PL404233A1 - The method of cooling foundry mold circuits and the technological system of the device for cooling foundry mold circuits - Google Patents

The method of cooling foundry mold circuits and the technological system of the device for cooling foundry mold circuits

Info

Publication number
PL404233A1
PL404233A1 PL404233A PL40423313A PL404233A1 PL 404233 A1 PL404233 A1 PL 404233A1 PL 404233 A PL404233 A PL 404233A PL 40423313 A PL40423313 A PL 40423313A PL 404233 A1 PL404233 A1 PL 404233A1
Authority
PL
Poland
Prior art keywords
cooling
mold
circuits
distilled water
foundry mold
Prior art date
Application number
PL404233A
Other languages
Polish (pl)
Other versions
PL221794B1 (en
Inventor
Zbigniew Kuziów
Artur Borgiel
Original Assignee
Nemak Poland Spółka Z Ograniczoną Odpowiedzialnością
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nemak Poland Spółka Z Ograniczoną Odpowiedzialnością filed Critical Nemak Poland Spółka Z Ograniczoną Odpowiedzialnością
Priority to PL404233A priority Critical patent/PL221794B1/en
Publication of PL404233A1 publication Critical patent/PL404233A1/en
Publication of PL221794B1 publication Critical patent/PL221794B1/en

Links

Landscapes

  • Molds, Cores, And Manufacturing Methods Thereof (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

Przedmiotem wynalazku jest sposób chłodzenia obwodów form wykorzystywany do chłodzenia miejsc trudnodostępnych w formie, jak i do chłodzenia dużych kanałów w formach. Sposób chłodzenia obwodów form odlewniczych w maszynie odlewniczej polega na tym, że stosuje się centralę mikroprocesorową, sterującą obiegiem zamkniętym destylowanej wody o przepływie 100 l/min i temperaturze wejściowej około 20°C, która ze zbiornika wody destylowanej o pojemności 200 l zostaje przepompowana pod ciśnieniem dochodzącym do 1,2MPa przez pompę wyjściową do dwóch ciśnieniowych obwodów skąd trafia ona do rozdzielacza, kierującego ją do wewnętrznego obwodu chłodzenia formy, której chłodzenie trwa do 99 sekund, po czym woda destylowana wypływa w temperaturze około 80°C poprzez rozdzielacz do kolektora o pojemności 60 l, zaopatrzonego w chłodnicę, schładzającą ją do 20° C, skąd za pomocą pompy powrotnej trafia ona do zbiornika wody destylowanej i w międzyczasie następuje przedmuch formy sprężonym powietrzem o ciśnieniu do 6 x 105 Pa i cykl chłodzenia powtarza się kolejno dla kolejnych odlewów. Przedmiotem wynalazku jest również urządzenie do realizacji sposobu.The subject of the invention is a method for cooling mold circuits used for cooling hard to reach places in a mold, as well as for cooling large mold channels. The method of cooling the foundry mold circuits in a foundry machine is that a microprocessor control unit is used, controlling the closed circuit of distilled water with a flow of 100 l / min and an inlet temperature of about 20 ° C, which is pumped from the distilled water tank with a capacity of 200 l reaching up to 1.2 MPa through the output pump to two pressure circuits from where it goes to the manifold, directing it to the internal mold cooling circuit, which cooling lasts up to 99 seconds, after which distilled water flows at a temperature of about 80 ° C through the manifold to a collector with a capacity 60 l, equipped with a cooler, cooling it down to 20 ° C, from where it goes to a distilled water tank using a return pump and in the meantime the mold is blown with compressed air at a pressure of 6 x 105 Pa and the cooling cycle is repeated successively for subsequent castings. The invention also relates to a device for carrying out the method.

PL404233A 2013-06-06 2013-06-06 Method for cooling circuits of foundry molds and technological system cooling device of circuits molds PL221794B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PL404233A PL221794B1 (en) 2013-06-06 2013-06-06 Method for cooling circuits of foundry molds and technological system cooling device of circuits molds

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PL404233A PL221794B1 (en) 2013-06-06 2013-06-06 Method for cooling circuits of foundry molds and technological system cooling device of circuits molds

Publications (2)

Publication Number Publication Date
PL404233A1 true PL404233A1 (en) 2014-12-08
PL221794B1 PL221794B1 (en) 2016-05-31

Family

ID=52003399

Family Applications (1)

Application Number Title Priority Date Filing Date
PL404233A PL221794B1 (en) 2013-06-06 2013-06-06 Method for cooling circuits of foundry molds and technological system cooling device of circuits molds

Country Status (1)

Country Link
PL (1) PL221794B1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109604572B (en) * 2018-12-05 2021-01-01 马鞍山市万鑫铸造有限公司 Metal wear-resistant medium casting equipment

Also Published As

Publication number Publication date
PL221794B1 (en) 2016-05-31

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