RU2461911C2 - Multichip module - Google Patents

Abstract

FIELD: physics.

SUBSTANCE: multichip module is in form of a pile of chip holders, each having stacked metal-coated micro-boards, the bottom board being in form of a solid substrate, the middle and top being in form of frames on which are mounted an integrated circuit and contact pads which are electrically connected by wire connections between themselves and by microconductors of the metal coating of the micro-boards with external leads which are in form of channels formed by coaxial through-holes and lying in the periphery of the micro-boards. The substrate and the frame of the micro-boards in the chip holders are rectangular and oval shaped, respectively, and the channels lie on each side of the module with equal spacing on an arc such that the centres of the channels and contact pads of the micro-boards having the same index numbers are connected by wires of equal length.

EFFECT: use of the invention prevents undesirable concentration of heat in separate zones of the structure of the module, thereby ensuring reliable operation of integrated circuits and the article as a whole.

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Description

The invention relates to electronic equipment and can be used in the manufacture of multi-chip modules.

Known multi-chip module (1), including a set of metallized boards with integrated circuits and conductive patterns, electrically connected wire connections, while the conductive microconductors of the boards are interconnected by vertical through channels located on the periphery of the module.

The closest to the claimed invention in technical essence is a multi-chip module (2), made in the form of a package of crystal holders, in each of which integrated circuits are fixed on metallized microcircuits, electrically connected to external terminals by wire connections and microplating metallization of microplates.

The channels formed by coaxial through holes made around the periphery of the lower, middle, and upper microplates and filled with solder were used as external conclusions.

The disadvantage of the above modules is the uneven distribution of heat in individual zones of multichip modules, associated with the electrical and thermal characteristics of the microconductors of metallized boards of different lengths that connect the vertical conductive channels to the contact pads of the microcards.

The problem to which the invention is directed is to eliminate these shortcomings by aligning the electrical and thermal characteristics of microconductors, which ultimately leads to an increase in the quality of multi-chip modules.

To solve this problem, the multi-chip module is made in the form of a package of crystal holders, each of which contains metallized microplates installed on top of each other, the lower one in the form of a continuous substrate, the middle and upper ones in the form of frames on which an integrated circuit and contact pads are placed, electrically connected by wire connections between themselves and microplating metallization of microboards with external terminals, which are used as channels formed by coaxial through holes and located located on the periphery of the microboards, characterized in that the substrate and the framework of the microboards in the crystal holder are respectively rectangular and oval, and the channels are placed on each side of the module with an equal arc pitch in such a way that the centers of the channels and contact pads of the microboards having the same serial numbers, connected by conductors of equal length.

The invention is illustrated by drawings, where:

figure 1 - multi-chip module, General view;

figure 2 - multi-chip module, top view;

figure 3 is a multi-chip module, section AA;

figure 4 is a multi-chip module, section BB;

figure 5 - multichip module, section bb.

The multi-chip module is a package of crystal holders 1, interconnected by diffusion welding. Each crystal holder consists of three microplates: substrate 2, middle 3 and upper 4.

Each microplate in the crystal holder is made with metallization of surfaces in accordance with the requirements of the circuit diagram of a multi-chip module.

The substrate 2 is made of a solid rectangular shape. The middle and upper microboards are made in the form of oval-shaped metallized frames having central openings, respectively, of larger and smaller sizes. Assembled, the substrate, the middle and upper microboards form a blind step cavity 5 in which the integrated circuit 6 and wire connections 7 are located, connecting the pads of the integrated circuit 8 and the pads 9 of the microcards 3.

Along the periphery of the substrate, the middle and upper microboards, through coaxial holes 10 are made, arranged along an arc with an equal pitch (T). The centers of the holes 10 are located at the intersection of the vertical axes of the coordinate grid (serial numbers 1 ”, 2”, 3 ”, etc.), with arcs of circles with a radius R drawn from the centers of the contact pads 9 of the microplates of the corresponding serial number (1 ', 2 ', 3', etc.). In this case, the radius R has the same value corresponding to the lengths of the microconductors connecting the channels 11 with the contact pads 9 (Fig. 4).

The through holes 10 forming the channels 11 are filled with solder. These channels provide switching communications between the main elements of the module, while the length of the microconductors 12 connecting the contact pads of the microboards 8 and the conductive channels 11 is the same. A cover 13 is mounted on the upper crystal holder. It is attached to the crystal holder by diffusion welding, which provides sealing of the mounting area of the integrated circuit of the upper crystal holder.

In addition, the substrates 2, made of a rectangular shape, and assembled in a bag with frames, protrude at their corners 14 for the dimensions of the metallized frames, thereby increasing the heat transfer surface of the module case, which allows to increase the heat transfer efficiency from the area where the microcircuits are located into the environment. The proposed multi-chip module eliminates undesirable heat concentrations in individual areas of the module design, thereby ensuring the reliability of integrated circuits and the product as a whole.

Information sources

1. US patent No. 7652362, IPC H01L 23/02, 2010

2. RF patent №2335822, IPC H01L 23/02, 2008

Claims (1)

A multi-chip module made in the form of a package of crystal holders, each of which contains metallized microboards installed on top of each other, the lower one in the form of a continuous substrate, the middle and upper ones in the form of frames on which an integrated circuit and contact pads are placed, electrically connected by wire connections between themselves and microconductors metallization of microplates with external terminals, which are used channels formed by coaxial through holes and located on the periphery of the microboards, from characterized in that the substrate and the framework of the microboards in the crystal holders are respectively rectangular and oval, and the channels are placed on each side of the module with an equal arc pitch so that the centers of the channels and contact pads of the microboards having the same serial numbers are connected by conductors of equal length.

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