NZ794463A - Thermal management systems for wearable components - Google Patents

Abstract

various embodiments, a wearable component configured to be worn on a head of a user is disclosed. The wearable component can comprise a wearable support and an electronic component coupled to or disposed within the wearable support. A thermal management structure can be provided in thermal communication with the electronic component. The thermal management structure can be configured to transfer heat from the electronic component away from the head of the user when the wearable support is disposed on the head of the user. unication with the electronic component. The thermal management structure can be configured to transfer heat from the electronic component away from the head of the user when the wearable support is disposed on the head of the user.

Description

In various embodiments, a wearable component configured to be worn on a head of a user is disclosed. The wearable component can comprise a wearable support and an electronic component coupled to or disposed within the wearable support. A thermal management structure can be provided in l communication with the electronic component. The thermal management structure can be configured to transfer heat from the onic component away from the head of the user when the le support is disposed on the head of the user.

NZ 794463 MLEAP.168WO PATENT THERMAL MANAGEMENT SYSTEMS FOR WEARABLE COMPONENTS CROSS-REFERENCE TO RELATED APPLICATIONS This application claims priority to U.S. Provisional Patent Application No. 62/423,192, filed November 16, 2016, the contents of which are incorporated by reference herein in their entirety and for all purposes. [0001A] This application is a divisional of New Zealand Patent Application No. 753626, the entire content of which is incorporated herein by reference.

BACKGROUND Field of the ion The field relates to thermal management systems for wearable components, including thermal management systems for ounted augmented reality systems.

Description of the Related Art Modern computing and display technologies have facilitated the development of virtual reality (“VR”), ted reality (“AR”), and mixed reality (“MR”) systems. A VR system creates a simulated environment for a user to experience. This can be done by presenting computer-generated imagery to the user through a head-mounted display.

This imagery s a sensory experience which immerses the user in the ted environment. A VR scenario typically involves presentation of only er-generated imagery rather than also ing actual real-world imagery.

An AR system generally supplements a real-world environment with simulated elements. For example, an AR system may provide a user with a view of the surrounding orld environment via a head-mounted display. However, computergenerated imagery can also be presented on the display to enhance the real-world environment. This computer-generated imagery can include elements which are contextually-related to the real-world environment. Such elements can include simulated text, images, objects, etc. An MR system is a type of AR system which also uces simulated objects into a real-world nment, but these objects typically e a greater degree of interactivity. The simulated elements can often times be interactive in real time SUMMARY In one embodiment, a wearable component configured to be worn on a head of a user is disclosed. The wearable component can comprise a wearable support and an electronic component in thermal ication with the wearable support. A thermal management structure can be in thermal ication with the electronic ent, the thermal management structure configured to transfer heat from the electronic component away from a user side of the wearable component.

In another embodiment, a wearable ent ured to be worn on a head of a user is disclosed. The wearable component can comprise an internal mechanical structure and an outer shell structure mechanically coupled with the al mechanical structure such that the internal mechanical structure is between a user side of the le component and the outer shell structure. The internal mechanical structure can be configured to er heat away from the user side of the wearable component to the outer shell structure. A thermally conductive via can extend from the internal mechanical structure at least partially through a thickness of the outer shell structure.

In another embodiment, a method of cturing a wearable component configured to be worn on a head of a user is disclosed. The method can comprise providing an internal mechanical structure and a thermally conductive via extending from the internal mechanical structure at least lly through a ess of the outer shell structure. The method can comprise mechanically coupling a back surface of an outer shell ure to the internal mechanical ure such that the internal mechanical structure is between a user side of the wearable component and the outer shell structure. The internal mechanical structure can be configured to transfer heat away from the user side of the wearable component to the outer shell structure.

] In one broad form, the present invention seeks to provide a wearable component configured to be worn on a head of a user, the wearable component including a user surface configured to face the head of the user when worn by the user and an outside surface opposite the user surface and spaced from the user surface along a first direction nonparallel to the user surface, the outside surface configured to face away from the head of the user when worn by the user, the wearable component comprising: a wearable support having a thickness along the first direction; an electronic component in thermal ication with the wearable support; and a thermal ment ure in thermal communication with the onic component, the thermal management structure comprising a thermally conductive structure extending through at least a portion of the thickness of the wearable support and configured to transfer heat along the first direction from the electronic component away from the user surface of the wearable component s the outside surface of the wearable component, wherein the thermally conductive structure comprises a thermally conductive planar member in thermal communication with the electronic component and a thermally conductive via d to or formed with the planar member, the thermally conductive via extending non-parallel from the planar member such that the planar member is disposed between the thermally conductive via and the electronic component, the thermal management structure comprising a plurality of layers disposed about the thermally conductive via. [0007B] In one embodiment, the thermal management structure comprises a ical structure disposed in or on the wearable support and in thermal communication with the electronic component.

