 10 μm; 5 - the dependence of the number of elements (curve 5) in the "blind zones" of the MFP at L _pix = 10 μm; 6 - dependence of the number of elements (curve 6) in the "blind zones" of the MFP at L _pix = 17 μm; 7 - dependence of the number of elements (curve 7) in the "blind zones" of the MFP at L _pix = 51 µm; 8 - dependence of the number of elements (curve 8) in the "blind zones" of the MFP at L _pix = 102 µm.

FIG. 2 shows a diagram of the decrease in the number of elements lost in the "blind zone" perpendicular to the joining lines of adjacent submodules, with an increase in the PSE step and with a different size of the technological part of the "blind zone" of the MFP: 9 - the size of the technological part of the "blind zone" of the MFP is 13 μm; 10 - the size of the technological part of the "blind zone" of the MFP is 17 microns; 11 - the size of the technological part of the "blind zone" of the MFP is 22 microns; 12 - the size of the technological part of the "blind zone" of the MFP is 30 microns.

FIG. 3 shows the dependence of the number of elements in the "blind zone" on the MFP format based on submodules of different formats: curve 13 - 256 × 256, 14 - 512 × 512, 15 - 1024 × 1024, 16 - 2048 × 2048, the size of the technological part of the "blind zone "is 13 microns, the pitch of the elements is 25 microns.

FIG. 4 shows the dependence of the number of elements in the "blind zone" on the step (L _pix ) of elements based on combinations of submodules of different formats and MFPs of different dimensions ("combinations of submodules and submodule format" / "MFP dimension"): curve 17 - 8 × 8 × 512 / 4096, 18 - 4 × 4 × 1024/4096, 19 - 2 × 2 × 2048/4096, 20 - 4 × 4 × 512/2048, 21 - 2 × 2 × 1024/2048, 22 - 4 × 4 × 256 / 1024, 23 - 2 × 2 × 512/1024).

FIG. 5 shows a well-known MFP in the form of a matrix of 4 × 2 submodules (the first analogue).

FIG. 6 shows a well-known MFP in the form of a matrix of 5 × 7 submodules (prototype).

FIG. 7 ( a , b) shows a well-known manufacturing method: a - matrix of the PSE and CM, combined before assembly (top view): 24 - matrix of the PSE, 25 - CM, 26 - displacement latches along the "xy", 27 - supports of the latches, 28 - fiducial marks on the PSE matrix; b - a fragment of matched crystals near the remote reference mark (top view and side view): 24 - PSE matrix, 25 - CM, 29 - reference mark carrier, 30 - transparent polyamide, 31 - indium micropillars, 32 - glue layer.

FIG. 8 shows a known semi-automatic method for manufacturing MFP.

FIG. 9 shows the first version of the MFP based on hybrid and monolithic open-frame submodules with the use of micro stubs and wiring on the carrier plate, where n is the number of submodules in the MFP horizontally (example n = 3), m is the number of submodules in the MFP vertically (example m = 3), 33 - carrier plate, 34 - frameless photodetector submodule (hybrid or monolithic), 35 - insulating plate (if necessary), 36 - contact pad of the carrier plate, 37 - micro-cable with metal wiring and contact pads, 38 - contact site of the frameless photodetector submodule.

FIG. 10 shows the second version of the MFP based on a large single crystal CM as a carrier plate and crystals of PSE matrices as submodules connected using micropillars, where n is the number of submodules in the MFP horizontally (example n = 3), m is the number of submodules in MFP vertically (example m = 3), 33.1 - carrier plate in the form of a large single crystal CM, 34.1 - submodule in the form of an unpackaged crystal of the PSE matrix (unpackaged IC), 36 - contact pad of the carrier plate, 38 - contact pad of the photodetector submodule ...

FIG. 11 shows the third version of the MFP based on a large single crystal of the PSE matrix as a carrier plate and CM crystals as submodules connected using micropillars, where n is the number of submodules in the MFP horizontally (example n = 3), m is the number of submodules in MFP vertically (example m = 3), 33.2 - carrier plate in the form of a large single crystal of the PSE matrix, 34.2 - submodule in the form of an open-frame CM crystal (unpackaged IC), 36 - contact area of the carrier plate, 38 - contact area of the photodetector submodule ...

FIG. 12 shows the fourth version of the MFP based on hybrid or monolithic frameless submodules using micro-stubs and wiring on CM crystals, where n is the number of submodules in the MFP horizontally (example n = 3), m is the number of submodules in the MFP vertically (example m = 3 ), 33 - carrier plate, 34 - frameless hybrid or monolithic photodetector submodule, 38 - contact pad of the photodetector submodule, 39 - micro loop with metal wiring and contact pads.

FIG. 13 shows the fifth version of the MFP based on frameless monolithic submodules using micropillars, where n is the number of submodules in the MFP horizontally (example n = 3), m is the number of submodules in the MFP vertically (example m = 3), 33 is the carrier plate , 34.3 - unpackaged monolithic photodetector submodule, 36 - contact area of the carrier plate, 38.3 - contact area of the unpackaged monolithic photoreceiving submodule; 40 - photosensitive element (PSE).

FIG. 14 shows a large-format two-spectral (two-color) MFP (sixth version) based on open-frame submodules docked from 3 sides, where n is the number of submodules in the MFP horizontally (example n = 3), m is the number of submodules in the MFP vertically (example m = 2), 33 - carrier plate, 34.4 - unpackaged photodetector submodule of one spectral range, for example, based on MCT photodiodes, 34.5 - unpackaged photodetector submodule of the second spectral range, for example, based on MSQW photodetectors.

FIG. 15 shows a wide-format (panoramic, 3072 × 576 format) two-spectral (two-color) mosaic microbolometric receiver, sensitive in the IR and THz ranges simultaneously (seventh option), where n = 8 is the number of submodules in the MFP horizontally, m = 2 is the number of submodules in Vertical MFP, 33 - carrier plate, 34.6 - frameless photodetecting microbolometric submodule, for example, IR spectral range with a format of 384 × 288 elements, 34.7 - frameless photoreceiving microbolometric submodule, for example, THz range with dimension 384 × 288.

FIG. 16 shows the principle of the technological design of the areas of joining of adjacent crystals of submodules in the MFP according to the ninth option with individual integral bifocal lenses of the corresponding spectral ranges (sketch), where 33 is the carrier plate; 34 - unpackaged monolithic or hybrid photodetector submodule, FIG. an example is shown based on monolithic photodetecting submodules - CM crystals with PSEs located on them in specially designated places; 41 - lens, 42 - bifocal lens, 43 - area of joining of submodules, 44 - area of damage to semiconductor material.

- коэффициент преломления i-ой среды (

- для менее плотной среды,

- для плотной среды,

- для более плотной среды); поз. 46 применяют при необходимости. Показано возможное предельное расположение по горизонтали оптической призмы треугольной формы {штриховая линия на фиг. 17 (a)}.FIG. 17 ( a -c) show the principles of the technological design of the areas of joining of adjacent crystals of submodules in the MFP according to the tenth and eleventh options with optical prisms of the corresponding spectral ranges; sketches of execution options ( a -c), where 33 is a carrier plate; 34 - unpackaged (monolithic or hybrid) photodetector submodule, FIG. an example is shown based on monolithic photodetecting submodules - CM crystals with PSEs located on them in specially designated places; 43 - area of joining of submodules, 44 - area of damage to semiconductor material, 45 - prism, 46 - mirror;

is the refractive index of the i-th medium (

- for less dense media,

- for dense media,

- for a denser environment); pos. 46 apply as needed. A possible limiting horizontal arrangement of a triangular optical prism {dashed line in FIG. 17 (a)}.

FIG. 18 ( a- h) shows the region of crystal joining in the MFP according to the twelfth option based on sensitive elements (SE) - microbolometers of the IR spectral range, where 33 is a carrier plate, 34.6 is a frameless receiving microbolometric submodule - a CM crystal with SE, located in a specially assigned places, 43 - area of joining of submodules, 44 - area of damage to semiconductor material, 47 - sensitive element, 48 - bollard microcontact.

FIG. 19 shows the area of crystal joining in the MFP according to the thirteenth variant based on SE - microbolometers with THz range antennas, where 33 is a carrier plate, 34.7 is a frameless receiving microbolometric submodule - a CM crystal with SEs located in specially designated places, 43 - the area of submodules docking , 44 - damage area of semiconductor material, 47 - sensitive element, 49 - THz range antenna, 50 - microcontact.

FIG. 20 ( a , b) shows an illustration of a method for manufacturing a MFP using fiducial marks: ( a ) one fiducial mark for each frameless submodule, (b) two fiducial marks for each submodule, where 33 is a carrier plate, 34 is a frameless hybrid or a monolithic photodetector submodule, 51 - support bar, 52 - carrier of external fiducial mark, 53 - external fiducial mark.

FIG. 21 ( a , b) shows an illustration of the first method of orientation of submodules during positioning using a measuring microscope and / or video camera, topological fiducial marks on the installed submodule and external fiducial marks on individual for each submodule carriers of fiducial marks, fixed: on one support bar ( a : 1st option) or on crystals of the previous row of submodules (b: 2nd option), where 33 is the carrier plate, 34 is the photodetector submodule, 43 is the area where the submodules are joined, 51 is the support bar, 52 is the carrier of the external reference mark , 53 - external reference mark, 54 - topological reference mark, 55 - additional reference mark.

FIG. 22 shows an illustration of the second method of orientation of submodules during positioning using a microscope and / or a video camera, topological fiducial marks on an installed submodule with external fiducial marks on a carrier of fiducial marks that is common for the entire row of submodules, fixed on two support bars, where 33 is a carrier plate, 34 - photodetector submodule, 43 - area of joining of submodules, 51 - support bar, 52 - carrier of external reference mark, 53 - external reference mark, 54 - topological reference mark, 55 - additional reference mark.

FIG. 23 shows an illustration of the third method of orientation of submodules during positioning using a computer vision system, made on the basis of a video camera and providing the alignment of the corresponding (topological and additional topological) reference marks of crystals of adjacent rows of submodules, where 33 is a carrier plate, 34 is a photodetecting submodule, 43 is area of joining of submodules, 54 - topological reference mark, 55 - additional reference mark.

FIG. 24 shows an illustration of the second method of manufacturing a MFP using a support bar 51 in the form of a rectangular frame, where 33 is a carrier plate, 34 is a photodetector submodule, 43 is a submodule joining area, 52 is a carrier of an external reference mark, 53 is an external reference mark.

FIG. 25 shows an illustration of the third method of manufacturing a MFP using a support bar 51.1 in the form of a rectangular frame and additional support bars-inserts 51.2, where 33 is a carrier plate, 34 is a photodetector submodule, 43 is an area for joining submodules, 52 is a carrier of an external reference mark, 53 - external reference mark.

