PL78989B2 - - Google Patents

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Publication number
PL78989B2
PL78989B2 PL15985472A PL15985472A PL78989B2 PL 78989 B2 PL78989 B2 PL 78989B2 PL 15985472 A PL15985472 A PL 15985472A PL 15985472 A PL15985472 A PL 15985472A PL 78989 B2 PL78989 B2 PL 78989B2
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PL
Poland
Prior art keywords
bath
additives
plasma
kinetic energy
alloys
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Application number
PL15985472A
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Polish (pl)
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Priority to PL15985472A priority Critical patent/PL78989B2/pl
Publication of PL78989B2 publication Critical patent/PL78989B2/pl

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Description

Pierwszenstwo: Zgloszenie ogloszono: 30.09.1973 * Opis patentowy opublikowano: 10.06.1975 78989 H. l8b,7/00 MKP C21c 7/00 !*l&UGicKA| Twórcywynalazku: Jerzy Szopa, Andrzej Bialobrzeski Uprawniony z patentu tymczasowego: Akademia Górniczo-Hutnicza im. Stanislawa Staszica, Kraków (Polska) Sposób wprowadzania dodatków do kapieli stopów metali Przedmiotem wynalazku jest sposób wprowadzania dodatków, do których zalicza sie dodatki stopowe, modyfikatory, reagenty i inne, do kapieli stopów metali.Dotychczas wprowadza sie dodatki, umieszczajac odpowiednio rozdrobnione skladniki w postaci zapraw-, czyli stopów dwu— lub wieloskladnikowych, w zbiorniku dozownika umieszczonego nad rynna spustowa lub kadzia. Stad zsypuja sie one na przegrode kierujaca i przy pomocy mechanizmu dozujacego sa wprowadzane do kapieli metalowej. Stosowanie zapraw jest zwiazane z wprowadzaniem niepozadanych skladników mogacych zmienic wlasnosci i sklad stopu, a nie zawsze jest mozliwe stosowanie skladników czystych, zwlaszcza trudnotopliwych, ze wzgledu na niska temperature kapieli uniemozliwiajaca ich wymieszanie i rozpuszczenie.Ponadto w wyniku endotermicznych reakcji rozpuszczania nastepuje gwaltowny spadek temperatury kapieli i pogorszenie wlasnosci fizyko-chemicznych zuzla rafinujacego. Otrzymane w ten sposób stopy maja niejednorod¬ na strukture i wykazuja wahania w skladzie chemicznym.Celem wynalazku jest ulatwienie wprowadzania dodatków stopowych o wysokiej temperaturze topnienia, przez wykorzystanie strumienia plazmy o duzej energii kinetycznej.Cel ten zostal osiagniety przez wprowadzenie do kapieli metalowej dodatków stopowych, modyfikatorów lub reagentów w postaci proszków lub pretów w strumieniu plazmy, wyplywajacej z duza energia kinetyczna ze znanego urzadzenia plazmowego. Uzyskiwana w urzadzeniu plazmowym tempertura wystarcza do stopienia najbardziej trudnotopliwego materialu. Wyplywajaca z urzadzenia plazmowego plazma porywa czastki skladnika stopowego i kieruje je do kapieli metalowej. Duza energia kinetyczna czastki zapewnia calkowite wymieszanie kapieli i jej rafinacje gazowa. Wysoka tempratura uzyskiwana w sposobie wedlug wynalazku polepsza wlasnosci fizykochemiczne zuzla rafinujacego zwiekszajac jego aktywnosc. Ponadto stosowane w urzadzeniu plazmowym gazy obojetne jak hel lub argon zapewniaja wytworzenie atmosfery ochronnej nad kapiela metalowa. Stopy otrzymane sposobem wedlug wynalazku posiadaja jednorodna strukture i wymagany sklad chemiczny. PL PLRegistration: Application announced: September 30, 1973 * Patent description published: June 10, 1975 78989 H. l8b, 7/00 MKP C21c 7/00! * L & UGicKA | Creators of the invention: Jerzy Szopa, Andrzej Bialobrzeski Authorized by the provisional patent: AGH University of Science and Technology Stanislawa Staszica, Kraków (Poland) Method of introducing additives to the bath of metal alloys The subject of the invention is a method of introducing additives, which include alloying additives, modifiers, reagents and others, to the bath of metal alloys. So far, additives have been introduced by placing suitably fragmented components in the form of mortars - that is, two- or multi-component alloys, in the dispenser tank located above the spout or ladle. Hence, they fall onto the directing partition and by means of a dosing mechanism they are introduced into the metal bath. The use of mortars is associated with the introduction of undesirable components that can change the properties and composition of the alloy, and it is not always possible to use pure ingredients, especially difficult-to-burn ingredients, due to the low temperature of the bath, which prevents their mixing and dissolution. and deterioration of the physical and chemical properties of the refining slag. The alloys obtained in this way have a heterogeneous structure and show fluctuations in their chemical composition. The aim of the invention is to facilitate the introduction of alloying additives with high melting point by using a plasma stream with high kinetic energy. This goal was achieved by introducing alloying additives into the metal bath, modifiers or reagents in the form of powders or rods in a plasma stream flowing with high kinetic energy from a known plasma device. The temperature obtained in the plasma device is sufficient to melt the most difficult-to-melt material. The plasma flowing from the plasma device carries away the particles of the alloy component and directs them to the metal bath. The high kinetic energy of the particle ensures complete mixing of the bath and its gas refining. The high temperature obtained in the method according to the invention improves the physicochemical properties of the refining slurry by increasing its activity. In addition, inert gases such as helium or argon used in the plasma device ensure the creation of a protective atmosphere over the metal drip. The alloys obtained by the method according to the invention have a homogeneous structure and the required chemical composition. PL PL

Claims (1)

1. Zastrzezenie patentowe Sposób wprowadzania dodatków do kapieli stopów metali, znamienny tym, ze dodatki stopowe, modyfikatory lub reagenty w postaci proszków lub pretów wprowadza sie do kapieli w strumieniu plazmy wyplywajacej z duza energia kinetyczna ze znanego urzadzenia plazmowego. PL PLClaim 1. A method of introducing additives to a bath of metal alloys, characterized in that the alloy additives, modifiers or reagents in the form of powders or rods are introduced into the bath in a stream of plasma flowing with high kinetic energy from a known plasma device. PL PL
PL15985472A 1972-12-27 1972-12-27 PL78989B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PL15985472A PL78989B2 (en) 1972-12-27 1972-12-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PL15985472A PL78989B2 (en) 1972-12-27 1972-12-27

Publications (1)

Publication Number Publication Date
PL78989B2 true PL78989B2 (en) 1975-06-30

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PL15985472A PL78989B2 (en) 1972-12-27 1972-12-27

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PL (1) PL78989B2 (en)

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