] In one ment, the system comprises one or more grooves formed h at least a portion of a thickness of the mechanical structure, the one or more grooves configured to control deflection of the mechanical ure. [0007D] In one embodiment, wherein the thermal management structure ses an outer shell coupled with the mechanical structure such that the mechanical structure is between the user side of the wearable component and the outer shell structure, and wherein the mechanical structure is configured to transfer heat from the electronic component to the outer shell, the outer shell comprising the plurality of layers. [0007E] In one embodiment, the thermally conductive via s at least partially through a thickness of the outer shell. [0007F] In one embodiment, the thermally conductive planar member is coupled to a back surface of the outer shell. [0007G] In one embodiment, the outer shell comprises a laminate structure.

] In one embodiment, the laminate structure comprises a plurality of alternating first and second layers, the first layer having a higher thermal conductivity than the second layer. [0007I] In one embodiment, the first layer comprises a reinforcement material. [0007J] In one embodiment, the reinforcement material comprises a fiber or fabric. [0007K] In one embodiment, the first layer comprises carbon fiber.

] In one embodiment, the second layer comprises an epoxy. [0007M] In one embodiment, the system comprises one or more thermally conductive components within the epoxy. [0007N] In one embodiment, the one or more lly conductive components comprises at least one of carbon nanotubes, graphene, or a metal. [0007O] In one embodiment, the electronic component comprises at least one of a processor and a camera.

] In one embodiment, the wearable component comprises an augmented y device. [0007Q] In one embodiment, the system comprises one or more electrical components embedded in the thermal management system. [0007R] In one embodiment, the thermal management system does not e any fans.

] In one ment, the thermal management system does not include any air vents. [0007T] In another broad form, the present invention seeks to provide a wearable component configured to be worn on a head of a user, the le component including a user surface configured to face the head of the user when worn by the user and an outside e te the user surface and spaced from the user surface along a first direction nonparallel to the user surface, the outside surface configured to face away from the head of the user when worn by the user, the wearable component comprising: a wearable support having a thickness along the first direction; an electronic component in thermal communication with the wearable support; a thermally conductive planar member in thermal communication with the electronic component; an array of le conductive vias in thermal communication with the electronic component and configured to transfer heat from the electronic component away along the first direction from the user surface of the wearable component through at least a portion of the thickness, the multiple conductive vias coupled to or formed with the planar member, the multiple tive vias extending non-parallel from the planar member such that the planar member is disposed between the multiple conductive vias and the electronic component; and a plurality of layers disposed about the multiple conductive vias. [0007U] In one embodiment, the system comprises a mechanical structure disposed in or on the le support and in thermal communication with the electronic component and an outer shell coupled with the ical structure such that the mechanical ure is between the user e of the wearable ent and the outer shell structure, and wherein the mechanical structure is configured to er heat from the electronic component to the outer shell, the array of multiple conductive vias extending at least partially through a thickness of the outer shell, the outer shell comprising the plurality of layers. [0007V] In another broad form, the present ion seeks to provide a wearable component ured to be worn on a head of a user, the wearable component including a user surface configured to face the head of the user when worn by the user and an outside surface opposite the user surface and spaced from the user surface along a first direction nonparallel to the user surface, the outside surface configured to face away from the head of the user when worn by the user, the wearable component comprising: a wearable support having a thickness along the first direction; an electronic component in thermal communication with the wearable support; and a l management structure in thermal communication with the onic component, the thermal management structure comprising a thermally conductive structure extending through at least a portion of the thickness of the wearable support and configured to transfer heat along the first direction from the electronic component away from the user surface of the wearable component towards the outside surface of the wearable component, wherein the thermally conductive structure comprises a thermally conductive planar member in l ication with the electronic ent and a thermally conductive via coupled to or formed with the planar member, the thermally conductive via extending generally perpendicular from the planar member such that the planar member is disposed between the lly conductive via and the electronic component. [0007W] In one ment, the system comprises a plurality of alternating first and second layers disposed about the thermally tive via, the first layer having a higher thermal conductivity than the second layer.

Details of one or more embodiments of the subject matter described in this specification are set forth in the anying drawings and in the description below. Other features, aspects, and advantages will become apparent from the description, the drawings, and the claims.

BRIEF DESCRIPTION OF THE DRAWINGS depicts an illustration of an augmented reality scenario with certain l reality objects, and certain physical objects viewed by a person.

