RU2232447C1 - Printed-circuit board for plug-in electronic components - Google Patents

Abstract

FIELD: electronic instrumentation engineering.

SUBSTANCE: proposed printed-circuit board characterized in unified mechanical design and manufactured to unified documentation using unified process and equipment thereof is essentially planar substrate having at least one seating place for separately packaged plug-in electronic component such as integrated-circuit of definite size provided on at least one end with terminal contacts arranged in line. Line of conducting strips whose quantity depends on number of terminal contacts are formed on planar substrate in vicinity of seating place to secure respective terminal contacts on them, each strip being connected to printed conductors for connection to other electronic components disposed on wafer surface in compliance with schematic circuit diagram. Line of additional printed conducting strips is formed on planar substrate in parallel with line of printed conducting strips used to secure output terminals of plug-in electronic components for surface wiring and securing terminal contacts of other separately packaged plug-in electronic component of integrated-circuit type whose size is other than that of mentioned electronic component. Printed conducting strips of both plug-in electronic components of same circuit arrangement are interconnected on this substrate. Printed conducting strips of other plug-in electronic component whose circuit arrangement is other than that of mentioned plug-in components and printed conducting strips of other electronic plug-in component have their terminal contacts brought out through substrate to its other side, and at least some of printed conductors designed for connecting mentioned terminal contacts in compliance with their connection diagram are formed on additional planar substrate contacting through its rear side the planar substrate carrying electronic component.

EFFECT: enlarged functional capabilities of printed-circuit boards designed for operation under versatile conditions.

2 cl, 5 dwg

Description

The invention relates to the field of electronic instrumentation and can be used in the design, manufacture and installation of dual-use electronic printed circuit boards designed to operate in either lightweight or harsh operating conditions by replacing one discrete electronic component on a printed circuit board with a given logical function for another made with a similar function, but differing in the dimensions and geometry of the cases, the number of conclusions, etc.

A known method of functional tuning of hybrid integrated circuits, including the placement of discrete components on the landing sections of the board, their temporary electrical connection to a controlled circuit by creating clamping electrical contact connections between the terminals of the components and the corresponding contact pads of the board; control of the electrical functioning of the hybrid integrated circuit, its adjustment by replacing defective discrete components and the subsequent manufacture of monolithic electrical contact connections, holes are formed in the board at the locations of the seating sections, discrete components are installed in these holes, and their temporary connection is carried out by means of metal film conductors fixed on a flexible dielectric substrate (SU, ed. St. No. 1387807, H 01 L 21/70, publ. 15.12.1991).

The disadvantage of this method of manufacturing and installation of electronic printing units is that

- holes are formed in the printed circuit board at the locations of the landing sites for discrete electronic components, discrete electronic components are installed in these holes, and their temporary connection is carried out by means of metal film conductors mounted on a flexible dielectric substrate;

- holes are formed in the printed circuit board for installing discrete electronic components, which indicates that only discrete outputs are used as discrete electronic components;

- connection of discrete electronic components is carried out by means of temporary metal film conductors.

Since the electronic components for printing units of different designs differ in the types, sizes, wiring and geometry of the housings, then, say, on a commercial printed circuit board instead of electronic components of a commercial design, it is not possible to install military electronic components in order to obtain an electronic printed circuit unit operating in more rigid operating conditions. This means that under changing, in the direction of tightening, operating conditions, it is necessary to re-design, manufacture and assemble the electronic printing unit. When changing operating conditions in the direction of softening, you can leave the electronic printing unit that meets more stringent operating conditions. At the same time, the cost of such a printing unit will be overestimated in relation to easier operating conditions.

A known printed circuit board, which is a flat substrate with at least one seat for installing a removable electronic component in a separate housing with a given size, such as a microcircuit, has at least one side of the separate housing aligned in the output lamellas, while in the area of the landing places according to the number of output slats of the electronic component on a flat substrate are formed in a row located printed conductive sections for fixing on each of them corresponds output lamellas connected to printed conductors for connection with other electronic components placed on the surface of the plate in accordance with the circuit diagram (RU, “Country of Games” magazine, No. 5 (134), March 2003, p. 100, article “ New motherboard from Gygabyte ”).

