RU1832407C - Method and device for making high frequency volumetric integrated circuit module - Google Patents

Abstract

Usage: for the manufacture of multifunctional modules of microwave devices, information processing devices in radio relay communication, ultrafast computing devices, active phased antenna arrays. SUMMARY OF THE INVENTION: increasing manufacturability while improving electrical characteristics is achieved by the fact that strip boards are made by applying film heaters with excess solder layers to the periphery of the dielectric layers having contact pads at the ends of the layers. Next, the boards with attached hinged elements are placed in a package, the inputs and outputs of the module circuit are connected to the test bench and performed in groups, starting with the upper packages of the package, sequential alignment alignment of the film strip elements on adjacent boards by their mutual movement with simultaneous control of electrical characteristics and mutual fixing of these boards by applying voltage to the contact pads of the film heaters, after which the second g board groups with the participation of the combined first group and so on until the last board package. Using the thick film heater, the module is also packed. The assembly of the module is carried out in an assembly cassette comprising a base with a bottom and a cover, with a piston mounted inside the base to move along the walls of the base, and a spring-loaded rod ending in a plate parallel to the piston through a hole in the cover 3. In the middle part of the base, micrometric screws and opposing springs on the inner walls of the spring, as well as spring-loaded electrical contacts connected to the voltage source, are installed at several levels. 2 s.i. 1 wpp, 5 ill.

Description

The invention relates to high-frequency integrated technology and can be used for the manufacture of

devices, information processing devices in radio relay communication, superfast computing devices, active phased antenna arrays.

The aim of the invention is to increase manufacturability while improving electrical performance. In order to achieve the goal of a method for manufacturing a high-frequency surround integrated module, including the manufacture of strip boards by applying film strip elements to the dielectric layer, attaching weightless elements thereto, sequentially assembling the strip boards in a tightly packed bag, securing them together, performing external switching and packaging, simultaneously a film heater is applied with film strip elements, after which they are applied to the end surfaces of the dielectric layers ntaktnye pad, the surface film heater service and cover layer excess solder during assembly in the package is performed to connect the inputs and outputs realized in the module circuitry to control the measuring bench and, starting from the upper stripline circuit board package. alignment of the film strip elements on adjacent strip boards for a group that implements one or more finished functional units is performed by linear and angular mutual displacement with simultaneous control of electrical characteristics, and the strip strips of the group are mutually fixed by heating the solder on the contacting film heaters of neighboring strip boards by applying voltage to their contact pads, after which the group of strip boards is moved up and alignment is performed the combination and mutual fixing of the next group of strip boards, the combined previous group being included in the next as a single thickened board, and the packaging is carried out using film heaters.

The goal is also achieved in that in the device for assembling a high-frequency surround integrated module containing a cassette / for assembling strip boards in a package, the cassette is made in the form of a box-shaped base with a threaded hole and a cover with a hole and provided with a piston with a screw rod located in the threaded hole of the base with the ability to move along the inner walls of the base, and the clamping unit, made in the form of a spring-loaded rod, the free end of which is placed in the hole of the cover, and the plate, fixed at its other end is parallel to the piston, and in the middle part of the base at several levels, the distance between which corresponds to the thickness of the strip boards, through two holes are made on two adjacent sides, in which micrometric screws with tips are installed on the outside of the base, and on two opposite the sides are made of internal blind holes in which springs are installed, and the tips and springs are installed with the possibility of contact with the end surfaces of the respective strip boards, and on hydrochloric side on the same levels are made through holes in which the spring-loaded electrical contacts are placed.

In FIG. Figure 1 shows the design fails. a cassette with a package of strip cards placed in it; in FIG. 2 shows a horizontal section of a cartridge; in FIG. 3 shows the module assembly with attached;. base case; in FIG. 4 - a unit for interlocking strip boards with a film heater; in FIG. 5 - a unit for fixing the module housing to its base using a thick film heater.

