RU2533076C1 - Case for electronic equipment - Google Patents

Abstract

FIELD: electricity.

SUBSTANCE: case for electronic equipment includes two metal parts shaped as a hollow rectangular prism, and each of them has at peaks flanges from the same base with openings for connection of the parts by a fastening tool. The right and left outer lateral sides of the hollow rectangular prism are made as outer radiators, at the front and rear sides there are openings for interfaces and electronics control equipment and electronic system status monitoring, besides between parallel cooling fins there are at least two horizontal rows of ventilation openings. Between two neighbouring rows of ventilation openings there are openings made to install guiding brackets inside this metal part and to fix a module of replaceable Winchester disc in them; there is also a horizontal rack integrated with the metal part to fix electronic component on one side and radiator on the other side, which is made as plurality of parallel cooling fins with fans installed in it for forced cooling.

EFFECT: simplified installation of different electronics into the case and improved cooling of electronics.

10 cl, 10 dwg

Description

A device is proposed for the design of the body of electronic equipment, namely, a small-sized on-board electronic control unit for collecting and processing data with high energy consumption, intended for critical applications in harsh operating conditions, including on orbiting spacecraft and orbiting space stations.

The closest analogue is the patent for utility model RU 87599 U1 dated 10.10.2009, in which the device housing is disclosed, in which radiators in the form of fins with holes are made on two opposite sides of the case, and holes for interfaces and controls are made on the other two opposite sides. electronic equipment. At the same time, inside the case in the form of a rectangular parallelepiped there is an attached wall, one side of which serves to fix electronic components, and the other is a radiator with a cooling fan mounted on it. In addition, in the case in the form of a rectangular parallelepiped, there are also holes for fixing electronic components. The disadvantage of this technical solution is the difficulty of installing electronic equipment in it and the insufficient cooling of electronic equipment in zero gravity and space vacuum (under conditions of space vacuum there must be a version with no fans).

The technical result consists in eliminating the above disadvantages, namely, in simplifying the installation of various electronic equipment in the housing and improving the cooling of electronic equipment.

The technical result is achieved in that the housing of the electronic equipment includes two metal parts in the form of a rectangular hollow parallelepiped, each of which has flanges with holes for connecting these parts by means of a fixing tool from one base at the vertices

in this case, the right and left outer side walls (located opposite each other) of the rectangular hollow parallelepiped of each metal part of the body are external radiators in the form of many parallel cooling fins (the number of fins can be different), and holes for interfaces are made on the front and rear walls of the parallelepiped and controls for electronic equipment and monitoring the status of electronic systems,

in addition, between the parallel cooling fins in both the right and left side walls of the parallelepiped of at least one metal part of the housing, at least two horizontal rows of ventilation holes are made with a protective mesh installed on the inside of the housing wall, and between two adjacent rows of ventilation openings with a protective mesh on each side of the housing part have openings for mounting inside the metal part of the guide brackets and fixing the replaceable module to them hard disk provided in the impact-resistant, completely closed flat aluminum housing, under which the front wall is formed of a parallelepiped corresponding slot,

also, in at least one metal part of the body in the form of a rectangular hollow parallelepiped, there is made at the same time a horizontal rack for securing electronic components on one side and a radiator from a plurality of parallel cooling fins with fans installed on it for forced cooling, on the other hand,

and the upper and / or lower walls of the bases of the rectangular hollow parallelepiped have holes for connecting electronic equipment, are removable and have mounting holes for connecting the housing to external seats at the installation site.

Preferably, the housing is made of AK6 aluminum alloy.

To ensure operator safety, it is necessary that all parallel cooling fins have round radii of at least 2 mm.

To organize rapid heat transfer from the heat-generating elements of electronic components to the side walls of the case on which external radiators are located, solid-state heat sinks (not shown) are used that are fixed by gluing (using VK-9T or Elasil glue) to the inner side of the radiator on the heat-generating elements of electronic components and the inner walls of the housing. Solid-state heat sinks are obtained from a composite in the form of a corner, with a thickness of about 2-3 mm. These solid-state heat sinks are obtained by sintering diamond micropowders with a size of 1-10 microns at pressures of more than 6 GPa and temperatures of more than 1500 ° C.

