RU2174292C1 - Facility for heat removal and thermal stabilization of electron plates - Google Patents

Abstract

FIELD: electronics, provision for required thermal conditions of elements of radio electronic equipment. SUBSTANCE: technical result of proposed facility lies in increase of efficiency of cooling thermoelectric battery, in decrease of power consumption and mass of cooling unit which are achieved thanks to organization of uneven removal of heat from elements of electron plate by thermoelectric battery of stage implementation. Removal of heat and thermal stabilization are so organized that removal of heat from elements of electron plate with highest heat release is conducted by " coolest " stages of cooling thermoelectric battery and removal of heat from elements of electron plate releasing less heat is conducted by lesser " cool " stages, etc. In this case elements of electron plate releasing highest heat are positioned on stages of thermoelectric battery with highest level of cooling, elements and units releasing less heat are located on stages with lesser level of cooling. Facility incorporates stage thermoelectric battery made of basic thermoelectric battery making lower stage and additional thermoelectric batteries forming upper stages, heat transfers and heat exchanger. Stage thermoelectric battery is supplied from D C source. EFFECT: increased efficiency of cooling thermoelectric battery. 1 dwg

Description

 The invention relates to electronics and can be used to provide the required thermal regimes of elements of electronic equipment (REA), in particular electronic circuit boards.

 Modern REA devices are characterized by high local heat dissipations, which destabilizes their operation and reduces reliability. The use of thermal management systems based on air, water cooling or heat pipes is often impossible due to operational and weight and size limitations. Therefore, the solution to the problem of temperature stabilization of CEA can be obtained by using semiconductor thermoelectric batteries (TEB) as thermal management systems that are optimally combined with CEA in terms of the most important energy and weight and size parameters.

 Currently, solutions are being practiced, according to which the REA is directly connected to the cooled element with the provision of thermal contact of the thermopile [1, 2]. In this case, the heat-absorbing ("cold") junction of the thermopile is cooling the CEA element, and the heat-generating ("hot") is attached to the air or liquid heat exchanger. The fuel and energy complex provides uniform heat removal along the entire contact surface with the CEA element (the heat flux developed by the TEB has the same value over the entire area of the CEA element). In some cases, when an REA element is an electronic board or any other design that is a flat surface with radio components mounted on it, in which there is an uneven distribution of heat release over the area (there are several sources of heat release of unequal power), this approach is irrational. For these cases, the thermopile is calculated to lower the temperature to acceptable values of the area of the electronic circuit board with a heat source with maximum heat generation. In this case, the rest of the electronic board with heat sources having lower heat dissipation is cooled with the same intensity as the cooling of the region with an increased value of the heat source power. With this approach, there is excessive supercooling of the rest of the electronic board, associated with an additional waste of electrical energy and thermoelectric material.

 The aim of the invention is to increase the efficiency of use of cooling thermopile, to reduce energy consumption and mass of the cooling device.

 To achieve this goal, the proposed device design shown in the drawing.

 The device contains a cascade thermopile, consisting of a base thermopile 1, constituting the lower cascade, and additional thermopiles 2 forming the upper cascades, heat transfer 3, heat exchanger 4. An electronic board 5 with heat-generating elements 6 is placed on the cold junctions of the additional thermopile 2 and heat transfer 3. The placement of additional thermopiles 2 is carried out so that their "cold" junctions are located under the most heat-generating elements 6 of the electronic board 5. The cascade thermopiles are powered by a constant current source 7.

 The principle of operation of the device is to organize uneven heat removal from the elements of the electronic board, in which the cooling of the fuel elements is carried out with unequal intensity depending on the level of heat generated by them. In the present case, the system is organized in such a way that the heat is removed from the most heat-generating elements of the electronic circuit board with the most “cold” cascades of thermopile, the heat is taken from less heat-generating elements by the less “cold” cascades, etc. With this approach, the most heat-generating elements of the electronic board are placed on cascades of thermopiles with a higher level of cooling, elements and units with less heat are located on cascades with a lower level of cooling.

 The device operates as follows.

 The basic thermopile 1, designed to provide a given temperature regime of the areas of the electronic circuit board 5 with heat-generating elements 6 having the lowest dissipation power, sets a certain initial level of cooling of the electronic circuit board. Additional thermopiles 2 forming the upper cascades located under the heat-generating elements 6 of the electronic circuit board 5 with high dissipation powers organize additional heat removal, the value of which is determined in accordance with the dissipation power level of a particular heat-generating element 6. Thermal contact of the cold junctions of the cascade thermopiles with areas of electronic boards 5 carry out heat transfers 3 made of highly heat-conducting material. Heat is removed from the “hot” junction of the cascade thermopile; it is made by heat exchanger 4, which, depending on the level of the output power, can be air or liquid. The power supply of individual cascades of thermopile is carried out by a constant current source 7 in parallel or in series.

 Studies have shown that the use of the proposed device significantly increases the efficiency of heat dissipation, and also reduces the overall dimensions of the cooling system. In this case, the maximum gain in the consumption of electric energy can be obtained using a sequential cascade supply circuit, and the maximum reduction in the overall dimensions of the device can be achieved using the minimum mass mode.

Literature
1. Zorin I.V., Zorina Z.L. Thermoelectric refrigerators and generators. L .: Energy, 1973.

 2. Kolenko EA Thermoelectric cooling devices. L .: Nauka, 1967.

Claims (1)

 A device for heat removal and thermal stabilization of electronic circuit boards, comprising a thermoelectric battery, a heat exchanger, characterized in that the thermoelectric battery has a cascade design, in which the lower base cascade provides a predetermined temperature regime for the regions of the electronic circuit board with heat-generating elements having the lowest dissipation power, and the upper additional cascades located under the heat-generating elements of the electronic board with high dissipation powers, provide additional heat removal, the value of which is determined in accordance with the dissipation power level of a specific fuel element, the contact of the lower base cascade of thermoelectric batteries with areas of the electronic board is carried out by heat transfers made of highly heat-conducting material.