The assembly cartridge contains a box-shaped base 1 with a bottom 2 and a removable cover 3. Inside the base 1, a piston 5 with screw feed from the bottom 2 is mounted along the inner walls 4. The feed is carried out by turning ± of the handle 6, which is rigidly connected to the screw rod 7 placed in the threaded hole 8 of the bottom 2, the endless threadless part 9 of which is installed in the blind hole of the piston 5 with free rotation relative to the piston 5 and secured to prevent the ± Z movement of the rod 7 relative to the piston 5 with the help of a split washer 10, rigidly fixed on the bottom surface of the piston 5 and passed through an annular cutout in the end part 9 of the rod 7. A spring-loaded rod 12 with a plate 13 parallel to the piston 5 with a thin a vacuum rubber layer 14, with the inner end 15 of the rod 12 installed in the blind hole of the plate 13 and fixed by soldering 16. The free end of the rod 12 is connected to the cover 3 by a tension spring 17, which is passed through the hole by the end of the upper turn 18 upper portion of the free end of the stem 12 is mounted kon1schntrichno with the rod 12, and the end

the lower coil of the spring 17 is passed through the hole 19 in the cover 3 and thermocompression welding 20 is fixed on the lower surface of the cover 3.

In the middle part of the base 1, at several levels, the distance between which corresponds to the thicknesses of the strip boards 21, 22, 23, 24, miniature micrometer screws with tips are installed on two adjacent sides in the through holes made. In FIG. 1, for the sake of clarity, shows only one of the identical micrometer screws 25 with rotation ± 3i, located in a section of the main view of the drawing along the plane of symmetry. A micrometer screw 25 is fixed to the outer wall of the base 1 by soldering 26. Its tip 27 is passed through the hole 28 of the wall of the base 1. On the opposite inner wall 4 of the base 1 (type I), a compression spring 30 is installed in the blind hole 29 in contact with the strip plate 31 of the strip package boards mounted on the upper surface of the piston 5, in which 32 is the bottom and 21 is the top of the package board. Any of a strip of boards, for example a board 24, may contain film strip elements 33 and attached hanging elements 34, for which blind or through holes are made in an adjacent strip board, for example in a board 23.

In view I of FIG. Fig. 1 shows a unit for gripping two adjacent strip boards 31 and 35 with an excess solder layer 36 connecting the film heater 37 on the board 35 and the film contact conductor 38 on the board 31.

Output electrical switching in the form of insulated conductors and coaxial microcables .39. soldered to the control contact end faces of the strip boards, to which the inputs and outputs of the circuitry module are output, are assembled into bundles 40, which are passed through the cutouts 41 in the plate 13 and the holes 42 in the walls of the base 1 and are connected to the test bench.

A horizontal section (Fig. 2) shows a strip board 31 from a package of strip boards located on the first (upper) level of the assembly cassette, which contains micrometric screws 25, 43, 44 - level (, 2,3), compression springs 30 (see .view I) and spring-loaded electrical contacts containing the actual metal contact pins 45, dielectric sleeves 46 mounted

in the openings of the base 1 wall, a contact housing 47 fixed to the outer surface of the base 1 wall by soldering 48, contact buttons 49 and conductors 50 connecting the contacts to the voltage source. The strip board 31 contains film strips and some attached elements that are located in the topological zone 51, and

0 is also located on the periphery of the board film heater 52, connected at both ends with film pads 53.

In the second, lower level XI, 2,3) micrometer screws 54, 55 and 56, electrical contacts to the housing 57 and compression springs (not shown in Fig. 2) are installed. The third level 6k (.2) contains micrometer screws 58 and 59 and compression springs (not shown in Fig. 2).

In FIG. Figure 3 shows a module in an assembly with a module 62 connected with a metal base heater 60 to a metal base 61, housing 62 with flanging 63. An assembled package of 64 strip boards is installed on the base of the housing. The Enagr voltage is applied to the end thick-film contact pads 65

0 and 66.