FIG. 26 shows a photograph of a gapless microassembly of silicon crystals placed similarly to the crystals of unpackaged submodules in the MFP in the form of a matrix of 3 × 3 submodules ( a ); and photographs of aligned silicon crystals, side view (b), where 56 is the groove wall, 57 is the cleavage surface, 58 is the silicon crystal, 59 is the groove wall upon re-scribing.

FIG. 27 shows the principle of forming the edge of a crystal by laser radiation ( a ) with a given wavelength in a multi-pass mode (120 μm / sec); profiles of the formed grooves for different angles of deviation of the optical axis of radiation relative to the normal to the crystal surface (b), where 60 is a focusing lens; energy distribution in the radiation spot: 61 - zone 1, 62 - zone 2, 63 - zone 3; 64 - photoresist, 65 - SiO ₂ , 66 - edge of the crystal, 67 - crystal, 68 - groove formed by radiation with the optical axis coinciding with the normal to the surface, 69 - the groove formed by radiation with the optical axis deflected relative to the normal to the surface by 12 "(optimal angle), 70 - a groove formed by radiation with the optical axis deflected relative to the normal to the surface by 24" [Novoselov A.R. Method of reducing the gap between chips in mosaic photodetector modules // Avtometriya. 2016.Vol. 52.No. 1. S. 116-121; Pat. RF No. 2509391].

FIG. 28 is an illustration of a shielded laser scribing methodology. Dependences of the "dark" PSE current (71) on the distance to the groove. Laser scribing with radiation shielding was performed in a multi-pass mode (50 passes) at an energy density of 2.6 J / cm ² , and a groove depth of 26 μm was obtained. Points (71) on the graphs correspond to the values of the currents in the PSE after scribing. The horizontal lines (72, 73) in the graphs correspond to the spread of the PSE currents before scribing, where 72 is the level of the maximum values of the currents in the PSE, 73 is the level of the minimum values of the currents in the PSE. The width of the damaged area without photoresist ( a ) is about 13 μm, with photoresist (b) - 8 μm. [Novoselov A.R. Development of highly efficient mosaic photodetectors based on photosensitive element lines // Avtometriya. 2010. T. 46, No. 6, S. 106-115; Pat. RF No. 2509391].

FIG. 29 ( a- b) shows the achieved technological level using the example of silicon technology. The developed method of forming the edges of the crystal provides a smooth butted crystal face perpendicular to the planar side and allows the alignment of adjacent submodules without a gap ( a ). Dependences of the reverse current (74, 75) of pn junctions in crystals on the distance to the groove wall (b), where 74 are the reverse current values for the LOCOS technology, 75 are the reverse current values for the MOS technology with stop diffusion. The reverse bias voltage of pn junctions is 8.2 V. The width of the damaged area is about 5 microns. [Klimenko A.G., Kozlov A.I., Novoselov A.R., Demyanenko M.A., Esaev D.G., Marchishin I.V., Ovsyuk V.N. Development of mosaic uncooled microbolometric receivers for infrared and terahertz spectral ranges up to 3072 × 576 and more // Uspekhi prikladnoi fiziki. 2014.2, no. 2. S. 123-130; Kozlov A.I., Novoselov A.R., Demyanenko M.A., Ovsyuk V.N. Improving the efficiency of image conversion in mosaic microbolometric receivers // Optical journal. 2018.Vol. 85, No. 2. S. 60-66].

FIG. 30 shows an example of a MFP with a format of 1152 × 576 elements indicating the locations of the "blind zone" and its technological part, where 33 is a carrier plate, 34 is a photodetector submodule, 43 is an area where submodules are joined, 54 is a topological reference mark.

FIG. 31 ( a- f) shows an illustration of an example of a method for manufacturing MFPs with a format of 1152 × 576 elements using fiducial marks, steps 1-6 are the sequential installation of six submodules, where 33 is a carrier plate, 34 is a photodetector submodule, 43 is an area where submodules are joined, 51 - support bar, 52 - carrier of external fiducial mark, 53 - external fiducial mark, 54 - topological fiducial mark.

FIG. 32 shows an example of a MFP consisting of a 3 × 2 submodule matrix, indicating the locations of the "blind zone" and its technological part, with a variant of the location of the IR image on the PSE submodule matrices and with the subsequent electronic assembly of the resulting thermal image in a video processor in RAM with an arbitrary addressing, where 33 is a carrier plate, 34 is a photodetector submodule, 43 is an area for joining submodules, 76 is a random-addressable RAM.

FIG. 33 ( a -e) shows an illustration of a second example of a method for manufacturing MFPs with a format of 1152 × 864 elements using fiducial marks, stages 1-3 are sequential installation of nine submodules, where 33 is a carrier plate, 34 is a photodetector submodule, 43 is a submodule docking area , 51 - support bar, 52 - carrier of external fiducial mark, 53 - external fiducial mark, 54 - topological fiducial mark.

FIG. 34 shows an illustration of a fifth example of a method for manufacturing MFPs with a format of 1152 × 864 elements with the use of additional fiducial marks, stages 1-3 - sequential installation of nine submodules, stage 3 is shown, where 33 is a carrier plate, 34 is a photodetector submodule, 43 is a docking area of submodules , 51 - support bar, 52 - carrier of external fiducial mark, 53 - external fiducial mark, 54 - topological fiducial mark, 55 - additional fiducial mark.

FIG. 35 ( a- m) shows an illustration of a sixth example of a method of (semi-automatic) production of MFPs with a format of 1152 × 864 elements: stages 1-12 - sequential installation of the first three submodules, where 33 is a carrier plate, 34 is a frameless photodetector submodule, 77 is a stop for alignment, 78 - hinge, 79 - upper, fixed ("Z") part of the micro-assembly unit, 80 - hinged hatch of the micro-assembly unit for preliminary placement of the photodetector submodule, 81 - lower, movable ("Z") part of the micro-assembly unit, 82 - visualization and alignment system.

CARRYING OUT THE INVENTION

The first version of the MFP (Fig. 9) of ultra-high dimension with the limiting efficiency of image conversion consists of a matrix of n × m photodetector submodules, where n = 1, 2, 3, 4, 5, 6, 7, 8, ... ∞, m = 1, 2, 3, 4, 5, 6, 7, 8, ... ∞, (n ≠ m at n = 1 or at m = 1), photodetector submodules are installed butt-to-side on the carrier plate, photodetector submodules are in monolithic design manufactured as unpackaged monolithic photodetectors in the form of CM crystals with additionally integrated PSE arrays on them, and in a hybrid design as unpackaged hybrid microassemblies from a PSE matrix crystal and a CM crystal, the contact pads of the submodules are electrically connected to the contact pads of the carrier plate using microcircuits,

frameless monolithic or hybrid photodetector submodules of the MFP are manufactured with the provision of minimal (5-8 microns) areas of damage to multilayer microstructures and semiconductor materials at the abutting edges of the submodule crystals,

Unpackaged monolithic or hybrid photodetector submodules with minimal areas of damage to multilayer microstructures and semiconductor materials at the abutting edges of the crystals are directly placed with the photodetector side up on a single carrier plate without gaps or with minimal (no more than 2 μm) gaps between crystals of adjacent submodules.

If a more dense microassembly of submodules is required in the MFP and to isolate the rear surface of the submodules from the metal wiring, insulating plates (pos. 35) are used on the carrier plate.

The second version of the MFP (Fig. 10) of ultra-high dimension with the limiting efficiency of image conversion (according to the first version of the design) consists of a matrix of n × m photodetector submodules, where n = 1, 2, 3, 4, 5, 6, 7, 8, ... ∞, m = 1, 2, 3, 4, 5, 6, 7, 8,… ∞, (n ≠ m at n = 1 or at m = 1), the photodetector submodules are installed end-to-end on the carrier plate ,

a single large CM crystal was used as the MPP carrier plate,

crystals of PSE matrices are used as submodules,

submodules are made with the provision of extremely minimal (5-8 microns) areas of damage to semiconductor materials and multilayer microstructures at the abutting edges of the crystals,

submodules with extremely minimal areas of damage to semiconductor materials and multilayer microstructures at the abutting edges of the crystals are directly placed with the photodetector side up on a single carrier plate without gaps or with minimum (no more than 2 μm) gaps between crystals of adjacent submodules,

while the signal contact pads (pos. 36) of the CM are electrically connected to the contact pads (pos. 38) of the submodules - crystals of the PSE matrices using micropillars.

The third version of the MFP (Fig. 11) of ultra-high dimension with the limiting efficiency of image conversion (according to the first version of the design) consists of a matrix of n × m photodetecting submodules, where n = 1, 2, 3, 4, 5, 6, 7, 8, ... ∞, m = 1, 2, 3, 4, 5, 6, 7, 8,… ∞, (n ≠ m at n = 1 or at m = 1), the photodetector submodules are installed end-to-end on the carrier plate ,

the only large crystal of the PSE matrix is used as the MPP carrier plate,

KM crystals are used as submodules,

submodules are made with the provision of extremely minimal (5-8 microns) areas of damage to semiconductor materials and multilayer microstructures at the abutting edges of the crystals,

submodules with extremely minimal areas of damage to semiconductor materials and multilayer microstructures at the abutting edges of the crystals are directly placed on a single carrier plate without gaps or with minimum (no more than 2 μm) gaps between crystals of adjacent submodules,

the signal and control contact pads (pos. 38) of the submodules - CM are electrically connected to the contact pads (pos. 36) of the PSE matrix crystal using micropillars.

The fourth version of the MFP (Fig. 12) of ultra-high dimension with the limiting efficiency of image conversion (according to the first version of the design) consists of a matrix of n × m photodetecting submodules, where n = 1, 2, 3, 4, 5, 6, 7, 8, ... ∞, m = 1, 2, 3, 4, 5, 6, 7, 8,… ∞, (n ≠ m at n = 1 or at m = 1), the photodetector submodules are installed end-to-end to each other on the carrier plate ,

frameless monolithic or hybrid photodetector submodules of the MFP are manufactured to ensure the extremely minimal (5-8 microns) areas of damage to semiconductor materials and multilayer microstructures at the abutting edges of the crystals,

Unpackaged monolithic or hybrid photodetector submodules with extremely minimal areas of damage to semiconductor materials and multilayer microstructures at the abutting edges of the crystals are directly placed on a single carrier plate without gaps or with minimum (no more than 2 μm) gaps between crystals of adjacent submodules.

The unified principle of photo signal reading and addressing to the PSE in the MFP is ensured by the use of microconductors or micro loops connecting the corresponding signal and control (including address) contact pads of adjacent crystals of submodules.