In addition, it is preferable to apply a thermostatic coating to the external surfaces of the casing: VL-02 primer, black color and AK-243 enamel black.

Also, a removable bracket can be mounted on the upper wall of the housing to secure a monitor or TFT panel (not shown).

It is also preferable to apply a multilayer film structure to the inner surfaces of the housing (as well as to the outer surfaces, when it is impossible to apply to some places of the inner surfaces due to their use for organizing heat removal channels), with the exception of the surfaces used to organize the channels for heat removal , consisting of alternating layers with high magnetic permeability based on nickel - iron alloys and layers with high electrical conductivity - copper.

In the mounting holes, the upper and / or lower walls of the bases, it is preferable to install bushings with an internal thread made of titanium to provide thermal insulation of the housing from the landing surface.

In the upper and / or lower walls of the bases of the rectangular hollow parallelepiped, it is preferable to make edging boards for fixing the metal parts in the form of a rectangular hollow parallelepiped in a horizontal position when they are joined.

The claimed technical solution is illustrated in figures 1-10:

- figure 1 shows a module designed to install a removable power node top view;

- figure 2 - shows the finished (fully assembled) module designed to install a removable power supply;

- figure 3 - shows a module designed to install a removable power supply, bottom view;

- figure 4 - shows a module designed to install a single-board computer (MOPC), top view;

- figure 5 - shows a module designed to install a single-board computer (MOCC), side view;

- figure 6 is a module designed for installing a single-board computer (MOPK), bottom view;

- Fig.7 - shows a module designed to install a single-board computer (MOCC), side view;

- on Fig - shows a General view of the housing of electronic equipment;

- Fig. 9 shows a module for installing a single-board computer (MOCC), a view showing the installation of the guide brackets and fixing the removable hard drive module to them;

- figure 10 - shows a removable hard drive module.

1-10, the following positions are indicated:

1. External radiators

2. Connecting bolts

3. Spherical nuts

4. Removable hard drive module

5. Removable power supply

6. Commercially available secondary power modules

7. Seats - titanium bushings

8. The border is edging

9. Internal heat sink-radiator

10. Fans

11. Single Board Computer

12. Air vents

13. Brackets-guides for the removable hard drive module.

The housing is a modular structure consisting of at least two modules (maybe two to four modules) in the form of a rectangular hollow parallelepiped, fastened together by means of fasteners. The body is made of aluminum alloy of high thermal conductivity AK6.

The housing shown in figures 1-9, is a two-module design, including:

- the first part is a module designed to install a single-board computer (MOPC) (Figs. 4-7 and 9);

- the second part is a module designed to install a removable power unit (MP) (Fig.1-3).

During assembly, these two parts form a single structure - a monoblock (Fig. 8). The above two parts from one base have flanges that are fastened together with four connecting bolts (2) and four spherical nuts (3), as a result of which a single body structure is formed.

The proposed case is designed to accommodate a high-performance computer system based on commercially available single-board computers (11) - small-sized processor modules in the formats Micro PC, PC / 104, PC / 104-Plus, PCIe / 104, PCI / 104 (or specially designed processor modules for special operating conditions), a removable power supply unit (5), made on the basis of commercially available secondary power modules (6), a removable hard drive module, made on the basis of commercially available removable memory drives (for example, a solid state the first drive) or a specially designed memory modules for special operating conditions.

In addition, the proposed housing may include an expansion module (not shown) in the form of a similar hollow parallelepiped, having flanges on the upper and lower bases and which is placed between the first and second parts of the housing and is also fastened to them with four connecting screws and four spherical nuts .

In the proposed building, computer systems are installed that are designed to operate as part of other on-board systems and equipment under severe operating conditions, including in maintenance-free (remotely controlled) mode.

