PL3724370T3 - Szybszy impulsowy stałoprądowy układ rozpylający - Google Patents
Szybszy impulsowy stałoprądowy układ rozpylającyInfo
- Publication number
- PL3724370T3 PL3724370T3 PL18889771.4T PL18889771T PL3724370T3 PL 3724370 T3 PL3724370 T3 PL 3724370T3 PL 18889771 T PL18889771 T PL 18889771T PL 3724370 T3 PL3724370 T3 PL 3724370T3
- Authority
- PL
- Poland
- Prior art keywords
- sputtering system
- rate enhanced
- enhanced pulsed
- pulsed
- rate
- Prior art date
Links
- 238000004544 sputter deposition Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3485—Sputtering using pulsed power to the target
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3464—Operating strategies
- H01J37/3467—Pulsed operation, e.g. HIPIMS
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3417—Arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3438—Electrodes other than cathode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3444—Associated circuits
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/844,438 US11049702B2 (en) | 2015-04-27 | 2017-12-15 | Rate enhanced pulsed DC sputtering system |
PCT/US2018/016223 WO2019117979A1 (en) | 2017-12-15 | 2018-01-31 | Rate enhanced pulsed dc sputtering system |
Publications (1)
Publication Number | Publication Date |
---|---|
PL3724370T3 true PL3724370T3 (pl) | 2024-04-02 |
Family
ID=66820622
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PL18889771.4T PL3724370T3 (pl) | 2017-12-15 | 2018-01-31 | Szybszy impulsowy stałoprądowy układ rozpylający |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP3724370B1 (pl) |
JP (1) | JP2021507122A (pl) |
KR (1) | KR102539816B1 (pl) |
CN (1) | CN111788331A (pl) |
PL (1) | PL3724370T3 (pl) |
WO (1) | WO2019117979A1 (pl) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20210027998A1 (en) * | 2019-07-25 | 2021-01-28 | Advanced Energy Industries, Inc. | Pulsed dc sputtering systems and methods |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5186281B2 (ja) * | 2008-05-26 | 2013-04-17 | 株式会社アルバック | バイポーラパルス電源及びこのバイポーラパルス電源を複数台並列接続してなる電源装置 |
JP5124345B2 (ja) * | 2008-05-26 | 2013-01-23 | 株式会社アルバック | バイポーラパルス電源及びこのバイポーラパルス電源を複数台並列接続してなる電源装置 |
US9812305B2 (en) * | 2015-04-27 | 2017-11-07 | Advanced Energy Industries, Inc. | Rate enhanced pulsed DC sputtering system |
-
2018
- 2018-01-31 WO PCT/US2018/016223 patent/WO2019117979A1/en unknown
- 2018-01-31 CN CN201880089409.1A patent/CN111788331A/zh active Pending
- 2018-01-31 JP JP2020552669A patent/JP2021507122A/ja active Pending
- 2018-01-31 EP EP18889771.4A patent/EP3724370B1/en active Active
- 2018-01-31 PL PL18889771.4T patent/PL3724370T3/pl unknown
- 2018-01-31 KR KR1020207020262A patent/KR102539816B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
EP3724370A4 (en) | 2021-10-06 |
KR102539816B1 (ko) | 2023-06-02 |
EP3724370B1 (en) | 2024-01-03 |
KR20200111174A (ko) | 2020-09-28 |
WO2019117979A1 (en) | 2019-06-20 |
EP3724370A1 (en) | 2020-10-21 |
CN111788331A (zh) | 2020-10-16 |
JP2021507122A (ja) | 2021-02-22 |
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