PL4082306T3 - Urządzenie do rozpraszania ciepła, układ elektryczny obejmujący takie urządzenie i powiązany sposób wytwarzania - Google Patents

Urządzenie do rozpraszania ciepła, układ elektryczny obejmujący takie urządzenie i powiązany sposób wytwarzania

Info

Publication number
PL4082306T3
PL4082306T3 PL20820454.5T PL20820454T PL4082306T3 PL 4082306 T3 PL4082306 T3 PL 4082306T3 PL 20820454 T PL20820454 T PL 20820454T PL 4082306 T3 PL4082306 T3 PL 4082306T3
Authority
PL
Poland
Prior art keywords
heat dissipation
electrical system
associated manufacturing
dissipation device
manufacturing
Prior art date
Application number
PL20820454.5T
Other languages
English (en)
Inventor
Pierre Smal
Emmanuel Talon
Arnaud COIA
Original Assignee
Valeo Systemes De Controle Moteur
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Systemes De Controle Moteur filed Critical Valeo Systemes De Controle Moteur
Publication of PL4082306T3 publication Critical patent/PL4082306T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
PL20820454.5T 2019-12-24 2020-12-14 Urządzenie do rozpraszania ciepła, układ elektryczny obejmujący takie urządzenie i powiązany sposób wytwarzania PL4082306T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1915594A FR3105713B1 (fr) 2019-12-24 2019-12-24 Dispositif de dissipation de chaleur, système électrique comportant un tel dispositif et procédé de fabrication associé
PCT/EP2020/085915 WO2021130039A1 (fr) 2019-12-24 2020-12-14 Dispositif de dissipation de chaleur, système électrique comportant un tel dispositif et procédé de fabrication associé

Publications (1)

Publication Number Publication Date
PL4082306T3 true PL4082306T3 (pl) 2024-10-14

Family

ID=70295302

Family Applications (1)

Application Number Title Priority Date Filing Date
PL20820454.5T PL4082306T3 (pl) 2019-12-24 2020-12-14 Urządzenie do rozpraszania ciepła, układ elektryczny obejmujący takie urządzenie i powiązany sposób wytwarzania

Country Status (6)

Country Link
EP (1) EP4082306B1 (pl)
CN (1) CN115088398A (pl)
FR (1) FR3105713B1 (pl)
HU (1) HUE068526T2 (pl)
PL (1) PL4082306T3 (pl)
WO (1) WO2021130039A1 (pl)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4518598A1 (en) * 2023-08-29 2025-03-05 Valeo Comfort and Driving Assistance Electronic device for a vehicle comprising a thermal insulation pad

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6201699B1 (en) * 1999-03-01 2001-03-13 Lucent Technologies Inc. Transverse mountable heat sink for use in an electronic device
US6916122B2 (en) * 2002-03-05 2005-07-12 Jds Uniphase Corporation Modular heat sinks
US7391614B2 (en) * 2005-03-24 2008-06-24 Dell Products L.P. Method and apparatus for thermal dissipation in an information handling system
US20080068805A1 (en) * 2006-09-15 2008-03-20 Foxconn Technology Co., Ltd. Heat sink assembly for multiple electronic components
CN201066977Y (zh) * 2007-08-07 2008-05-28 天津锐新电子热传技术有限公司 组合式散热器
CN101594764B (zh) * 2008-05-28 2011-05-11 富准精密工业(深圳)有限公司 散热装置及其制造方法
KR101156903B1 (ko) * 2010-10-28 2012-06-21 삼성전기주식회사 전력변환모듈의 방열장치
DE102011076325B4 (de) * 2011-05-24 2016-05-04 Semikron Elektronik Gmbh & Co. Kg Kühlanordnung für eine leistungselektronische Komponente mit Subsystemen und einer Kühleinrichtung
CN104519713B (zh) * 2013-09-29 2017-08-25 华为技术有限公司 散热装置

Also Published As

Publication number Publication date
EP4082306B1 (fr) 2024-05-01
FR3105713A1 (fr) 2021-06-25
EP4082306A1 (fr) 2022-11-02
HUE068526T2 (hu) 2025-01-28
WO2021130039A1 (fr) 2021-07-01
FR3105713B1 (fr) 2022-03-11
CN115088398A (zh) 2022-09-20

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