PL2502255T3 - System cewek częściowych do symulacji cewek kołowych do urządzeń próżniowych - Google Patents

System cewek częściowych do symulacji cewek kołowych do urządzeń próżniowych

Info

Publication number
PL2502255T3
PL2502255T3 PL10768183T PL10768183T PL2502255T3 PL 2502255 T3 PL2502255 T3 PL 2502255T3 PL 10768183 T PL10768183 T PL 10768183T PL 10768183 T PL10768183 T PL 10768183T PL 2502255 T3 PL2502255 T3 PL 2502255T3
Authority
PL
Poland
Prior art keywords
coil section
section assembly
vacuum devices
circular coils
simulating
Prior art date
Application number
PL10768183T
Other languages
English (en)
Inventor
Siegfried Krassnitzer
Original Assignee
Oerlikon Trading Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oerlikon Trading Ag filed Critical Oerlikon Trading Ag
Publication of PL2502255T3 publication Critical patent/PL2502255T3/pl

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
  • Treatment Of Fiber Materials (AREA)
  • Solid-Phase Diffusion Into Metallic Material Surfaces (AREA)
PL10768183T 2009-11-20 2010-10-05 System cewek częściowych do symulacji cewek kołowych do urządzeń próżniowych PL2502255T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US26296509P 2009-11-20 2009-11-20
PCT/EP2010/006067 WO2011060847A1 (de) 2009-11-20 2010-10-05 Teilspulensystem zur simulation von kreisspulen für vakuumvorrichtungen
EP10768183.5A EP2502255B1 (de) 2009-11-20 2010-10-05 Teilspulensystem zur simulation von kreisspulen für vakuumvorrichtungen

Publications (1)

Publication Number Publication Date
PL2502255T3 true PL2502255T3 (pl) 2014-09-30

Family

ID=43085761

Family Applications (1)

Application Number Title Priority Date Filing Date
PL10768183T PL2502255T3 (pl) 2009-11-20 2010-10-05 System cewek częściowych do symulacji cewek kołowych do urządzeń próżniowych

Country Status (12)

Country Link
US (1) US9208999B2 (pl)
EP (1) EP2502255B1 (pl)
JP (1) JP5816187B2 (pl)
KR (1) KR101453174B1 (pl)
CN (1) CN102770936B (pl)
BR (1) BR112012012002B1 (pl)
ES (1) ES2482593T3 (pl)
IN (1) IN2012DN04904A (pl)
MY (1) MY159633A (pl)
PL (1) PL2502255T3 (pl)
PT (1) PT2502255E (pl)
WO (1) WO2011060847A1 (pl)

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5250779A (en) 1990-11-05 1993-10-05 Balzers Aktiengesellschaft Method and apparatus for heating-up a substrate by means of a low voltage arc discharge and variable magnetic field
WO1995015672A1 (en) 1993-12-01 1995-06-08 Wisconsin Alumni Research Foundation Method and apparatus for planar plasma processing
US5874704A (en) 1995-06-30 1999-02-23 Lam Research Corporation Low inductance large area coil for an inductively coupled plasma source
JP3780306B2 (ja) * 1996-10-25 2006-05-31 米沢電線株式会社 コイル装置
JP3955351B2 (ja) * 1996-12-27 2007-08-08 キヤノンアネルバ株式会社 プラズマ処理装置
JP3582287B2 (ja) * 1997-03-26 2004-10-27 株式会社日立製作所 エッチング装置
US6013905A (en) * 1998-04-30 2000-01-11 Oster; Eugene L. Magnetic vacuum oven with safe door access to air gap
US6164241A (en) * 1998-06-30 2000-12-26 Lam Research Corporation Multiple coil antenna for inductively-coupled plasma generation systems
US6474258B2 (en) * 1999-03-26 2002-11-05 Tokyo Electron Limited Apparatus and method for improving plasma distribution and performance in an inductively coupled plasma
DE10018143C5 (de) * 2000-04-12 2012-09-06 Oerlikon Trading Ag, Trübbach DLC-Schichtsystem sowie Verfahren und Vorrichtung zur Herstellung eines derartigen Schichtsystems
US7883633B2 (en) 2003-02-14 2011-02-08 Applied Materials, Inc. Method for shaping a magnetic field in a magnetic field-enhanced plasma reactor
US7422654B2 (en) * 2003-02-14 2008-09-09 Applied Materials, Inc. Method and apparatus for shaping a magnetic field in a magnetic field-enhanced plasma reactor
CH697552B1 (de) * 2004-11-12 2008-11-28 Oerlikon Trading Ag Vakuumbehandlungsanlage.
JP5445754B2 (ja) * 2009-10-01 2014-03-19 株式会社 Jeol Resonance Nmrにおけるマジック角精密調整方法及び装置

Also Published As

Publication number Publication date
BR112012012002A2 (pt) 2016-05-10
EP2502255B1 (de) 2014-04-23
JP5816187B2 (ja) 2015-11-18
CN102770936A (zh) 2012-11-07
US9208999B2 (en) 2015-12-08
JP2013511797A (ja) 2013-04-04
IN2012DN04904A (pl) 2015-09-25
KR101453174B1 (ko) 2014-10-22
WO2011060847A1 (de) 2011-05-26
MY159633A (en) 2017-01-13
EP2502255A1 (de) 2012-09-26
CN102770936B (zh) 2015-07-08
KR20120117773A (ko) 2012-10-24
US20120279450A1 (en) 2012-11-08
ES2482593T3 (es) 2014-08-04
PT2502255E (pt) 2014-06-11
BR112012012002B1 (pt) 2020-11-10

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