PL267477A2 - Cured by irradiation two-layer system and a method for manufacturing polymer coatings of that system - Google Patents

Cured by irradiation two-layer system and a method for manufacturing polymer coatings of that system

Info

Publication number
PL267477A2
PL267477A2 PL26747787A PL26747787A PL267477A2 PL 267477 A2 PL267477 A2 PL 267477A2 PL 26747787 A PL26747787 A PL 26747787A PL 26747787 A PL26747787 A PL 26747787A PL 267477 A2 PL267477 A2 PL 267477A2
Authority
PL
Poland
Prior art keywords
cured
irradiation
polymer coatings
manufacturing polymer
layer system
Prior art date
Application number
PL26747787A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of PL267477A2 publication Critical patent/PL267477A2/en

Links

PL26747787A 1986-08-30 1987-08-28 Cured by irradiation two-layer system and a method for manufacturing polymer coatings of that system PL267477A2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3629543 1986-08-30

Publications (1)

Publication Number Publication Date
PL267477A2 true PL267477A2 (en) 1988-06-09

Family

ID=6308548

Family Applications (1)

Application Number Title Priority Date Filing Date
PL26747787A PL267477A2 (en) 1986-08-30 1987-08-28 Cured by irradiation two-layer system and a method for manufacturing polymer coatings of that system

Country Status (3)

Country Link
JP (1) JPS6363030A (en)
PL (1) PL267477A2 (en)
ZA (1) ZA876457B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4790380B2 (en) * 2005-11-11 2011-10-12 富士フイルム株式会社 LAMINATE FOR PRINTED WIRING BOARD AND METHOD FOR PRODUCING PRINTED WIRING BOARD USING SAME
JP6085076B2 (en) * 2009-03-16 2017-02-22 リンテック株式会社 Adhesive sheet, semiconductor wafer processing method, and semiconductor chip manufacturing method

Also Published As

Publication number Publication date
JPS6363030A (en) 1988-03-19
ZA876457B (en) 1988-04-27

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