PL442767A1 - Chipboard - Google Patents

Chipboard

Info

Publication number
PL442767A1
PL442767A1 PL442767A PL44276722A PL442767A1 PL 442767 A1 PL442767 A1 PL 442767A1 PL 442767 A PL442767 A PL 442767A PL 44276722 A PL44276722 A PL 44276722A PL 442767 A1 PL442767 A1 PL 442767A1
Authority
PL
Poland
Prior art keywords
chipboard
weight
outer layers
hardener
amounts
Prior art date
Application number
PL442767A
Other languages
Polish (pl)
Inventor
Tomasz Rydzkowski
Wiesław Szada-Borzyszkowski
Monika Szada-Borzyszkowska
Grzegorz Chomka
Jarosław Chodór
Original Assignee
Politechnika Koszalińska
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Politechnika Koszalińska filed Critical Politechnika Koszalińska
Priority to PL442767A priority Critical patent/PL442767A1/en
Publication of PL442767A1 publication Critical patent/PL442767A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B21/00—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board
    • B32B21/02—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board the layer being formed of fibres, chips, or particles, e.g. MDF, HDF, OSB, chipboard, particle board, hardboard
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/002—Manufacture of substantially flat articles, e.g. boards, from particles or fibres characterised by the type of binder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/02—Manufacture of substantially flat articles, e.g. boards, from particles or fibres from particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/04—Manufacture of substantially flat articles, e.g. boards, from particles or fibres from fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B21/00—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board
    • B32B21/04—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board comprising wood as the main or only constituent of a layer, which is next to another layer of the same or of a different material

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Manufacturing & Machinery (AREA)
  • Forests & Forestry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Laminated Bodies (AREA)
  • Dry Formation Of Fiberboard And The Like (AREA)

Abstract

Zgłoszenie dotyczy płyty wiórowej, która posiada dwie warstwy zewnętrzne, pomiędzy którymi znajduje się trzecia warstwa wewnętrzna. Płyta wiórowa charakteryzuje się tym, że każda z warstw zewnętrznych (1, 1') składa się, między innymi, z igieł drzew iglastych w ilości od 3,000% do 15,150% wag. oraz wiórów drzewnych w ilości od 15,150% do 27,300% wag. W skład płyty wiórowej wchodzi również żywica klejowa, emulsja mocznikowa, utwardzacz oraz woda.The application concerns a chipboard that has two outer layers with a third inner layer between them. The chipboard is characterized by the fact that each of the outer layers (1, 1') consists of, among others, coniferous needles in an amount ranging from 3,000% to 15,150% by weight. and wood chips in amounts from 15.150% to 27.300% by weight. The chipboard also contains adhesive resin, urea emulsion, hardener and water.

PL442767A 2022-11-09 2022-11-09 Chipboard PL442767A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PL442767A PL442767A1 (en) 2022-11-09 2022-11-09 Chipboard

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PL442767A PL442767A1 (en) 2022-11-09 2022-11-09 Chipboard

Publications (1)

Publication Number Publication Date
PL442767A1 true PL442767A1 (en) 2024-05-13

Family

ID=91070361

Family Applications (1)

Application Number Title Priority Date Filing Date
PL442767A PL442767A1 (en) 2022-11-09 2022-11-09 Chipboard

Country Status (1)

Country Link
PL (1) PL442767A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
PL169489B3 (en) * 1992-06-10 1996-07-31 Politechnika Warszawska Chipboard of reduced free formaldehyde emission and method of making same
CN102229157A (en) * 2011-05-04 2011-11-02 成江 Artificial pine needle board
PL66155Y1 (en) * 2010-07-21 2012-10-31 Szkola Glowna Gospod Wiejsk Ak Chipboard of reduced density
PL214412B1 (en) * 2002-05-08 2013-07-31 Inter Ikea Sys Bv A chip board and a process for the preparation thereof
AU2014205040A1 (en) * 2013-01-11 2015-07-30 Mmw Equine Therapy Pty Ltd Composite boards comprising cellulosic plant material

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
PL169489B3 (en) * 1992-06-10 1996-07-31 Politechnika Warszawska Chipboard of reduced free formaldehyde emission and method of making same
PL214412B1 (en) * 2002-05-08 2013-07-31 Inter Ikea Sys Bv A chip board and a process for the preparation thereof
PL66155Y1 (en) * 2010-07-21 2012-10-31 Szkola Glowna Gospod Wiejsk Ak Chipboard of reduced density
CN102229157A (en) * 2011-05-04 2011-11-02 成江 Artificial pine needle board
AU2014205040A1 (en) * 2013-01-11 2015-07-30 Mmw Equine Therapy Pty Ltd Composite boards comprising cellulosic plant material

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