PL34485B1 - - Google Patents
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- PL34485B1 PL34485B1 PL34485A PL3448547A PL34485B1 PL 34485 B1 PL34485 B1 PL 34485B1 PL 34485 A PL34485 A PL 34485A PL 3448547 A PL3448547 A PL 3448547A PL 34485 B1 PL34485 B1 PL 34485B1
- Authority
- PL
- Poland
- Prior art keywords
- copper
- measure according
- carrier
- water
- particles
- Prior art date
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- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims description 8
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- 241000233866 Fungi Species 0.000 claims description 4
- 229960003280 cupric chloride Drugs 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- 239000005749 Copper compound Substances 0.000 claims description 3
- 239000012876 carrier material Substances 0.000 claims description 3
- 239000000084 colloidal system Substances 0.000 claims description 3
- 150000001880 copper compounds Chemical class 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 238000001179 sorption measurement Methods 0.000 claims description 3
- 241001223281 Peronospora Species 0.000 claims description 2
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 2
- 201000010099 disease Diseases 0.000 claims description 2
- 208000037265 diseases, disorders, signs and symptoms Diseases 0.000 claims description 2
- 238000001035 drying Methods 0.000 claims description 2
- 230000002441 reversible effect Effects 0.000 claims description 2
- 238000009736 wetting Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 claims 5
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 150000001879 copper Chemical class 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 241000196324 Embryophyta Species 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000032683 aging Effects 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 230000000274 adsorptive effect Effects 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 239000000440 bentonite Substances 0.000 description 2
- 229910000278 bentonite Inorganic materials 0.000 description 2
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 2
- 230000000855 fungicidal effect Effects 0.000 description 2
- 239000000417 fungicide Substances 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- DEXFNLNNUZKHNO-UHFFFAOYSA-N 6-[3-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperidin-1-yl]-3-oxopropyl]-3H-1,3-benzoxazol-2-one Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C1CCN(CC1)C(CCC1=CC2=C(NC(O2)=O)C=C1)=O DEXFNLNNUZKHNO-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- JJLJMEJHUUYSSY-UHFFFAOYSA-L Copper hydroxide Chemical compound [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 description 1
- 239000005750 Copper hydroxide Substances 0.000 description 1
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 241001281803 Plasmopara viticola Species 0.000 description 1
- 240000004808 Saccharomyces cerevisiae Species 0.000 description 1
- 240000006365 Vitis vinifera Species 0.000 description 1
- 235000014787 Vitis vinifera Nutrition 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 229910001514 alkali metal chloride Inorganic materials 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229940116318 copper carbonate Drugs 0.000 description 1
- 229910001956 copper hydroxide Inorganic materials 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 1
- GEZOTWYUIKXWOA-UHFFFAOYSA-L copper;carbonate Chemical compound [Cu+2].[O-]C([O-])=O GEZOTWYUIKXWOA-UHFFFAOYSA-L 0.000 description 1
- 229940045803 cuprous chloride Drugs 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 235000019353 potassium silicate Nutrition 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- 239000011163 secondary particle Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- GRVFOGOEDUUMBP-UHFFFAOYSA-N sodium sulfide (anhydrous) Chemical compound [Na+].[Na+].[S-2] GRVFOGOEDUUMBP-UHFFFAOYSA-N 0.000 description 1
- 208000024891 symptom Diseases 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
Description
Jest rzecza znana, ze rozpuszczane w wodzie sole miedzi, zwlaszcza siarczan miedzi; stanowia doskonale srodki grzybobójcze do zwalczania nie¬ których chorób roslin, wywolanych przez grzybki pasozytnicze, zwlaszcza grzybka Peronospora, np. winorosli (Peronospora Viticola). Stosowanie je-' dnak np. siarczanu miedzi jako srodka grzybobój¬ czego w hodowli winorosli i drzew owocowych jest w praktyce utrudnione, nawet w okolicach • wybitnie suchym klimacie w porze letniej, ponie¬ waz rozpuszczalne w wodzie sole miedzi powoduj i silne oparzenia roslin. Z tego powodu w celu ochrony roslin stosuje sie sole miedzi wylacznie w postaci zwiazków nierozpuszczalnych lub prawie nierozpuszczalnych jak wodorotlenek miedzi, chlo¬ rek miedziawy, weglan miedzi itd.Stwierdzono, ze rozpuszczalne w wodzie zwiaz¬ ki miedzi mozna tak zwiazac na nosnikach o wy¬ sokiej zdolnosci adsorpcyjnej, ze jony miedzi beda bardzo powoli przechodzily z nosnika na wilgotna powierzchnie roslin Jako rozpuszczalne w wodzie zwiazki miedzi stosuje sie, np. siarctan miedzi, chlorek miedziowy lub ich mieszanine. Zwiazanie rozpuszczalnej w wodzie soli miedzi" z nosnikiem wykazujacym zdolnosci adsorpcyjne, np. z weglem aktywowanym, wodorotlenkiem glinu, zelem krze¬ mionkowym, bentonitem itd. nie przedstawia tru¬ dnosci. Stwierdzono np., ze mieszanina 100 g ben- . tonitu i 5 g siarczanu miedzi w 1 litrze wody, po opadnieciu bentonitu, nie zawiera miedzi, w fazie cieklej, w ilosci, dajacej sie stwierdzic analiza.Przez odpowiedni dobór stosunku ilosciowego miedzi do substancji nosnej mozna sporzadzac cie¬ cze do opryskiwania, w których ilosc wolnej soli miedzi w stosunku do miedzi zwiazanej z nosni¬ kiem zmienia sie w