RU2013113524A - SOLUTION FOR LASER-INDUCED METALIZATION OF DIELECTRICS - Google Patents
SOLUTION FOR LASER-INDUCED METALIZATION OF DIELECTRICS Download PDFInfo
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- RU2013113524A RU2013113524A RU2013113524/02A RU2013113524A RU2013113524A RU 2013113524 A RU2013113524 A RU 2013113524A RU 2013113524/02 A RU2013113524/02 A RU 2013113524/02A RU 2013113524 A RU2013113524 A RU 2013113524A RU 2013113524 A RU2013113524 A RU 2013113524A
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Abstract
1. Раствор для лазерно-индуцированной металлизации диэлектриков, включающий соль меди, восстановитель и поверхностно-активную добавку, отличающийся тем, что в качестве соли меди применен формиат меди(II) в концентрации водного раствора 0.02÷0.6 моль/л.2. Раствор по п.1, отличающийся тем, что в качестве поверхностно-активной добавки использован полиоксиэтиленсорбитан (Твин 20÷80) в концентрации водного раствора 0.01÷1 г/л.3. Раствор по п.1, отличающийся тем, что в качестве восстановителя использован метиловый спирт, в концентрации водного раствора 0.05÷2 моль/л.4. Раствор по п.1, отличающийся тем, что в качестве восстановителя использован изопропиловый спирт, в концентрации водного раствора 0.05÷2 моль/л.5. Раствор по п.1, отличающийся тем, что в качестве восстановителя использован 1,3-бутиленгликоль, в концентрации водного раствора 0.05÷0.3 моль/л.1. A solution for laser-induced metallization of dielectrics, including a copper salt, a reducing agent and a surface-active additive, characterized in that copper (II) formate is used as a copper salt in an aqueous solution concentration of 0.02–0.6 mol / L. 2. The solution according to claim 1, characterized in that polyoxyethylene sorbitan (Tween 20 ÷ 80) in an aqueous solution concentration of 0.01 ÷ 1 g / l is used as a surface-active additive. The solution according to claim 1, characterized in that methyl alcohol is used as a reducing agent in an aqueous solution concentration of 0.05 ÷ 2 mol / l. The solution according to claim 1, characterized in that isopropyl alcohol is used as a reducing agent in an aqueous solution concentration of 0.05 ÷ 2 mol / l. The solution according to claim 1, characterized in that 1,3-butylene glycol is used as a reducing agent in an aqueous solution concentration of 0.05 ÷ 0.3 mol / L.
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RU2013113524/02A RU2532775C1 (en) | 2013-03-26 | 2013-03-26 | Solution for laser-induced metallisation of dielectrics |
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RU2013113524/02A RU2532775C1 (en) | 2013-03-26 | 2013-03-26 | Solution for laser-induced metallisation of dielectrics |
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RU2013113524A true RU2013113524A (en) | 2014-11-10 |
RU2532775C1 RU2532775C1 (en) | 2014-11-10 |
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RU2013113524/02A RU2532775C1 (en) | 2013-03-26 | 2013-03-26 | Solution for laser-induced metallisation of dielectrics |
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Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
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SU819148A1 (en) * | 1979-01-04 | 1981-04-07 | Предприятие П/Я Г-4493 | Photosensitive solution |
GB0212632D0 (en) * | 2002-05-31 | 2002-07-10 | Shipley Co Llc | Laser-activated dielectric material and method for using the same in an electroless deposition process |
RU2323553C1 (en) * | 2007-01-09 | 2008-04-27 | Федеральное государственное образовательное учреждение высшего профессионального образования Санкт-Петербургский государственный университет (СПбГУ) | Method for laser deposition of copper from electrolyte solution on surface of dielectric |
UA94328C2 (en) * | 2009-11-30 | 2011-04-26 | Одесский Национальный Университет Им. И.И. Мечникова | Method for manufacturing back planes |
RU2462537C2 (en) * | 2010-11-11 | 2012-09-27 | Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования Санкт-Петербургский государственный университет | Solution for laser-induced metallisation of dielectric materials, and method of laser-induced metallisation of dielectric materials using it |
RU2468548C1 (en) * | 2011-10-11 | 2012-11-27 | Леонид Геннадьевич Менчиков | Method of laser copper deposition from solution of electrolyte on dielectric surface |
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Effective date: 20170117 |
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Effective date: 20180327 |