FIGS. 2A-2D schematically illustrate examples of a wearable . schematically illustrates coordination between cloud computing assets and local processing assets. schematically illustrates examples of components of an embodiment of an AR system. is a schematic perspective view of a wearable component according to various embodiments. is a schematic perspective view of a wearable ent according to various embodiments. is a schematic side sectional view of a composite laminate ure that transfers heat asymmetrically relative to a heat source. is a schematic side sectional view of a thermal ment structure, according to various embodiments. is a schematic view of a wearable ent comprising the thermal management structure of .

Throughout the drawings, reference numbers may be re-used to indicate correspondence between referenced elements. The gs are provided to illustrate example embodiments described herein and are not intended to limit the scope of the disclosure.

DETAILED DESCRIPTION Overview of AR, VR and Localization s In an augmented reality scene (4) is depicted where a user of an AR technology sees a real-world park-like setting (6) featuring people, trees, buildings in the background, and a concrete platform (1120). In addition to these items, the user of the AR technology also perceives that he “sees” a robot statue (1110) ng upon the real-world platform (1120), and a cartoon-like avatar character (2) flying by which seems to be a personification of a bumble bee, even though these elements (2, 1110) do not exist in the real world. The human visual perception system is very complex, and ing a VR or AR technology that facilitates a comfortable, natural-feeling, rich presentation of virtual image elements amongst other virtual or orld y elements is challenging. orn VR or AR displays (or helmet-mounted ys, or smart glasses) typically are at least loosely coupled to a user’s head, and thus move when the user’s head moves. If the user’s head motions are detected by the y system, the data being displayed can be updated to take the change in head pose into account. As an example, if a user wearing a head-worn display views a virtual representation of a three-dimensional (3D) object on the display and walks around the area where the 3D object appears, that 3D object can be re-rendered for each viewpoint, giving the user the perception that he or she is walking around an object that occupies real space. If the head-worn display is used to present multiple objects within a virtual space (for instance, a rich virtual world), measurements of head pose (e.g., the location and ation of the user’s head) can be used to re-render the scene to match the user’s dynamically changing head location and orientation and provide an increased sense of immersion in the virtual space.

In AR systems, detection or calculation of head pose can permit the display system to render virtual s such that they appear to occupy a space in the real world in a manner that makes sense to the user. In addition, detection of the position and/or orientation of a real object, such as handheld device (which also may be referred to as a “totem”), haptic device, or other real physical object, in relation to the user’s head or AR system may also facilitate the display system in presenting display information to the user to enable the user to interact with certain s of the AR system efficiently. As the user’s head moves around in the real world, the virtual objects may be re-rendered as a function of head pose, such that the virtual objects appear to remain stable relative to the real world. At least for AR applications, placement of virtual objects in spatial relation to physical s (e.g., presented to appear spatially ate a physical object in two- or three-dimensions) may be a non-trivial problem. For example, head movement may icantly complicate placement of virtual objects in a view of an ambient environment. Such is true whether the view is captured as an image of the ambient environment and then projected or displayed to the end user, or whether the end user perceives the view of the ambient environment directly.

For instance, head movement will likely cause a field of view of the end user to change, which will likely require an update to where various virtual s are displayed in the field of the view of the end user. Additionally, head movements may occur within a large variety of ranges and speeds. Head movement speed may vary not only between different head movements, but within or across the range of a single head movement. For instance, head movement speed may initially increase (e.g., linearly or not) from a starting point, and may decrease as an ending point is reached, obtaining a maximum speed somewhere between the starting and ending points of the head movement. Rapid head nts may even exceed the ability of the particular display or projection technology to render images that appear uniform and/or as smooth motion to the end user.

Head ng accuracy and latency (e.g., the d time between when the user moves his or her head and the time when the image gets updated and displayed to the user) have been challenges for VR and AR systems. Especially for display systems that fill a substantial portion of the user’s visual field with l elements, it is advantageous if the cy of head-tracking is high and that the overall system latency is very low from the first detection of head motion to the updating of the light that is delivered by the display to the user’s eyes. If the latency is high, the system can create a mismatch between the user’s vestibular and visual sensory systems, and generate a user perception scenario that can lead to motion sickness or simulator sickness. If the system latency is high, the nt location of l objects will appear unstable during rapid head motions.

In on to head-worn display systems, other display systems can benefit from te and low y head pose detection. These include head-tracked display systems in which the display is not worn on the user’s body, but is, e.g., d on a wall or other surface. The head-tracked display acts like a window onto a scene, and as a user moves his head relative to the “window” the scene is re-rendered to match the user’s changing viewpoint. Other systems include a head-worn projection system, in which a headworn display projects light onto the real world.

