PL2355443T3 - Sposób uwierzytelniania sieciowego i urządzenie do jego realizacji - Google Patents

Sposób uwierzytelniania sieciowego i urządzenie do jego realizacji

Info

Publication number
PL2355443T3
PL2355443T3 PL11152033T PL11152033T PL2355443T3 PL 2355443 T3 PL2355443 T3 PL 2355443T3 PL 11152033 T PL11152033 T PL 11152033T PL 11152033 T PL11152033 T PL 11152033T PL 2355443 T3 PL2355443 T3 PL 2355443T3
Authority
PL
Poland
Prior art keywords
implementing
same
authentication method
network authentication
network
Prior art date
Application number
PL11152033T
Other languages
English (en)
Polish (pl)
Inventor
Maw-Tsong Lin
Original Assignee
Lydsec Digital Technology Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=43881253&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=PL2355443(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Lydsec Digital Technology Co., Ltd. filed Critical Lydsec Digital Technology Co., Ltd.
Publication of PL2355443T3 publication Critical patent/PL2355443T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L63/00—Network architectures or network communication protocols for network security
    • H04L63/08—Network architectures or network communication protocols for network security for authentication of entities
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
    • G06F21/30—Authentication, i.e. establishing the identity or authorisation of security principals
    • G06F21/31—User authentication
    • G06F21/34—User authentication involving the use of external additional devices, e.g. dongles or smart cards
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L63/00—Network architectures or network communication protocols for network security
    • H04L63/08—Network architectures or network communication protocols for network security for authentication of entities
    • H04L63/0815—Network architectures or network communication protocols for network security for authentication of entities providing single-sign-on or federations
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L63/00—Network architectures or network communication protocols for network security
    • H04L63/08—Network architectures or network communication protocols for network security for authentication of entities
    • H04L63/0876—Network architectures or network communication protocols for network security for authentication of entities based on the identity of the terminal or configuration, e.g. MAC address, hardware or software configuration or device fingerprint
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L63/00—Network architectures or network communication protocols for network security
    • H04L63/12—Applying verification of the received information
    • H04L63/123—Applying verification of the received information received data contents, e.g. message integrity
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L63/00—Network architectures or network communication protocols for network security
    • H04L63/12—Applying verification of the received information
    • H04L63/126—Applying verification of the received information the source of the received data
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L2463/00—Additional details relating to network architectures or network communication protocols for network security covered by H04L63/00
    • H04L2463/082—Additional details relating to network architectures or network communication protocols for network security covered by H04L63/00 applying multi-factor authentication

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Security & Cryptography (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Computing Systems (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Software Systems (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer And Data Communications (AREA)
  • Mobile Radio Communication Systems (AREA)
  • Telephonic Communication Services (AREA)
PL11152033T 2010-01-27 2011-01-25 Sposób uwierzytelniania sieciowego i urządzenie do jego realizacji PL2355443T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW099102251A TW201121280A (en) 2009-12-10 2010-01-27 Network security verification method and device and handheld electronic device verification method.
EP11152033.4A EP2355443B1 (en) 2010-01-27 2011-01-25 Network authentication method and device for implementing the same

Publications (1)

Publication Number Publication Date
PL2355443T3 true PL2355443T3 (pl) 2019-12-31

Family

ID=43881253

Family Applications (1)

Application Number Title Priority Date Filing Date
PL11152033T PL2355443T3 (pl) 2010-01-27 2011-01-25 Sposób uwierzytelniania sieciowego i urządzenie do jego realizacji

Country Status (8)

Country Link
US (1) US20110185181A1 (enExample)
EP (1) EP2355443B1 (enExample)
JP (1) JP5529775B2 (enExample)
KR (1) KR101233401B1 (enExample)
BR (1) BRPI1100749A2 (enExample)
ES (1) ES2741632T3 (enExample)
PL (1) PL2355443T3 (enExample)
TW (1) TW201121280A (enExample)

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US9838205B2 (en) 2014-09-16 2017-12-05 Keypasco Ab Network authentication method for secure electronic transactions
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US10817593B1 (en) * 2015-12-29 2020-10-27 Wells Fargo Bank, N.A. User information gathering and distribution system
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US10637853B2 (en) 2016-08-05 2020-04-28 Nok Nok Labs, Inc. Authentication techniques including speech and/or lip movement analysis
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CN106487785B (zh) * 2016-09-28 2019-07-23 武汉理工大学 一种基于移动终端的身份鉴别方法及系统
TWI637620B (zh) * 2016-12-26 2018-10-01 中華電信股份有限公司 Dynamic attribute authentication agent signature system and method thereof
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US12041039B2 (en) 2019-02-28 2024-07-16 Nok Nok Labs, Inc. System and method for endorsing a new authenticator
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Also Published As

Publication number Publication date
KR101233401B1 (ko) 2013-02-22
BRPI1100749A2 (pt) 2012-10-02
ES2741632T3 (es) 2020-02-11
KR20110088424A (ko) 2011-08-03
US20110185181A1 (en) 2011-07-28
EP2355443A2 (en) 2011-08-10
JP5529775B2 (ja) 2014-06-25
EP2355443B1 (en) 2019-06-19
EP2355443A3 (en) 2014-12-03
TW201121280A (en) 2011-06-16
TWI413393B (enExample) 2013-10-21
JP2011154688A (ja) 2011-08-11

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