PL227744B1 - Process for producing substrates with nano-coatings with a high surface area - Google Patents
Process for producing substrates with nano-coatings with a high surface area Download PDFInfo
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- PL227744B1 PL227744B1 PL403897A PL40389713A PL227744B1 PL 227744 B1 PL227744 B1 PL 227744B1 PL 403897 A PL403897 A PL 403897A PL 40389713 A PL40389713 A PL 40389713A PL 227744 B1 PL227744 B1 PL 227744B1
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- 238000000034 method Methods 0.000 title claims description 31
- 239000000758 substrate Substances 0.000 title claims description 25
- 239000002103 nanocoating Substances 0.000 title claims description 13
- 239000002243 precursor Substances 0.000 claims description 22
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical class O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 14
- 238000000231 atomic layer deposition Methods 0.000 claims description 14
- 229910052710 silicon Inorganic materials 0.000 claims description 10
- 239000010703 silicon Substances 0.000 claims description 10
- 238000001027 hydrothermal synthesis Methods 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- 239000003989 dielectric material Substances 0.000 claims description 7
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 6
- 238000000151 deposition Methods 0.000 claims description 6
- 239000001301 oxygen Substances 0.000 claims description 6
- 229910052760 oxygen Inorganic materials 0.000 claims description 6
- 230000008021 deposition Effects 0.000 claims description 5
- 239000004408 titanium dioxide Substances 0.000 claims description 5
- 238000005530 etching Methods 0.000 claims description 4
- CJNBYAVZURUTKZ-UHFFFAOYSA-N hafnium(iv) oxide Chemical compound O=[Hf]=O CJNBYAVZURUTKZ-UHFFFAOYSA-N 0.000 claims description 4
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical class [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 3
- MCMNRKCIXSYSNV-UHFFFAOYSA-N ZrO2 Inorganic materials O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 3
- 239000010453 quartz Substances 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 claims description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- ZOIORXHNWRGPMV-UHFFFAOYSA-N acetic acid;zinc Chemical group [Zn].CC(O)=O.CC(O)=O ZOIORXHNWRGPMV-UHFFFAOYSA-N 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 239000002070 nanowire Substances 0.000 claims description 2
- 238000005406 washing Methods 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 239000011701 zinc Substances 0.000 claims description 2
- 239000004246 zinc acetate Substances 0.000 claims description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 16
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
- 239000011787 zinc oxide Substances 0.000 description 7
- 239000002086 nanomaterial Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 239000002071 nanotube Substances 0.000 description 5
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 238000000137 annealing Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 239000002061 nanopillar Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- ONDPHDOFVYQSGI-UHFFFAOYSA-N zinc nitrate Chemical compound [Zn+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O ONDPHDOFVYQSGI-UHFFFAOYSA-N 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 244000309464 bull Species 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000029087 digestion Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002073 nanorod Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45555—Atomic layer deposition [ALD] applied in non-semiconductor technology
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/02—Pretreatment of the material to be coated
- C23C16/0272—Deposition of sub-layers, e.g. to promote the adhesion of the main coating
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/16—Oxides
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/60—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape characterised by shape
- C30B29/605—Products containing multiple oriented crystallites, e.g. columnar crystallites
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B7/00—Single-crystal growth from solutions using solvents which are liquid at normal temperature, e.g. aqueous solutions
- C30B7/10—Single-crystal growth from solutions using solvents which are liquid at normal temperature, e.g. aqueous solutions by application of pressure, e.g. hydrothermal processes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0665—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
- H01L29/0669—Nanowires or nanotubes
Description
Przedmiotem wynalazku jest sposób wytwarzania podłoży pokrytych nanopowłokami o rozwiniętej powierzchni z materiałów półprzewodnikowych i/lub dielektrycznych. Podłoża takie, a zwłaszcza podłoża z krzemu, kwarcu lub azotku galu zawierające takie nanopowłoki mogą być stosowane w czujnikach pomiaru stężeń gazów i cieczy, w ogniwach fotowoltaicznych, a także w różnego typu przyrządach emisyjnych.The subject of the invention is a method of producing nanocoated substrates with a high surface of semiconductor and / or dielectric materials. Such substrates, and in particular silicon, quartz or gallium nitride substrates containing such nanocoatings, can be used in sensors for measuring gas and liquid concentrations, in photovoltaic cells, and in various types of emission devices.