Additionally, in order to provide a realistic augmented reality experience, AR systems may be designed to be ctive with the user. For example, multiple users may play a ball game with a virtual ball and/or other virtual objects. One user may “catch” the virtual ball, and throw the ball back to another user. In another embodiment, a first user may be provided with a totem (e.g., a bat-like object communicatively coupled to the AR system) to hit the l ball. In other ments, a virtual user interface may be presented to the AR user to allow the user to select one of many options. The user may use totems, haptic devices, wearable components, or simply touch the virtual screen to interact with the system.

Detecting head pose and orientation of the user, and detecting a physical on of real objects in space enable the AR system to display virtual content in an effective and enjoyable manner. However, although these capabilities are advantageous to an AR , they may be difficult to achieve. In other words, the AR system can recognize a physical location of a real object (e.g., user’s head, totem, haptic device, wearable component, user’s hand, etc.) and correlate the physical coordinates of the real object to virtual coordinates corresponding to one or more virtual objects being displayed to the user.

This generally requires highly accurate sensors and sensor recognition systems that track a on and orientation of one or more objects at rapid rates. Current approaches may not perform localization at satisfactory speed or ion standards. Thus, there is a need for a better localization system in the context of AR and VR devices. e AR and VR Systems and Components With reference to FIGS. 2A-2D, some general componentry options are rated. In the portions of the detailed description which follow the discussion of FIGS. 2A-2D, various systems, subsystems, and components are presented for addressing the ives of providing a high-quality, comfortably-perceived display system for human VR and/or AR.

As shown in , an AR system user (60) is depicted wearing head mounted component (58) featuring a frame (64) structure coupled to a y system (62) oned in front of the eyes of the user. A speaker (66) is coupled to the frame (64) in the ed configuration and positioned adjacent the ear canal of the user (in one embodiment, another speaker, not shown, is oned adjacent the other ear canal of the user to provide for stereo / shapeable sound control). The display (62) is ively coupled (68), such as by a wired lead or wireless connectivity, to a local processing and data module (70) which may be mounted in a variety of configurations, such as fixedly ed to the frame (64), fixedly attached to a helmet or hat (80) as shown in the embodiment of , embedded in headphones, removably ed to the torso (82) of the user (60) in a backpack-style configuration as shown in the embodiment of , or removably attached to the hip (84) of the user (60) in a belt-coupling style configuration as shown in the embodiment of FIG.

The local processing and data module (70) may comprise a power-efficient processor or controller, as well as digital memory, such as flash memory, both of which may be utilized to assist in the sing, caching, and storage of data a) captured from sensors which may be operatively coupled to the frame (64), such as image capture devices (such as cameras), microphones, inertial measurement units, accelerometers, compasses, GPS units, radio devices, and/or gyros; and/or b) acquired and/or processed using the remote processing module (72) and/or remote data repository (74), possibly for e to the display (62) after such processing or val. The local processing and data module (70) may be operatively coupled (76, 78), such as via a wired or wireless communication links, to the remote processing module (72) and remote data repository (74) such that these remote modules (72, 74) are operatively coupled to each other and available as resources to the local processing and data module (70).

In one embodiment, the remote processing module (72) may comprise one or more relatively powerful processors or controllers configured to analyze and process data and/or image information. In one embodiment, the remote data repository (74) may comprise a relatively large-scale l data storage facility, which may be available through the internet or other networking configuration in a “cloud” resource configuration. In one embodiment, all data is stored and all computation is performed in the local processing and data , allowing fully autonomous use from any remote modules.

With reference now to a schematic illustrates coordination between the cloud computing assets (46) and local processing assets, which may, for e reside in head mounted componentry (58) coupled to the user’s head (120) and a local processing and data module (70), coupled to the user’s belt (308; therefore the component 70 may also be termed a “belt pack” 70), as shown in In one embodiment, the cloud (46) assets, such as one or more server systems (110) are operatively coupled (115), such as via wired or wireless networking (wireless being preferred for mobility, wired being preferred for certain high-bandwidth or ata-volume transfers that may be desired), directly to (40, 42) one or both of the local ing assets, such as processor and memory configurations, coupled to the user’s head (120) and belt (308) as described above. These computing assets local to the user may be operatively coupled to each other as well, via wired and/or wireless connectivity configurations (44), such as the wired coupling (68) discussed below in reference to In one embodiment, to maintain a low-inertia and small-size subsystem mounted to the user’s head (120), primary transfer between the user and the cloud (46) may be via the link between the tem mounted at the belt (308) and the cloud, with the head mounted (120) subsystem primarily data-tethered to the belt-based (308) tem using wireless connectivity, such as ultra-wideband ) connectivity, as is currently employed, for example, in personal computing peripheral connectivity ations.

