PL3948924T3 - Konstrukcja pręta magnetycznego z dołączonym czujnikiem - Google Patents

Konstrukcja pręta magnetycznego z dołączonym czujnikiem

Info

Publication number
PL3948924T3
PL3948924T3 PL20714231.6T PL20714231T PL3948924T3 PL 3948924 T3 PL3948924 T3 PL 3948924T3 PL 20714231 T PL20714231 T PL 20714231T PL 3948924 T3 PL3948924 T3 PL 3948924T3
Authority
PL
Poland
Prior art keywords
bar structure
magnet bar
attached sensor
sensor
attached
Prior art date
Application number
PL20714231.6T
Other languages
English (en)
Inventor
Francis Taylor HUMBLE
Wilmert De Bosscher
Ivan Van De Putte
Original Assignee
Soleras Advanced Coatings Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Soleras Advanced Coatings Bv filed Critical Soleras Advanced Coatings Bv
Publication of PL3948924T3 publication Critical patent/PL3948924T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/342—Hollow targets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3464—Operating strategies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3476—Testing and control

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
PL20714231.6T 2019-04-05 2020-03-31 Konstrukcja pręta magnetycznego z dołączonym czujnikiem PL3948924T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
BE20195222A BE1027175B1 (nl) 2019-04-05 2019-04-05 Magneetstaaf met aangehechte sensor
PCT/EP2020/059174 WO2020201309A1 (en) 2019-04-05 2020-03-31 Magnet bar with attached sensor

Publications (1)

Publication Number Publication Date
PL3948924T3 true PL3948924T3 (pl) 2023-10-30

Family

ID=66912481

Family Applications (1)

Application Number Title Priority Date Filing Date
PL20714231.6T PL3948924T3 (pl) 2019-04-05 2020-03-31 Konstrukcja pręta magnetycznego z dołączonym czujnikiem

Country Status (9)

Country Link
US (1) US20220157582A1 (pl)
EP (1) EP3948924B1 (pl)
JP (1) JP2022528421A (pl)
KR (1) KR20210145262A (pl)
CN (1) CN113748484A (pl)
BE (1) BE1027175B1 (pl)
PL (1) PL3948924T3 (pl)
TW (1) TW202111759A (pl)
WO (1) WO2020201309A1 (pl)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102021129533A1 (de) * 2021-11-12 2023-05-17 VON ARDENNE Asset GmbH & Co. KG Magnetron-Targetkupplung und Lagervorrichtung

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4407708A (en) * 1981-08-06 1983-10-04 Eaton Corporation Method for operating a magnetron sputtering apparatus
US4500409A (en) * 1983-07-19 1985-02-19 Varian Associates, Inc. Magnetron sputter coating source for both magnetic and non magnetic target materials
CH669609A5 (pl) * 1986-12-23 1989-03-31 Balzers Hochvakuum
US5284561A (en) * 1991-11-13 1994-02-08 Materials Research Corporation Method and apparatus for sputter coating employing machine readable indicia carried by target assembly
US7744735B2 (en) * 2001-05-04 2010-06-29 Tokyo Electron Limited Ionized PVD with sequential deposition and etching
US6811657B2 (en) * 2003-01-27 2004-11-02 Micron Technology, Inc. Device for measuring the profile of a metal film sputter deposition target, and system and method employing same
EP2626887A1 (en) * 2012-02-13 2013-08-14 Soleras Advanced Coatings bvba Online adjustable magnet bar
CN103531011B (zh) * 2013-10-31 2017-07-18 清华大学 微型旋转传感器/换能器的脉冲信号非接触传输装置
CN110211858A (zh) * 2014-03-14 2019-09-06 应用材料公司 智能腔室及智能腔室元件
US9791415B2 (en) * 2015-06-25 2017-10-17 Taiwan Semiconductor Manufacturing Co., Ltd. Method for monitoring usage of a physical vapor deposition (PVD) target with an ultrasonic transducer
US10896812B2 (en) * 2017-01-25 2021-01-19 Materion Corporation Sputtering target having RFID information

Also Published As

Publication number Publication date
EP3948924A1 (en) 2022-02-09
CN113748484A (zh) 2021-12-03
KR20210145262A (ko) 2021-12-01
BE1027175B1 (nl) 2020-11-03
TW202111759A (zh) 2021-03-16
US20220157582A1 (en) 2022-05-19
BE1027175A1 (nl) 2020-10-27
EP3948924B1 (en) 2023-06-07
WO2020201309A1 (en) 2020-10-08
JP2022528421A (ja) 2022-06-10
EP3948924C0 (en) 2023-06-07

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