W literaturze znane są różne sposoby otrzymywania nanostruktur materiałów półprzewodn ikowych i dielektrycznych o różnych kształtach takich jak: nanosłupki, nanorurki, nanowąsy itp. Na przykład w publikacji: Ku, Se Jin: Jo, Gyeong Cheon et al. Nanotechnology 24 (2013) 085301 (8pp) opisany jest wzrost nanorurek dwutlenku tytanu (TiO2) i tlenku glinu (AI2O3) prowadzony z wykorzystaniem techniki osadzania warstw atomowych (ang. Atomie Layer Deposition, ALD). W opisanym sposobie, wykorzystuje się specjalną matrycę, która składa się z podłoża krzemowego, na którym znajduje się porowata warstwa polimeru (PS-b-PSSi) z otworami o średnicy około 53 nm i wysokości 200 nm. Porowatą powierzchnię polimerową najpierw pokrywa się warstwami dielektryków a następnie poprzez trawienie jonowe (ang. dry etching) usuwa się je, pozostawiając na powierzchni podłoża tylko nanorurki wykonane z ww. materiałów. Do otrzymania takich nanostruktur autorzy wykorzystują skomplikowane i wieloetapowe procesy trawienia i grzania termicznego. W publikacji: Das, S. K., Sahoo, S. N., Sarangi, S. N., & Sahoo, P. K., Journal of Experimental Nanoscience, (ahead-of-print) 1-7 (2012) opisano nanosłupki tlenku cynku (ZnO) otrzymywane metodą hydrotermalną w temperaturze 90°C na różnych podłożach takich jak Si, SiO2, MgO oraz ITO.In the literature, various methods are known to obtain nanostructures of semiconductor and dielectric materials of various shapes, such as: nano-bars, nanotubes, nanowashes, etc. For example, in the publication: Ku, Se Jin: Jo, Gyeong Cheon et al. Nanotechnology 24 (2013) 085301 (8pp) the growth of titanium dioxide (TiO 2 ) and alumina (Al 2 O 3 ) nanotubes is described using the atomic layer deposition (ALD) technique. In the described method, a special matrix is used, which consists of a silicon substrate on which there is a porous polymer layer (PS-b-PSSi) with holes about 53 nm in diameter and 200 nm in height. The porous polymer surface is first covered with layers of dielectrics and then, by dry etching, they are removed, leaving only nanotubes made of the above-mentioned on the surface of the substrate. materials. To obtain such nanostructures, the authors use complex and multi-stage etching and thermal heating processes. In the publication: Das, SK, Sahoo, SN, Sarangi, SN, & Sahoo, PK, Journal of Experimental Nanoscience, (ahead-of-print) 1-7 (2012), zinc oxide (ZnO) nanograms obtained by the hydrothermal method at a temperature of 90 ° C on various substrates such as Si, SiO 2 , MgO and ITO.
Z publikacji: Chih-Chiang Chen, Wei-Yun Cheng et al., CrystEngComm 12, 3664-3669(2010) znane są nanostruktury dwutlenku cyrkonu (ZrO2) wykonywane metodą osadzania z fazy pary (ang. Chemical Vapour Deposition, CVD) na podłożu półprzewodnikowym. W opisanym sposobie wzrost struktur odbywa się w temperaturach z zakresu 550-1000°C.From the publication of: Chih-Chiang Chen, Wei-Yun Cheng et al., CrystEngComm 12, 3664-3669 (2010) there are known zirconium dioxide (ZrO 2 ) nanostructures made by the Chemical Vapor Deposition (CVD) method on semiconductor substrate. In the described process, the growth of structures takes place at temperatures in the range 550-1000 ° C.
