RU240297U1 - An adapter board for installing TSSOP-24 packaged microcircuits from the back of a DIP-24 footprint on the main printed circuit board. - Google Patents

Abstract

The utility model relates to microcircuit adapters, more specifically to adapter printed circuit boards for installing microcircuits in a TSSOP-24 package on the reverse side of a DIP-24 footprint on a main printed circuit board. The technical result—enabling the installation of a microcircuit in a TSSOP-24 package as part of an adapter board on the reverse side of a DIP-24 footprint on a main printed circuit board—a device printed circuit board—is achieved by means of an adapter board for installing microcircuits in a TSSOP-24 package on the reverse side of a DIP-24 footprint on a main printed circuit board comprising a main substrate, on one side of which a footprint for installing a microcircuit in a TSSOP-24 package is formed, electrically connected to through-hole metallized contact holes of the DIP-24 footprint formed on the substrate. In this case, in the view from the side of the seat for installing the microcircuit in the TSSOP-24 package, the pins of the TSSOP-24 seat are connected to the contact holes of the DIP-24 seat in the following order: 1st with 24th, 2nd with 23rd, 3rd with 22nd, 4th with 21st, 5th with 20th, 6th with 19th, 7th with 18th, 8th with 17th, 9th with 16th, 10th with 15th, 11th with 14th, 12th with 13th, 13th with 12th, 14th with 11th, 15th with 10th, 16th with 9th, 17th with 8th, 18th with 7th, 19th with 6th, 20th with 5th, 21st with 4th, 22nd with 3rd, 23rd with 2nd and 24th with 1st. In the view from the side of the footprint for installing the chip in the TSSOP-24 package, the numbering of the contact holes of the DIP-24 footprint starts from the contact hole with the square contact pad and continues counterclockwise, and the numbering of the pins of the TSSOP-24 footprint starts from the pin of the TSSOP-24 footprint, which is connected to the 24th contact hole of the DIP-24 footprint, and continues counterclockwise. 2 fig.

Description

Field of technology

This utility model relates to microcircuit adapters, more specifically, to adapter printed circuit boards for mounting microcircuits in TSSOP-24 packages on the reverse side of a DIP-24 footprint on a main printed circuit board. This utility model can be used for mounting surface-mount microcircuits in devices designed for through-hole packages, without the need to redesign the main printed circuit board.

State of the art

A prior art chip adapter described in patent CN 200983360 Y, issued November 28, 2007, includes a transition printed circuit board (PCB) containing dual-in-line (d.i.l.) pins and corresponding solder pads designed for mounting chips in PLCC or SOIC packages. These pads are electrically connected to the DIP pins in a direct order: the first pin of the SOIC chip is connected to the first pin of the DIP, the second to the second, and so on, providing a direct pinout without cross-wiring. This allows, when mounting the adapter on a DIP chip on a main PCB, the chip to be replaced with a chip in an SOIC package while maintaining the same connection diagram, without the need to redesign the main PCB. The design of the well-known adapter assumes direct pinout: the SOIC pins directly correspond to the DIP pins in terms of numbering, which is only acceptable when installed on the side of the main printed circuit board where the microcircuit seat in the DIP package is located.

The electrical connections in the known solution for mounting an adapter with a microcircuit in a SOIC package on the back side of the main printed circuit board (opposite to the mounting site of the microcircuit in the DIP package), due to the mirror image of two rows of contact holes of the DIP package mounting site, lead to a numbering mismatch, i.e., they do not ensure the correspondence of the pins of the SOIC package on the adapter printed circuit board and the contact holes of the DIP package mounting site on the main printed circuit board, as a result of which the connection logic is disrupted.

Thus, the known pinout of the adapter board does not allow for correct switching between the TSSOP-24 pins and the DIP-24 contact holes when mounted on the back side of the main printed circuit board, which excludes the possibility of using such a solution in cases where, according to design or technological requirements, the adapter board must be installed on the back side of the main board.

Also known from the prior art is the STK5XX integrated circuit module, described in patent KR 20080000110 U, issued January 28, 2008, designed for programming ATMEL microcontrollers using the STK500 basic programmer. This known technical solution is a universal add-on (top module) combining the functions of several specialized modules (STK501, STK503, STK505, STK520, STK525), allowing the connection of various adapters – both for SOIC and TQFP packages and for their corresponding connectors. This utilizes a system of interchangeable printed and pluggable adapters that connect to a common universal programmer board.

Despite the stated advantages, the known technical solution is not intended for placement of a TSSOP-24 chip in a transition printed circuit board on the reverse side of a DIP-24 footprint on the main board while maintaining the correspondence of contact pins, since the electrical connections in known adapters do not provide mirror switching, which is necessary when installed on the opposite side from the DIP-24 footprint, which excludes the use of such adapters in conditions where installation can only be performed from the reverse side, for example, due to limitations in the layout or dimensions of the device housing.

