PL410637A1 - Method for spreading tin layer on a copper substrate - Google Patents

Method for spreading tin layer on a copper substrate

Info

Publication number
PL410637A1
PL410637A1 PL410637A PL41063714A PL410637A1 PL 410637 A1 PL410637 A1 PL 410637A1 PL 410637 A PL410637 A PL 410637A PL 41063714 A PL41063714 A PL 41063714A PL 410637 A1 PL410637 A1 PL 410637A1
Authority
PL
Poland
Prior art keywords
copper substrate
tin layer
substrate
spreading
working tool
Prior art date
Application number
PL410637A
Other languages
Polish (pl)
Other versions
PL223507B1 (en
Inventor
Ewa Harpińska
Marcin Korzeniowski
Kazimierz Diduszko
Original Assignee
Politechnika Wrocławska
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Politechnika Wrocławska filed Critical Politechnika Wrocławska
Priority to PL410637A priority Critical patent/PL223507B1/en
Publication of PL410637A1 publication Critical patent/PL410637A1/en
Publication of PL223507B1 publication Critical patent/PL223507B1/en

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Coating With Molten Metal (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

Sposób nanoszenia warstwy cynowej na miedziane podłoże realizowane zwłaszcza celem zabezpieczenia tego podłoża przed utlenianiem czy celem zwiększenia jego obciążalności prądowej polega na tym, że warstwę cynową na miedziane podłoże (12) nanosi się przy użyciu ultradźwiękowego urządzenia technologicznego mającego jako narzędzie robocze (9) przymocowany do jego koncentratora (8) tips mający powierzchnię spodnią pokrytą warstwą cyny która dociskana jest do podłoża miedzianego (12) przy czym pokrywanie miedzianego podłoża (12) następuje poprzez posuw podłoża miedzianego (12) względem pokrytej warstwą cyny powierzchni narzędzia roboczego (9).The method of applying the tin layer to a copper substrate, implemented in particular to protect this substrate against oxidation or to increase its current carrying capacity, is based on the fact that the tin layer on the copper substrate (12) is applied using an ultrasonic technological device having as a working tool (9) attached to its concentrator (8) tips having a bottom surface covered with a tin layer which is pressed against the copper substrate (12) with the copper substrate (12) being coated by the copper substrate (12) feed relative to the surface of the working tool (9) covered with a tin layer.

PL410637A 2014-12-24 2014-12-24 Method for spreading tin layer on a copper substrate PL223507B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PL410637A PL223507B1 (en) 2014-12-24 2014-12-24 Method for spreading tin layer on a copper substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PL410637A PL223507B1 (en) 2014-12-24 2014-12-24 Method for spreading tin layer on a copper substrate

Publications (2)

Publication Number Publication Date
PL410637A1 true PL410637A1 (en) 2015-09-28
PL223507B1 PL223507B1 (en) 2016-10-31

Family

ID=54150911

Family Applications (1)

Application Number Title Priority Date Filing Date
PL410637A PL223507B1 (en) 2014-12-24 2014-12-24 Method for spreading tin layer on a copper substrate

Country Status (1)

Country Link
PL (1) PL223507B1 (en)

Also Published As

Publication number Publication date
PL223507B1 (en) 2016-10-31

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