Znany jest z publikacji: Min Young Cho, Min Su Kim, Hyun Young Choi, Kwang Gug Yim, and Jae-Young Leem - Post-Annealing Effects on Properties of ZnO Nanorods Grown on Au Seed Layers - Bull. Korean Chem. Soc. 2011, Vol. 32, No. 3 sposób wzrostu nanosłupków ZnO metodą hydrotermalną. Opisany tam sposób wymaga jednak niezwykle dokładnego przygotowania podłoża (trawienie silnymi i toksycznymi kwasami). Podczas procesu wzrostu wykorzystuje się azotan cynku i HMT (heksametylotetraamina) wysokiej czystości, a wzrost odbywa się w temperaturze 130°C aż przez 7 godzin. Po zakończeniu procesu wzrostu wymagane jest ponadto wygrzewanie wysokotemperaturowe.He is known for his publications: Min Young Cho, Min Su Kim, Hyun Young Choi, Kwang Gug Yim, and Jae-Young Leem - Post-Annealing Effects on Properties of ZnO Nanorods Grown on Au Seed Layers - Bull. Korean Chem. Soc. 2011, Vol. 32, No. 3 way of growth of ZnO nanostructures by hydrothermal method. However, the method described there requires extremely careful preparation of the substrate (digestion with strong and toxic acids). High purity zinc nitrate and HMT (hexamethyltetramine) are used during the growth process, and the growth takes place at 130 ° C for up to 7 hours. After completion of the growth process, high-temperature annealing is also required.
Celem wynalazku jest opracowanie taniego, prostego i szybkiego sposobu wytwarzania podłoży pokrytych nanopowłokami o rozwiniętej powierzchni z materiałów dielektrycznych i/lub półprzewodnikowych.The aim of the invention is to provide an inexpensive, simple and quick method of producing nanocoated substrates with a high surface area from dielectric and / or semiconductor materials.
Sposób według wynalazku polega na tym, że najpierw na podłożu, korzystnie krzemowym, kwarcowym lub z azotku galu wytwarza się w procesie hydrotermalnym, fakturowaną warstwę ZnO zawierającą przytwierdzone do podłoża nanosłupki, nanokropki, czy nanodruty. Proces hydrotermalny prowadzi się w temperaturze niższej niż 100°C, w czasie krótszym niż 5 minut, a prekursorem cynku jest octan cynku natomiast prekursorem tlenu jest woda. Następnie w temperaturze 20-800°C, metodą osadzania warstw atomowych (ALD), na warstwie fakturowanej osadza się półprzewodnikową i/lub dielektryczną nanopowłokę, w postaci warstwy dwutlenku tytanu, dwutlenku cyrkonu, dwutlenku hafnu lub tlenku glinu lub w postaci wielowarstwy. Przy czym osadzanie warstwy prowadzi się w co najmniej 10 cyklach ALD, w których czasy pulsów prekursorów są z zakresu 0,015-2 s, prekursorem metalu jest prekursor organiczny lub nieorganiczny a prekursorem tlenu woda, korzystnie dejonizowana lub ozon. Po zakończeniu osadzania usuwa się znajdującą się pod nanopowłoką, fakturowaną warstwę ZnO, korzystnie, za pomocą wypłukania w wodzie lub wytrawiania w roztworze kwasu solnego.The method according to the invention consists in that, first of all, on a substrate, preferably silicon, quartz or gallium nitride, in a hydrothermal process, a textured ZnO layer is produced, containing nanostructures, nanodots or nanowires attached to the substrate. The hydrothermal process is carried out at a temperature lower than 100 ° C, in less than 5 minutes, and the zinc precursor is zinc acetate and the oxygen precursor is water. Then, at a temperature of 20-800 ° C, by the method of atomic layer deposition (ALD), a semiconductor and / or dielectric nanocoating is deposited on the textured layer in the form of a layer of titanium dioxide, zirconium dioxide, hafnium dioxide or alumina, or in the form of a multilayer. The deposition of the layer is carried out in at least 10 ALD cycles, in which the precursor pulse times are in the range of 0.015-2 s, the metal precursor is an organic or inorganic precursor and the oxygen precursor is water, preferably deionized or ozone. Upon completion of the deposition, the textured ZnO layer beneath the nano-coating is removed, preferably by washing with water or by etching with hydrochloric acid.