dowolnych granicach. Takie ciecze do opryskiwania dzialaja podobnie jak roz¬ cienczone roztwory soli miedzi, które sa dostate¬ cznie grzybobójcze i nie powoduja oparzen roslin.Jako. materialy nosne mozna stosowac z korzy¬ scia koloidy czesciowo odwracalne, które, przy wy¬ sychaniu wykazuja objawy starzenia, to znaczy powiekszania czastek. Objawy starzenia „polegaja na zbijaniu sie drobniutkich czastek pierwotnych w wieksze czastki wtórne i w zwiazku z tym na zmniejszaniu sie powierzchni akt)wnej. Wywolanyw ten sposób spadek zdolnosci adsorpcyjnych nos¬ nika w stosunku do substancji czynnej jest w tym przypadku pozadany, albowiem powoduje zwalnia¬ nie dalszych ilosci soli miedzi.Poczatkowo obawiano sie, ze material nosny zwiaze tak silnie reszte miedzi, ze po zuzyciu, mie¬ dzi wolnej, wskutek wyplukania rirzez deszcz i ro¬ se, nie, pozostanie juz na roslinie zadna aktywna'- ilosc tego metalu. W praktyce jednak okazalo sie ze nosnik po wyschnieciu ulega stalemu procesowi starzenia, dzieki czemu w miare zanikania zdolno¬ sci adsorpcyjnej nosnika, coraz to nowe ilosci soli miedzi przechodza do roztworu. W razie potrzeby mozna przyspieszyc proces starzenia przez dobór odpowiedniego pH srodowiska lub przez dodatek substancji fizjologicznie obojetnych i trudno roz¬ puszczalnych. Do mieszaniny soli miedzi i materia¬ lu nosnego o zdolnosciach adsorpcyjnych mozna dodac jeszcze innych substancji, np. znanych srod¬ ków zwilzajacych i przyczepnych, barwników w celu zwiekszenia widocznosci itd.P r z,y k l a d 1. 100 g swiezo sporzadzonego zelu krzemionkowego poddaje sie dzialaniu 5 g chlorku miedziowego, rozpuszczonego w 20 cnr wody \, po 2 godzinach mieszanine rozciencza sie do 100 cm*, uzyskujac ciecz do opryskiwania.Przyklad 2. Do roztworu szkla wodnego, za¬ wierajacego 100 g S/O2, dodaje sie 5 g chlorku mie¬ dziowego, rozpuszczonego w 20 'cm3 wody, i wy¬ traca krzemionke kwasem solnym, która prakty¬ cznie adsorbuje caly crjlorek miedziowy. Osad prze¬ mywa sie w celu ^usuniecia chlorku metalu alkali¬ cznego. Siady miedzi w przesaczu mozna odzyskac przez wytracenie, np. siarczkiem sodu.- PLIt is known that copper salts dissolved in water, especially copper sulfate; they are excellent fungicides for combating some plant diseases caused by parasitic fungi, in particular the fungus Peronospora, for example grapevines (Peronospora Viticola). However, the use of, for example, copper sulphate as a fungicide in the cultivation of vines and fruit trees is difficult in practice, even in extremely dry climates in summer, because the water-soluble copper salts cause severe burns to the plants. For this reason, in order to protect plants, only copper salts are used in the form of insoluble or almost insoluble compounds, such as copper hydroxide, cuprous chloride, copper carbonate, etc. It has been found that water-soluble copper compounds can thus be bound on carriers with high adsorption capacity, that the copper ions will pass very slowly from the carrier to the wet plant surfaces. Water-soluble copper compounds are, for example, copper sulphate, cupric chloride or a mixture thereof. The binding of the water-soluble copper salt to a carrier exhibiting adsorptive properties, for example, activated carbon, aluminum hydroxide, silica gel, bentonite, etc., is not difficult. It has been found, for example, that a mixture of 100 g of benzene and 5 g of copper sulphate in 1 liter of water, after the bentonite has fallen, it does not contain copper, in the liquid phase, in an amount that can be determined by analysis. of copper versus carrier copper can be varied within any limits.Such sprays work similarly to dilute solutions of copper salts, which are sufficiently fungicidal and do not cause burns to the plants. Partially reversible colloids which, when they dry out, show signs of aging, that is, particle enlargement. Symptoms of aging "are the clumping of the yeast. tiny primary particles into larger secondary particles and therefore the reduction of the file surface. The decrease in the adsorptive capacity of the carrier in relation to the active substance thus caused is desirable in this case, as it causes the release of further amounts of copper salts. At first it was feared that the carrier material would bind the rest of the copper so strongly that, when worn, copper free, as a result of rinsing the water with rain and growth, no, no active amount of this metal will remain on the plant. In practice, however, it turned out that the carrier undergoes a constant aging process after drying, so that, as the adsorption capacity of the carrier disappears, new amounts of copper salt pass into solution. If necessary, the aging process can be accelerated by selecting an appropriate pH of the environment or by adding physiologically inert and difficult to dissolve substances. Other substances can be added to the mixture of copper salts and adsorptive carrier material, e.g. known wetting and adhesive agents, dyes to increase the visibility, etc., Example 1 100 g of freshly prepared silica gel is treated with 5 g of cupric chloride, dissolved in 20 cnr of water, after 2 hours the mixture is diluted to 100 cm 2, obtaining a spray liquid. Example 2 5 g of chloride are added to a water glass solution containing 100 g S / O 2. copper, dissolved in 20 cm.sup.3 of water, and precipitates the silica with hydrochloric acid, which practically adsorbs all cupric chloride. The precipitate is washed to remove alkali metal chloride. Copper deposits in the weir can be recovered by precipitation, eg with sodium sulphide.- PL
Claims (5)
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL34485B1 true PL34485B1 (en) | 1951-06-30 |
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