Thus, the known technical solution does not allow for the correct installation of a microcircuit in a TSSOP-24 package on the reverse side of the DIP-24 package seat on the main printed circuit board, which limits its applicability in tasks of directly replacing DIP-24 microcircuits with TSSOP-24 without redesigning the main board.

Disclosure of a utility model

Thus, the objective of the utility model is to eliminate the shortcomings of the prior art, and the technical result of the utility model is to create a transition board that allows for the installation of a microcircuit in a TSSOP-24 package as part of a transition board on the reverse side of a DIP-24 seat on the main printed circuit board - the printed circuit board of the device.

The said technical result is achieved by means of a transition board for installing microcircuits in a TSSOP-24 package on the reverse side of a DIP-24 seat on a main printed circuit board containing a main substrate, on one side of which a seat is made for installing a microcircuit in a TSSOP-24 package, which is electrically connected to through metallized contact holes of a DIP-24 seat made on the substrate,

Moreover, in the view from the side of the mounting site for installing the microcircuit in the TSSOP-24 case,

The 1st pin of the TSSOP-24 footprint is connected to the 24th contact hole of the DIP-24 footprint,

The 2nd pin of the TSSOP-24 footprint is connected to the 23rd contact hole of the DIP-24 footprint,

The 3rd pin of the TSSOP-24 footprint is connected to the 22nd contact hole of the DIP-24 footprint,

The 4th pin of the TSSOP-24 footprint is connected to the 21st contact hole of the DIP-24 footprint,

The 5th pin of the TSSOP-24 footprint is connected to the 20th contact hole of the DIP-24 footprint,

The 6th pin of the TSSOP-24 footprint is connected to the 19th contact hole of the DIP-24 footprint,

The 7th pin of the TSSOP-24 footprint is connected to the 18th contact hole of the DIP-24 footprint,

The 8th pin of the TSSOP-24 footprint is connected to the 17th contact hole of the DIP-24 footprint,

The 9th pin of the TSSOP-24 footprint is connected to the 16th contact hole of the DIP-24 footprint,

The 10th pin of the TSSOP-24 footprint is connected to the 15th contact hole of the DIP-24 footprint,

The 11th pin of the TSSOP-24 footprint is connected to the 14th contact hole of the DIP-24 footprint,

The 12th pin of the TSSOP-24 footprint is connected to the 13th contact hole of the DIP-24 footprint,

The 13th pin of the TSSOP-24 footprint is connected to the 12th contact hole of the DIP-24 footprint,

The 14th pin of the TSSOP-24 footprint is connected to the 11th contact hole of the DIP-24 footprint,

The 15th pin of the TSSOP-24 footprint is connected to the 10th contact hole of the DIP-24 footprint,

The 16th pin of the TSSOP-24 footprint is connected to the 9th contact hole of the DIP-24 footprint,

The 17th pin of the TSSOP-24 footprint is connected to the 8th contact hole of the DIP-24 footprint,

The 18th pin of the TSSOP-24 footprint is connected to the 7th contact hole of the DIP-24 footprint,

The 19th pin of the TSSOP-24 footprint is connected to the 6th contact hole of the DIP-24 footprint,

The 20th pin of the TSSOP-24 footprint is connected to the 5th contact hole of the DIP-24 footprint,

The 21st pin of the TSSOP-24 footprint is connected to the 4th contact hole of the DIP-24 footprint,

The 22nd pin of the TSSOP-24 footprint is connected to the 3rd contact hole of the DIP-24 footprint,

The 23rd pin of the TSSOP-24 footprint is connected to the 2nd contact hole of the DIP-24 footprint,

The 24th pin of the TSSOP-24 footprint is connected to the 1st contact hole of the DIP-24 footprint,

In addition, when viewed from the side of the TSSOP-24 package's mounting location, the numbering of the DIP-24 mounting location's contact holes starts from the contact hole with the square contact pad and proceeds counterclockwise, while the numbering of the TSSOP-24 mounting location's pins starts from the TSSOP-24 mounting location's pin that is connected to the 24th contact hole of the DIP-24 mounting location and proceeds counterclockwise.

It's worth noting that the design of the adapter board with its mirrored pinout allows for easy installation of TSSOP-24 packaged ICs on existing printed circuit boards (PCBs) using the reverse side of the DIP-24 footprint. It also ensures reliable switching that complies with the connection logic and allows for the adapter board to be used in cases where design or process requirements require the adapter board to be installed on the reverse side of the main PCB.