Opisany sposób umożliwia otrzymywanie podłoży z nanopowłokami o rozwiniętej powierzchni z materiałów półprzewodnikowych i/lub dielektrycznych, jest prosty i relatywnie krótkotrwały. Sposób ten nie wymaga stosowania skomplikowanych wieloetapowych procesów trawienia czy wysokotemperaturowego wygrzewania, ponieważ wzrost odbywa się w temperaturze z zakresu 20-800°C. Ponadto nanopowłoki te można wytwarzać na różnych podłożach.The described method makes it possible to obtain substrates with nanocoatings with a developed surface from semiconductor and / or dielectric materials, it is simple and relatively short-lived. This method does not require the use of complicated multi-stage etching processes or high-temperature annealing, because the growth takes place at a temperature in the range of 20-800 ° C. In addition, these nanocoatings can be produced on a variety of substrates.
Wynalazek zostanie bliżej objaśniony na przykładzie wykonania podłoża krzemowego z nanopowłoką z dwutlenku tytanu (TiO2).The invention will be explained in more detail on an embodiment of a silicon substrate with a titanium dioxide (TiO2) nanocoating.
Sposób według wynalazku wykorzystuje zupełnie nowy mechanizm wzrostu materiałów półprzewodnikowych i dielektrycznych o rozwiniętej powierzchni.The method according to the invention uses a completely new mechanism of growth of semiconductor and dielectric materials with a developed surface.
PL 227 744 B1PL 227 744 B1
W przykładowym sposobie, najpierw wykonuje się matrycę złożoną ze słupków ZnO przytwierdzonych do podłoża, w tym przypadku do podłoża krzemowego. W tym celu na krzemowym podłożu za pomocą metody hydrotermalnej wytwarza się fakturowaną warstwę tlenku cynku (ZnO) zawierającą nanosłupki. Metoda hydrotermalna umożliwia wytworzenie nanosłupków przytwierdzonych podstawami do podłoża i w miarę równomiernie rozmieszczonych. Następnie na powierzchni tych nanosłupków oraz częściowo na powierzchni podłoża krzemowego (pomiędzy nanosłupkami) osadza się nanop owłokę. W przykładzie osadzono warstwę dwutlenku tytanu (TiO2) o grubości 10 nm. Ten materiał tlenkowy (TiO2) został osadzony za pomocą technologii ALD.In an exemplary method, a matrix is first made of ZnO pillars attached to a substrate, in this case to a silicon substrate. For this purpose, a textured layer of zinc oxide (ZnO) containing nanograms is produced on a silicon substrate using a hydrothermal method. The hydrothermal method makes it possible to create nano-pillars attached to the substrate with their bases and relatively evenly distributed. Then, a nanopaint is deposited on the surface of these nano-pillars and partially on the surface of the silicon substrate (between the nano-pillars). In the example, a 10 nm thick layer of titanium dioxide (TiO 2) was deposited. This oxide material (TiO 2 ) was deposited using ALD technology.
W prezentowanym sposobie wykorzystano metodę osadzania warstw atomowych (ALD) jako jedną z możliwych do stosowania metod osadzania cienkich warstw. Technika ALD jest odmianą m etody chemicznego osadzania z fazy pary (ang. Chemial Vapor Deposition, CVD), która polega na naprzemiennym podawaniu reagentów, zwanych prekursorami, do komory reakcyjnej, w której na podłożu w wyniku chemicznej reakcji wymiany lub syntezy jest osadzana warstwa żądanego materiału. Po każdym podaniu prekursora następuje płukanie gazem obojętnym.The presented method uses the atomic layer deposition (ALD) method as one of the possible methods of thin layer deposition. The ALD technique is a variation of the method of Chemical Vapor Deposition (CVD), which consists in the alternating feeding of reagents, called precursors, to a reaction chamber, in which a layer of the desired chemical is deposited on the substrate as a result of a chemical exchange reaction or synthesis. material. Flushing with an inert gas follows each injection of the precursor.