The disadvantage of this device is that its modernization or readjustment of an electronic assembly mounted on a printed circuit board to work in other, for example, more severe conditions, is possible only by replacing, for example, a standard installed microcircuit with another microcircuit, without fail having dimensions , the pinout and dimensions of the case, which coincide with the similar characteristics of the replaced microcircuit. In other words, due to the fact that the trace of conductive conductors on the board is initially configured for a specific microcircuit, the replacement microcircuit, not only in external parameters, but also in the connection diagram, should be similar to the one being replaced. In this regard, a difficult task arises of constructing a new microcircuit that performs a more complex function, which in terms of the resulting parameter should be similar to the function of the microcircuit being replaced, but at the same time, the components of its construction should be laid out in the dimensions of the housing of the old microcircuit with the marking of its conclusions being preserved. Such a problem is completely solvable for small changes, which takes place, for example, when creating a family of processor units for a specific computer motherboard. However, this problem becomes difficult to solve when, in addition to changing the internal structure of the processor unit, it is necessary to make changes to the case material or provide a predetermined internal thermal regime without involving an externally mounted fan or supplement the function previously integrated into the microcircuit with a correction function, etc., since such design corrections significantly affect not only the dimensions of the case, but also the number of conclusions and their marking with a change in the wiring diagram.

At the same time, it is very difficult to perform additional tracing of printed conductive conductors, which cannot be “laid” between previously made conductors.

This well-known technical solution is made as a prototype for the claimed.

The present invention is aimed at solving the technical problem of modifying a printed circuit board by combining on a single place for a microcircuit the conductive sections of the connection of the leads of different dimensions of the cases and the marking at the levels of the printed conductors for connecting the leads of the circuits that implement the same logical function, which will allow for the manufacture and installation electronic printing units for various groups of operating conditions on the basis of one design base.

The technical result achieved in this case is to expand the operational suitability and increase the functional capabilities of the board by creating a unity of design and technological documentation, as well as the uniformity of the technological process and technological equipment for the manufacture and installation of electronic printing units designed for various groups of operating conditions.

The specified technical result for the device is achieved by the fact that in the printed circuit board for interchangeable electronic components, which is a flat substrate with at least one seat for installing a replaceable, made in a separate housing with a given size of the electronic component type of chip having at least one the sides of a separate case are arranged in a row of output contacts, while in the area of the seat in the number of output contacts of the electronic component on a flat substrate formed printed conductive lamellas are arranged in a row for fastening on each of them a corresponding output contact, connected to printed conductors for connection with other electronic components placed on the surface of the plate in accordance with a circuit diagram, parallel to a series of printed conductive lamellas for fixing removable output contacts of an electronic component on a flat substrate at a seat of said electronic component, a series of additional chat conductive lamellas for surface mounting and securing the output contacts of another removable electronic component such as microcircuit, made in a separate housing with dimensions different from the housing of the previously indicated electronic component, printed conductive lamellas of both replaceable electronic components, matching the connection diagram, are interconnected on this substrate printed conductive lamellas of another removable electronic component, the wiring diagram of which is different from the wiring diagram of the contact in the first of the said replaceable electronic components, and printed conductors on a flat substrate to be connected to the printed conductive lamellas of another removable electronic component, are made with contacts brought out through the substrate to its reverse side, and at least part of the printed conductors intended to connect said contacts in accordance with the scheme of their connection, is made on an additional flat substrate contacting adjacent to the back side of the flat substrate on which the electronic Symbol Item.

In this case, the other part of the printed conductors intended for connection with the printed conductors on an additional flat substrate is made on a second additional flat substrate contacting adjacent to the rear side of the first additional flat substrate on which printed conductors are made for contact connection with the contacts of the flat substrate on which hosted electronic component.

The indicated features for each of the declared objects are essential and interconnected with each other with the formation of a stable set of essential features sufficient to obtain the desired technical result.

The present invention is illustrated by the specific examples presented in the drawings, where

figure 1 - General view of the printed circuit board with modified seats for removable microcircuits;

figure 2 is a General view of the location of the printed areas on the seat of the printed circuit board for replaceable microcircuits;

figure 3 shows the position of the removable chip and its attachment to the seat;

figure 4 - the same as in figure 3, when replacing a removable chip with another, with a different pinout and housing dimensions exceeding the housing dimensions of the replaced microcircuit;

figure 5 is a cross section of a printed circuit board with additional flat substrates.

According to the present invention, the printed circuit board (Fig. 1) is a flat substrate 1 with seats 2 and 3 for installing interchangeable electronic components in a separate housing with a given size, such as a microcircuit having at least one side of a separate housing aligned output contacts . The board can be configured for one seat for replaceable microcircuits. In the area of the seat 2 or 3, in the number of output contacts of one electronic component on a flat substrate, printed conductive lamellas 4 are arranged in a row arranged to fix on each of them the corresponding output lamella of one microcircuit (by lamellas we mean the conductive contacts formed on the substrate, to which the output contacts are soldered chip contacts). These lamellas are connected to the printed conductors 5 for connection with other electronic components (not shown) placed on the surface of the substrate in accordance with a circuit diagram (not shown).