The fifth version of the MFP (Fig. 13) of ultra-high dimension with the limiting efficiency of image conversion (according to the first version of the design) consists of a matrix of n × m photodetecting submodules, where n = 1, 2, 3, 4, 5, 6, 7, 8, ... ∞, m = 1, 2, 3, 4, 5, 6, 7, 8,… ∞, (n ≠ m at n = 1 or at m = 1), the photodetector submodules are installed end-to-end on the carrier plate ,

submodules of the mosaic photodetector are made in a monolithic design as unpackaged monolithic photodetectors in the form of CM crystals with additionally integrated PSE arrays on them,

unpackaged monolithic photodetector submodules of the MFP are made with the provision of extremely minimal (5-8 μm) areas of damage to semiconductor materials and multilayer microstructures at the abutting edges of the crystals,

unpackaged monolithic photodetector submodules are directly placed on a single carrier plate,

fastening of frameless monolithic submodules on a carrier plate is performed using micropillars or a small predetermined amount (layers) of vacuum heat-conducting retaining material under each submodule,

if necessary, the carrier plate is made of a material that is transparent in the working spectral range.

The sixth version of the MFP (Fig. 14) of ultra-high dimension with the limiting efficiency of image conversion (according to the first version of the design) consists of a matrix of n × m photodetecting submodules, where n = 1, 2, 3, 4, 5, 6, 7, 8, ... ∞, m = 1, 2, 3, 4, 5, 6, 7, 8,… ∞, (n ≠ m at n = 1 or at m = 1), the photodetector submodules are installed end-to-end to each other on the carrier plate ,

Cooled open-frame hybrid submodules based on PSEs of various types, for example, KPT photodiodes and MSQP photodetectors, photosensitive in different specified spectral ranges, are placed simultaneously and in specified combinations on a single carrier plate.

MFP according to the sixth option has a combined, i.e. combining broadband (MCT) and narrowband (MSQW) parts, spectral characteristic of photosensitivity due to the use of different photodetector crystals of submodules based on PSEs of various types: KPT photo diodes and MSQW photodetectors operating in different IR spectral ranges (Fig. 14).

The seventh version of the MFP (Fig. 15) of ultra-high dimension with the limiting efficiency of image conversion (according to the first version of the design) consists of a matrix of n × m photodetecting submodules, where n = 1, 2, 3, 4, 5, 6, 7, 8, ... ∞, m = 1, 2, 3, 4, 5, 6, 7, 8,… ∞, (n ≠ m at n = 1 or at m = 1), the photodetector submodules are installed end-to-end on the carrier plate ,

uncooled unpackaged monolithic submodules based on microbolometric elements of various types, sensitive in different preset spectral IR and THz ranges, are placed simultaneously and in preset combinations on a single carrier plate.

According to the seventh version, the MFP has a combined one, i.e. combining broadband and narrowband parts, spectral characteristic of sensitivity due to the use of different crystals of submodules based on microbolometric elements of various types operating in different IR and THz ranges (Fig. 15).

The eighth version of the ultra-high-dimensional FPM with the limiting image conversion efficiency (according to the first design version) consists of a matrix of n × m photodetector submodules, where n = 1, 2, 3, 4, 5, 6, 7, 8, ... ∞, m = 1 , 2, 3, 4, 5, 6, 7, 8,… ∞, (n ≠ m at n = 1 or at m = 1), the photodetector submodules are installed butt-to-side to each other on the carrier plate,

edge PSEs of submodules are made smaller in area relative to the dimensions of PSEs located inside the matrix,

and the corresponding correction of the PSE signals is provided in the video processor and / or in the CM.

The ninth version of the MFP (Fig. 16) of ultra-high dimension with the limiting efficiency of image conversion (according to the first version of the design) consists of a matrix of n × m photodetecting submodules, where n = 1, 2, 3, 4, 5, 6, 7, 8, ... ∞, m = 1, 2, 3, 4, 5, 6, 7, 8,… ∞, (n ≠ m at n = 1 or at m = 1), the photodetector submodules are installed end-to-end on the carrier plate ,

above each edge PSE of a smaller area, an individual integral bifocal lens of the corresponding spectral range is placed, focusing on each reduced edge element of the submodule radiation from a larger area equivalent to the area of the PSE inside the matrix.

The tenth version of the MFP (Fig. 17 a ) of ultra-high dimension with the limiting efficiency of image conversion (according to the first version of the design) consists of a matrix of n × m photodetecting submodules, where n = 1, 2, 3, 4, 5, 6, 7, 8, … ∞, m = 1, 2, 3, 4, 5, 6, 7, 8,… ∞, (n ≠ m at n = 1 or at m = 1), the photodetector submodules are installed end-to-end to each other on the plate carrier,

above the "blind zones" are placed optical prisms of the corresponding spectral ranges, transmitting to each reduced edge element of the submodules radiation from a larger area equivalent to the area of the PSE inside the matrix, the linear dimensions of the optical prisms correspond to the dimensions of the "blind zones";

while pos. 46 are used if necessary, optical prisms of appropriate designs and shapes are made from appropriate materials (for more details, see the eleventh option).

The eleventh version of the MFP (Fig. 17 a -c) of ultra-high dimension with the limiting efficiency of image conversion (according to the tenth version of the design) consists of a matrix of n × m photodetector submodules, where n = 1, 2, 3, 4, 5, 6, 7, 8,… ∞, m = 1, 2, 3, 4, 5, 6, 7, 8,… ∞, (n ≠ m at n = 1 or at m = 1), the photodetector submodules are installed end-to-end to each other on carrier plate,

optical prisms of specified spectral ranges, located above the "blind zones", are made in the form of various structures of different (simple and complex) shapes to collect the radiation flux by reduced edge PSEs of the MPP submodules with a larger area equivalent to the PSE area inside the matrix;

the specified optical prisms are made in the form of rotary and fixed structures of triangular, diamond-shaped, trapezoidal, complex trapezoidal, angular, simple and complex "M" - and "Δ" -shaped; in the form of optical wave channels, transmitting radiation from an area equal to the PSE area inside the matrix to the reduced edge elements of the submodules;

Corresponding optical prisms are made of various materials that are transparent in specified spectral ranges, have different refractive indices and include semitransparent and opaque mirror surfaces for the corresponding spectral ranges.

The twelfth version of the MFP (Fig. 18 a- h) of ultra-high dimension with the limiting efficiency of image conversion (according to the first version of the design) consists of a matrix of n × m photodetector submodules, where n = 1, 2, 3, 4, 5, 6, 7, 8,… ∞, m = 1, 2, 3, 4, 5, 6, 7, 8,… ∞, (n ≠ m at n = 1 or at m = 1), the photodetector submodules are installed end-to-end to each other on carrier plate,

Edge microbolometric elements sensitive in IR or THz ranges are made so that parts of microbolometric elements overlap areas of damage to semiconductor materials at abutting edges of adjacent submodules, and in some cases also areas of gaps between submodules, thereby eliminating the "blind zone".

The thirteenth version of the MFP (Fig. 19) of ultra-high dimension with the limiting efficiency of image conversion (according to the first version of the design) consists of a matrix of n × m photodetecting submodules, where n = 1, 2, 3, 4, 5, 6, 7, 8, ... ∞, m = 1, 2, 3, 4, 5, 6, 7, 8,… ∞, (n ≠ m at n = 1 or at m = 1), the photodetector submodules are installed end-to-end on the carrier plate ,

Edge microbolometric elements with antennas sensitive in the THz range are made so that parts of the antennas that are asymmetric with respect to the microbolometric elements overlap areas of damage to semiconductor materials at the abutting edges of adjacent submodules, thereby eliminating the "blind zone".

The fourteenth version of an ultrahigh-dimensional FPM with the limiting efficiency of image conversion (according to the first version of the design) consists of a matrix of n × m photodetecting submodules, where n = 1, 2, 3, 4, 5, 6, 7, 8, ... ∞, m = 1 , 2, 3, 4, 5, 6, 7, 8,… ∞, (n ≠ m at n = 1 or at m = 1), the photodetector submodules are installed butt-to-side to each other on the carrier plate,

As SE, individual antenna structures are used, the radiation pattern and transmission coefficient of which in a given range are optimized by equalizing the sensitivity to radiation of edge elements and elements located inside the receiving matrix of submodules.

Achievement of the technical result in the variants of the method of manufacturing the MFP is based on the installation, positioning and fixation of the crystals of the submodules butt-to-end to each other directly on a single heat-conducting plate-carrier with minimum (no more than 2 μm) gaps or without gaps between adjacent crystals of submodules (Fig. 26) , on the original precision formation of the crystal faces of submodules with the provision of extremely minimal (5-8 μm) areas of damage to multilayer microstructures and semiconductor materials at the abutting edges of the crystals, on the formation of holes in the carrier plate in the places of the proposed placement of the crystals of submodules, the number of holes per submodule is determined in each case individually by calculation and experiment, using a vacuum gripper, a vacuum line and a vacuum pump for fixing the crystals of submodules in the process of manufacturing MFP, using a support bar in the form of a rectangular frame, if necessary with additional inserts and / or with limiters for aligning the crystals of submodules in height, on an additional study of the performance of crystals and grading according to the parameters of submodules, including the roughness of the edges and thickness of the crystals, according to the results of which the replacement of submodules, rejected and out of order during the manufacturing process MFP, and on the use of a semi-automatic micromanipulator and / or an automatic micromanipulator-robot.

EXPERIMENTAL BASIS OF THE INVENTION

The above results were obtained in a proactive search study of the effect of laser radiation and laser modes on various semiconductor materials and multilayer microstructures during scribing and crystal edge formation on various original experimental installations, as well as in the study of technological principles for creating prototypes of high and ultra-high dimension, precision microassembly of hybrid ICs. methods of performing and modes of technological operation of precision scribing and forming the edges of crystals, precision microassembly of crystals of submodules of high and ultrahigh dimension on experimental and industrial automated installations [Klimenko A.G., Novoselov A.R., Nedoseksha T.N., Karnaeva N.V. ., Marchishin I.V., Ovsyuk V.N., Esaev D.E. Assembly technology of large-format infrared photodetector modules on indium micropillars // Optical journal. 2009. Vol. 76, no. 12. S. 63-68; Novoselov A.R. Development of highly efficient mosaic photodetectors based on photosensitive element lines // Avtometriya. 2010. T. 46, No. 6. S.106-115; Klimenko A.G., Kozlov A.I., Novoselov A.R., Demyanenko M.A., Esaev D.G., Marchishin I.V., Ovsyuk V.N.Image conversion in mosaic uncooled microbolometric infrared and terahertz receivers ranges up to 3072 × 576 and more // Optical Journal. 2014. T. 81, No. 3. S. 35-43; Klimenko A.G., Kozlov A.I., Novoselov A.R., Demyanenko M.A., Esaev D.G., Marchishin I.V., Ovsyuk V.N. Development of mosaic uncooled microbolometric receivers for infrared and terahertz spectral ranges up to 3072 × 576 and more // Uspekhi prikladnoi fiziki. 2014.2, no. 2. Pp. 123-130; Kozlov A.I., Novoselov A.R., Demyanenko M.A., Ovsyuk V.N. About mosaic uncooled microbolometric receivers of infrared and terahertz ranges // Avtometriya. 2016.Vol. 52, No. 2. S. 115-121; Novoselov A.R. Method of reducing the gap between chips in mosaic photodetector modules // Avtometriya. 2016.Vol. 52, No. 1. S. 116-121; Kozlov A.I., Novoselov A.R., Demyanenko M.A., Ovsyuk V.N. Improving the efficiency of image conversion in mosaic microbolometric receivers // Optical journal. 2018.Vol. 85, No. 2. P. 60-66] (Fig. 25).

