PL4041677T3 - Sposób i urządzenie do generowania sygnatury termicznej - Google Patents

Sposób i urządzenie do generowania sygnatury termicznej

Info

Publication number
PL4041677T3
PL4041677T3 PL20872793.3T PL20872793T PL4041677T3 PL 4041677 T3 PL4041677 T3 PL 4041677T3 PL 20872793 T PL20872793 T PL 20872793T PL 4041677 T3 PL4041677 T3 PL 4041677T3
Authority
PL
Poland
Prior art keywords
generating
thermal signature
signature
thermal
Prior art date
Application number
PL20872793.3T
Other languages
English (en)
Inventor
Asaf Miller
Itay MOSHE
Original Assignee
Polaris Solutions, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polaris Solutions, Ltd. filed Critical Polaris Solutions, Ltd.
Publication of PL4041677T3 publication Critical patent/PL4041677T3/pl

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/10Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/145Carbon only, e.g. carbon black, graphite
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/20Carbon compounds, e.g. carbon nanotubes or fullerenes
    • H10K85/221Carbon nanotubes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F41WEAPONS
    • F41HARMOUR; ARMOURED TURRETS; ARMOURED OR ARMED VEHICLES; MEANS OF ATTACK OR DEFENCE, e.g. CAMOUFLAGE, IN GENERAL
    • F41H3/00Camouflage, i.e. means or methods for concealment or disguise
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/48Thermography; Techniques using wholly visual means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00Electrodes
    • H01M4/86Inert electrodes with catalytic activity, e.g. for fuel cells
    • H01M4/96Carbon-based electrodes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B1/00Details of electric heating devices
    • H05B1/02Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
    • H05B1/0227Applications
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/02Details
    • H05B3/03Electrodes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/20Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/20Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H05B3/22Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible
    • H05B3/26Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/40Heating elements having the shape of rods or tubes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/013Heaters using resistive films or coatings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/032Heaters specially adapted for heating by radiation heating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/035Electrical circuits used in resistive heating apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Nanotechnology (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Resistance Heating (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Electronic Switches (AREA)
  • Radiation Pyrometers (AREA)
PL20872793.3T 2019-10-02 2020-10-01 Sposób i urządzenie do generowania sygnatury termicznej PL4041677T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IL269762A IL269762B (en) 2019-10-02 2019-10-02 Method and device for creating a thermal signature
PCT/IL2020/051072 WO2021064733A2 (en) 2019-10-02 2020-10-01 Method and device for generating a thermal signature

Publications (1)

Publication Number Publication Date
PL4041677T3 true PL4041677T3 (pl) 2026-02-09

Family

ID=75336899

Family Applications (1)

Application Number Title Priority Date Filing Date
PL20872793.3T PL4041677T3 (pl) 2019-10-02 2020-10-01 Sposób i urządzenie do generowania sygnatury termicznej

Country Status (9)

Country Link
US (1) US12117273B2 (pl)
EP (1) EP4041677B1 (pl)
JP (2) JP2022552806A (pl)
KR (1) KR102945565B1 (pl)
AU (1) AU2020356907B2 (pl)
CA (1) CA3156334A1 (pl)
IL (1) IL269762B (pl)
PL (1) PL4041677T3 (pl)
WO (1) WO2021064733A2 (pl)

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB415427A (en) 1933-01-24 1934-08-24 Distillers Co Yeast Ltd Improvements in or relating to the hydration of olefines
JPS63144509U (pl) * 1987-03-12 1988-09-22
US5036211A (en) 1988-01-04 1991-07-30 The Commonwealth Of Australia Infrared signature control mechanism
GB9415921D0 (en) 1994-08-04 1994-09-28 Secr Defence Infra-red body
US6338292B1 (en) 1999-09-30 2002-01-15 Robert Fisher Reynolds Thermal and visual camouflage system
DE19955608C2 (de) 1999-11-19 2003-01-30 Dornier Gmbh Infrarot-Tarnvorrichtung
US7085125B2 (en) * 2002-03-21 2006-08-01 Chien-Min Sung Carbon nanotube devices and uses therefor
EP2685250A1 (en) * 2003-05-23 2014-01-15 Japan Science and Technology Agency Method for sensing a substance to be detected in a sample
US7122815B2 (en) 2003-05-27 2006-10-17 Wood Donald S Infrared radiation emitter
DE202006008806U1 (de) * 2006-06-03 2006-08-03 Conrad Electronic Gmbh Flachsicherungsadapter
US7959969B2 (en) * 2007-07-10 2011-06-14 California Institute Of Technology Fabrication of anchored carbon nanotube array devices for integrated light collection and energy conversion
CN101409962B (zh) * 2007-10-10 2010-11-10 清华大学 面热光源及其制备方法
US20090252982A1 (en) 2008-04-04 2009-10-08 Qinetiq Limited Indentification device
CN101868072B (zh) * 2009-04-20 2015-06-03 清华大学 线热源的制备方法
US9144397B2 (en) * 2008-12-04 2015-09-29 Real Imaging Ltd. Method apparatus and system for determining a thermal signature
CH701372A2 (de) 2009-06-30 2010-12-31 Ssz Camouflage Technology Ag Adaptive Tarnung.
US8911859B1 (en) * 2010-11-05 2014-12-16 Lockheed Martin Corporation Carbon nanotube material and method of making the same
SE536136C2 (sv) * 2011-06-07 2013-05-28 Bae Systems Haegglunds Ab Anordning och metod för signaturanpassning
SE536137C2 (sv) 2011-06-07 2013-05-28 Bae Systems Haegglunds Ab Anordning för signaturanpassning
US8495946B2 (en) 2011-06-16 2013-07-30 Lockheed Martin Corporation Camouflage utilizing nano-optical arrays embedded in carbon matrix
US8817950B2 (en) * 2011-12-22 2014-08-26 Moxtek, Inc. X-ray tube to power supply connector
CH707045A2 (en) 2012-09-17 2014-03-31 Ssz Camouflage Technology Ag Adaptive visual camouflage.
US9281152B2 (en) * 2012-12-05 2016-03-08 Eaton Corporation Fuse with carbon fiber fusible element
KR20140112270A (ko) * 2013-03-13 2014-09-23 삼성전자주식회사 방열 블록을 포함한 엑스선 발생 장치
CN105428516B (zh) 2015-11-06 2018-05-22 中国空间技术研究院 一种基于二氧化钒的主动型红外伪装结构

Also Published As

Publication number Publication date
JP2022552806A (ja) 2022-12-20
EP4041677A2 (en) 2022-08-17
KR102945565B1 (ko) 2026-03-31
EP4041677C0 (en) 2025-08-20
EP4041677B1 (en) 2025-08-20
US12117273B2 (en) 2024-10-15
JP2026016370A (ja) 2026-02-03
IL269762B (en) 2022-08-01
WO2021064733A3 (en) 2021-05-14
EP4041677A4 (en) 2024-01-03
WO2021064733A2 (en) 2021-04-08
AU2020356907A1 (en) 2022-05-12
US20220341711A1 (en) 2022-10-27
AU2020356907B2 (en) 2025-07-31
CA3156334A1 (en) 2021-04-08
KR20220075384A (ko) 2022-06-08
IL269762A (en) 2021-04-29

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