RU2451437C1 - Chassis - Google Patents

Abstract

FIELD: radio engineering.

SUBSTANCE: chassis comprises a jacket with handles, a window in a front wall, a frame comprising a combining circuit board with sockets and holes, where traps are installed, having an alignment surface, a board of guides having longitudinal detachable planks. Besides, the guides are made in the form of slots, between which there are ventilation holes, transverse detachable planks installed at the end side of the guide board perpendicularly to guide slots, arranged in the form of angles with rectangular holes at one of shelves, legs installed on the lower and upper walls of the jacket, between which there are windows, at least one longitudinal detachable plank is made with a slot at the side of the front wall of the jacket, handles are installed at the side walls of the jacket, ventilation holes are made as stepped and expanding towards the nearest side wall. Edges of stages of the ventilation holes are blunted with a flat face.

EFFECT: improved heat removal, provision of repairability, possibility to model cooling conditions, possibility to simultaneously install electronic modules of different types of cooling and versions.

5 cl, 9 dwg

Description

The proposed device relates to the field of radio engineering and electronics and is intended for installation and placement in it of electronic modules of any type of cooling and execution with the possibility of visualizing them in the process of work for debugging. The device allows you to install electronic modules with convective and conductive cooling, while it can provide both cooling in one way or another at the same time, and mainly one of them.

Currently produced in a large number of chassis, racks, frames do not allow for the electromechanical compatibility of a wide range of electronic modules with convective and conductive cooling. As a rule, they are focused on electronic modules in one or two versions with one type of cooling.

Known devices (US patent No. 7180737, H05K 7/20, publ. 06/22/2006, Japanese application No. JP 2001284862, H05K 7/20, publ. 12/10/2001), consisting of a backplane, a frame with rails, electronic modules and covers . Designs contain an air exchange compartment, due to which airflow of electronic modules is formed and their additional cooling by air is provided. The disadvantage of these devices is the orientation to a certain type of design of electronic modules, namely modules with conductive heat sink with wedge-shaped clamps. In addition, the efficiency of air cooling is low, since the air flow repeatedly changes its direction inside the device. However, the device does not provide visualization of processes inside the frame and access to the modules during operation for their maintenance.

A device is also known (US patent No. 5424916, H05K 7/20, publ. 06/13/1995), in which, in contrast to the above solutions, air channels are formed in the walls of the housing, and the air flow cools the elements of the electronic module installed in the slot. This solution is associated with significant energy costs for blowing narrow channels with air. In addition, the air channels become an obstacle to the heat flow, increase the heat capacity of the device as a whole. In addition, the design does not provide visualization of electronic modules and access to them for maintenance.

The chassis is also known (US patent No. 7336493, H05K 7/20, publ. 01/25/2007), which is an open mounting frame. This device implements three types of cooling, however, the device has a strictly specified operating position, a change in which leads to a deterioration in heat removal from the modules.

Known laboratory chassis VPX 6-SLOT manufactured by Curtiss-Wright Controls Embedded Computing (2009, see Appendix 1). The device comprises a housing, built-in ventilation units, a frame with guides and transverse profile elements for several slots, a backplane, transfer handles located on the top cover of the housing.

The disadvantages of the device include the ability to work only with electronic modules of one type of cooling - convective, while the visualization of electronic modules installed in the slot and access to them are not provided. In addition, the device is designed to work only in a given position and does not allow it to be changed if it is necessary to improve visualization, as this will lead to a decrease in the efficiency of air cooling.

The closest solution is a device developed by OSATEK (2010, see Appendix 2). The design of the chassis of this chassis involves removable slats for each slot. In the absence of these slats, it is possible to install electronic modules with convective cooling, and in the presence of conductive ones.

However, the disadvantage of this solution is its low maintainability due to the lack of access to electronic modules. A combination of well-known solutions, such as using a different frame, will not provide access to electronic modules for their maintenance.

The technical result of the proposed technical solution is to improve heat dissipation, maintainability, the ability to simulate cooling conditions, and the ability to simultaneously install electronic modules of various types of cooling and designs.