The achieved technological level of the operation of forming abutting edges of crystals by laser radiation is shown in Fig. 27-29. Laser formation of crystal edges is carried out in a multi-pass mode (speed 120 μm / sec), with a given angle of inclination of the optical axis of radiation to the surface normal. With this method of formation, the wall of the groove on the side of the crystal has a minimum deviation from the normal to the surface; there is no material melt on the planar side of the crystal (Fig. 27). To reduce the width of the damage area for multilayer microstructures and semiconductor materials, it is necessary to limit the radiation spot to two areas: a central area in which the radiation energy density is sufficient for the material to go into a gaseous state, and an area in which the energy density is above the melting threshold. For this purpose, a protective layer of photoresist, opaque at a given wavelength, is applied to the surface of the photodetector (Fig. 28). The developed method of forming the edges of crystals with the selected method of splitting the edge of the crystal provides a flat, perpendicular to the planar side, the lateral surface of the crystal of the submodule and allows you to combine adjacent submodules without gaps or with minimal gaps (Fig. 26b); the crystal edge roughness is about 1 μm or less. The dependences of the change in the current of the pn junctions in the CM on the distance to the edge of the scribing groove, shown in Fig. 29, confirm the obtained theoretical and experimental data.

OPERATING PRINCIPLE OF SUPER-HIGH DIMENSIONAL MFP WITH ULTIMATE IMAGE CONVERSION EFFICIENCY

The image of the visualized scene is focused on the focal surface of the PSE of the MPP matrices. Unpackaged hybrid submodules consisting of crystals of PSE matrices and CM crystals, or unpackaged monolithic submodules in the form of CM crystals with PSEs placed on them in specially designated places, are placed on a single carrier plate without gaps or with minimal (no more than 2 μm) gaps between adjacent crystals. The PSE matrices of submodules can be rectangular or square, consist of one, two, three, four (for example, in the form of a 2 × 2 array) or more elements, which is determined by the required spatial resolution of the MFP (Fig.20b, Fig. 24, Fig. 25 , fig. 30, fig. 32).

MFP according to the sixth and / or seventh options consist of various combinations of submodules, photosensitive in different (UV, visible, IR, THz, etc.) spectral ranges and made on the basis of CCD devices, silicon photodiodes, KPT photodiodes, MSQW - photodetectors, detectors based on superlattices or microbolometers, depending on the task solved by the thermal imaging device, which includes this MFP. The MFP according to the seventh embodiment, for example, shown in Fig. 15, has a combined spectral response characteristic due to the use of different types of crystals of submodules based on microbolometers, operating simultaneously in different spectral ranges: IR and THz.

The separation of the radiation flux or photons incident on the PSE matrix is carried out in the specified spectral ranges by beam splitters. In some cases, the optical system is not used. Each submodule operates within its assigned range. The long-wavelength photosensitivity limit, for example, in the IR spectral range is provided by the PSE design, and the short-wavelength photosensitivity limit is provided by a "cut-off" optical filter. CM submodules provide parallel reading and processing of signals from PSE matrices of specified spectral ranges. Subsequent processing and alignment of images in different spectral ranges from individual submodules is carried out by a signal video processor.

EXAMPLES OF THE PROPOSED OPTIONS OF A METHOD FOR CREATING A MFP OF SUPER HIGH DIMENSION WITH THE ULTIMATE EFFICIENCY OF IMAGE CONVERSION

As information confirming the possibility of implementing variants of the method for manufacturing an ultrahigh-dimensional MFP with the achievement of the specified technical result, we give the following examples of implementation.

Example 1

Consider an example of manufacturing a MFP with a format of 1152 × 576 elements from open-frame submodules with a dimension of 384 × 288 elements (Figs. 30-31). The production of a MFP based on a 3 × 2 submodule matrix is carried out using fiducial marks; the minimum gap along the "X" and "Y" coordinates between the crystals of adjacent submodules is absent or does not exceed 2 microns.

Preparatory stage (Fig. 31 a ):

A carrier plate (pos. 33) of appropriate dimensions is made, crystals and submodules of appropriate formats are made, and topological reference marks are created on the crystals of submodules during the manufacturing process. The operability is examined and the submodules are sorted according to the parameters, including the roughness of the edges and the thickness of the crystals. Support strips (item 51) are made, the length is not less than the total length of three abutting adjacent submodules, and the height is greater than the height of the submodule crystal (~ 10 μm), carriers of external reference marks are made (item 52), external reference marks are made. If necessary, use two carriers of external fiducial marks per submodule.

On the front side of the crystals, the abutting edges of all submodules recognized as suitable and necessary for micro-assembly of the MFP crystals are formed by laser radiation. Additional precision formation of the edges of the crystals of the submodules is performed as follows: a protective layer of photoresist is applied to the front surface of the crystal of the submodule, then the edges of the crystal are formed by laser radiation with a given wavelength in a multi-pass mode with a given angle of inclination of the optical axis of radiation to the normal of the surface of the crystal being processed, the edge of the crystal is split off with the use of a wedge shifted under the crystal, the abutting edges of the crystal are additionally formed by repeated removal (evaporation) of the inclined part and the protrusion on the lateral surface of the crystal from the back, non-working side of the crystal by laser radiation, after which the technological operation of removing the photoresist layer from the processed crystal is performed.

Holes are formed in the heat-conducting plate-carrier (pos. 33) in the places of the intended placement of the crystals of the submodules. The number of holes per submodule is determined in each case individually. Before installing the submodule on the surface of the carrier plate (pos. 33), a small predetermined amount (layers) of a vacuum heat-conducting retaining material is applied to the place of the intended placement of the crystal. The installation and fixation of the crystals of the submodules is carried out sequentially, crystal by crystal, butt to each other directly on a single heat-conducting plate-carrier.

Stage 1 (fig. 31 a ):

Parallel to the top edge of the carrier plate (key 33), install the support bar (key 51). A vacuum line is brought from below to the first hole (group of holes) in the carrier plate (pos. 33), corresponding to the place of the proposed placement of the first submodule. With the help of micromanipulators, the first submodule is captured and installed in the place of the intended placement on the carrier plate (pos. 33). The positioning of the first and subsequent submodules on the surface of the carrier plate (pos. 33) is carried out using micromanipulators and using a microscope and / or video camera until the topological reference marks on the installed submodule coincide with external reference marks on the carrier of reference marks (position 52). Hereinafter, if necessary, limiters for aligning the crystals of submodules in height (along "Z") are used. A layer of vacuum heat-conducting retaining material under the crystal ensures smooth movement of the submodules over the surface of the carrier plate (item 33) for final positioning. Then the vacuum line is connected to a vacuum pump for a while to polymerize / solidify the layers of the holding material under the first crystal to be installed on the carrier plate (item 33), while the first submodule is held in place using micromanipulators.

Let us consider in more detail the positioning of the submodules on the surface of the carrier plate (pos. 33), which is carried out using micromanipulators. The orientation of the submodules during positioning can be done in three ways. First, the orientation of the submodules during positioning can be carried out using a microscope and / or a video camera until the topological fiducial marks on the installed submodule coincide with external fiducial marks on an individual fiducial mark carrier for each submodule (pos. 52). Individual carriers of fiducial marks (item 52), for example, for the first row of submodules, can be fixed on one support bar (item 51), as shown in FIG. 21 a, or on the previous line crystals submodules as shown in FIG. 21b. Second, the orientation of the submodules during positioning can be carried out using a microscope and / or a video camera until the topological fiducial marks on the installed submodule coincide with external fiducial marks on a carrier of fiducial marks that is common for the entire row of submodules (pos. 52). The carrier of fiducial marks, which is uniform for the entire row of submodules (pos. 52), can be fixed on two support strips (pos. 51), as shown in FIG. 22. Third, the orientation of the submodules during positioning can be carried out using a vision system made on the basis of a video camera and providing the alignment of the corresponding fiducial marks (pos. 54-55) of crystals of adjacent rows of submodules (Fig. 23).

Stage 2 (fig.31b):

A vacuum line is brought to the second hole (group of holes) in the carrier plate (pos. 33), corresponding to the place of the proposed location of the second submodule. The second submodule is installed on the specified place of the carrier plate (pos. 33). The capture of the second submodule, precision close docking of the second submodule with the fixed first submodule, the movement of the second submodule along the surface of the carrier plate (pos. 33) is performed using micromanipulators until the topological fiducial marks on the second submodule to be installed coincide with the external fiducial marks on the carrier of fiducial marks (pos. . 52). Then the vacuum line is connected to a vacuum pump for a while for the polymerization / solidification of the layers of the retaining material under the second submodule installed on the carrier plate (item 33).

Stage 3 (fig.31c):

A vacuum line is brought to the third hole (group of holes) in the carrier plate (pos. 33), corresponding to the place of the proposed placement of the third submodule. The capture, installation, movement of the third submodule, taking into account the orientation along the edge of the crystal of the already installed second submodule, is performed using micromanipulators until the corresponding external fiducial marks on the fiducial mark carrier (item 52) match with the topological fiducial marks on the third submodule being installed, then the vacuum line is connected to a vacuum pump for a while to polymerize / harden the layers of the retaining material under the third submodule to be installed on the carrier plate (pos. 33).

Stage 4 (Fig.31d):

Parallel to the left edge of the carrier plate (key 33), install a second support bar (key 51). The fourth submodule is installed and moved until the corresponding fiducial marks coincide with the micromanipulators, and then held in place until the layers of the retaining material are polymerized / solidified with the micromanipulators and vacuum in the same way as for the first, second and third submodules.

Stage 5 (Fig.31e):

Parallel to the bottom edge of the carrier plate (key 33), install a third support bar (key 51). The fifth submodule is installed and moved until the corresponding fiducial marks coincide with the micromanipulators, and then held in place until the layers of the retention material are polymerized / solidified using the micromanipulators and vacuum in the manner described above.

Stage 6 (Fig.31e):

The sixth submodule is installed and moved until the corresponding fiducial marks coincide with the micromanipulators, and then held in place until the layers of the retention material are polymerized / solidified using the micromanipulators and vacuum in the manner described above.

