PL3739619T3 - Instalacja do wytwarzania płyt z mechanizmem wyrzucającym - Google Patents
Instalacja do wytwarzania płyt z mechanizmem wyrzucającymInfo
- Publication number
- PL3739619T3 PL3739619T3 PL20171131.4T PL20171131T PL3739619T3 PL 3739619 T3 PL3739619 T3 PL 3739619T3 PL 20171131 T PL20171131 T PL 20171131T PL 3739619 T3 PL3739619 T3 PL 3739619T3
- Authority
- PL
- Poland
- Prior art keywords
- boards
- installation
- manufacturing
- ejecting mechanism
- ejecting
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
- H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3306—Horizontal transfer of a single workpiece
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102019113034 | 2019-05-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL3739619T3 true PL3739619T3 (pl) | 2022-10-17 |
Family
ID=70470767
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL20171131.4T PL3739619T3 (pl) | 2019-05-17 | 2020-04-23 | Instalacja do wytwarzania płyt z mechanizmem wyrzucającym |
Country Status (2)
| Country | Link |
|---|---|
| EP (1) | EP3739619B1 (pl) |
| PL (1) | PL3739619T3 (pl) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007095780A (ja) * | 2005-09-27 | 2007-04-12 | Oki Electric Ind Co Ltd | 半導体装置製造用治具と半導体装置製造方法 |
| MY150953A (en) * | 2008-11-05 | 2014-03-31 | Esec Ag | Die-ejector |
| KR101616464B1 (ko) * | 2014-11-18 | 2016-04-29 | 주식회사 엘지실트론 | 웨이퍼 연마장비의 웨이퍼 로딩장치 및 웨이퍼 로딩위치 조정 방법 |
-
2020
- 2020-04-23 EP EP20171131.4A patent/EP3739619B1/de active Active
- 2020-04-23 PL PL20171131.4T patent/PL3739619T3/pl unknown
Also Published As
| Publication number | Publication date |
|---|---|
| EP3739619A1 (de) | 2020-11-18 |
| EP3739619B1 (de) | 2022-03-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| GB2608902B (en) | Multilayer piezolelectric substrate | |
| IL290392A (en) | Aerial vehicle | |
| EP3826775A4 (en) | ATOMIZER | |
| EP3766824A4 (en) | AUTOMATIC UNLOADING LIFT MECHANISM | |
| IL286084A (en) | Semiconductor package having side wall plating | |
| CY1126464T1 (el) | Αυξητικος παραγοντας διαφοροποιησης 15 ως βιοδεικτης για μετφορμινη | |
| IL283368A (en) | Heterocyclic compound | |
| IL285950A (en) | Semiconductor package having side wall plating | |
| EP3801553A4 (en) | PRODRUGS OF FULVESTRANT | |
| HUE062981T2 (hu) | Légi jármû | |
| SG11202102782XA (en) | Board for building with magnetic layer | |
| EP4049556C0 (en) | LOCKING MECHANISM | |
| EP3598856C0 (en) | WIRING SUBSTRATE | |
| EP4269536C0 (en) | FIRE-RESISTANT Oriented Strand Board (OSB) | |
| EP3986832A4 (en) | Polyester polymer nanocomposites | |
| EP4061376A4 (en) | Prodrugs of fulvestrant | |
| LT4034728T (lt) | Statybinių plokščių rinkinys | |
| EP3888920C0 (en) | COMMUNICATING PRINTING COMPONENT | |
| PL3786406T3 (pl) | Zderzak z samonastawnym ogranicznikiem | |
| EP4055337C0 (en) | FLASH NOZZLE ASSEMBLY | |
| EP3825124A4 (en) | MULTI-LAYER STRUCTURE | |
| PL3898144T3 (pl) | Układy do budowy konstrukcji wykorzystujące techniki wytwarzania addytywnego | |
| EP3973109C0 (en) | MULTI-BACKHOE EXCAVATOR LINKAGE MECHANISM | |
| EP4013675C0 (en) | ROTARY WING AIRCRAFT | |
| EP3897972C0 (en) | LIGAND COUPLER SUBSTRATE |