With efficient local and remote processing coordination, and an appropriate display device for a user, such as the user interface or user display system (62) shown in , or variations thereof, aspects of one world pertinent to a user’s current actual or virtual location may be erred or “passed” to the user and d in an efficient fashion. In other words, a map of the world may be continually updated at a e location which may partially reside on the user’s AR system and lly reside in the cloud resources. The map (also referred to as a “passable world model”) may be a large database comprising raster imagery, 3-D and 2-D points, parametric information and other information about the real world. As more and more AR users continually capture information about their real environment (e.g., through cameras, sensors, IMUs, etc.), the map becomes more and more accurate and complete.

With a configuration as described above, wherein there is one world model that can reside on cloud computing resources and be distributed from there, such world can be “passable” to one or more users in a relatively low bandwidth form preferable to trying to pass around real-time video data or the like. The augmented experience of the person standing near the statue (e.g., as shown in may be ed by the cloud-based world model, a subset of which may be passed down to them and their local display device to complete the view. A person g at a remote display device, which may be as simple as a personal computer g on a desk, can efficiently download that same section of information from the cloud and have it rendered on their display. Indeed, one person actually present in the park near the statue may take a remotely-located friend for a walk in that park, with the friend joining through virtual and augmented reality. The system will need to know where the street is, wherein the trees are, where the statue is – but with that information on the cloud, the joining friend can download from the cloud aspects of the io, and then start walking along as an augmented y local relative to the person who is actually in the park.

Three-dimensional (3-D) points may be captured from the environment, and the pose (e.g., vector and/or origin position information relative to the world) of the s that capture those images or points may be determined, so that these points or images may be “tagged”, or ated, with this pose information. Then points captured by a second camera may be utilized to determine the pose of the second camera. In other words, one can orient and/or localize a second camera based upon comparisons with tagged images from a first camera. Then this knowledge may be utilized to extract textures, make maps, and create a virtual copy of the real world (because then there are two s around that are registered).

So at the base level, in one embodiment a person-worn system can be utilized to capture both 3-D points and the 2-D images that produced the points, and these points and images may be sent out to a cloud storage and processing resource. They may also be cached locally with embedded pose information (e.g., cache the tagged images); so the cloud may have on the ready (e.g., in available cache) tagged 2-D images (e.g., tagged with a 3-D pose), along with 3-D points. If a user is observing something dynamic, he may also send additional information up to the cloud pertinent to the motion (for example, if looking at another person’s face, the user can take a texture map of the face and push that up at an optimized ncy even though the surrounding world is otherwise basically static). More information on object recognizers and the passable world model may be found in U.S. Patent Pub. No. 2014/0306866, entitled “System and method for augmented and virtual reality”, which is incorporated by reference in its entirety herein, along with the following additional disclosures, which related to augmented and virtual reality s such as those developed by Magic Leap, Inc. of Plantation, Florida: U.S. Patent Pub. No. 2015/0178939; U.S. Patent Pub. No. 2015/0205126; U.S. Patent Pub. No. 2014/0267420; U.S. Patent Pub. No. 2015/0302652; U.S. Patent Pub. No. 2013/0117377; and U.S. Patent Pub. No. 2013/0128230, each of which is hereby incorporated by reference herein in its entirety.

GPS and other localization information may be utilized as inputs to such sing. Highly accurate localization of the user’s head, totems, hand gestures, haptic devices etc. may be advantageous in order to display appropriate virtual content to the user.

The ounted device (58) may e displays positionable in front of the eyes of the wearer of the device. The displays may comprise light field displays. The displays may be ured to present images to the wearer at a plurality of depth planes.

The displays may comprise planar waveguides with diffraction elements. Examples of displays, ounted devices, and other AR components usable with any of the embodiments disclosed herein are described in U.S. Patent ation No. 2015/0016777.

U.S. Patent Publication No. 2015/0016777 is hereby incorporated by nce herein in its entirety.

With reference to a system uration is illustrated which features many sensing ents. A head mounted wearable component (58) is shown operatively coupled (68) to a local processing and data module (70), such as a belt pack, here using a physical multicore lead which also features a l and quick release module (86).

The local processing and data module (70) is operatively coupled (100) to a hand held component (606), here by a wireless connection such as low power Bluetooth; the hand held component (606) may also be operatively coupled (94) directly to the head mounted wearable component (58), such as by a ss connection such as low power Bluetooth. Generally where IMU data is passed to coordinate pose detection of various components, a highfrequency connection is desirable, such as in the range of hundreds or thousands of /second or higher; tens of cycles per second may be adequate for electromagnetic localization sensing, such as by the sensor (604) and transmitter (602) gs. Also shown is a global coordinate system (10), representative of fixed objects in the real world around the user, such as a wall (8).

