PL3910662T3 - Zespół magnetronowy - Google Patents
Zespół magnetronowyInfo
- Publication number
- PL3910662T3 PL3910662T3 PL21163946.3T PL21163946T PL3910662T3 PL 3910662 T3 PL3910662 T3 PL 3910662T3 PL 21163946 T PL21163946 T PL 21163946T PL 3910662 T3 PL3910662 T3 PL 3910662T3
- Authority
- PL
- Poland
- Prior art keywords
- magnetron assembly
- magnetron
- assembly
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/342—Hollow targets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
- H01J37/3455—Movable magnets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3464—Operating strategies
- H01J37/347—Thickness uniformity of coated layers or desired profile of target erosion
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102020112979.3A DE102020112979B4 (de) | 2020-05-13 | 2020-05-13 | Magnetronanordnung |
Publications (1)
Publication Number | Publication Date |
---|---|
PL3910662T3 true PL3910662T3 (pl) | 2024-02-19 |
Family
ID=75143509
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PL21163946.3T PL3910662T3 (pl) | 2020-05-13 | 2021-03-22 | Zespół magnetronowy |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP3910662B1 (pl) |
DE (1) | DE102020112979B4 (pl) |
PL (1) | PL3910662T3 (pl) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070125303A1 (en) | 2005-12-02 | 2007-06-07 | Ward Ruby | High-throughput deposition system for oxide thin film growth by reactive coevaportation |
US20110155568A1 (en) * | 2009-12-29 | 2011-06-30 | Sputtering Components, Inc. | Indexing magnet assembly for rotary sputtering cathode |
DE102012109424A1 (de) * | 2012-10-04 | 2014-04-10 | Von Ardenne Anlagentechnik Gmbh | Sputtermagnetron und Verfahren zur dynamischen Magnetfeldbeeinflussung |
US9312108B2 (en) | 2013-03-01 | 2016-04-12 | Sputtering Components, Inc. | Sputtering apparatus |
CN106795621B (zh) * | 2014-04-28 | 2020-05-22 | 零件喷涂公司 | 磁控管组件和旋转靶阴极组件 |
DE102014109991A1 (de) | 2014-07-16 | 2016-01-21 | Von Ardenne Gmbh | Magnetron-Anordnung, Prozessieranordnung, Verfahren und Verwendung einer Magnetron-Anordnung |
-
2020
- 2020-05-13 DE DE102020112979.3A patent/DE102020112979B4/de active Active
-
2021
- 2021-03-22 EP EP21163946.3A patent/EP3910662B1/de active Active
- 2021-03-22 PL PL21163946.3T patent/PL3910662T3/pl unknown
Also Published As
Publication number | Publication date |
---|---|
DE102020112979A1 (de) | 2021-11-18 |
DE102020112979B4 (de) | 2021-12-23 |
EP3910662B1 (de) | 2023-08-09 |
EP3910662A1 (de) | 2021-11-17 |
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