PL410637A1 - Method for spreading tin layer on a copper substrate - Google Patents
Method for spreading tin layer on a copper substrateInfo
- Publication number
- PL410637A1 PL410637A1 PL410637A PL41063714A PL410637A1 PL 410637 A1 PL410637 A1 PL 410637A1 PL 410637 A PL410637 A PL 410637A PL 41063714 A PL41063714 A PL 41063714A PL 410637 A1 PL410637 A1 PL 410637A1
- Authority
- PL
- Poland
- Prior art keywords
- copper substrate
- tin layer
- substrate
- spreading
- working tool
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 6
- 229910052802 copper Inorganic materials 0.000 title abstract 6
- 239000010949 copper Substances 0.000 title abstract 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title abstract 5
- 238000000034 method Methods 0.000 title abstract 2
- 230000003647 oxidation Effects 0.000 abstract 1
- 238000007254 oxidation reaction Methods 0.000 abstract 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Coating With Molten Metal (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
Sposób nanoszenia warstwy cynowej na miedziane podłoże realizowane zwłaszcza celem zabezpieczenia tego podłoża przed utlenianiem czy celem zwiększenia jego obciążalności prądowej polega na tym, że warstwę cynową na miedziane podłoże (12) nanosi się przy użyciu ultradźwiękowego urządzenia technologicznego mającego jako narzędzie robocze (9) przymocowany do jego koncentratora (8) tips mający powierzchnię spodnią pokrytą warstwą cyny która dociskana jest do podłoża miedzianego (12) przy czym pokrywanie miedzianego podłoża (12) następuje poprzez posuw podłoża miedzianego (12) względem pokrytej warstwą cyny powierzchni narzędzia roboczego (9).The method of applying the tin layer to a copper substrate, implemented in particular to protect this substrate against oxidation or to increase its current carrying capacity, is based on the fact that the tin layer on the copper substrate (12) is applied using an ultrasonic technological device having as a working tool (9) attached to its concentrator (8) tips having a bottom surface covered with a tin layer which is pressed against the copper substrate (12) with the copper substrate (12) being coated by the copper substrate (12) feed relative to the surface of the working tool (9) covered with a tin layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PL410637A PL223507B1 (en) | 2014-12-24 | 2014-12-24 | Method for spreading tin layer on a copper substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PL410637A PL223507B1 (en) | 2014-12-24 | 2014-12-24 | Method for spreading tin layer on a copper substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
PL410637A1 true PL410637A1 (en) | 2015-09-28 |
PL223507B1 PL223507B1 (en) | 2016-10-31 |
Family
ID=54150911
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PL410637A PL223507B1 (en) | 2014-12-24 | 2014-12-24 | Method for spreading tin layer on a copper substrate |
Country Status (1)
Country | Link |
---|---|
PL (1) | PL223507B1 (en) |
-
2014
- 2014-12-24 PL PL410637A patent/PL223507B1/en unknown
Also Published As
Publication number | Publication date |
---|---|
PL223507B1 (en) | 2016-10-31 |
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