PL410446A1 - Multi-lead surface mount for BGA packages - Google Patents

Multi-lead surface mount for BGA packages

Info

Publication number
PL410446A1
PL410446A1 PL410446A PL41044614A PL410446A1 PL 410446 A1 PL410446 A1 PL 410446A1 PL 410446 A PL410446 A PL 410446A PL 41044614 A PL41044614 A PL 41044614A PL 410446 A1 PL410446 A1 PL 410446A1
Authority
PL
Poland
Prior art keywords
printed circuit
circuit board
surface mount
bga
lead surface
Prior art date
Application number
PL410446A
Other languages
Polish (pl)
Other versions
PL225759B1 (en
Inventor
Konrad Futera
Wojciech Stęplewski
Original Assignee
Instytut Tele- I Radiotechniczny
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Instytut Tele- I Radiotechniczny filed Critical Instytut Tele- I Radiotechniczny
Priority to PL410446A priority Critical patent/PL225759B1/en
Publication of PL410446A1 publication Critical patent/PL410446A1/en
Publication of PL225759B1 publication Critical patent/PL225759B1/en

Links

Landscapes

  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

Wielowyprowadzeniowa podstawka pod układy w obudowie BGA do modułowego montażu typu płytka-płytka składa się z wielowarstwowej płytki obwodu drukowanego (1) z wieloma polami montażowymi (2) pod wielowyprowadzeniowy układ w obudowie BGA z połączeniami elektrycznymi (3) i terminalami (4) ukształtowanymi w postaci otwartych otworów przelotowych metalizowanych na ich wewnętrznych powierzchniach (5), które są rozmieszone na krawędziach (6) płytki obwodu drukowanego (1). Terminale (4) występują na co najmniej jednej krawędzi (6) płytki obwodu drukowanego (1).Multi-lead base for BGA enclosure systems for modular board-to-board assembly consists of a multi-layer printed circuit board (1) with multiple mounting fields (2) for a multi-lead system in a BGA enclosure with electrical connections (3) and terminals (4) shaped in open metallized through holes on their inner surfaces (5), which are arranged on the edges (6) of the printed circuit board (1). The terminals (4) appear on at least one edge (6) of the printed circuit board (1).

PL410446A 2014-12-08 2014-12-08 Multi-lead surface mount for BGA packages PL225759B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PL410446A PL225759B1 (en) 2014-12-08 2014-12-08 Multi-lead surface mount for BGA packages

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PL410446A PL225759B1 (en) 2014-12-08 2014-12-08 Multi-lead surface mount for BGA packages

Publications (2)

Publication Number Publication Date
PL410446A1 true PL410446A1 (en) 2016-06-20
PL225759B1 PL225759B1 (en) 2017-05-31

Family

ID=56120638

Family Applications (1)

Application Number Title Priority Date Filing Date
PL410446A PL225759B1 (en) 2014-12-08 2014-12-08 Multi-lead surface mount for BGA packages

Country Status (1)

Country Link
PL (1) PL225759B1 (en)

Also Published As

Publication number Publication date
PL225759B1 (en) 2017-05-31

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