RU1829132C - Device for inspection of printed circuit boards - Google Patents

Abstract

The invention relates to radio engineering and electronics and can be used to contact printed circuit boards and connect them to instrumentation and test equipment. The aim of the invention is to expand the functionality and higher

Description

The invention relates to radio engineering and electronics and can be used to contact printed circuit boards and connect them to instrumentation and test equipment.

The purpose of the invention is to expand the functionality and increase the density of installation.

Connecting two current collectors to one contact ensures that the printed circuit boards are monitored not only for the integrity and disconnection of the circuits and the insulation resistance between them, but also for the condition and reliability of the interlayer metallized junctions with the current and potential circuits connected to them (two contacts from the bottom and two contacts on top for each transition).

To provide the technological capabilities of mounting connections at high density, only a block of printed ones. circuit boards provides the implementation of this technical solution.

In FIG. 1 shows an apparatus for monitoring circuit boards, general view; figure 2 - contact matrix in isometry; in Fig.Z - collapsible contact module, front view; figure 4 is the same side view; figure 5 is the same, a top view; figure 6 is the same, bottom view; Fig.7 is a section aa in Fig.Z; in Fig.8 is a section bB in Fig.4.

The device for monitoring printed circuit boards consists of a housing 1, a contact block 2 mounted on it, and is cantileverly built. The contact matrix 6 is mounted on the panel 3 of the housing 1 of the movable cross beam 4. A contact matrix 6. is fixed on the panel 5 of block 2. A replaceable adapter 7 with a set of elastic contacts 8 is installed on top of the matrix.

The contact matrix b consists of a base 9, made in the form of a frame, guides 10 arranged parallel to each other and fixed from the bottom of the frame and installed in the frame lumen 11, onto the bearing pads 12 of the guides 10

collapsible contact modules 13, consisting of two parts. The modules 13 from longitudinal movement by pins 14 are fixed in the grooves 15 of the guides 10 and pushed to them by screws 16. On the top

the base plane 9, along the perimeter of the modules 13, orienting pins 17 are mounted for coordinate fixation of the adapter 7 relative to the matrix 6.

Each of the modules 13 consists of an upper part 18 made of electrically insulating material, mated with protrusions 19 with grooves 20 of the lower part 21, made of metal-clad shape. Both parts 18 and 21 in the mating zone

interconnected by pins 22. The upper part 18 is perforated throughout the field with vertical holes 23. in which contacts 24 are made with hollow cylindrical shanks 25 and rectangular heads 26. Longitudinal 27 and transverse 28 are laid between the heads 26 and in the grooves of the body of the upper part 18 insulating gaskets and the entire field of heads 26 is divided into equivalent zones 29. To each

two current collectors 30 are connected (connected) to the shank 25. From the bottom of the upper part 18, from the side of its mating with the lower part 21, parallel longitudinal grooves 31 are made intersecting rows of holes

23.8 grooves 31 of the current collectors 30 are molded to the center - towards the approach and compaction with each other. Between the legs 32 and 33 of the P-shaped part 21 is placed a block 34, which is a package of equivalent printed circuit boards 35, interconnected

pins 36 through spacer sleeves 37.

The circuit board 35 pattern consists of rows of mounting pads 38 interconnected by conductors 39, current collectors 30 of contacts 24 are connected to the upper rows of the pads 37, and connecting wires 40 assembled into bundles 41 that are placed to the lower pads 37 in 1 + n holes 42, formed by the grooves of the base of the jj-shaped part 21, and preloaded by screws 43 with the help of strips 44. At the output, the harnesses 41 are wired to the connectors.

A device for monitoring printed circuit boards operates as follows.

The movable yoke 4 rises up. On the pins 17 of the contact matrix b, an adapter 7 with contacts 8 is installed corresponding to the tested printed circuit board 8. A verified printed circuit board is installed on the base pins 45 of the adapter 7. The traverse 4 goes down and the test circuit board is pressed to the contacts 8, and the contacts 8 to the contacts 24 of the modules 13. Each contact 24 through a pair of current collectors 30, the corresponding printed circuit board 35, connecting wires 40 from each printed circuit board 35, assembled into bundles 41, which pass through the openings 42 of the base (j-trim part 21 of each module, exit to the connectors of the device, which are connected to instrumentation and test equipment.

The proposed device for monitoring printed circuit boards in comparison with the prototype has the following advantages:

- expands the functionality for checking circuitry of printed circuit boards and interlayer metallized junctions due to the fact that two current collectors are connected to each contact of the module, all current collectors through the printed circuit board block are connected to the connecting wires assembled into bundles taking into account the functional purpose;

-increases installation density due to the fact that one of the parts of each module is made in a j-shape, inside which is placed a block that is a package of equivalent printed circuit boards, and in the other part of each module, in the transition zone

to the printed circuit boards, a series of holes are made, intersected by parallel grooves for coordinate adjustment and a number of current collector layouts.

5 In addition, the bundle of connecting wires, in addition to the functional purpose of the current collectors, provides selective - zone connection of individual sections of the contact matrix through the zones of the contact heads of the modules with instrumentation and test equipment, which can reduce its capacity and machine monitoring time.

5 Formulas a invented and

Claims (3)

1. A device for monitoring printed circuit boards containing a base, guides, mounted on them collapsible contact modules made of two 0 parts, interconnected by grooves and protrusions, made in modules of a series of holes with contacts placed in them and intersected by parallel grooves, and an opening for accommodating assembled 5 is a wiring harness, characterized in that, in order to expand the functionality and increase the density of installation, one of the parts of each module is made U-shaped with 0 a block placed inside it, made in the form of a package of equivalent printed circuit boards, each of which is connected to. a number of contacts in the second part of each module through current collectors, 5 each pair of which is connected to one of the contacts of this series. 2. The device according to claim 1. on the basis of the fact that a number of holes with contacts placed in them are made in the second 0 parts of each module, parallel grooves intersecting these holes, are also made in the second part of each module from the side mating with the cil-shaped part of each module. 5 3. The device according to claim 1, characterized in that the holes for accommodating the connecting wires assembled into a bundle are made at the base of the lJ-shaped part of each module. 10 YU J /5 2 V sixteen Fie.Z I AM 7