RU2011120246A - METHOD FOR FIRMWARE AND METALIZATION OF HOLES IN A PCB BY LASER RADIATION - Google Patents

METHOD FOR FIRMWARE AND METALIZATION OF HOLES IN A PCB BY LASER RADIATION Download PDF

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Publication number
RU2011120246A
RU2011120246A RU2011120246/02A RU2011120246A RU2011120246A RU 2011120246 A RU2011120246 A RU 2011120246A RU 2011120246/02 A RU2011120246/02 A RU 2011120246/02A RU 2011120246 A RU2011120246 A RU 2011120246A RU 2011120246 A RU2011120246 A RU 2011120246A
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RU
Russia
Prior art keywords
laser radiation
holes
substrate
board
pole
Prior art date
Application number
RU2011120246/02A
Other languages
Russian (ru)
Other versions
RU2472325C1 (en
Inventor
Игорь Валентинович Колядов
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Игорь Валентинович Колядов
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Priority to RU2011120246/02A priority Critical patent/RU2472325C1/en
Publication of RU2011120246A publication Critical patent/RU2011120246A/en
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Publication of RU2472325C1 publication Critical patent/RU2472325C1/en

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Abstract

Способ прошивки и металлизации отверстий в печатной плате лазерным излучением, заключающийся в формировании отверстий в подложке перемещением фокального пятна сфокусированного лазерного излучения и их металлизации, отличающийся тем, что перемещают фокальное пятно вертикально вниз с верхней поверхности платы до нижней поверхности платы, под которую перед прошивкой подкладывают подложку из электропроводящего материала, зеркально отражающего лазерное излучение, в процессе прошивки принимают отраженное лазерное излучение и после окончания прошивки отверстия получают резкое увеличение сигнала от отраженного лазерного излучения, а затем осуществляют металлизацию отверстия электрическим газовым разрядом, для чего прилагают напряжение одним полюсом к подложке, а другим полюсом - к кольцу, располагаемому над печатной платой и охватывающему лазерное излучение.A method of flashing and metallizing holes in a printed circuit board with laser radiation, which consists in forming holes in the substrate by moving the focal spot of focused laser radiation and metallizing them, characterized in that the focal spot is moved vertically down from the top surface of the board to the bottom surface of the board, under which a substrate of electrically conductive material that mirrors laser radiation, during the firmware process receive reflected laser radiation and after an eye chania EEPROM holes receive a sharp increase in the signal from the reflected laser light, and then carry out a metallization electric gas discharge opening, which voltage is applied to the substrate with one pole and the other pole - to the ring, is located above the printed circuit board and covering the laser radiation.

Claims (1)

Способ прошивки и металлизации отверстий в печатной плате лазерным излучением, заключающийся в формировании отверстий в подложке перемещением фокального пятна сфокусированного лазерного излучения и их металлизации, отличающийся тем, что перемещают фокальное пятно вертикально вниз с верхней поверхности платы до нижней поверхности платы, под которую перед прошивкой подкладывают подложку из электропроводящего материала, зеркально отражающего лазерное излучение, в процессе прошивки принимают отраженное лазерное излучение и после окончания прошивки отверстия получают резкое увеличение сигнала от отраженного лазерного излучения, а затем осуществляют металлизацию отверстия электрическим газовым разрядом, для чего прилагают напряжение одним полюсом к подложке, а другим полюсом - к кольцу, располагаемому над печатной платой и охватывающему лазерное излучение. A method of flashing and metallizing holes in a printed circuit board with laser radiation, which consists in forming holes in the substrate by moving the focal spot of focused laser radiation and metallizing them, characterized in that the focal spot is moved vertically down from the top surface of the board to the bottom surface of the board, under which a substrate of electrically conductive material that mirrors laser radiation, during the firmware process receive reflected laser radiation and after an eye chania EEPROM holes receive a sharp increase in the signal from the reflected laser light, and then carry out a metallization electric gas discharge opening, which voltage is applied to the substrate with one pole and the other pole - to the ring, is located above the printed circuit board and covering the laser radiation.
RU2011120246/02A 2011-05-20 2011-05-20 Method of making plated holes in printed-circuit board RU2472325C1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
RU2011120246/02A RU2472325C1 (en) 2011-05-20 2011-05-20 Method of making plated holes in printed-circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
RU2011120246/02A RU2472325C1 (en) 2011-05-20 2011-05-20 Method of making plated holes in printed-circuit board

Publications (2)

Publication Number Publication Date
RU2011120246A true RU2011120246A (en) 2012-11-27
RU2472325C1 RU2472325C1 (en) 2013-01-10

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Application Number Title Priority Date Filing Date
RU2011120246/02A RU2472325C1 (en) 2011-05-20 2011-05-20 Method of making plated holes in printed-circuit board

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RU (1) RU2472325C1 (en)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU1050141A1 (en) * 1982-07-19 1983-10-23 Куйбышевский авиационный институт им.акад.С.П.Королева Method of forming holes in dielectric substrate
US4818834A (en) * 1988-03-21 1989-04-04 Raycon Corporation Process for drilling chamfered holes
US4925723A (en) * 1988-09-29 1990-05-15 Microwave Power, Inc. Microwave integrated circuit substrate including metal filled via holes and method of manufacture
SU1820831A1 (en) * 1991-03-12 1996-03-10 Саратовское научно-производственное объединение "Алмаз" Method for metal coating of holes in dielectric substrate
US6172331B1 (en) * 1997-09-17 2001-01-09 General Electric Company Method and apparatus for laser drilling
RU2395938C1 (en) * 2008-10-29 2010-07-27 Федеральное государственное унитарное предприятие "Научно-производственное предприятие "Полет" Method for manufacturing of printed circuit boards

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RU2472325C1 (en) 2013-01-10

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