PL2383773T3 - Sposób elektrochemiczno-mechanicznego polerowania płytek z węglika krzemu - Google Patents
Sposób elektrochemiczno-mechanicznego polerowania płytek z węglika krzemuInfo
- Publication number
- PL2383773T3 PL2383773T3 PL11163617T PL11163617T PL2383773T3 PL 2383773 T3 PL2383773 T3 PL 2383773T3 PL 11163617 T PL11163617 T PL 11163617T PL 11163617 T PL11163617 T PL 11163617T PL 2383773 T3 PL2383773 T3 PL 2383773T3
- Authority
- PL
- Poland
- Prior art keywords
- electrochemical
- mechanical polishing
- silicon carbon
- tiles
- carbon tiles
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
- H10P90/12—Preparing bulk and homogeneous wafers
- H10P90/129—Preparing bulk and homogeneous wafers by polishing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/046—Lapping machines or devices; Accessories designed for working plane surfaces using electric current
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/16—Polishing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
- H10D62/832—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
- H10D62/8325—Silicon carbide
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PL39107610 | 2010-04-27 | ||
| EP11163617.1A EP2383773B1 (en) | 2010-04-27 | 2011-04-23 | Method of electrochemical-mechanical polishing of silicon carbide wafers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL2383773T3 true PL2383773T3 (pl) | 2013-09-30 |
Family
ID=44485970
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL11163617T PL2383773T3 (pl) | 2010-04-27 | 2011-04-23 | Sposób elektrochemiczno-mechanicznego polerowania płytek z węglika krzemu |
Country Status (2)
| Country | Link |
|---|---|
| EP (1) | EP2383773B1 (pl) |
| PL (1) | PL2383773T3 (pl) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10879077B2 (en) * | 2017-10-30 | 2020-12-29 | Taiwan Semiconductor Manufacturing Company Ltd. | Planarization apparatus and planarization method thereof |
| CN116657231B (zh) * | 2023-05-26 | 2025-08-26 | 无锡市恒利弘实业有限公司 | 一种碳化硅基材抛光方法 |
| CN120206314B (zh) * | 2025-05-09 | 2025-09-05 | 河北同光半导体股份有限公司 | 一种大尺寸碳化硅衬底的化学机械抛光方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4946547A (en) | 1989-10-13 | 1990-08-07 | Cree Research, Inc. | Method of preparing silicon carbide surfaces for crystal growth |
| JP3891133B2 (ja) | 2003-03-26 | 2007-03-14 | セイコーエプソン株式会社 | 電子部品の製造方法および電子部品の実装方法 |
| WO2005099388A2 (en) | 2004-04-08 | 2005-10-27 | Ii-Vi Incorporated | Chemical-mechanical polishing of sic surfaces using hydrogen peroixde or ozonated water solutions in combination with colloidal abrasive |
-
2011
- 2011-04-23 PL PL11163617T patent/PL2383773T3/pl unknown
- 2011-04-23 EP EP11163617.1A patent/EP2383773B1/en not_active Not-in-force
Also Published As
| Publication number | Publication date |
|---|---|
| EP2383773B1 (en) | 2013-05-08 |
| EP2383773A3 (en) | 2012-05-30 |
| EP2383773A2 (en) | 2011-11-02 |
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