Cloud resources (46) also may be operatively coupled (42, 40, 88, 90) to the local processing and data module (70), to the head mounted wearable component (58), to resources which may be coupled to the wall (8) or other item fixed relative to the global coordinate system (10), respectively. The resources coupled to the wall (8) or having known positions and/or orientations relative to the global coordinate system (10) may include a wireless transceiver (114), an electromagnetic emitter (602) and/or receiver (604), a beacon or reflector (112) configured to emit or reflect a given type of radiation, such as an infrared LED beacon, a cellular k transceiver (110), a RADAR emitter or detector (108), a LIDAR emitter or detector (106), a GPS eiver (118), a poster or marker having a known detectable pattern (122), and a camera (124).

The head mounted wearable component (58) features similar components, as illustrated, in addition to ng rs (130) configured to assist the camera (124) detectors, such as infrared emitters (130) for an ed camera (124); also featured on the head mounted wearable ent (58) are one or more strain gauges (116), which may be fixedly coupled to the frame or mechanical rm of the head mounted wearable component (58) and configured to determine deflection of such platform in between components such as electromagnetic receiver sensors (604) or display elements (62), n it may be valuable to understand if bending of the platform has occurred, such as at a thinned portion of the platform, such as the portion above the nose on the eyeglasses-like platform depicted in The head mounted wearable component (58) also features a processor (128) and one or more IMUs (102). Each of the components preferably are operatively coupled to the processor (128). The hand held component (606) and local processing and data module (70) are illustrated featuring similar components. As shown in with so many sensing and connectivity means, such a system is likely to be heavy, power hungry, large, and relatively expensive. However, for illustrative purposes, such a system may be utilized to provide a very high level of connectivity, system component integration, and position/orientation tracking. For example, with such a configuration, the s main mobile components (58, 70, 606) may be zed in terms of position relative to the global coordinate system using WiFi, GPS, or Cellular signal triangulation; beacons, electromagnetic tracking (as described herein), RADAR, and LIDAR systems may provide yet further location and/or orientation information and feedback. Markers and cameras also may be utilized to provide r information regarding relative and absolute on and orientation. For example, the various camera components (124), such as those shown d to the head mounted wearable component (58), may be utilized to capture data which may be utilized in simultaneous localization and mapping protocols, or “SLAM”, to ine where the component (58) is and how it is oriented relative to other components.

Other features and embodiments of the head mounted wearable ent (58) and its s are described in U.S. Patent Application No. 15/683,664, filed August 22, 2017, and entitled “AUGMENTED Y DISPLAY DEVICE WITH DEEP LEARNING S,” the entire contents of which are hereby orated by reference herein.

As discussed , the head mounted wearable AR/VR system (58) can include a variety of sensors for determining the location and/or orientation of the system within a three-dimensional space. For example, ic s and optical sensors can be used for this purpose. Suitable magnetic sensors may include magnetometers, such as the electromagnetic sensors (604) discussed above which can be used to help determine the location and/or orientation of the AR/VR system (58) based on detection of magnetic fields from an emitter (602). Another suitable magnetic sensor is a built-in magnetometer within the IMU (102) which can help determine the location and/or orientation of the AR/VR system (58) based on detection of the Earth's magnetic field. Meanwhile, suitable optical sensors can include, for example, outward-facing visible light or infrared cameras which can se be used to help determine the location and/or orientation of both the AR/VR system (58) and other objects.

Examples of Thermal ment Systems Various embodiments disclosed herein relate to thermal management systems for wearable components, including, e.g.¸ for wearable, head-mounted AR systems and devices. Referring to Figures 5A-6C, one of the challenges with a head mounted wearable component (58) that comprises various electronic components, such as an embedded processor, is conducting heat out of the component (58) and associated ponents, and away from the user’s head. As shown in Figures 5A-5B, for example, the wearable component (58) can comprise a wearable support 373 comprising one or more support structures configured to provide ical support for the system subcomponents (e.g.¸ subcomponents such as those shown in Figure 4 configured to provide AR, VR, and other functionality), the wearable component 58 being configured to conduct thermal energy or heat away from the user’s head. For example, as explained herein, the wearable component (58) can comprise one or more electronic components coupled to or disposed within the wearable support (373), including the electronic components shown and described in connection with Figure 4. Such electronic ents may generate heat, and it can be desirable to conduct the generated heat away from the user’s head.

It is also desirable to have a head d wearable ent (58) which generally is low in mass for comfort and other ergonomic and operational advantages (for e, low a and moment of inertia to easily stay with the head of the user during head movement). In one embodiment, various components of the head mounted wearable component (58) may comprise composite materials, such as a reinforcement al, e.g., carbon fiber strands and/or fabric combined with one or more matrix materials such as epoxy. Such a construct may be engineered to have specific ural moduli over various portions of the head d wearable component (58), and may be relatively low in mass.

