RU2004136784A - METHOD FOR REMOVING DEFECTS IN SOLDERED COMPOUNDS - Google Patents

METHOD FOR REMOVING DEFECTS IN SOLDERED COMPOUNDS Download PDF

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Publication number
RU2004136784A
RU2004136784A RU2004136784/02A RU2004136784A RU2004136784A RU 2004136784 A RU2004136784 A RU 2004136784A RU 2004136784/02 A RU2004136784/02 A RU 2004136784/02A RU 2004136784 A RU2004136784 A RU 2004136784A RU 2004136784 A RU2004136784 A RU 2004136784A
Authority
RU
Russia
Prior art keywords
removing defects
soldered
compounds
soldered compounds
defects
Prior art date
Application number
RU2004136784/02A
Other languages
Russian (ru)
Other versions
RU2284883C2 (en
Inventor
Анатолий Гаврилович Астафьев (RU)
Анатолий Гаврилович Астафьев
Original Assignee
ОАО "Научно-производственна корпораци "ИРКУТ" (ОАО Корпораци "ИРКУТ") (RU)
ОАО "Научно-производственная корпорация "ИРКУТ" (ОАО Корпорация "ИРКУТ")
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ОАО "Научно-производственна корпораци "ИРКУТ" (ОАО Корпораци "ИРКУТ") (RU), ОАО "Научно-производственная корпорация "ИРКУТ" (ОАО Корпорация "ИРКУТ") filed Critical ОАО "Научно-производственна корпораци "ИРКУТ" (ОАО Корпораци "ИРКУТ") (RU)
Priority to RU2004136784/02A priority Critical patent/RU2284883C2/en
Publication of RU2004136784A publication Critical patent/RU2004136784A/en
Application granted granted Critical
Publication of RU2284883C2 publication Critical patent/RU2284883C2/en

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  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Claims (1)

Способ удаления дефектов в паяных соединениях, заключающийся в нагреве дефектного паяного соединения до температуры расплавления припоя, отличающийся тем, что на дефектное паяное соединение дополнительно подают ультразвуковые колебания.A method for removing defects in soldered joints, which consists in heating the defective soldered joint to the melting point of the solder, characterized in that ultrasonic vibrations are additionally applied to the defective soldered joint.
RU2004136784/02A 2004-12-15 2004-12-15 Method for eliminating defects in soldered joints RU2284883C2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
RU2004136784/02A RU2284883C2 (en) 2004-12-15 2004-12-15 Method for eliminating defects in soldered joints

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
RU2004136784/02A RU2284883C2 (en) 2004-12-15 2004-12-15 Method for eliminating defects in soldered joints

Publications (2)

Publication Number Publication Date
RU2004136784A true RU2004136784A (en) 2006-06-10
RU2284883C2 RU2284883C2 (en) 2006-10-10

Family

ID=36711994

Family Applications (1)

Application Number Title Priority Date Filing Date
RU2004136784/02A RU2284883C2 (en) 2004-12-15 2004-12-15 Method for eliminating defects in soldered joints

Country Status (1)

Country Link
RU (1) RU2284883C2 (en)

Also Published As

Publication number Publication date
RU2284883C2 (en) 2006-10-10

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