The unit for mutual fastening of the strip boards using the film heating heater (Fig. 4) contains deposited on the surface of two adjacent strip

5 boards 67 and 68 elements: a film heater 69 with an end contact pad 70 and an excess layer of solder 71, a film contact conductor 72. repeating in plan the configuration of the film

0 of heater 69. with an excess layer of solder 73. On the bottom surface of the board 68, a film heater 74 is made with an excess layer of solder 75 and an end contact pad 76 for connecting to the downstream strip plate.

5 The pads 70 and 76 are spaced along the length of the sides of the board relative to each other.

The module housing fixing unit at its base 0 using a thick-film heater (Fig. 5) contains a dielectric layer 77 sequentially applied to the module base 61, a thick film heater 78, a protective dielectric 5 layer 79. Over which a solder layer 80 is applied. Flanging section 63 of the body served.

A method of manufacturing a high frequency surround integrated module is as follows.

Strip boards 21 are made.

22, 23i32 (Fig. 1) by deposition on polycore or insulating dielectric layers with standard thicknesses of 0.25.0.5 ... mm according to industrial microwave technology of film strip elements 33 in accordance with the calculated topology, and along the periphery of the dielectric layers of film heaters 37 and film contact conductors 38. Using the same technology, contact pads 53 are applied to the end surfaces of the dielectric layers. Next, the hanging elements 34 are brazed to the film strip elements 33. Strip boards 23 are made on dielectric layers with pre-made holes for mounting hinge elements 34 on adjacent strip boards. End contact pads are also made on some strip boards for soldering to test points, c) and the outputs of the electrical circuit of the output electrical switching module 39 - insulated conductors and coaxial microcables connected to the test bench. Film switching conductors connecting the film strip elements to these end contact pads, at the periphery of the strip boards on the sides where the film heater 37 is located, extend to the contact pads between the ends of the heater, and on the sides where the film contact conductor 38, they extend at the provided breaks of this conductor.

Fabricated strip boards 21, 22,

2332 are collected in the required order

following in the package, which is installed on the 8th upper surface of the piston 5 of the assembly cartridge. The conductors and microcables of the output electrical commutation 39 are assembled into bundles 40, which, through the openings 42 in the upper part of the walls of the base 1, are led outside the cassette and connected to a test bench. In this case, the piston 5 is located in the lower part of the base 1. Next, the cover 3 with the clamping unit of the spring-loaded rod 12, the plate 13 and the tension spring 17 is mounted and fixed on the upper ends of its walls. In this case, the plate 13 with the layer 14 fixed on its lower surface tightly presses the pop-bag

circuit boards to the surface of the piston 5. After that, the conductors and microcables of the harnesses 40 are connected to the test stand, and the conductors 50 are electrical

contacts to the voltage source of the heaters.

By rotating ± a of the handle 6, the piston 5 is set to the initial operating position corresponding to the placement

the upper strip board 21 in the first (upper) level / cassette. In the initial position, the tips of 27 micrometric screws 25 of all levels D,}, 5k ,,,, are turned flush with the inner surface

the walls of the base 1, and the springs 30 squeeze in their upper levels 1 of the cassette the corresponding strip boards to the maximum gap (Fig. 2, view AND). Rotation ±, where (psij s, YS, 5s of micrometric screws, strip boards 21,22,23, ... of all levels D, involved in the cartridge),, 3k,.,. mutually relative to each other, and depending on the supply of tips of 27 micrometer screws in each level, the corresponding strip The board performs a combined - angular and linear - movement in the level plane. Thus, in the first group of strip

boards 21, 22, 23 ,,,,, implementing one or more complete and interconnected functional units of the module, an optimal alignment of film strip elements forming volume nodes and located on adjacent strip boards is achieved, fixed by the maximum readings of the required electrical characteristics on test bench

After alignment of the film strip elements, alignment of the strip boards 21, 22.23, ... of the first group is performed. To do this, the voltage is applied to the film heaters 52 of these strip boards in series or simultaneously by pressing the buttons 49 of the electrical contacts of the cassette levels. In this case, the voltage from the source through the connecting conductors 50 and the contact

Item 45 is fed to the film end contact pads 53 and then the circuit closes on the film heater 52. When the film layer of the heater 37 is heated (FIG. 1), the excess layer melts

Solder 36, which, when cooled after disconnecting the voltage, connects the film heater conductor 37 and the film contact conductor 38 around the entire perimeter of the strip boards 35 and 31, i.e.

connects boards 31 and 35. Similarly, all strip boards 21, 22, 23 ... of the first group of packages are connected.