The designs of each of the housing modules: MOPK, MP, and the expansion module are a rectangular hollow parallelepiped, in which there are holes in the front and rear walls for connectors and controls for monitoring the status of electronic systems, the right and left side walls are external radiators (1) , in the form of a plurality of parallel cooling fins (the fins may be horizontal or vertical, as shown in FIGS. 1-9). At the same time, between the external parallel cooling fins in both the right and left side walls of the MOCC, at least two horizontal rows of ventilation holes (BO) (12) are made with a protective mesh (ZS) installed on the inside. At the same time, between two adjacent rows of ventilation holes (BO) with a protective mesh (ZS), a series of holes were made for installing guide-rail brackets (13) inside the module and securing a removable hard drive module to them. In addition, in each of the modules of the case of electronic equipment (preferably in MOCC), a horizontal rack is made at the same time with this part of the case for fixing the electronic components on one side and with a heat sink-radiator (TP) (9) from a set of parallel cooling fins with fans installed on it (10) for forced cooling, on the other hand.

TP is made in the form of a flat plate on one side of which a radiator is made of many parallel cooling fins (see Figs. 4-6). TP contains openings that allow installing at least two fans from the side of the radiator to provide “hot” redundancy. In the design of MOPK and MP, the upper and / or lower walls of the bases (opposite to the sides of the base having flanges) can be made removable and have mounting holes in which it is possible to install bushings with an internal thread made of titanium (7) to attach each module to external seats (figure 3). If the upper and / or lower walls of the bases (opposite to the sides of the base having flanges) are made removable, respectively, these upper and / or lower walls are attached to the modules with fasteners, for example, screws passing through the upper wall and entering holes with thread in the inner four bulges inside the box, as shown in Fig.7 (for clarity, the upper attached wall in Fig.7 is not shown). In addition, the upper and / or lower walls of the bases (opposite to the sides of the base having flanges), respectively, MOCC and MP can have holes for attaching internal vertical racks, on which an additional tier of electronic boards is located.

It is preferable for each module from above and below to make edging boards (8) to fix the modules in a horizontal position when they are articulated and to prevent their displacement during overloads in the horizontal direction.

It is proposed that all of the above case elements be made of an aluminum alloy with increased thermal conductivity in the form of a single milled structural part (or in batch production, by casting, which significantly reduces the cost of manufacture).

Tables 1-3 show the main mechanical and physical characteristics of the most famous and affordable heat-conducting aluminum alloys. An analysis of the characteristics shown in these tables 1-3 showed that the most preferred materials for the manufacture of load-bearing structures of modules of the proposed housing in terms of thermal conductivity are aluminum alloys AK6 and AD31. However, the AD31 alloy has the smallest short-term strength (250 MPa), therefore, it is proposed to use the AK6 alloy, which combines high thermal conductivity and high mechanical strength, for the manufacture of the proposed housing. This alloy is widely used for critical power parts of aircraft, in particular in the wings of passenger aircraft.

Table 1 Classification and application of aluminum alloys with high thermal conductivity Alloy grade Classification Application AK8 Aluminum Wrought Alloy For the manufacture of highly loaded aircraft parts; for parts operating under cryogenic temperatures AK6 Aluminum Wrought Alloy For the manufacture of complex stampings AD31 Aluminum Wrought Alloy For the manufacture of parts of low strength and high corrosion resistance, operating in the range from minus 70 to 50 ° C AD33 Aluminum Wrought Alloy For the manufacture of parts of medium strength and high corrosion resistance, operating in the range from minus 70 to 50 ° C, in a humid atmosphere and sea water AMG6 Aluminum Wrought Alloy For the manufacture of semi-finished products by hot or cold deformation, as well as ingots and slabs; high corrosion resistance

table 2
Mechanical properties (at T = 20 ° C) of aluminum alloys with high thermal conductivity Alloy grade Brinell hardness HB 10 ^-1 , MPa The limit of short-term strength, MPa Impact strength, kJ / m ² AK8 110-120 490 AK6 95-100 447 190 AD31 80 MPa 250 500 ADZZ 80 MPa 320 300 AMG6 65 MPa 355

Table 3 Physical properties of aluminum alloys with high thermal conductivity Mark Temperature, Coefficient Specific Density Specific alloy with which heat conduit electrical material heat capacity received nosti decay kg / m ³ material data (heat capacity R 10 ⁹ , Ohm · m (range properties, degree material), W / (m · hail) 20 ° - T), J / (kg AK8 twenty 43 2800 one hundred 168 838 AK6 twenty 41 2750 one hundred 180 838 AD31 twenty 34,4 2710 one hundred 188 921 AD33 twenty 43.8 2710 one hundred 151 945 AMG6 twenty 67.3 2640 one hundred 122 922

In order to ensure safety, the side walls, which are external radiators, of each of the modules must have radii of fillet of at least 2 mm.