On the seat 2 or 3 to accommodate the chip 7 in parallel in a row are printed conductive lamellas for securing the output contacts (figure 2) of the replaceable electronic component 8 with the same specified parameters. At the same seat 2 on a flat substrate, a number of additional printed conductive lamellas 6 are formed for surface mounting and fixing the output contacts of another removable electronic component 8 of the type of microcircuit, made in a separate case with dimensions different from the case of the previously indicated electronic component. Additional printed conductive lamellas 6 are connected to printed conductors 5 made on a flat substrate in accordance with the circuit diagram and the connection diagram of the first of the mentioned interchangeable electronic component.

The specified modified printed circuit board is designed for surface mounting of microcircuits by fixing their output contacts to printed conductive lamellas by soldering.

The printed conductive lamellas of both removable electronic components that match the connection diagram are interconnected on this substrate (Fig. 2), and for the case when the lamellar pattern of the second microcircuit does not coincide with the connection of similar lamellas of the replaced microcircuit, additional printed conductors intended for connection additional printed conductive lamellas of the replacement microcircuit of the second of the mentioned replaceable electronic components with printed conductors previously formed on a flat substrate in accordance Corollary a circuit diagram executed by at least one additional plane in the substrate, wherein the contact attached to the rear side of the main planar substrate.

In general, the preparation of compounds at diversity levels is provided as follows (FIG. 5):

- printed conductive lamellas of another removable electronic component, the connection diagram of which is different from the connection diagram of the lamellas of the first of the mentioned replaceable electronic components, and printed conductors on a flat substrate to be connected to printed conductive lamellas of another removable electronic component, made with contacts brought through the substrate to it the reverse side, and at least part of the printed conductors intended for connecting these contacts in accordance with the scheme of their connection, in performed on an additional flat substrate contacting adjacent to the back side of the flat substrate on which the electronic component is placed;

- another part of the printed conductors intended for connection with the printed conductors on an additional flat substrate is made on a second additional flat substrate contacting adjacent to the rear side of the first additional flat substrate, on which printed conductors are made for contact connection with the contacts of the flat substrate on which electronic component.

Figure 1 shows two examples of the design of seats for surface mounting of electronic components that are different in their parameters and sizes. The first example of execution (seat 2) is shown in Figs. 3 and 4 for microcircuits having smaller dimensions of the case, but the length of the rows of lamellas of which exceeds the length of the side of the case, and for the use of replaceable microcircuits with larger sizes of the sides of the body, in which the length of the rows of lamellas on each side is less than the length of the rows of lamellas of the first of the mentioned lamellas. Layout on the seat 2 on the board, the rows of conductive sections 6 under the lamellas of the replaceable microcircuit are located on the outside of the rows of the same sections 4 belonging to the replaced microcircuit.

Another example of a seat design is possible (see pos. 3 in Fig. 1), according to which, for a microcircuit with a smaller case size, rows of sections for these lamellas are located on the inside with respect to similar rows for microcircuit lamellas with a large case, whose length a number of externally placed lamellas exceeds the length of a number of internally placed lamellas of a replaceable microcircuit.

The present invention allows, with this design of the printed circuit board, to manufacture and mount electronic printing units for various groups of operating conditions on the basis of one design base. A new approach to the design of level modifiable printed circuit boards allows for the unity of design and technological documentation, as well as to ensure uniformity of the technological process and technological equipment for the manufacture and installation of electronic printed circuit boards designed for various groups of operating conditions.

The following is an example of a specific implementation of the method of changeover.

Figure 2-4 presents, as an example, a fragment of the printing unit (seat) for installing on it two different circuits that perform the same functions, but in different cases (foreign and domestic). The foreign case PQFP-144 (pos. 7) is a ceramic or plastic case for surface mounting of terminals; it contains a foreign FPGA (programmable logic integrated circuit) of ALTERA company designed for operation in lightweight operating conditions. The domestic case “Monopoly-88” (pos. 8) is a ceramic-metal case designed for surface mounting of terminals, which contains a custom or semi-ordered LSI manufactured by the Angstrem, Mikron or any other domestic plant designed to operate in harsh operating conditions.