By turning ± a of the handle b, the piston 5 rises by the amount at which the lower strip board of the previously combined group of strip boards is located in the first level of the cartridge. For the three-level cassette (Fig. 1), such a lower plate is a strip board 23. A second level has a strip board 24 at the cartridge, and so on. In the above order, the same process steps are performed with the difference that the top board of the second group of aligned and interconnected strip boards is the combined first group of strip boards.

This procedure is performed for all underlying groups of boards up to the last strip board 32 of the packet.

The packaged strip cards are removed from the cassette. Conductors and coaxial microcables of electrical switching 39 are soldered from the end contact pads, and the package of boards is installed on the metal base 61 of the module (Fig. 3) with compound fastening, and a thick-film heater 60 is applied on the periphery of the base. Then the inputs and outputs of the module circuit from the same end the contact pads are connected by conductors and microcables to external high and low frequency connectors mounted in the holes of the base 61 (not shown in Fig. 3). After that, the housing 62 is installed by flanging 63 on the base 61. The Enagr voltage is applied to the end thick-film contact pads 65 and 66, the solder layer 80 is heated (Fig. 5). applied to the protective dielectric layer 79. which connects the housing to the base of the module.

An example of a specific implementation of a method for manufacturing a high-frequency surround integrated module and device for its assembly is illustrated in FIG. 1, 2, 3, 4, 5.

Since, due to the specifics of the circuit design solutions of high-frequency surround modules, its functional units are mainly implemented in two or three adjacent strip boards (levels) of the module, alignment is sufficient to be performed in three levels of the assembly cassette. To implement the particular method, a three-level cassette is used (Fig. . 1, 2): levels D, Y) and dk. The first two levels contain

three micrometric screws each, the third level - two micrometric screws, which is caused by the maximum density of the screws on the sides of the base. The relative position of the screws in each level is designed to ensure eccentricity, i.e. linear and angular movement of the strip board relative to the walls of the base 1, and in the totality of the frame levels, the mutual eccentricity of the strip boards at the frame levels.

Micrometric screws - miniaturized, of special manufacture: simplified, because small things are important to them

pitch of a threaded pair; no readout accuracy is required. The springs 30 have an ellipsoidal contact surface (Fig. 1, view I) to prevent the spring from catching over the edges of the strip boards during movement

package vertically. Micrometric screws provide, as well as the springs 30, the movement of the strip boards within D5 5max-5min 100 ... 250 μm (see Fig. 2, view I), which with a margin ensures the required adjustment range of adjacent strip boards with a linear (in two dimensions) and their angular displacement.

Spring Material 30 - Phosphor

bronze or steel 65 G, the latter is used as the material of the tension spring 17. The rod material 7 is steel, the material of the micrometer screw parts is brass with a nickel chemical coating. The remaining parts of the cartridge design are alloy D16 with a HIM.N6 coating ... 9. Insulated conductors of electrical switching 39 - type MGTF, coaxial microcables - miniaturized standard, the gap size of 8min (see Fig. 2, view I) is selected from the condition + (50 ... 100) microns, where dkk is the diameter of the microcable used. Designs of electrical contacts 47, 57 are specialized.

To minimize the number of electrical contacts (two contacts for a three-level cassette) in a particular assembly cassette, the contacts are installed on the first |) and second () / 0 levels of the cassette, which allows three strip boards to be connected. This is understood from FIG. 4, where board 67 is located at the level, board 68 is at the level, and the underlying one, in FIG. 4 not shown, board located

at the level of d. When the film heaters 69, 74 are located on the lower surfaces of the boards at levels 3, y, three boards at the levels, y, d are connected using two electrical contacts.