In the process of manufacturing the MFP on the carrier plate, an additional study of the performance of the crystals of the submodules is carried out and the grading is carried out according to parameters, including the roughness of the edges and the thickness of the crystals, according to the results of which the replacement of submodules, rejected and failed by removing the rejected submodules and installing them in their place, is performed. of known acceptable submodules in the manner described above.

FIG. 32 shows a MFP with dimensions of 1152 × 576 in the form of a matrix of 3 × 2 submodules with a format of 384 × 288, indicating the locations of the "blind zone" and its technological part, with a variant of the location of the IR image on the PSE matrices of submodules and with subsequent electronic assembly of the resulting thermal image in a video processor in random-address RAM.

MFP format 1152 × 576 works as follows (Fig. 32). The input image of the rendered scene is projected onto the PSE matrix of the submodules using an optical system. In each submodule in the PSE, the incident radiation is converted into electrical signals, which are processed and read using CM. The output signals of the CM of the submodules are transmitted to the video processor, in which electronic assembly of the resulting thermal image is carried out in randomly addressed RAM. The resulting thermal image can be displayed on a monitor for visualization.

Example 2

Let us consider an example of manufacturing a MFP with a dimension of 1152 × 864 elements based on unpackaged submodules with a format of 384 × 288 PSEs (Fig. 33). Manufacturing of MFP based on a matrix of 3 × 3 submodules is carried out using fiducial marks; the minimum gap along the "X" and "Y" coordinates between the crystals of adjacent submodules is absent or does not exceed 2 microns.

Preparatory stage (fig. 33 a ):

A carrier plate (pos. 33) of appropriate dimensions is made, crystals and submodules of appropriate formats are made, topological reference marks are created on the crystals of submodules during the manufacturing process; fiducial marks in the case of FIG. 30 are integrated into the crystal of the PSE matrix. The operability is examined and the submodules are sorted according to the parameters, including the roughness of the edges and the thickness of the crystals. Support strips (item 51) are made, the length is not less than the total length of three abutting adjacent submodules, and the height is greater than the height of the submodule crystal (~ 10 μm), carriers of external reference marks are made (item 52), external reference marks are made. If necessary, use two carriers of external fiducial marks per submodule.

On the front side of the crystals, the abutting edges of all submodules recognized as suitable and necessary for micro-assembly of the MFP crystals are formed by laser radiation. Additional precision formation of the edges of the crystals of the submodules is performed as follows: a protective layer of photoresist is applied to the front surface of the crystal of the submodule, then the edges of the crystal are formed by laser radiation with a given wavelength in a multi-pass mode with a given angle of inclination of the optical axis of radiation to the normal of the surface of the crystal being processed, the edge of the crystal is split off with the use of a wedge shifted under the crystal, the abutting edges of the crystal are additionally formed by repeated removal of the inclined part and the protrusion on the lateral surface of the crystal from the back, non-working side of the crystal with laser radiation;

Holes are formed in the heat-conducting plate-carrier (pos. 33) in the places of the intended placement of the crystals of the submodules. Before installing the submodule on the surface of the carrier plate (pos. 33), a small predetermined amount (layers) of a vacuum heat-conducting retaining material is applied to the crystal installation site. The installation and fixation of the crystals of the submodules is carried out sequentially, crystal by crystal, butt to each other directly on a single heat-conducting plate-carrier.

Stage 1 (fig. 33 a ):

Parallel to the top edge of the carrier plate (key 33), install the support bar (key 51). A vacuum line is brought from below to the first hole (group of holes) in the carrier plate (pos. 33), corresponding to the place of the proposed placement of the first submodule. Using micromanipulators, the first submodule is gripped and installed on the carrier plate (pos. 33) in the place of the intended placement, the submodule on the carrier plate (pos. 33) is aligned along the "X" and "Y" axes. Hereinafter, if necessary, limiters for aligning the crystals of submodules in height (along "Z") are used. The positioning of the first and subsequent submodules on the surface of the carrier plate (pos. 33) is carried out using micromanipulators and using a microscope and / or video camera until the topological reference marks on the installed submodule coincide with external reference marks on the carrier of reference marks (position 52). Then the vacuum line is connected to a vacuum pump for a while to polymerize / solidify the layers of the holding material under the first crystal to be installed on the carrier plate (item 33).

A vacuum line is brought to the second hole (group of holes) in the carrier plate (pos. 33), corresponding to the place of the proposed location of the second submodule. The second submodule is installed on the predetermined place of the carrier plate. The capture of the second submodule, precision close docking of the second submodule with the fixed first submodule, the movement of the second submodule along the surface of the carrier plate (pos. 33) is performed using micromanipulators until the topological fiducial marks on the second submodule to be installed coincide with the external fiducial marks on the carrier of fiducial marks (pos. . 52). Then the vacuum line is connected to a vacuum pump for a while for the polymerization / solidification of the layers of the retaining material under the second submodule installed on the carrier plate (item 33).

A vacuum line is brought to the third hole (group of holes) in the carrier plate (pos. 33), corresponding to the place of the proposed placement of the third submodule. The capture, installation, movement of the third submodule, taking into account the orientation along the edge of the crystal of the already installed second submodule, is performed using micromanipulators until the corresponding external fiducial marks on the fiducial mark carrier (item 52) match with the topological fiducial marks on the third submodule being installed, then the vacuum line is connected to a vacuum pump for a while to polymerize / harden the layers of the retaining material under the third submodule to be installed on the carrier plate (pos. 33).

Stage 2 (fig.33b):

Parallel to the left edge of the carrier plate (key 33), install a second support bar (key 51). The fourth submodule is installed and moved until the corresponding fiducial marks coincide with the micromanipulators, and then held in place until the layers of the retaining material are polymerized / solidified with the micromanipulators and vacuum in the same way as for the first, second and third submodules.

Stage 3 (fig.33c):

Parallel to the lower edge of the carrier plate (pos. 33), a third support bar (pos. 51) is installed on its surface. The fifth and sixth submodules are installed and moved until the corresponding fiducial marks coincide with the micromanipulators, and then held in place until the layers of the retention material are polymerized / solidified using the micromanipulators and vacuum in the manner described above.

Stage 4 (fig.33d):

Parallel to the left edge of the carrier plate (key 33), install a fourth support bar (key 51). The seventh submodule is installed and moved until the corresponding fiducial marks coincide with the micromanipulators, and then held in place until the layers of the retention material are polymerized / solidified using the micromanipulators and vacuum in the manner described above.

Stage 5 (fig. 33e):

Parallel to the bottom edge of the carrier plate (key 33), install a fifth support bar (key 51). The eighth and ninth submodules are installed and moved until the corresponding fiducial marks coincide with the micromanipulators, and then held in place until the layers of the retention material are polymerized / solidified using the micromanipulators and vacuum in the manner described above.

Example 3

Consider an example of manufacturing a MFP with a dimension of 1152 × 864 elements from unpackaged submodules with a 384 × 288 PSE format using a support bar (pos. 51) in the form of a rectangular frame (Fig. 24). The MFP is fabricated on the basis of a 3 × 3 submodule matrix; the minimum gap along the "X" and "Y" coordinates between the crystals of adjacent submodules is absent or does not exceed 2 microns.

A carrier plate (pos. 33) of appropriate dimensions is made, crystals and submodules of appropriate formats are made, topological reference marks and additional reference marks are created on the crystals of submodules; fiducial marks and additional fiducial marks in the case of FIG. 24 are integrated into the crystal of the PSE matrix. The operability is examined and the submodules are sorted according to the parameters, including the roughness of the edges and the thickness of the crystals. Carriers of external fiducial marks are made (pos. 52), external fiducial marks are made. If necessary, use two carriers of external fiducial marks per submodule. A support bar (item 51) is made in the form of a rectangular frame, the internal dimensions of which correspond to the dimensions of the MFP to be created, holes are created in the carrier plate at the places where the submodules are supposed to be placed. Before installing the submodule on the surface of the carrier plate (pos. 33), a small predetermined amount (layers) of a vacuum heat-conducting retaining material is applied to the crystal installation site.

On the front side of the crystals, the abutting edges of all submodules recognized as suitable and necessary for micro-assembly of the MFP crystals are formed by laser radiation. Additional precision formation of the edges of the crystals of the submodules is performed as follows: a protective layer of photoresist is applied to the front surface of the crystal of the submodule, then the edges of the crystal are formed by laser radiation with a given wavelength in a multi-pass mode with a given angle of inclination of the optical axis of radiation to the normal of the surface of the crystal being processed, the edge of the crystal is split off with the use of a wedge shifted under the crystal, the abutting edges of the crystal are additionally formed by repeated removal of the inclined part and the protrusion on the side surface of the crystal from the back, non-working side of the crystal with laser radiation, after which the photoresist layer is removed from the processed crystal.

The capture and installation of each submodule on the carrier plate at specified places within a rectangular frame is performed using micromanipulators without gaps or with minimal (no more than 2 microns) gaps along the "X" and "Y" coordinates between adjacent crystals, if necessary, use crystal alignment limiters submodules in height (along "Z"), to each hole (group of holes) in the carrier plate corresponding to the place of the intended location of the submodule to be installed, vacuum lines are brought from below, after installing all submodules at the given places of the carrier plate, the submodules are fixed simultaneously by connecting vacuum lines to the vacuum pump temporarily for polymerization / solidification of the layers of the retaining material under the mounted submodules on the carrier plate (Fig. 24).

Example 4

Consider an example of manufacturing a MFP with a dimension of 1152 × 864 elements from open-frame submodules with a 384 × 288 PSE format using a support bar (pos. 51) in the form of a rectangular frame and additional support inserts (Fig. 25). The production of the MFP is carried out on the basis of a matrix of 3 × 3 submodules; the minimum gap along the "X" and "Y" coordinates between the crystals of the submodules does not exceed 2 microns.

A carrier plate (pos. 33) of the appropriate size is made, crystals and submodules of appropriate formats are made, topological fiducial marks and additional fiducial marks are created on the crystals of submodules; fiducial marks and additional fiducial marks in the case of FIG. 20 are integrated into the crystal of the PSE matrix. The operability is examined and the submodules are sorted according to the parameters, including the roughness of the edges and the thickness of the crystals. Carriers of external fiducial marks are made (pos. 52), external fiducial marks are made. If necessary, use two carriers of external fiducial marks per submodule. A support bar (item 51) is made in the form of a rectangular frame, the internal dimensions of which correspond to the dimensions of the created MFP, taking into account the need to place additional support bars-inserts, holes (groups of holes) are created in the carrier plate in the places of the intended placement of submodules. Before installing the submodule on the surface of the carrier plate (pos. 33), a small predetermined amount (layers) of a vacuum heat-conducting retaining material is applied to the crystal installation site.

Inside the support strip, made in the form of a corresponding rectangular frame, along the edges on each side there are four additional support strip-inserts, with a length corresponding to the dimensions of the MFP being created (Fig. 25).