Typowy cykl osadzania materiału w procesie ALD składa się z czterech etapów: czas podawania pierwszego prekursora, płukanie, czas podawania drugiego prekursora, płukanie. Grubość warstwy jest zdeterminowana ilością cykli. Przykładową matrycę pokryto konformalnie nanometrową warstwą dwutlenku tytanu w wyniku reakcji prekursorów (reagentów) nieorganicznych. Warstwę TiO2 osadzono w 100 cyklach ALD w temperaturze wzrostu o wartości 100°C. W procesie osadzania tej warstwy zastosowano jako prekursor tytanowy chlorek tytanu, TiCl4, a jako prekursor tlenowy wodę dejonizowaną.A typical material deposition cycle in an ALD process consists of four steps: first precursor feed time, rinse, second precursor feed time, and rinse. The layer thickness is determined by the number of cycles. An exemplary matrix was covered with a conformal nanometer layer of titanium dioxide as a result of the reaction of inorganic precursors (reactants). The TiO2 layer was deposited with 100 ALD cycles at a growth temperature of 100 ° C. In the process of depositing this layer, titanium chloride, TiCl 4 , was used as the titanium precursor and deionized water as the oxygen precursor.
Parametry wzrostu ustawiono następująco: puls prekursora TiCl4: 0,1 s; płukanie po pulsie TiCl4: 5 s; puls prekursora tlenowego: 0,1 s; płukanie po pulsie H2O: 5 s. Do płukania pomiędzy kolejnymi dozami prekursorów stosowano gaz neutralny, jakim jest azot, N2 o wysokiej czystości 99,9999%.The growth parameters were set as follows: TiCl 4 precursor pulse: 0.1 s; Pulse rinse with TiCl 4 : 5 s; oxygen precursor pulse: 0.1 s; H 2 O pulse rinsing: 5 s. Neutral gas, nitrogen, N 2 of high purity 99.9999% was used for rinsing between successive doses of precursors.
Po osadzeniu warstwy TiO2, przystąpiono do usuwania nanosłupków ZnO. Nanosłupki te usunięto poprzez wypłukanie w wodzie ale może być to także wytrawienie w roztworze kwasu solnego. W efekcie stosowania sposobu według wynalazku otrzymano na podłożu krzemowym nanopowłokę tlenku tytanu o rozwiniętej powierzchni. Otrzymana nanopowłoka odwzorowuje zewnętrzny kształt nanosłupków i ma postać zamkniętych od góry nanorurek przymocowanych miejscami do krzemowego podłoża. Wysokość i szerokość tych nanorurek jest ściśle związana z zewnętrznym kształtem nanosłupków znajdujących się w fakturowanej warstwie ZnO. Tak otrzymana nanostruktura może zostać wykorzystana w kolejnych procesach wzrostu, gdy zachodzi potrzeba wytworzenia nanopowłoki wielowarstwowej lub struktur wielowarstwowych z dowolnych materiałów półprzewodnikowych czy dielektrycznych.After the TiO2 layer was deposited, the ZnO nanograms were removed. These nano-columns were removed by rinsing in water, but it can also be etched in a hydrochloric acid solution. As a result of the method according to the invention, a titanium oxide nanocoating with a developed surface was obtained on a silicon substrate. The obtained nanocoating imitates the external shape of the nanobars and is in the form of nanotubes closed at the top, attached in places to a silicon substrate. The height and width of these nanotubes is closely related to the outer shape of the nanograms in the textured ZnO layer. The nanostructure obtained in this way can be used in subsequent growth processes, when there is a need to create a multilayer nanocoating or multilayer structures from any semiconductor or dielectric materials.
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