Mounting an adapter board with a TSSOP-24 chip on the backside of the main board is important when mounting from the DIP-24 footprint side of the board, which prevents the assembly from reaching the permissible height due to package size limitations or closely spaced components. Exceeding the permissible height can lead to mechanical damage or prevent assembly. However, if the product is subject to vibration or impact, mounting it on the backside can help reduce the overall component height relative to the device's mounting points and reduce the inertial moments acting on the soldered joints, thereby reducing the risk of their failure. This can also help reduce the amplitude of vibration responses in the mounting area and prevent the formation of localized resonant oscillations. In dense mounting conditions or when the soldering zone is inaccessible from above, this installation ensures the assembly is feasible. Furthermore, if the adapter board blocks accessible calibration points or connectors on the main side, relocating it to the other side becomes the only solution for maintaining repairability and service access.

Brief description of the drawings

The utility model is illustrated by Fig. 1 and 2, which show examples of the design and layout of a transition board for installing microcircuits in a TSSOP-24 package on the reverse side of a DIP-24 seat on the main printed circuit board, respectively.

Implementation of a utility model

The adapter printed circuit board, illustrated in Fig. 1 and 2, is designed to install a microcircuit in a TSSOP-24 package on the back side of a DIP-24 seat on the main printed circuit board of the device.

As shown in Fig. 1, the transition printed circuit board includes a base substrate (1), which may be made, for example, of FR4 fiberglass, polyimide, or another dielectric used in the production of printed circuit boards. A mounting pad (2) for installing a microcircuit in a TSSOP-24 package is formed on one side of the substrate (1). The contact pads of the mounting pad (2) may be made of a copper foil layer with a protective coating applied, for example, a layer of nickel with gold, tin, or silver.

The contact pads of the footprint (2) are electrically connected to the metallized contact holes (3) located on the substrate (1) according to the DIP-24 pinout. These connections can be made using copper conductive traces formed on the substrate surface using photoresist and subsequent etching. The holes (3) are metallized by applying a metallic coating, most often copper, to the inner walls of the holes, ensuring reliable electrical contact between the board layers or components on the opposite side.

It should be noted that, in accordance with JEDEC Standard No. JESD30 - Mechanical Package Outlines for Integrated Circuits, the pin numbering for DIP, SOIC, SOP, SSOP, MSOP, TSSOP, and TSOP packages is strictly unambiguous: it starts with the pin located immediately to the left of the key (notch or dot) when viewed from above the package, and continues counterclockwise around the package, which ensures standardization and eliminates ambiguity.

Fig. 2 shows an example of a routing that implements a mirror connection of the pins of a TSSOP-24 footprint with the contact holes of a DIP-24. In particular, in the view from the side of the seat for installing the microcircuit in the TSSOP-24 package, the pins of the TSSOP-24 seat are connected to the contact holes of the DIP-24 seat in the following order: 1st with 24th, 2nd with 23rd, 3rd with 22nd, 4th with 21st, 5th with 20th, 6th with 19th, 7th with 18th, 8th with 17th, 9th with 16th, 10th with 15th, 11th with 14th, 12th with 13th, 13th with 12th, 14th with 11th, 15th with 10th, 16th with 9th, 17th with 8th, 18th with 7th, 19th with 6th, 20th with 5th, 21st with 4th, 22nd with 3rd, 23rd with 2nd and 24th with 1st.]

This mirror-image alignment ensures proper connection of the TSSOP-24 packaged chip when installed on an adapter board on the back of the DIP-24 footprint on the main PCB. This is especially important when component height is limited, packaging density is tight, or the solder zone is inaccessible from the top. This placement also improves the mechanical reliability of the connections by reducing the height of protruding components and reducing the impact of vibration loads.

The following installation procedure is provided for the implementation of the utility model.

The connection of the transition board to the main printed circuit board is achieved using contact leads (pin contacts), which are metal elements that provide an electrical and mechanical connection between the transition board and the main printed circuit board.

Examples of contact pin design:

individual metal pins similar to the pin contacts of standard connectors;

lengths of stiff wire formed to fit into holes;

specially manufactured metal elements with a straight or profiled shape.

Contact terminals can be made from materials that provide the necessary mechanical strength and good solderability, such as tinned copper, bronze or brass.

Position of elements on the transition board when assembled:

The chip in the TSSOP-24 package is installed and soldered to the landing pads on the first side of the adapter board.

The contact pins are installed and soldered into the metallized holes of the transition board on the side opposite to the installation of the microcircuit in the TSSOP-24 package.

The free ends of the contact pins are intended for installation in the contact holes of the DIP-24 mounting site on the main printed circuit board from its reverse side.