The technical result is achieved by the fact that the chassis comprises a casing with handles, a window in the front wall, a frame including a backplane with sockets and holes in which catchers are installed having an orienting surface, a guide plate having longitudinal removable slats, and the guides are made in the form of grooves between which vents are located. Moreover, it contains transverse removable strips installed on the end side of the guide plate perpendicular to the guide grooves, made in the form of corners with rectangular holes on one of the shelves, legs located on the lower and upper walls of the casing, between which there are windows, at least one longitudinal removable the bar is made with a groove on the side of the front wall of the casing. In this case, the handles are installed on the side walls of the casing. Moreover, the ventilation holes are stepped, expanding towards the nearest side wall. Moreover, the edges of the steps of the ventilation holes are dulled with a chamfer. Moreover, at least one longitudinal removable strip, one side surface of the groove is made in the form of a removable bracket. Moreover, the bracket is connected to the rest of the longitudinal removable bar by a hinge.

The essence of the technical solution is illustrated by drawings.

Figure 1 shows the appearance of the device from front to top.

Figure 2 shows the appearance of the device from the bottom to the bottom.

Figure 3 shows the backplane catcher.

Figure 4 shows an electronic module with conductive cooling.

Figure 5 shows an electronic module with convective cooling.

Figure 6 shows the longitudinal removable straps.

7 shows longitudinal removable slats with a dovetail groove.

On Fig shows a longitudinal removable strap with a hinge.

Figure 9 shows a transverse removable bar.

The chassis (Figure 1) contains a casing 1, in which there is a frame with a backplane 2, on which sockets 3 are installed, information input modules 4 with connectors 5 of signal circuits, adapter boards 6 with connectors 7 of power circuits (Figure 2), ventilation blocks 8 and board 9 control and display. Moreover, the modules 4 are installed in the middle of the chassis and connected to the sockets 3 of the backplane 2. This arrangement of the modules 4 makes it possible to visualize the working processes and provides maintainability. Adapter boards 6 are installed between the rear wall of the casing 1 and the backplane 2 and are connected to sockets 3. At the same time, they are located perpendicular to the information input modules 4. The ventilation units 8 are made on the side walls of the casing 1. The control and indication board 9 is located on the front wall of the casing 1.

On the backplane 2 mounted catchers 10, made in the form of cylinders with a pointed end having an orienting surface 11 (Figure 3). At the other end of the cylinders, a thread and a regular octahedron are made. The orienting surface 11 is collinear to one of the faces of the octahedron.

An electrical switch is connected to the backplane 2 by conductors, located on the front wall of the casing 1 and designed to turn on and off the ventilation units 8. Switching can be performed during operation both manually and automatically.

The casing 1 and the frame are made of aluminum alloy having high thermal conductivity, which provides heat dissipation.

In the front wall of the casing 1, a window 12 for installing EMs is made, which is closed by a cover 13, in the upper and lower walls are windows 14 for servicing EMs, which are also closed by covers 15. The covers 13 and 15 are made of transparent material, for example, from organic glass or polycarbonate using known technologies, and allow you to visualize the process of the device, without violating the thermal regime in the internal space. The covers 13 and 15 are removable, which allows you to quickly provide access to the elements of the board, which ensures maintainability.

When the covers are installed and the ventilation units 8 are turned on, convective cooling is provided. In this case, temporary removal of the covers 13, 15 for servicing the EM is allowed. With the covers 13, 15 removed and the ventilation units 8 turned off, conductive cooling is provided.

Handles 16 are installed on the side walls of the casing 1, legs 17 are installed on the upper and lower walls. The chassis can be installed on the side, upper or lower walls, since the shape protruding beyond the casing dimensions 1 and the symmetrical pairing on the side walls of the handles 16, and on the bottom and the upper walls of the legs 17 provide air to the ventilation units 8 at any of these chassis positions.

In addition, on one of the side walls of the casing 1 near the ventilation units 8 are inlet openings 18 for cold air to enter the casing 1. On the opposite side wall of the casing 1 there are outlet openings 19 for blowing heated air. Moreover, the area of the holes 18 corresponds to the area of the holes 19.

