RO127650A2 - Method and device for attaching polymeric materials using adhesives - Google Patents

Abstract

The invention relates to a method and a device for attaching polymeric materials by means of adhesives, such as epoxy resins, using controlled pressing forces and temperatures. According to the invention, the method consists in fixing the two components (1 and 2) of polymeric materials within a fixing device (3) and placing an adhesive layer (4) therebetween, the component (1) being pressed onto the component (2) by means of a rod (5) driven by a piston (6) controlled by the pressure transducer (7), the adhesive polymerization temperature being controlled by the thermocouple (8). The device claimed by the invention comprises a support on which there rests a fixed table for fixing the component (1), a sliding table for fixing the component (2), both tables having some dovetail channels (5), a pneumatic cylinder (6), a pressure transducer (7) and a thermocouple (8).

Description

The invention relates to a method and to a device for bonding with adhesives, such as epoxy resins, polymeric materials, using press forces and controlled temperatures. The method according to the invention consists in fixing the two components (1 and 2) of polymeric materials in a: fixing device (3), between which a layer (4) of adhesive is deposited, the component (1) being pressed by a: component (2) by means of a piston rod (5). (6) which is controlled by the pressure transducer (7) and the polymerization temperature of the adhesive is controlled by means of the thermocouple (8). The device according to the invention consists of a support that supports a fixed table, for fixing the component (1), a sliding table, for fixing: the component (2), both tables having channels (5) in the form of a swallowtail, a pneumatic cylinder (6), pressure transducer (7) and thermocouple (8).

Claims: 2:

Figures: 2

Starting from the date of publication of the patent application, the application provides, provisionally, to the Applicant, the protection granted according to the provisions of art.32 of Law no: 64/1991, except in cases where the patent application has been rejected, withdrawn or considered. being withdrawn, the extent of the protection conferred by the patent application is determined by the claims contained in the application published in accordance with article 23 paragraph (i) - (3).

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Patent application

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Deposit date .... Ζ · 9 .. ~ · ΐ! Λ? Ρ.ί? ·.

Method and device for bonding with adhesives of polymeric materials

The invention relates to a method and to a device for bonding with adhesives of polymeric materials.

There are known methods of bonding hard with adhesives of polymeric materials where the adhesive surfaces are covered with adhesive and pressed together with a certain force over a period of time.

These methods of bonding with adhesives of polymeric materials have the disadvantage that the pressing force between the components is not known, this force involving the amount of adhesive material that remains between the components, following the reaction between the adhesive material and the components, an amount of heat is released which is not know.

The object of the invention is to increase the quality of bonded joints with adhesives of polymeric materials and at the same time to increase the service life of bonded joints.

The method, according to the invention, removes the disadvantages presented by that it ensures the measurement and control of the pressing force between the components of polymeric materials that stick with adhesives and at the same time the polymerization temperature of the expodic resins used for soldering is measured and controlled.

The adhesive bonding device of the polymeric materials ensures the control and adjustment of the pressing force between the components to be

Ck-2 Ο 1 Ο - Ο 1 2 45 - 2 9 -11-2010 soldered and at the same time controls the polymerization temperature of the expodic resins used as adhesives.

The following is an example of embodiment of the invention in relation to Figures 1 and 2, which represents:

Figure 1, adhesive method with force and temperature controlled adhesives

Figure 2, device for fixing the components to be bonded and a way of ensuring the adhesive force and controlling the temperature of the adhesive.

The method of bonding with adhesives with controlled force and temperature (figure 1), according to the invention, fixes the two components of polymeric materials 1 and 2 in the fixing device 3, between the two components a layer of adhesive 4 is deposited, component 1 is pressed on the component 2 by means of the rod 5 actuated by the gun 6 which is controlled by the pressure transducer 7. The temperature of polymerization of the expodic resin used as adhesive is controlled by means of the thermocouple 8.

The device for fixing the components to be bonded and which provides the pressing force between the components and the temperature control of the adhesive (figure 2) for applying the method of bonding with controlled force and temperature, is formed by a base plate 1 on which they are fixed two fastening tables 2 and 3.

The table 2 is fixed on the support 1, and the table 3 slides on the support 1 by means of a guide 4.

The two tables, one fixed and the other movable, have been practiced on them channels 5 in the tail end, these channels ensure the attachment of the components 6 and 7 which are to be glued by means of the fixing clamps 8. In the fixed mass 6 a hole is practiced. introduces thermocouple 9, which provides temperature control in the bonded area between the two components 6 and 7.

On the support 1 is fixed the pneumatic cylinder 10, which ensures the translation of the mobile table 7 by means of the adjustable screw 11.

Cfl O 1 0 - O 1 2 4 5 - 2 9 -11- 2010

The pressing force between the components to be bonded is ensured and controlled by means of the pressure transducer 12, which acts on the piston 10, and this by means of the adjustable screw on the movable table 7, on which the soldering component 7 is fixed.

The invention has the following advantages:

- ensures control over the technological parameters of adhesive bonding of polymeric materials,

- increases the quality and reliability of adhesive bonded joints,

- it provides flexibility for adoption to several types of components that can be bonded and can fit into different technological flows.

Claims (2)

1. Method of adhesive bonding of polymeric materials, characterized in that, in order to ensure control over the technological parameters of adhesive bonding of polymeric materials, the pressing force between the components that are bonded and the resulting temperature is measured and controlled. during the gluing process. Device for securing and moving the components to be bonded according to claim 1, characterized in that the components to be bonded (2) and (3) are fixed on two tables, one table is fixed and the other movable. The moving mass is moved by means of the pneumatic cylinder (10) controlled by the pressure switch (12) and the temperature during the technological bonding process is measured and controlled by the thermocouple (9).