On the front side of the crystals, the abutting edges of all submodules recognized as suitable and necessary for micro-assembly of the MFP crystals are formed by laser radiation. Additional precision formation of the edges of the crystals of the submodules is performed as follows: a protective layer of photoresist is applied to the front surface of the crystal of the submodule, then the edges of the crystal are formed by laser radiation with a given wavelength in a multi-pass mode with a given angle of inclination of the optical axis of radiation to the normal of the surface of the crystal being processed, the edge of the crystal is split off with the use of a wedge shifted under the crystal, the abutting edges of the crystal are additionally formed by repeated removal of the inclined part and the protrusion on the side surface of the crystal from the back, non-working side of the crystal with laser radiation, after which the photoresist layer is removed from the processed crystal.

The capture and installation of each submodule on the carrier plate at specified places within a rectangular frame is performed using micromanipulators without gaps or with minimal (no more than 2 microns) gaps between adjacent crystals, if necessary, use limiters for aligning the crystals of submodules in height (along "Z") , vacuum lines are supplied from below to each hole (group of holes) in the carrier plate corresponding to the place of the proposed placement of the submodule, after installing all the submodules at the given places of the carrier plate, the submodules are fixed simultaneously by connecting vacuum lines to a vacuum pump for a while for polymerization / solidification of the layers of retaining material under the installed submodules on the carrier plate (Fig. 25).

Example 5

Consider an example of manufacturing a MFP with a dimension of 1152 × 864 PSE from unpackaged submodules with a format of 384x288 elements using additional reference marks (Figs. 21-23, 34). The production of the MFP is carried out on the basis of a matrix of 3 × 3 submodules; the minimum gap along the "X" and "Y" coordinates between the crystals of the submodules does not exceed 2 microns.

Preparatory stage (fig. 21 a ):

A carrier plate (pos. 33) of the appropriate size is made, crystals and submodules of appropriate formats are made, topological fiducial marks and additional fiducial marks are created on the crystals of submodules; fiducial marks and additional fiducial marks in the case of FIG. 34 are integrated into the crystal of the PSE matrix. The operability is examined and the submodules are sorted according to the parameters, including the roughness of the edges and the thickness of the crystals. Support strips (item 51) are made, the length is not less than the total length of three abutting adjacent submodules, and the height is greater than the height of the submodule crystal (~ 10 μm), carriers of external reference marks are made (item 52), external reference marks are made. If necessary, use two carriers of external fiducial marks per submodule.

On the front side of the crystals, the abutting edges of all submodules recognized as suitable and necessary for micro-assembly of the MFP crystals are formed by laser radiation. Additional precision formation of the edges of the crystals of the submodules is performed as follows: a protective layer of photoresist is applied to the front surface of the crystal of the submodule, then the edges of the crystal are formed by laser radiation with a given wavelength in a multi-pass mode with a given angle of inclination of the optical axis of radiation to the normal of the surface of the crystal being processed, the edge of the crystal is split off with the use of a wedge shifted under the crystal, the abutting edges of the crystal are additionally formed by repeated removal of the inclined part and the protrusion on the lateral surface of the crystal from the back, non-working side of the crystal with laser radiation, after which the technological operation of removing the photoresist layer from the crystal being processed is performed.

Holes are formed in the heat-conducting plate-carrier (pos. 33) in the places of the intended placement of the crystals of the submodules. Before installing the submodule on the surface of the carrier plate (pos. 33), a small predetermined amount (layers) of a vacuum heat-conducting retaining material is applied to the crystal installation site. The installation and fixation of the crystals of the submodules is carried out sequentially, crystal by crystal, butt to each other directly on a single heat-conducting plate-carrier.

Step 1 (Fig 21 a.)

Parallel to the top edge of the carrier plate (key 33), install the support bar (key 51). A vacuum line is brought to the first hole (group of holes) in the carrier plate (pos. 33), corresponding to the place of the proposed placement of the first submodule. Using micromanipulators, grab and install the first submodule on the carrier plate (pos. 33) in the place of the intended placement, align the submodule on the carrier plate (pos. 33) along the "X" and "Y" axes using support bars (pos. 51 ), carriers of fiducial marks (pos. 52) and fiducial marks proper. If necessary, use limiters for the alignment of the crystals of the submodules in height (along "Z"). The positioning of the submodules on the surface of the carrier plate (pos. 33) is carried out using micromanipulators. The orientation of the submodules during positioning can be done in three ways (see example 1). After precise positioning of the submodule, the vacuum line is connected to a vacuum pump for a while for polymerization / solidification of the layers of the holding material under the first crystal to be installed on the carrier plate (item 33).

A vacuum line is brought to the second hole (group of holes) in the carrier plate (pos. 33), corresponding to the place of the proposed location of the second submodule. The second submodule is installed on the specified place of the carrier plate (pos. 33). The capture of the second submodule, precision close docking of the installed second submodule with the fixed first submodule, movement of the second submodule along the surface of the carrier plate (pos. 33), taking into account the orientation along the edge of the crystal of the already installed first submodule, are performed using micromanipulators until the corresponding reference marks coincide. If necessary, use limiters for the alignment of the crystals of the submodules in height (along "Z"). Then the vacuum line is connected to a vacuum pump for a while for the polymerization / solidification of the layers of the retaining material under the second submodule installed on the carrier plate (item 33).

A vacuum line is brought to the third hole (group of holes) in the carrier plate (pos. 33), corresponding to the place of the proposed placement of the third submodule. The capture, installation and movement of the third submodule to be installed, taking into account the orientation along the edge of the crystal of the already installed second submodule, is performed using micromanipulators until the corresponding reference marks coincide, if necessary, use limiters for aligning the crystals of submodules in height (along the "Z"), then the vacuum line is connected to the vacuum pump for a while to polymerize / harden the layers of retaining material under the third submodule to be installed on the carrier plate (pos. 33).

Stage 2 (fig.21b, 22, 23):

The fourth, fifth and sixth submodules are installed and moved using micromanipulators until the corresponding fiducial marks coincide, and then held in place until polymerization / hardening of the layers of retaining material using micromanipulators and vacuum in the same way as for the first, second and third submodules.

Stage 3 (fig. 34):

Variation No. 1 of the third stage (the variant is shown in Fig. 34)

The seventh, eighth and ninth submodules are installed and moved using micromanipulators until the corresponding fiducial marks coincide, and then held in place until polymerization / hardening of the layers of the retaining material using micromanipulators and vacuum in the same way as for the fourth, fifth and sixth submodules.

Variation No. 2 of the third stage (the variant is shown in Fig. 33e)

Parallel to the lower edge of the carrier plate (pos. 33), a support bar (pos. 51) with fiducial markers (pos. 52) is installed. The seventh, eighth and ninth submodules are installed and moved until the corresponding fiducial marks coincide with the micromanipulators, and then held in place until the layers of the retention material are polymerized / solidified using the micromanipulators and vacuum in the manner described above.

Example 6

Semi-automatic method of manufacturing MFP (Fig. 35 a- m).

Carrier plates of appropriate sizes are made, submodules of corresponding formats are made in the form of unpackaged monolithic or hybrid photodetectors, in the process of manufacturing, topological reference marks are created on the crystals of the submodules. The operability is examined and the submodules are sorted according to the parameters, including the roughness of the edges and the thickness of the crystals.

The edges of the crystals of all submodules recognized as suitable and necessary for microassembly are formed, and at n = 1, m = 2 or at n = 2, m = 1, the edges are formed on one face of the crystals, at n = 2, m = 2 - on two faces crystals, at n = 3, 4, 5, 6, 7, 8,… ∞ and m = 2, 3, 4, 5, 6, 7, 8,… ∞ - on two faces of crystals placed in the corners of the n × m submodules, on three faces of crystals of submodules, placed on the edges of the matrix of n × m submodules (except for corner ones), on four faces of crystals, placed inside the matrix of n × m submodules.

Additional precision formation of the edges of the crystals of the submodules is performed as follows: a protective layer of photoresist is applied to the front surface of the crystal of the submodule, then the edges of the crystal are formed by laser radiation with a given wavelength in a multi-pass mode with a given angle of inclination of the optical axis of radiation to the normal of the surface of the crystal being processed, the edge of the crystal is split off with the use of a wedge displaced under the crystal, the abutting edges of the crystal are additionally formed by repeated removal of the inclined part and the protrusion on the lateral surface of the crystal from the back, non-working side of the crystal with laser radiation, after which a technological operation of removing the photoresist layer from the crystal being processed is performed.

On a single carrier plate (pos. 33), topological reference marks are created corresponding to the location of each submodule in the MFP, on the lower movable (along the "Z") part of the microassembly unit, the MFP carrier plate is placed and fixed with a vacuum suction cup, the MFP manufacturing process is performed cyclically: within each cycle, place and fix the submodule with a vacuum suction cup on the upper part of the microassembly unit, place and fix the submodule on the carrier plate without gaps or with minimum (no more than 2 μm) gaps along the "X" and "Y" coordinates between adjacent crystals is performed by lifting the lower movable part of the micro-assembly unit to a predetermined height, then the movable part of the micro-assembly unit is lowered to the lower position, the vacuum is turned off at the grip of the lower part, movement (along "X" and / or "Y") of the carrier plate is carried out at a distance equal to the dimensions of the submodules to be installed, fix the carrier plate (pos. 33) on a new preset place by applying a vacuum ste, install the next submodule (Fig. 35 a- m).

The orientation control and positioning of the installed submodules is carried out using a system of bilateral visualization and alignment based on a microscope and / or a video camera, while each time precision close docking of submodules with already installed submodules is carried out until the MFP of the required dimension is assembled on the carrier plate n × m submodules, and in the case of m = 2, the first and last submodules in each row are installed with close joining on two sides, the second and subsequent submodules (except for the last) in each row are installed with close joining on three sides, and in the case of m > 2 corner submodules are installed with close docking on two sides, edge submodules (except for corner ones) are installed with close docking on three sides, submodules placed inside the matrix of submodules are installed with close docking on four sides, in which, if necessary, a gap is provided between the rows of the n × m matrix of submodules for placement of micro-loops, installation and electrical connection of micro-loops with the contact pads of the submodules and with the contact pads of the carrier plate are performed.

The fixation of the submodules on the surface of the carrier plate is performed using micropillars or a small predetermined amount (layers) of vacuum heat-conducting retaining material under each submodule.

In the process of installing and fixing the submodules on the carrier plate, an additional study of the operability and sorting of the submodule parameters is carried out, including the roughness of the edges and the thickness of the crystals, according to the results of which submodules are replaced, rejected and out of order during the production of the MFP by removing the rejected submodules and installing in their place obviously suitable submodules in the manner described above.

Example 7

An automatic method for manufacturing ultra-high-dimensional MFPs with maximum image conversion efficiency.