The electronic modules (EM) are located in the chassis, containing extractors 21 in their bodies 20, having a lever 22 and a pusher 23, as well as forks 24, sockets 25, made of rectangular shape with holes having the shape of a circle with a truncated segment.

In the chassis can be placed two versions of EM: EM with conductive cooling (Figure 4) and EM with convective cooling (Figure 5).

The housing 20 EM with convective cooling contains ventilation holes 26 and a screw 27, fixing the EM in the chassis.

The case EM 20 with conductive cooling contains on the side walls a heat sink surface and a wedge-shaped retainer 28, fixing the EM in the device in the working position and driven by the shaft 29.

The frame contains two plates 30 of the guides, longitudinal and transverse removable strips (31 and 32, respectively). The guide plates 30 are made of a heat-conducting material, for example, of any aluminum alloy, all-metal and massive. They provide a quick distribution of heat throughout the entire chassis and at the same time form a large area of the heat-generating surface. The guides are made in the form of grooves in the plate 30, between which the ventilation holes 33 are located. These holes are made stepped, expanding towards the side walls. In this case, the edges of the steps of the holes 33 are dulled with a bevel. This solution allows you to effectively combine the heat sink properties of the plates 30 of the rails and uniform convective cooling of the internal volume of the chassis.

In the case of installing EM with conductive cooling, a longitudinal removable strip 31 is used (Fig. 6), which is made with a groove 34 on the side of the front wall of the casing 1. At the same time, a thermal contact is formed between the strip 31 and the heat-conducting surface of the EM, which is provided by the latch 28. In its in turn, the strip 31 is in thermal contact with the guide plate 30. Thus, in the conductive mode of heat removal between the EM and the plates 30 of the rails, a thermal contact is formed. In this case, convective heat removal is practically excluded, which allows us to simulate conductive cooling.

In case of mechanical deformations that make it difficult to extract the EM, longitudinal removable strips 31 with a groove 34 are used, one wall of which can be made in the form of a removable bracket 35. In this case, the bracket 35 is connected to the rest of the strip 31 by a dovetail protrusion (Fig. .7) or a rectangular protrusion and is fixed on the chassis frame with fasteners (screws, screws, etc.). In this case, the bracket 35 does not interfere with the extraction of EM, which ensures maintainability.

In order to increase maintainability, the bracket 35 may be located on the hinge 36 (Fig. 8). Unlike the previous case, when deformations occur, the bracket 35 can be rotated at any angle, which also does not prevent the extraction of EM.

In the case of installing EM with convective cooling, a transverse removable bar 32 (Fig. 9) is used, having the shape of a corner, in which one shelf mates with the guide plate 30 and the second shelf contains rectangular openings 37 for the pusher 23 of the EM extractor 21. In an emergency (for example, with local thermal damage to the EM elements), the transverse removable element 32 is removed independently of the EM.

Due to the presence of holes 26 in the EM with convective cooling and due to the absence of a heat sink surface in its housing 20, the contact surface of the EM with the guide plate 30 is minimal. This allows practically eliminating the conductive heat removal and simulating convective cooling.

Combined cooling is also possible in the chassis. This method is mainly used for EM with conductive cooling, when convective cooling is used as additional.

Thus, the chassis allows you to create conditions for convective, conductive and combined cooling.

When adapting catchers 10 on the backplane 2 and, respectively, when installing or removing the longitudinal or transverse bars (31, 32, respectively), if necessary, any EM can be installed in the chassis.

The device operates as follows.

To install the EM, first remove the covers 13 and the back wall of the casing 1. Using an octahedron, the catchers 10 are installed in any position with a step of 45 ° in the corresponding octagonal metallized holes located on the backplane 2, and the nuts fixing the catchers 21 are loosened. in the same position as the truncated segment of the holes of the nests 25, after which the catchers 10 are fixed with nuts. The rear wall of the casing 1 is installed in its place.

EM installation with convective and conductive heat dissipation has differences.

EM with conductive heat dissipation.

Before installing the EM longitudinal removable straps 31 are installed on the plate 30 of the rails.