Referring to Figure 5A, in one embodiment, the wearable support (373) can comprise a mechanical inner structure (370) that serves in ng deflection in select areas, and to provide a l pathway for transferring heat away from the user’s head. The wearable support (373) can also include an outer shell component (372) that may se a plurality of layers of composite material, such as that comprising fabric bound to epoxy or resin.

Referring to Figure 5B, one or more mechanical inner structures (376) may be provided to serve as tion limiters in select areas where relative stiffness is desired; as with the mechanical inner structure (370) shown in Figure 5A, the mechanical inner structure (376) of Figure 5B may also provide a thermal pathway for transferring heat away from the user’s head. As shown in Figure 5B, strategic cuts or gaps (374) (e.g., grooves) may be formed in various layers of the wearable support (373) to serve in limiting deflection to certain areas or zones (such as in the case of what is known as a “living hinge” configuration across a n of the construct), and to provide mechanical means for transferring heat away. In Figure 5B, for example, the cuts or gaps (374) may be formed lly through a thickness of the wearable support (373), e.g., partially through a thickness of the inner structure of the support (373). In various embodiments, the cuts or gaps (374) can increase the amount of deflection in the proximity of the gaps (374) so as to focus deflection to the region at or near the gaps (374), thereby limiting deflection in regions of the support (373) away from the gaps (374).

In various embodiments, the gaps (374) can enable the t (373) to bend ly so as to fold the support (373) when not in use.

One of the challenges with certain composite materials is that while some of the constituent materials, typically the reinforcement materials such as fibers or fabric, may have relatively high thermal conductivity properties, matrix materials such as epoxy typically have low l conductivity properties, making an overall composite have a somewhat low thermal conductivity. The thermal conductivity for the composite material may be anisotropic such that thermal conductivity in a plane parallel to the plane of rcement fibers may be r than thermal conductivity in a direction normal to the plane of reinforcement fibers. ing to Figure 6A, with a conventional layered configuration of a composite member, layers of matrix (384) are combined with layers of fiber or fabric (386), and while the fiber or fabric (386) may have relatively high thermal conductivity, the matrix (384) typically has low thermal conductivity, thus preventing efficient escape or transfer of heat (380) due to the repeated and symmetric layering. A simplified heat profile map (382) across the composite construct from the source of heat (380) is shown in Figure 6A, with more heat being transferred closer to the source.

Accordingly, various embodiments disclosed herein include a thermal ment structure or system that can be in l communication with the various electronic component(s) of the wearable component (58). The thermal management structure can be configured to er heat from the electronic component(s) away from the head of the user, thus away from a user side (392) of the wearable support (373), when the wearable support (373) is disposed on the user’s head. Referring to Figures 6B and 6C, asymmetries of various types may be provided in ite constructs of an outer shell structure (372) (which may comprise a laminate structure) to more optimally transfer heat across the construct, and at specified geometric ons. In Figures 6A-6C, for example, the outer shell structure (372) can comprise a te ure with a plurality of alternating first and second layers, with the first layer (e.g., layer (386)) having a higher thermal conductivity than the second layer (e.g., matrix layer (384)). In some arrangements, such as those shown in Figures 6B-6C, adjacent layers (386) can be separated by one or a plurality (e.g., two) of layers (384). ing to Figure 6B, an internal mechanical structure (388) having a relatively high thermal conductivity is shown extending across a substantial portion of the composite construct (e.g., the outer shell structure (372)) parallel to the adjoining face of the composite construct. Additionally, a thermal ment structure, including “thermal via” (390), is shown positioned near the heat source (380) to specifically focus heat transfer from the source (380) across at least one layer of the composite structure at such location. This is illustrated by, for example, the sample heat profile plot (383) with larger arrows generally representing more heat transferred than smaller arrows. In some embodiments, the thermal management structure directs heat from heat source (380) away from a user side (392) of the support ure, e.g., away from a side of the wearable component (58) that is adjacent or that faces the user when worn on the head of the user. In some embodiments, the internal mechanical structure (388) can be thermally coupled to the heat source (380), e.g., portions of the structure (388), such as the member (389) described below, may contact portions of the source (380) (such as an electronic component) so as to thermally conduct heat away from the source (380). It should be appreciated that the internal mechanical structure (388) shown in Figures 6B-6C may also include the mechanical structures shown in Figures 5A-5B, including, e.g., the gaps or grooves (374), etc.