To create optimal thermal conditions in the design of the proposed housing should be provided for active cooling by air flow and passive conductive cooling due to natural heat conduction (conductive cooling system in the form of radiators). The design of the MOCC housing provides for a heat sink-radiator (TP), which allows you to install fans operating in the "hot" reserve on it. These fans circulate the flow of air entering the MOCC housing through the ventilation holes (BO) with a protective mesh (ZS), directing it through the TP channels formed by the radiator fins, thus providing forced cooling by blowing air both TP and the right and left side walls, which are external radiators of the MOCC housing at the same time. Air flow is blown through the air vents opposite the TP channels, and air is blown out through the air vents located below (or, vice versa, it depends on how the blowing or blowing fan works). This cooling method, in contrast to the method based on the use of heat pipes (as is done in electronic modules manufactured by RTD Embedded Technologies, Inc., USA), allows more efficient heat removal from the heat-generating elements of the processor board in zero gravity conditions when there is no natural convection. It should also be noted that the possibility of using heat pipes on the modules of orbiting space stations and orbiting spacecraft, where astronauts are located, is limited in accordance with safety requirements and depends on the composition of the heat carrier used in heat pipes. Thus, in this case design, operating at extreme ambient temperatures, a combination of active cooling of the system environment (atmosphere and case structure) and passive conductive heat sink is used.

Additionally, to organize the rapid transfer of heat from the heat-generating elements of electronic components to the side walls of the MOCC housing on which the radiators are located, it is proposed to use specially organized effective channels for conductive heat removal - solid-state heat sinks (CT) (instead of widely used heat pipes) obtained by sintering diamond micropowders with a size of 1 to 10 microns at pressures of more than 6 GPa and temperatures of more than 1500 ° C. Such heat sinks have high strength characteristics ikami (strength degradation can reach 3.5 GPa) and a high thermal conductivity (350-450 W / (m · K)). These heat sinks are attached to the heat-generating elements and the inner walls of the body with VK-9 glue or Elasil-242 heat-conducting adhesive sealant.

On the external surfaces of the modules that make up the casing to ensure certain thermal radiation characteristics A _{s of} at least 0.95 and ε _{n of} at least 0.92, a temperature-controlled coating is applied (for example, VL-02 primer, black and AK-243 enamel black) that provides more effective heat transfer.

The design of the MOCC provides for the possibility of installing (on the upper removable wall of the MOCC) a removable bracket for mounting a monitor or TFT panel on it.

To ensure high shielding efficiency in conditions of increased requirements for electromagnetic compatibility (EMC), it is proposed to use a screen that is a multilayer film structure consisting of alternating layers with high magnetic permeability (based on nickel-iron alloys) and layers with high electrical conductivity (copper) . It is proposed that MPE be applied to the internal surfaces of modules (with the exception of surfaces used to organize channels for conductive heat removal) using electrolytic deposition technology.

The technology of electrolytic deposition allows the formation of MPE with the required magnetic and electrical characteristics, the number and thickness of individual layers, provides a high technological process, the possibility of forming complex geometric shapes on the cases, provides a rigid fixation of the screen design.

The shielding efficiency of MPE is much higher than that of equal-thickness screens made of single-layer magnetically soft materials, which reduces the mass of shielded units of equipment.

For the convenience of the operator, the electronic equipment case has buttons and toggle switches on and off the various modes of operation on the external surfaces of the modules of the proposed case, as well as the presence of LED indicators for the operational visualization of the results of monitoring the status of electronic systems.

The MP design provides for a removable power supply unit (aluminum plate with commercially available secondary power modules installed on it, having flanges with seats and orthogonal leads), which is installed on the MP case on the heat-conducting Elasil-242 adhesive-sealant and allows for the use of various types secondary power supply modules (depending on operating conditions, energy release and a set of secondary power supply voltages, radiation resistance and performance generated by them) without modifying weights design MP.

