PL4200101T3 - Sposób wytwarzania co najmniej jednej części przedmiotu poddawanego obróbce oraz pozostałej części przedmiotu poddawanego obróbce z przedmiotu poddawanego obróbce - Google Patents

Sposób wytwarzania co najmniej jednej części przedmiotu poddawanego obróbce oraz pozostałej części przedmiotu poddawanego obróbce z przedmiotu poddawanego obróbce

Info

Publication number
PL4200101T3
PL4200101T3 PL20767480.5T PL20767480T PL4200101T3 PL 4200101 T3 PL4200101 T3 PL 4200101T3 PL 20767480 T PL20767480 T PL 20767480T PL 4200101 T3 PL4200101 T3 PL 4200101T3
Authority
PL
Poland
Prior art keywords
workpiece
producing
residual
workpiece part
residual workpiece
Prior art date
Application number
PL20767480.5T
Other languages
English (en)
Inventor
Florian Sepp
Daniel Mock
Patrick Mach
Christoph Weiss
Original Assignee
TRUMPF Werkzeugmaschinen SE + Co. KG
Wsoptics Technologies Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TRUMPF Werkzeugmaschinen SE + Co. KG, Wsoptics Technologies Gmbh filed Critical TRUMPF Werkzeugmaschinen SE + Co. KG
Publication of PL4200101T3 publication Critical patent/PL4200101T3/pl

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/60—Preliminary treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
PL20767480.5T 2020-08-21 2020-08-21 Sposób wytwarzania co najmniej jednej części przedmiotu poddawanego obróbce oraz pozostałej części przedmiotu poddawanego obróbce z przedmiotu poddawanego obróbce PL4200101T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/EP2020/073578 WO2022037797A1 (de) 2020-08-21 2020-08-21 Verfahren zur herstellung mindestens eines werkstückteils und eines restwerkstücks aus einem werkstück
EP20767480.5A EP4200101B1 (de) 2020-08-21 2020-08-21 Verfahren zur herstellung mindestens eines werkstückteils und eines restwerkstücks aus einem werkstück

Publications (1)

Publication Number Publication Date
PL4200101T3 true PL4200101T3 (pl) 2025-06-09

Family

ID=72355946

Family Applications (1)

Application Number Title Priority Date Filing Date
PL20767480.5T PL4200101T3 (pl) 2020-08-21 2020-08-21 Sposób wytwarzania co najmniej jednej części przedmiotu poddawanego obróbce oraz pozostałej części przedmiotu poddawanego obróbce z przedmiotu poddawanego obróbce

Country Status (4)

Country Link
EP (1) EP4200101B1 (pl)
CN (1) CN114390958A (pl)
PL (1) PL4200101T3 (pl)
WO (1) WO2022037797A1 (pl)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022104791A1 (de) * 2022-03-01 2023-09-07 TRUMPF Werkzeugmaschinen SE + Co. KG Verfahren zur Bearbeitung eines platten- oder rohrförmigen Werkstücks
DE102022104779A1 (de) * 2022-03-01 2023-09-07 TRUMPF Werkzeugmaschinen SE + Co. KG Verfahren zur Bearbeitung eines platten- oder rohrförmigen Werkstücks
DE102022112212A1 (de) * 2022-05-16 2023-11-16 TRUMPF Werkzeugmaschinen SE + Co. KG Technik zum Erzeugen einer Kantenverrundung
WO2024069758A1 (ja) * 2022-09-27 2024-04-04 ファナック株式会社 レーザ加工装置及びレーザ加工方法
DE102022127687A1 (de) 2022-10-20 2024-04-25 TRUMPF Werkzeugmaschinen SE + Co. KG Verfahren zum Erzeugen eines dickenreduzierten Verbindungsstegs beim Schneiden eines Werkstückteils aus einem plattenartigen Werkstück sowie zugehöriges Steuerungsprogrammprodukt
DE102022127956A1 (de) 2022-10-21 2024-05-02 TRUMPF Werkzeugmaschinen SE + Co. KG Verfahren zum bearbeiten eines metallischen werkstücks sowie lasereinrichtung
DE102022128170A1 (de) * 2022-10-25 2024-04-25 TRUMPF Werkzeugmaschinen SE + Co. KG Technik zum Verrunden einer Werkstückkante
CN115846911B (zh) * 2023-02-23 2023-05-09 福建盈浩文化创意股份有限公司 一种悬挂式框画用激光切割设备

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19549666B4 (de) * 1994-02-28 2008-01-03 Mitsubishi Denki K.K. Laserstrahlbearbeitungsverfahren und Laserstrahlmaschine
JPH08108287A (ja) 1994-10-07 1996-04-30 Seiji Ishibe 面取り加工方法
JP4396953B2 (ja) * 1998-08-26 2010-01-13 三星電子株式会社 レーザ切断装置および切断方法
JP4812172B2 (ja) 2001-01-17 2011-11-09 株式会社アマダエンジニアリングセンター レーザによるｒ面取り加工方法および同方法の実施に適したレーザ加工ヘッド
US9346130B2 (en) * 2008-12-17 2016-05-24 Electro Scientific Industries, Inc. Method for laser processing glass with a chamfered edge
JP4976576B2 (ja) * 2010-11-01 2012-07-18 住友電気工業株式会社 切削工具とその製造方法および製造装置
US20140151347A1 (en) * 2012-11-30 2014-06-05 Shiloh Industries, Inc. Method of forming a weld notch in a sheet metal piece
US10442719B2 (en) * 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
US9764427B2 (en) 2014-02-28 2017-09-19 Ipg Photonics Corporation Multi-laser system and method for cutting and post-cut processing hard dielectric materials
WO2016033494A1 (en) * 2014-08-28 2016-03-03 Ipg Photonics Corporation System and method for laser beveling and/or polishing
US10384306B1 (en) * 2015-06-10 2019-08-20 Seagate Technology Llc Laser cutting array with multiple laser source arrangement
US10406634B2 (en) 2015-07-01 2019-09-10 Apple Inc. Enhancing strength in laser cutting of ceramic components
DE102017213394B4 (de) 2017-08-02 2020-03-26 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren zum Laserschneiden plattenförmiger Werkstücke und zugehöriges Computerprogrammprodukt
KR102174428B1 (ko) * 2019-11-27 2020-11-04 엘지디스플레이 주식회사 플렉서블 기판의 제조방법

Also Published As

Publication number Publication date
WO2022037797A1 (de) 2022-02-24
EP4200101A1 (de) 2023-06-28
CN114390958A (zh) 2022-04-22
EP4200101B1 (de) 2025-02-19

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