The material of the layers of film heaters 69, 74. end contact 70. 76 contact conductor 72 composition of chromium-copper-chromium. Solder 71.73 - POSC 50-18, Soldering mode when applying a constant voltage of 10, .. 15 V is selected experimentally with a width of a film heater of 0.8 ,,. 1.2 mm for strip boards with dielectric multicore layers of size 48x60 mm.

Base material 61 module steel 15x25 T, case material 62 module D16T alloy with a coating of Chemical I, 9, Dielectric layers 77 and 79 (Fig. 5) and a conductive layer 78 are applied to the base 61 by thick film technology: screen printing and firing. The material of layers 77.79 is a PD9 dielectric board according to ETO.035.103 TU with thicknesses of 30 and 74 μm, respectively. The material of the layer of the film heater 78 of the paste PP1 and PP4, successively applied, according to ETO.032.508 TU, each 20 microns thick. Solder 80 grade POSC 50-18 at a temperature of 150 ... 180 ° C is applied to the conductive layer of paste PP1 with a thickness of 20 microns. The width of the film heater 2. ,, 3 mm, the voltage Enagr 15 V.

The assembly work of the module when implementing a specific manufacturing method is described above, but taking into account the three-level cassette.

Compared with existing methods, the proposed method improves manufacturability, including simplification of assembly, by 3 ... 4 times (in economic terms) and improves the electrical characteristics of the module: reduction of losses by 15 ... 20% m bandwidth expansion by the same amount.

Claims (3)

1. A method of manufacturing a high-frequency three-dimensional integrated module, including the manufacture of strip boards by applying film strip elements to the dielectric layer, attaching hinged elements to them, sequential assembly of strip boards and a package with packaged packaging, their mutual fastening, performing external switching and packaging, characterized in , what. in order to improve manufacturability while improving electrical characteristics, a film heater is applied simultaneously with film strip elements, after which contact pads are applied to the end surfaces of the dielectric layers, the surface of the film heater is tinned and coated with an excess layer of solder, when assembled into a bag, connection of inputs and outputs implemented in the module electrical circuit to the test bench and, starting with the upper strip boards of the package, alignment of the film strip elements on adjacent strip boards is performed for a group that implements one or more complete functional units by linear and angular mutual movement with simultaneous control of electrical characteristics, and instead, fixing the strip boards of the group is carried out by heating the solder on the contacting film heaters of adjacent strip boards by supplying voltage Yen to their pads, after which the group of strip boards is moved up and adjustment of the next group of strip boards is carried out and the two groups are fixed together, the previous group joining the next and the next as a single thickened board. 2, The method according to claim 1, with the exception that the packaging is carried out using film heaters. 3. A device for manufacturing a high-frequency surround integrated module containing a cartridge for assembling strip boards into a package, characterized in that, in order to improve manufacturability while improving electrical characteristics, the cartridge is made in the form of a box base with a threaded hole and a cover with a hole and equipped with a piston with a screw rod, placed in the threaded hole of the base with the possibility of movement along the inner: blue walls of the base, and a clamping unit made in the form of a spring Foot a rod, the free end of which is placed in the opening of the cap, and a plate mounted on its other end parallel to the piston, in the middle of the base from several levels, the distance between which correspond to the thicknesses of the strip 1x boards, through two holes are made on two adjacent sides, in which micrometric screws with tips are installed on the outside of the base. and on two opposite sides there are internal blind holes in which the springs are installed, the tips and springs being installed with the possibility of contact with the end surfaces of the respective strip boards. and on one side at the same levels, through holes are made in which spring-loaded electrical contacts are placed. uU  2 39 30 eSi 3i S2 ft ij 3 th FIG. 2. 62 € k Negre fS P N gI, C || U |||| d |, ||||, D | ;. /..-.: .., ..... T-t-- /::/:;:::::::::::: /// € 7 € 8 t. G t /, 4. . 5,