PL2502255T3 - System cewek częściowych do symulacji cewek kołowych do urządzeń próżniowych - Google Patents
System cewek częściowych do symulacji cewek kołowych do urządzeń próżniowychInfo
- Publication number
- PL2502255T3 PL2502255T3 PL10768183T PL10768183T PL2502255T3 PL 2502255 T3 PL2502255 T3 PL 2502255T3 PL 10768183 T PL10768183 T PL 10768183T PL 10768183 T PL10768183 T PL 10768183T PL 2502255 T3 PL2502255 T3 PL 2502255T3
- Authority
- PL
- Poland
- Prior art keywords
- coil section
- section assembly
- vacuum devices
- circular coils
- simulating
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Plasma Technology (AREA)
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
- Treatment Of Fiber Materials (AREA)
- Solid-Phase Diffusion Into Metallic Material Surfaces (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US26296509P | 2009-11-20 | 2009-11-20 | |
| PCT/EP2010/006067 WO2011060847A1 (de) | 2009-11-20 | 2010-10-05 | Teilspulensystem zur simulation von kreisspulen für vakuumvorrichtungen |
| EP10768183.5A EP2502255B1 (de) | 2009-11-20 | 2010-10-05 | Teilspulensystem zur simulation von kreisspulen für vakuumvorrichtungen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL2502255T3 true PL2502255T3 (pl) | 2014-09-30 |
Family
ID=43085761
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL10768183T PL2502255T3 (pl) | 2009-11-20 | 2010-10-05 | System cewek częściowych do symulacji cewek kołowych do urządzeń próżniowych |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US9208999B2 (pl) |
| EP (1) | EP2502255B1 (pl) |
| JP (1) | JP5816187B2 (pl) |
| KR (1) | KR101453174B1 (pl) |
| CN (1) | CN102770936B (pl) |
| BR (1) | BR112012012002B1 (pl) |
| ES (1) | ES2482593T3 (pl) |
| IN (1) | IN2012DN04904A (pl) |
| MY (1) | MY159633A (pl) |
| PL (1) | PL2502255T3 (pl) |
| PT (1) | PT2502255E (pl) |
| WO (1) | WO2011060847A1 (pl) |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5250779A (en) | 1990-11-05 | 1993-10-05 | Balzers Aktiengesellschaft | Method and apparatus for heating-up a substrate by means of a low voltage arc discharge and variable magnetic field |
| WO1995015672A1 (en) | 1993-12-01 | 1995-06-08 | Wisconsin Alumni Research Foundation | Method and apparatus for planar plasma processing |
| US5874704A (en) | 1995-06-30 | 1999-02-23 | Lam Research Corporation | Low inductance large area coil for an inductively coupled plasma source |
| JP3780306B2 (ja) * | 1996-10-25 | 2006-05-31 | 米沢電線株式会社 | コイル装置 |
| JP3955351B2 (ja) * | 1996-12-27 | 2007-08-08 | キヤノンアネルバ株式会社 | プラズマ処理装置 |
| JP3582287B2 (ja) * | 1997-03-26 | 2004-10-27 | 株式会社日立製作所 | エッチング装置 |
| US6013905A (en) * | 1998-04-30 | 2000-01-11 | Oster; Eugene L. | Magnetic vacuum oven with safe door access to air gap |
| US6164241A (en) * | 1998-06-30 | 2000-12-26 | Lam Research Corporation | Multiple coil antenna for inductively-coupled plasma generation systems |
| US6474258B2 (en) * | 1999-03-26 | 2002-11-05 | Tokyo Electron Limited | Apparatus and method for improving plasma distribution and performance in an inductively coupled plasma |
| DE10018143C5 (de) * | 2000-04-12 | 2012-09-06 | Oerlikon Trading Ag, Trübbach | DLC-Schichtsystem sowie Verfahren und Vorrichtung zur Herstellung eines derartigen Schichtsystems |
| US7883633B2 (en) | 2003-02-14 | 2011-02-08 | Applied Materials, Inc. | Method for shaping a magnetic field in a magnetic field-enhanced plasma reactor |
| US7422654B2 (en) * | 2003-02-14 | 2008-09-09 | Applied Materials, Inc. | Method and apparatus for shaping a magnetic field in a magnetic field-enhanced plasma reactor |
| CH697552B1 (de) * | 2004-11-12 | 2008-11-28 | Oerlikon Trading Ag | Vakuumbehandlungsanlage. |
| JP5445754B2 (ja) * | 2009-10-01 | 2014-03-19 | 株式会社 Jeol Resonance | Nmrにおけるマジック角精密調整方法及び装置 |
-
2010
- 2010-10-05 MY MYPI2012002243A patent/MY159633A/en unknown
- 2010-10-05 PT PT107681835T patent/PT2502255E/pt unknown
- 2010-10-05 CN CN201080052526.4A patent/CN102770936B/zh active Active
- 2010-10-05 BR BR112012012002-6A patent/BR112012012002B1/pt not_active IP Right Cessation
- 2010-10-05 PL PL10768183T patent/PL2502255T3/pl unknown
- 2010-10-05 JP JP2012539204A patent/JP5816187B2/ja active Active
- 2010-10-05 ES ES10768183.5T patent/ES2482593T3/es active Active
- 2010-10-05 EP EP10768183.5A patent/EP2502255B1/de active Active
- 2010-10-05 KR KR1020127015037A patent/KR101453174B1/ko active Active
- 2010-10-05 WO PCT/EP2010/006067 patent/WO2011060847A1/de not_active Ceased
- 2010-10-05 US US13/510,733 patent/US9208999B2/en active Active
-
2012
- 2012-06-04 IN IN4904DEN2012 patent/IN2012DN04904A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| BR112012012002A2 (pt) | 2016-05-10 |
| EP2502255B1 (de) | 2014-04-23 |
| JP5816187B2 (ja) | 2015-11-18 |
| CN102770936A (zh) | 2012-11-07 |
| US9208999B2 (en) | 2015-12-08 |
| JP2013511797A (ja) | 2013-04-04 |
| IN2012DN04904A (pl) | 2015-09-25 |
| KR101453174B1 (ko) | 2014-10-22 |
| WO2011060847A1 (de) | 2011-05-26 |
| MY159633A (en) | 2017-01-13 |
| EP2502255A1 (de) | 2012-09-26 |
| CN102770936B (zh) | 2015-07-08 |
| KR20120117773A (ko) | 2012-10-24 |
| US20120279450A1 (en) | 2012-11-08 |
| ES2482593T3 (es) | 2014-08-04 |
| PT2502255E (pt) | 2014-06-11 |
| BR112012012002B1 (pt) | 2020-11-10 |
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