When installed on an FPGA printed circuit board in a PQFP package, its output slats are soldered to the printed conductive sections of the rows indicated by 4 (Fig. 3).

To transfer the specified print unit to another (military) execution, the following operations are performed:

- Dismantling of FPGAs (PQFP-144 case);

- cleaning of the vacant landing area from the remnants of solder, flux and other technological components;

- installation and installation on the vacant landing section of the domestic LSI (housing "Monopoly-88") (figure 4) with the soldering of its output lamellas to the printed conductive sections of 6 rows.

The electrical connection of the output lamellas of two different FPGA and LSI cases is carried out by preliminary tracing (connection) of the corresponding printed conductors of the rows, respectively, of the rows (pos. 4 and 6), which have exactly the same functional purpose.

Presented in figure 2, a fragment of the printing unit shows the electrical connections of the printed conductors belonging to different packages of microcircuits installed on the intended place for them. However, the manufacturing process of the printing unit includes, along with the formation of lamellas, to which the findings of installed microcircuits are soldered, the formation of printed conductors of electrical interconnects of the lamellas, designed to solder the findings of two different microcircuits to them. Moreover, the conductors of these interconnects, as a rule, are located in the next deeper layers of the multilayer printing unit. Figure 5 presents a fragment of a multilayer printing unit, showing the principle of the relative position of the printed conductors of the electrical interconnects.

Figure 5 is indicated:

Pos.9 - the first additional flat substrate (second layer of a multilayer printing unit of electrical insulating material);

Pos.10 - the second additional flat substrate (third layer of a multilayer printing unit of electrical insulating material);

Pos.11 - metallized contacts with the pads, brought out through holes in the substrate 1 to its rear side, to ensure electrical contact of the + V power circuits from the second layer of the printing unit, indicated by Pos. 12, to the + V power lamellas of the first layer of the printed conductor, indicated on the substrate of figure 1;

Pos.12 - power supply + V on the second layer of the printing unit;

Pos.13 - metallized contacts with platforms to ensure electrical contact of the power supply circuits “Earth”;

Pos.14 - printed conductors on the third layer of the printing unit for wiring power circuits "Earth", indicated in figure 1 by a black bold line;

POS.15 - metallized contacts with the pads to ensure electrical contact of the power circuits from the third layer of the printing unit to the first layer along the chain 14-15-13.

The described process provides one hundred percent electrical and functional combination of replaceable and replacing LSI and guaranteed performance. In this case, no additional configuration and adjustment of the printing unit, as well as any design changes are required.

The present invention is industrially applicable, as it is based on the new principle of arranging seats for microchips on modifiable printed circuit boards and processes for forming multilevel printed circuit conductors, the manufacture of which alone does not alter the known technological methods for manufacturing the circuit boards themselves, conductive lamellas and printed conductors and electronic components.

Claims (2)

1. A printed circuit board for interchangeable electronic components, which is a flat substrate with at least one seat for installing a removable, made in a separate housing with a given size of the electronic component of the type of microcircuit having at least one side of a separate housing aligned output contacts while in the area of the seat in the number of output contacts of the electronic component on a flat substrate are arranged in a row located printed conductive lamellas for fixing on each of them a corresponding output contact, connected to printed conductors for connection with other electronic components placed on the surface of the plate in accordance with a circuit diagram, characterized in that parallel to a series of printed conductive lamellas for fixing the output contacts of the replaceable electronic component on a flat a series of additional printed conductive lamellas for surface mounting and securing the output contacts of another removable electronic component, such as a microcircuit, made in a separate case with dimensions different from those of the previously indicated electronic component, printed conductive lamellas of both removable electronic components that match the connection diagram are interconnected on this substrate, printed conductive lamellas another interchangeable electronic component, the connection diagram of which is different from the connection diagram of the lamellas of the first of the mentioned interchangeable electronic components nents, and printed conductors on a flat substrate, to be connected to printed conductive lamellas of another removable electronic component, are made with contacts brought out through the substrate to its reverse side, and at least part of the printed conductors designed to connect these contacts in accordance with their circuit the connection is made on an additional flat substrate contacting adjacent to the back side of the flat substrate on which the electronic component is placed. 2. The printed circuit board according to claim 1, characterized in that the other part of the printed conductors intended for connection with the printed conductors on an additional flat substrate is made on a second additional flat substrate contacting adjacent to the rear side of the first additional flat substrate on which the printed conductors for contact connection with the contacts of the flat substrate on which the electronic component is placed.

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