Carrier plates of appropriate sizes are made, submodules of the corresponding formats are made in the form of unpackaged monolithic or unpackaged hybrid photodetectors; in the process of manufacturing, topological reference marks are created on the crystals of submodules. The operability is examined and the submodules are sorted according to the parameters, including the roughness of the edges and the thickness of the crystals.

Alignment of external fiducial marks on a carrier plate (pos. 33) or on a carrier of external fiducial marks and topological fiducial marks on installed submodules, as well as movement, installation and fixation of submodules during precision MFP assembly without gaps or with minimal (no more than 2 microns) the gaps along the coordinates "X" and "Y" between adjacent crystals are produced using an automatic micromanipulator-robot.

The fixation of the submodules on the surface of the carrier plate is performed using micropillars or a small predetermined amount (layers) of vacuum heat-conducting retaining material under each submodule.

In the process of installing and fixing the submodules on the carrier plate, an additional study of the operability and sorting of the submodule parameters is carried out, including the roughness of the edges and the thickness of the crystals, according to the results of which submodules are replaced, rejected and out of order during the production of the MFP by removing the rejected submodules and installing in their place obviously suitable submodules.

Claims (134)

1. An ultra-high-dimensional mosaic photodetector (MPD) with the limiting image conversion efficiency, consisting of a matrix of n × m photodetector submodules, where n = 1, 2, 3, 4, 5, 6, 7, 8, ..., m = 1, 2 , 3, 4, 5, 6, 7, 8, ..., n ≠ m at n = 1 or at m = 1, while the photodetector submodules are installed end-to-end on the carrier plate, the monolithic photodetector submodules are made as Unpackaged monolithic photodetectors in the form of CM crystals with additionally integrated PSE arrays on them, and in a hybrid version - as unpackaged hybrid microassemblies from a PSE matrix crystal and a CM crystal, while providing a gap between the rows of the n × m matrix of submodules to accommodate microcircuits with metal wiring and electrical connection of micro loops with the contact pads of the submodules and with the contact pads of the carrier plate, characterized in that monolithic or hybrid photoreceiving submodules of the MFP are manufactured with the provision of minimum 5-8 μm areas of damage to multilayer microstructures and semiconductor materials at the abutting edges of the submodule crystals, monolithic or hybrid photodetector submodules with minimal areas of damage to multilayer microstructures and semiconductor materials at the abutting edges of the crystals are directly placed with the photodetector side up on a single carrier plate without gaps or with a minimum gap of no more than 2 μm between adjacent crystals of submodules. 2. MFP ultra-high dimension with the limiting efficiency of image conversion according to claim 1, characterized in that a single large CM crystal was used as the MPP carrier plate, as submodules, crystals of PSE matrices are used, placed on a single carrier plate - a KM crystal, In this case, the signal contact pads of the CM are electrically connected to the contact pads of the submodules - crystals of the PSE matrices using micropillars. 3. MFP ultra-high dimensionality with the limiting efficiency of image conversion according to claim 1, characterized in that the only large crystal of the PSE matrix is used as the MPP carrier plate, CM crystals are used as submodules placed on a single carrier plate - a PSE matrix crystal, the signal and control contact pads of the submodules - CM are electrically connected to the contact pads of the PSE matrix crystal using micropillars. 4. MFP ultra-high dimensionality with the maximum efficiency of image conversion according to claim 1, characterized in that The unified principle of photo signals reading and addressing to the PSE in the MFP is ensured by the use of microconductors or micro loops connecting the corresponding signal and control, including address, contact pads of adjacent crystals of submodules. 5. MFP ultra-high dimensionality with the maximum efficiency of image conversion according to claim 1, characterized in that MFP submodules are made in a monolithic design as unpackaged monolithic photodetectors in the form of CM crystals with additionally integrated PSE arrays, monolithic photodetector submodules are directly placed on a single carrier plate, mounting of unpackaged monolithic submodules on the carrier plate is performed using micropillars or a small predetermined amount of vacuum heat-conducting retaining material under each submodule, the carrier plate is made of a material that is transparent in the working spectral range. 6. MFP ultra-high dimensionality with the limiting efficiency of image conversion according to claim 1, characterized in that contains cooled hybrid submodules based on PSEs of various types, for example, KPT photodiodes and MSQP photodetectors, photosensitive in different specified spectral ranges, placed simultaneously and in specified combinations on a single carrier plate. 7. MFP ultra-high dimensionality with the limiting efficiency of image conversion according to claim 1, characterized in that contains uncooled monolithic submodules based on microbolometric elements of various types, sensitive in different specified spectral IR and THz ranges, placed simultaneously and in specified combinations on a single carrier plate. 8. MFP ultra-high dimension with the limiting efficiency of image conversion according to any one of paragraphs. 1-7, characterized in that edge PSEs of adjacent submodules are made smaller in area relative to PSE dimensions inside the matrix, and the corresponding correction of the PSE signals is provided in the video processor and / or in the CM. 9. MFP ultra-high dimensionality with the limiting efficiency of image conversion according to claim 8, characterized in that above each edge PSE of a smaller area, an individual integral bifocal lens of the corresponding spectral range is placed, focusing on each reduced edge element of submodules radiation from a larger area equivalent to the PSE area inside the matrix, thereby overlapping "blind zones" from both sides. 10. MFP ultra-high dimensionality with the limiting efficiency of image conversion according to claim 9, characterized in that above the "blind zones" are placed optical prisms of the corresponding spectral ranges, transmitting to each reduced edge element of the submodules radiation from a larger area equivalent to the PSE area inside the matrix, the linear dimensions of the optical prisms correspond to the dimensions of the "blind zones". 11. MFP ultra-high dimensionality with the limiting efficiency of image conversion according to claim 10, characterized in that optical prisms of specified spectral ranges, located above the "blind zones", are made in the form of various structures of different, simple and complex shapes to collect the radiation flux by reduced edge PSEs of the MPP submodules from a larger area equivalent to the PSE area inside the matrix; the specified optical prisms are made in the form of rotary and fixed structures of triangular, diamond-shaped, trapezoidal, complex trapezoidal, angular, simple and complex M- and Δ-shaped shapes; in the form of optical wave channels, transmitting radiation from an area equal to the PSE area inside the matrix to the reduced edge elements of the submodules; Corresponding optical prisms are made of various materials that are transparent in specified spectral ranges, have different refractive indices and include semitransparent and opaque mirror surfaces for the corresponding spectral ranges. 12. MFP ultra-high dimensionality with the maximum efficiency of image conversion according to any one of paragraphs. 1-7, characterized in that edge, sensitive in the IR or THz ranges, microbolometric elements are made in such a way that parts of the microbolometric elements overlap areas of damage to multilayer microstructures and semiconductor materials at the abutting edges of adjacent submodules, and in some cases also the area of gaps between submodules, thereby eliminating the "blind zone" ... 13. MFP ultra-high dimensionality with the maximum efficiency of image conversion according to any one of paragraphs. 1-7, characterized in that Edge microbolometric elements with antennas sensitive in the THz range are made so that parts of the antennas that are asymmetric with respect to the microbolometric elements overlap areas of damage to multilayer microstructures and semiconductor materials at the abutting edges of adjacent submodules, thereby eliminating the "blind zone". 14. MFP ultra-high dimensionality with the limiting efficiency of image conversion according to claim 1, characterized in that As SE, individual antenna structures are used, the radiation pattern and transmission coefficient of which in a given range are optimized by equalizing the sensitivity to radiation of edge elements and elements located inside the receiving matrix of submodules. 15. A method of manufacturing an ultra-high-dimensional MFP with an ultimate image conversion efficiency, which consists in the fact that make a carrier plate of appropriate dimensions with external fiducial marks, make hybrid or monolithic submodules with topological and additional topological reference marks, investigate the performance and sort the submodules according to their parameters, including the roughness of the edges and the thickness of the crystals, prepare the surfaces of crystals of hybrid or monolithic submodules for fixation on the surface of the carrier plate, prepare the surface of the carrier plate for fixing crystals of hybrid or monolithic submodules, make carriers of fiducial marks with external fiducial marks, carry out the application of layers or drops of retention material in the places of the intended placement of the submodules, installation, positioning and fixation of crystals of submodules on the carrier plate is performed in the form of a matrix of n × m submodules, where n = 1, 2, 3, 4, 5, 6, 7, 8, ..., m = 1, 2, 3, 4 , 5, 6, 7, 8, ..., n ≠ m for n = 1 or m = 1, for n = 1, m = 2 or for n = 2, m = 1, the edge is formed on one face of the crystals, for n = 2 and m = 2 - on two faces of the crystals, for n = 3, 4, 5, 6, 7, 8, ... and m = 2, 3, 4, 5, 6, 7, 8, ... - on two faces of crystals placed in the corners of the n × m submodule matrix, on three faces of submodule crystals placed on the edges of the n × m submodules, excluding corner crystals, on four crystal faces placed inside a matrix of n × m submodules, positioning of submodules on the surface of the carrier plate is performed using micromanipulators, control gaps between crystals using a measuring microscope and / or video camera, the submodules are held in place until the layers of retention material have polymerized / hardened, in this case, a gap is provided between the rows of the n × m matrix of submodules to accommodate micro-loops with metal wiring and electrical connection of micro-loops with the contact pads of the submodules and with the contact pads of the carrier plate, characterized in that additional precision formation of abutting crystal faces of all submodules, recognized as suitable and necessary for microassembly of MFPs, ensuring the extremely minimal area of damage to the edges of the crystals is performed as follows: a protective layer of photoresist is applied to the front surface of the crystal of the submodule, a groove and abutting edges of the crystal are formed on the front side by laser radiation with a given wavelength in a multipass mode with a given angle of inclination of the optical axis of radiation to the normal of the surface of the crystal being processed, splitting off the edge of the crystal using a wedge shifted under the crystal, additionally, abutting edges of the crystal are formed by repeated removal of the inclined part of the former groove and the protrusion in the region of the bottom of the former groove on the side surface of the crystal from the back, non-working side of the crystal, by laser radiation, performing a technological operation of removing the photoresist layer from the processed crystal; holes are created in the carrier plate at the places where the submodules are supposed to be located, while the number of holes per submodule is determined in each case individually by calculation and experiment, vacuum lines are connected from below to each hole in the carrier plate corresponding to the place of the intended location of the submodule to be installed, precise positioning and fixation of submodules is carried out with the help of micromanipulators and vacuum grippers, butt-joint to each other on a single heat-conducting plate-carrier without gaps or with a minimum gap of no more than 2 microns between adjacent crystals of submodules, in this case, the positioning of the submodules is carried out until the topological fiducial marks and / or additional topological fiducial marks coincide on the installed submodules with external fiducial marks on the carrier plate or on the carriers of the fiducial marks, limiters are used to align the crystals in height, vacuum is applied to the vacuum gripper for a time to polymerize / solidify the layers of the retaining material under each installed submodule on the carrier plate, in the process of installing and fixing submodules on the carrier plate, an additional study of the operability is carried out and grading according to the parameters of the submodules, including the roughness of the edges and the thickness of the crystals, replace submodules that have failed in the process of manufacturing the MFP by removing the rejected submodules and installing in their place obviously suitable submodules in the manner described above. 