On the MP case, seats are provided, which are bushings with an internal thread made of titanium, to ensure thermal insulation of the electronic equipment case from the seating surface on which it is installed, since the temperature on the seating surface can be in the range from minus 150 ° C to plus 125 ° C.

The use of electronic equipment cases in this design:

1. In zero gravity conditions in sealed habitable (increased gas release requirements) instrument compartments of the modules of orbital space stations (for example, the international space station) and orbital spacecraft (for example, “OKA-ISS”) with the upper limit of the ambient temperature (air) range up to plus 60 ° C and the consumption of the OPK up to 30 watts.

2. On board mobile or stationary ground-based autonomous laboratories and stations as a device for collecting data and controlling the operating modes of on-board equipment complexes in harsh operating conditions (severe mechanical stress, weightlessness, increased radiation and a wide range of ambient temperature (air) from minus 40 ° C up to plus 60 ° C.

3. For automobile, railway, air and water transport, in agriculture or at the facilities for the extraction and processing of raw materials and energy.

4. At the facilities of the nuclear industry.

Claims (10)

1. The housing of electronic equipment, including two metal parts in the form of a rectangular hollow parallelepiped, each of which has flanges with holes for connecting these parts from one base at the vertices by means of a mounting tool, while the right and left outer side walls of the rectangular hollow parallelepiped are each parts of the case are external radiators in the form of many parallel cooling fins, and holes for interfaces and org are made on the front and rear walls control of electronic equipment, in addition, between parallel cooling fins in both the right and left side walls of at least one metal part of the housing, at least two horizontal rows of ventilation holes with a protective mesh mounted on the inside of the wall the casing, and between two adjacent rows of ventilation holes with a protective mesh on each side of the casing part, holes are made for mounting inside the metal part of the guide brackets and securing they include a removable hard drive module made in an impact-resistant, fully enclosed flat aluminum case, under which a corresponding slot is made on the front wall of the box, also in at least one metal part of the case in the form of a rectangular hollow box, a horizontal rack is integral with this part for fixing electronic components on one side and a radiator from a set of parallel cooling fins with fans installed on it for forced cooling - on the other hand, and the upper and / or lower walls of the bases of the rectangular hollow parallelepiped have holes for connecting electronic equipment, are removable and have mounting holes for connecting the housing to external seats at its installation site. 2. The housing of electronic equipment according to claim 1, characterized in that the housing is made of aluminum alloy AK6. 3. The housing of electronic equipment according to claim 1, characterized in that all parallel cooling fins must have round radii of at least 2 mm. 4. The housing of electronic equipment according to claim 1, characterized in that for organizing the rapid transfer of heat from the heat generating elements of the electronic components to the side walls of the housing, solid-state heat sinks in the form of a corner are used, fixed by gluing the electronic components and the internal walls of the housing with external radiators . 5. The housing of electronic equipment according to claim 4, characterized in that the solid-state heat sinks are obtained by sintering diamond micropowders with a size of 1-10 microns at pressures of more than 6 GPa and temperatures of more than 1500 ° C. 6. The housing of electronic equipment according to claim 1, characterized in that a temperature-controlled coating is applied to the outer surfaces of the housing: VL-02 primer, black color and AK-243 enamel black. 7. The housing of electronic equipment according to claim 1, characterized in that a removable bracket is mounted on the upper wall of the housing for mounting a monitor or TFT panel on it. 8. The housing of electronic equipment according to claim 1, characterized in that on the inner surfaces of the housing, with the exception of the surfaces used to organize the channels for heat removal, a multilayer film structure is applied, consisting of alternating layers with high magnetic permeability based on nickel-iron alloys and layers with high electrical conductivity - copper. 9. The housing of electronic equipment according to claim 1, characterized in that bushings with an internal thread made of titanium are installed in the mounting holes of the upper and / or lower walls of the bases to ensure thermal insulation of the housing from the landing surface. 10. The housing of electronic equipment according to claim 1, characterized in that in the upper and / or lower walls of the bases of the rectangular hollow parallelepiped, edging edges are made for fixing the metal parts in the form of a rectangular hollow parallelepiped in a horizontal position when they are joined.

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