Next, the EMs are installed: plugs 24 and sockets 3, catchers 10 and sockets 25 are connected, the lever 22 of the extractor 21 is pressed against the body 20 of the EM, the pusher 23 of the extractor 21 is installed in the groove 34. The covers 13 are installed in the windows 12. The EM installed in this way is fixed with a wedge-shaped latch 28.

When you press the lever 22, the pusher 23 abuts against the side surface of the groove 34, the EM is shifted towards the sockets 3 of the backplane 2.

After applying the supply voltage, the heat fluxes from the heat-loaded EM radio elements are transferred to the heat-removing surface of the housing 20, then through the longitudinal removable strip 31 they enter the guide plates 30, due to which they are distributed throughout the entire volume of the structure and are released into the external space.

In the case of insufficient cooling of the EM, it generates a signal that is transmitted to the board 9, to turn on the ventilation units 8, which cool the EM through the openings 26 and remove the heated air. This allows you to increase heat dissipation in case of overheating of the chassis elements.

When the lever 22 is retracted, the pusher 23 of the extractor 21 abuts against the opposite lateral surface of the groove 34 and shifts the EM in the direction from the sockets 3. Next, the plugs 24 and sockets 3 of the backplane 2 are undocked, after which the EM can be removed.

EM with convective heat dissipation

Before installing the EM longitudinal removable straps 31 are removed. To the plate of guides 30 establish transverse removable strips 32.

Next, install EM: plugs 24 and sockets 3, catchers 10 and sockets 25 are articulated, the pusher 23 of the extractor 21 is installed in the holes 37. The covers 13, 15 are installed in the windows 12 and 14, respectively. Screws 27 fix the position of the EM in the chassis.

When the lever 22 is pressed, the pusher 23 abuts against the surface of the hole 37 and shifts the EM towards the sockets 3 of the backplane 2.

After applying the supply voltage, the heat fluxes from the heat-loaded radio elements heat the internal volume of the EM. Through the openings 18, 33, the air flow enters the openings 26, blowing out the superheated air from the housing 20, thereby cooling the surface of the radioelements and the housing itself 20. The ventilation unit 8 takes air from the surrounding space, and the superheated air discharges into the outer space through the openings 33, 19 .

When the lever 22 is retracted, the pusher 23 of the extractor 21 abuts against the opposite surface of the rectangular hole 37 and shifts the EM in the direction from the sockets 3. Next, the plugs 24 and sockets 3 of the backplane 2 are undocked, after which the EM can be removed.

After installing the EM on connectors 5, 7 of modules 4 and risers 6, respectively, external equipment, cables of a testing PC, or other equipment necessary for the development of equipment are switched.

This provides direct visualization of the processes caused by the operation of the device: heating, local damage, failure and functioning of a particular element of the device or system as a whole, etc.

From the foregoing, it follows that the device can be manufactured at the instrument-making enterprise. The technical solution meets the conditions of patentability of the invention: novelty, industrial applicability, inventive step.

Claims (5)

1. The chassis, comprising a casing with handles, a window in the front wall, a frame including a backplane with sockets and holes in which there are catchers having an orienting surface, a guide plate having longitudinal removable slats, the guides being made in the form of grooves between which ventilation holes are located, characterized in that it contains transverse removable strips mounted on the end side of the guide plate perpendicular to the guide grooves, made in the form of corners with a rectangular holes on one of the legs, the legs are located on the upper and lower walls of the housing, between which the windows are made of at least one detachable longitudinal strip is formed with a groove from the front wall of the housing, wherein the handles are mounted on the side walls of the casing. 2. The chassis according to claim 1, characterized in that the ventilation holes are stepped, expanding towards the nearest side wall. 3. The chassis according to claim 2, characterized in that the edges of the steps of the ventilation holes are dulled with a chamfer. 4. The chassis according to claim 3, characterized in that, at least on one longitudinal removable strip, one side surface of the groove is made in the form of a removable bracket. 5. The chassis according to claim 4, characterized in that the bracket is connected to the rest of the longitudinal removable bar by a hinge.

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