The assembled transition board (with the TSSOP-24 chip installed and the contact pins soldered) is installed on the main printed circuit board and secured by soldering the contact pins into the holes in the DIP-24 mounting surface on its back side.

Variant of the sequence of soldering operations:

Installing a TSSOP-24 chip onto a mounting plate on a transition board and soldering it.

Installation of contact pins into metallized holes of the transition board from the side opposite to the installation of the microcircuit, with their subsequent soldering.

Installing a transition board with a soldered microcircuit and contact pins on the main printed circuit board from the opposite side relative to the DIP-24 seat.

Soldering the contact pins into the corresponding holes of the DIP-24 mounting site of the main printed circuit board.

This design ensures:

reliable electrical connection between the TSSOP-24 chip and the main printed circuit board via a transition board;

mechanical stability of the connection due to rigid fixing of the contact terminals;

the possibility of installation under conditions of limitations on the height of components and placement density on the main board;

increasing the vibration resistance of the structure.

The implementation of the described connection scheme on the transition board allows the use of microcircuits in the TSSOP-24 package without the need to redesign the main board, in conditions where standard DIP-24 packages are no longer available or are replaced by modern analogs in the TSSOP-24 package, and also provides a reliable electrical connection and allows the installation of the microcircuit on the back side of the main board, in accordance with dimensional limitations, design requirements, or repairability requirements.

Claims (29)

An adapter board for installing microcircuits in a TSSOP-24 package on the back side of a DIP-24 seat on the main printed circuit board, containing the main substrate, on one side of which there is a landing site for installing a microcircuit in a TSSOP-24 package, which is electrically connected to the through metallized contact holes of the DIP-24 footprint made on the substrate, at the same time, in the view from the side of the mounting site for installing the microcircuit in the TSSOP-24 case, The 1st pin of the TSSOP-24 footprint is connected to the 24th contact hole of the DIP-24 footprint, The 2nd pin of the TSSOP-24 footprint is connected to the 23rd contact hole of the DIP-24 footprint, The 3rd pin of the TSSOP-24 footprint is connected to the 22nd contact hole of the DIP-24 footprint, The 4th pin of the TSSOP-24 footprint is connected to the 21st contact hole of the DIP-24 footprint, The 5th pin of the TSSOP-24 footprint is connected to the 20th contact hole of the DIP-24 footprint, The 6th pin of the TSSOP-24 footprint is connected to the 19th contact hole of the DIP-24 footprint, The 7th pin of the TSSOP-24 footprint is connected to the 18th contact hole of the DIP-24 footprint, The 8th pin of the TSSOP-24 footprint is connected to the 17th contact hole of the DIP-24 footprint, The 9th pin of the TSSOP-24 footprint is connected to the 16th contact hole of the DIP-24 footprint, The 10th pin of the TSSOP-24 footprint is connected to the 15th contact hole of the DIP-24 footprint, The 11th pin of the TSSOP-24 footprint is connected to the 14th contact hole of the DIP-24 footprint, The 12th pin of the TSSOP-24 footprint is connected to the 13th contact hole of the DIP-24 footprint, The 13th pin of the TSSOP-24 footprint is connected to the 12th contact hole of the DIP-24 footprint, The 14th pin of the TSSOP-24 footprint is connected to the 11th contact hole of the DIP-24 footprint, The 15th pin of the TSSOP-24 footprint is connected to the 10th contact hole of the DIP-24 footprint, The 16th pin of the TSSOP-24 footprint is connected to the 9th contact hole of the DIP-24 footprint, The 17th pin of the TSSOP-24 footprint is connected to the 8th contact hole of the DIP-24 footprint, The 18th pin of the TSSOP-24 footprint is connected to the 7th contact hole of the DIP-24 footprint, The 19th pin of the TSSOP-24 footprint is connected to the 6th contact hole of the DIP-24 footprint, The 20th pin of the TSSOP-24 footprint is connected to the 5th contact hole of the DIP-24 footprint, The 21st pin of the TSSOP-24 footprint is connected to the 4th contact hole of the DIP-24 footprint, The 22nd pin of the TSSOP-24 footprint is connected to the 3rd contact hole of the DIP-24 footprint, The 23rd pin of the TSSOP-24 footprint is connected to the 2nd contact hole of the DIP-24 footprint, The 24th pin of the TSSOP-24 footprint is connected to the 1st contact hole of the DIP-24 footprint, In addition, when viewed from the side of the TSSOP-24 package's mounting location, the numbering of the DIP-24 mounting location's contact holes starts from the contact hole with the square contact pad and proceeds counterclockwise, while the numbering of the TSSOP-24 mounting location's pins starts from the TSSOP-24 mounting location's pin that is connected to the 24th contact hole of the DIP-24 mounting location and proceeds counterclockwise.