16. A method of manufacturing an ultra-high-dimensional MFP with the ultimate image conversion efficiency according to claim 15, characterized in that individual carriers of fiducial marks are fixed, for example, for the first row of submodules on one support bar, for the second and subsequent rows of submodules on the crystals of the previous rows of submodules; orientation of the submodules during positioning is carried out using a microscope and / or a video camera until the topological fiducial marks on the installed submodule coincide with external fiducial marks on an individual fiducial mark carrier for each submodule. 17. A method of manufacturing an ultra-high-dimensional MFP with a limiting image conversion efficiency according to claim 15, characterized in that a single carrier of fiducial marks is fixed on two supporting strips individually for each row of submodules; orientation of the submodules during positioning is carried out using a microscope and / or a video camera until the topological fiducial marks on the installed submodule coincide with external fiducial marks on a carrier of fiducial marks that is common for the entire row of submodules. 18. A method of manufacturing an ultra-high-dimensional MFP with the ultimate image conversion efficiency according to claim 15, characterized in that orientation of the submodules during positioning is carried out using topological fiducial marks, additional fiducials and a technical vision system made on the basis of a video camera and providing a process of aligning the corresponding fiducial marks of crystals of adjacent rows of submodules. 19. A method of manufacturing an ultra-high-dimensional MFP with a limiting image conversion efficiency according to claim 15, characterized in that the support bar is made in the form of a rectangular frame, the internal dimensions of which correspond to the dimensions of the MFP being created, the number of holes in the carrier plate per submodule is determined in each case individually by calculation and experiment, the submodules are installed on the specified places of the carrier plate, while limiters are used to align the crystals of the submodules in height, fixation of all submodules is carried out simultaneously by connecting vacuum lines to a vacuum pump for a while for polymerization / hardening of layers of retaining material under the submodules mounted on the carrier plate. 20. A method of manufacturing an ultra-high-dimensional MFP with a limiting image conversion efficiency according to claim 19, characterized in that inside the support strip, made in the form of a corresponding rectangular frame, along the edges on each side, there are four additional support strip-inserts with dimensions corresponding to the dimensions of the created MFP; the internal dimensions of the support strip in the form of a rectangular frame correspond to the dimensions of the created MFP, taking into account the placement of additional support tabs-inserts; the formation of the inner edges of the additional support strips-liners is carried out precisely, ensuring the edge roughness of no more than 1 micron. 21. A method of manufacturing an ultra-high-dimensional MFP with an ultimate image conversion efficiency according to any one of claims. 15-20, characterized in that positioning, installation and fixation of submodules with precision microassembly of the MFP is performed without gaps or with a minimum gap of no more than 2 μm between adjacent crystals of submodules, and the alignment of external fiducial marks on the carrier plate or on the carrier of external fiducial marks and topological fiducial marks on the installed submodules is performed with using a semi-automatic micromanipulator. 22. A method of manufacturing an ultra-high-dimensional MFP with an ultimate image conversion efficiency, which consists in the fact that make a carrier plate of appropriate dimensions with external reference marks corresponding to the locations of each submodule in the MFP, submodules of appropriate formats are manufactured in the form of unpackaged monolithic or unpackaged hybrid photodetectors with topological reference marks, investigate the performance and sort the submodules according to their parameters, including the roughness of the edges and the thickness of the crystals, installation, positioning and fixing of submodules is performed sequentially, crystal by crystal, butt-to-side to each other in the form of a matrix of n × m submodules on a carrier plate, where n = 1, 2, 3, 4, 5, 6, 7, 8, ... , m = 1, 2, 3, 4, 5, 6, 7, 8, ..., n ≠ m for n = 1 or m = 1, for n = 1, m = 2 or for n = 2, m = 1, the edge is formed on one face of the crystals, for n = 2 and m = 2 - on two faces of the crystals, for n = 3, 4, 5, 6, 7, 8,… and m = 2, 3, 4, 5, 6, 7, 8,…. - on two faces of crystals placed in the corners of the n × m submodule matrix, on three faces of submodule crystals placed on the edges of the n × m submodule matrix, except for corner crystals, on four crystal faces placed inside the n × m submodule matrix, the fixation of the submodules on the surface of the carrier plate is performed using micropillars or a small predetermined amount of vacuum heat-conducting retaining material under each submodule, the orientation control and positioning of the installed submodules is carried out using a system of bilateral visualization and alignment based on a microscope and / or a video camera, while each time precision microassembly of submodules with already installed submodules is carried out until the MFP of the required dimension n is assembled on the carrier plate × m submodules, moreover, in the case of m = 2, the first and last submodules in each row are installed with close joining on two sides, the second and subsequent submodules in each row, with the exception of the last one, are installed with close joining on three sides, in the case of m> 2, corner submodules are installed with close docking on two sides, edge submodules, except for corner ones, are installed with close docking on three sides, and submodules placed inside the matrix of submodules are installed with close docking on four sides, in this case, a gap is provided between the rows of the n × m matrix of submodules to accommodate micro-loops with metal wiring and electrical connection of micro-loops with the contact pads of the submodules and with the contact pads of the carrier plate, characterized in that additional precision formation of abutting crystal faces of all submodules recognized as suitable and necessary for microassembly of the MFP, ensuring the minimum area of damage to the edges of the crystals, is performed as follows: a protective layer of photoresist is applied to the front surface of the crystal of the submodule, a groove and abutting edges of the crystal are formed on the front side by laser radiation with a given wavelength in a multipass mode with a given angle of inclination of the optical axis of radiation to the normal of the surface of the crystal being processed, splitting off the edge of the crystal using a wedge shifted under the crystal, additionally, abutting edges of the crystal are formed by repeated removal of the inclined part and the protrusion on the lateral surface of the crystal from the back, non-working side of the crystal, by laser radiation, performing a technological operation of removing the photoresist layer from the processed crystal; the MFP manufacturing process is performed cyclically, within each cycle: place and fix the submodule with a vacuum gripper on the upper part of the micro-assembly unit, place the MFP carrier plate on the lower Z-movable part of the microassembly unit and fix it with a vacuum gripper, by raising the lower movable part of the microassembly unit to a predetermined height, the submodule is placed and fixed on the carrier plate without gaps or with a minimum gap of no more than 2 μm between adjacent crystals of the submodules, after the final fixing of the submodule on the carrier plate, the lower movable part of the micro-assembly unit is lowered to the lower position, the vacuum is turned off at the vacuum gripper of the lower part of the micro-assembly unit, carry out movement along X and / or Y of the carrier plate at a distance equal to the dimensions of the installed submodules, fix the carrier plate by applying a vacuum at the new predetermined place of the lower part of the micro-assembly unit, perform the next cycle to install the next submodule; in the process of installing and fixing submodules on the carrier plate, an additional study of the operability is carried out and grading according to the parameters of the submodules, including the roughness of the edges and the thickness of the crystals, replace submodules that have failed in the process of manufacturing the MFP by removing the rejected submodules and installing in their place obviously suitable submodules in the manner described above. 23. A method of manufacturing an ultra-high-dimensional MFP with a maximum image conversion efficiency, which consists in the fact that make a carrier plate of appropriate dimensions with external reference marks corresponding to the locations of each submodule in the MFP, submodules of appropriate formats are manufactured in the form of unpackaged monolithic or unpackaged hybrid photodetectors with topological reference marks, investigate the performance and sort the submodules according to their parameters, including the roughness of the edges and the thickness of the crystals, installation, positioning and fixation of submodules is performed sequentially, crystal by crystal, butt-to-side to each other in the form of a matrix of n × m submodules on a carrier plate, where n = 1, 2, 3, 4, 5, 6, 7, 8, ... , m = 1, 2, 3, 4, 5, 6, 7, 8, ..., n ≠ m for n = 1 or m = 1, for n = 1, m = 2 or for n = 2, m = 1, the edge is formed on one face of the crystals, for n = 2 and m = 2 - on two faces of the crystals, for n = 3, 4, 5, 6, 7, 8, ... and m = 2, 3, 4, 5, 6, 7, 8, ... - on two faces of crystals located in the corners of the n × m submodule matrix, on three faces of submodule crystals placed on the edges of the n × m submodules, excluding corner crystals, on four crystal faces placed inside a matrix of n × m submodules, the fixation of the submodules on the surface of the carrier plate is performed using micropillars or a small predetermined amount of vacuum heat-conducting retaining material under each submodule, orientation control and positioning of the installed submodules is carried out using a system of bilateral visualization and alignment based on a microscope and / or a video camera, each time performing precision microassembly of submodules with already installed submodules until the MFP of the required dimension n is assembled on the carrier plate × m submodules, moreover, in the case of m = 2, the first and last submodules in each row are installed with close joining on two sides, the second and subsequent submodules in each row, with the exception of the last one, are installed with close joining on three sides, in the case of m> 2, corner submodules are installed with close docking on two sides, edge submodules, except for corner ones, are installed with close docking on three sides, and submodules placed inside the matrix of submodules are installed with close docking on four sides, in this case, a gap is provided between the rows of the n × m matrix of submodules to accommodate micro-loops with metal wiring and electrical connection of micro-loops with the contact pads of the submodules and with the contact pads of the carrier plate, characterized in that additional precision formation of abutting crystal faces of all submodules recognized as suitable and necessary for microassembly of the MFP, ensuring the minimum area of damage to the edges of the crystals, is performed as follows: a protective layer of photoresist is applied to the front surface of the crystal of the submodule, a groove and abutting edges of the crystal are formed on the front side by laser radiation with a given wavelength in a multipass mode with a given angle of inclination of the optical axis of radiation to the normal of the surface of the crystal being processed, splitting off the edge of the crystal using a wedge shifted under the crystal, additionally, abutting edges of the crystal are formed by repeated removal of the inclined part and the protrusion on the lateral surface of the crystal from the back, non-working side of the crystal, by laser radiation, performing a technological operation of removing the photoresist layer from the processed crystal; positioning, installation and fixation of submodules with precision microassembly of the MFP without gaps or with a minimum of no more than 2 microns gaps between adjacent crystals of submodules and the alignment of external fiducial marks on the carrier plate or on the carrier of external fiducial marks and topological fiducial marks on the installed submodules are performed using automatic micromanipulator-robot; in the process of installing and fixing submodules on the carrier plate, an additional study of the operability is carried out and grading according to the parameters of the submodules, including the roughness of the edges and the thickness of the crystals, replace submodules that have failed in the process of manufacturing the MFP by removing the rejected submodules and installing in their place obviously suitable submodules in the manner described above.

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