As shown in Figure 6B, for example, the internal mechanical structure (388) can comprise a thermally conductive planar member (389) coupled (e.g.¸ adhered or otherwise mechanically connected) to a back surface (393) of the shell structure (372). The thermally conductive via (390) can extend from (e.g., can be coupled to or formed with) the thermally conductive planar member (389). As shown, the via (390) can be disposed allel (e.g., generally perpendicular to) the thermally conductive planar member (389).

Further, the thermally conductive via (390) can extend at least partially through a thickness of the outer shell structure (372). In the illustrated embodiment, for example, the via (390) extends partially through the thickness of the outer shell structure (372). In other embodiments, the via (390) may extend entirely through the thickness of the outer shell structure (372). In some embodiments, a ed thickness of the outer shell (372) and the inner mechanical structure (388) can be in a range of 2 mm to 5 mm, or in a range of 2 mm to 4 mm, or in a range of 2 mm to 3 mm. In some embodiments, a length of the via (390) can be less than the overall thickness of the outer shell (372) and mechanical structure (388). For e, in some embodiments, a length of the via (390) can be less than 5 mm, less than 4 mm, less than 3 mm, or less than 2 mm. In some embodiments, a length of the via (390) can be in a range of 0.5 mm to 5 mm, in a range of 0.5 mm to 3 mm, in a range of 0.5 mm to 2 mm, in a range of 0.5 mm to 1 mm, in a range of 0.25 mm to 2 mm, in a range of 0.25 mm to 1 mm, or in a range of 1 mm to 2 mm.

In some embodiments, as shown in Figures 6B-6C, one or a plurality of the relatively low thermal conductivity layers (384) can be ed between the outer or distal end of the via (390) and the outside surface of the le component (58) or the e surface of the shell (372), which may t hot spots on the outside surface of the component (58). When the wearable support (373) is worn on the head of the user, the internal ical structure (388) can be ed between the head of the user and the outer shell structure (372). The t (373) can beneficially be configured to transfer heat from the electronic component(s) away from the user’s head to the outer shell structure (372).

Figure 6C is an exploded view in which an inner mechanical structure (388) is illustrated as being separate from the outer shell structure (372) for ease of illustration. In s embodiments, the inner mechanical structure (388) and vias (390) can be coupled with the outer shell (372) in any suitable manner. For example, in some embodiments, the laminate structure of the shell (372) (e.g., the ating layers 384, 386) can be laminated, deposited, or molded about the vias (390) in some embodiments. In other embodiments, the vias (390) can be inserted or snapped into corresponding gs of the shell structure (372). Still other ways of ng the vias (390) and inner structure (388) to the shell structure (372) may be suitable. In s embodiments, as explained herein, the shell structure (372) can comprise the laminate structure shown in Figures 6B and 6C, e.g., the alternating layers (384, 386). The outer shell structure (372) can comprise other mechanical support and/or thermal management structures as well, including, e.g.¸ an outer mechanical cover or layer over the laminate structure.

Figure 6C illustrates an implementation of such a configuration with the internal mechanical structure (388) which may be exposed to relatively high heat (380), such as from an embedded processor, camera, or other exothermic electronic component. Such heat may be directed away from such ent using a thermal via (390) which may comprise a relatively high l conductivity material. Suitable materials for relatively high thermal conductivity fibers or fabrics (e.g., for the first layers (386)) include carbon fiber (thermal conductivity between about 21 and 180 W/mk, the units representing watts per meter kelvin); high modulus mesophase pitch carbon fiber, in the fiber direction (500 W/mk). Glass has a thermal conductivity of about 1 W/mk. Typical epoxy matrix materials (e.g., for the second layers (384)) have relatively low thermal conductivity, as noted above (between about 0.5 and 1.5 W/mk), although certain other ents may be added to the epoxy matrix (e.g., the second layers (384)) to increase the l conductivity. For example, in various embodiments carbon nanotube material (theoretical thermal conductivity of 3,500 W/mk) may be added; and/or Graphene (theoretical thermal tivity of 5,020 W/mk); and/or diamond (thermal conductivity of 2,500 W/mk); and/or metallic components, such as aluminum, copper, gold, or silver (210 W/mK, 398 W/mk, 315 W/mk, 428 W/mk, respectively), may be added to a matrix material (i.e., to be combined with a fiber or fabric in a composite configuration, and/or to be utilized as a thermal via structure) to improve its over thermal conductivity to assist in moving heat away from the device and away from the user’s head. As shown in Figure 6C, for example, the heat distribution (383) at the surface of the outer shell (372) transferred from the heat (380) can be more uniform than the distribution rated in Figure 6A. The transfer of heat (380) may also be better controlled.

For example, the heat (380) can be transferred over a smaller area (e.g., left and right of the via (390) in ) whereas the heat is transferred over a larger area in the absence of the via (390). The rate of heat transfer can also be faster in certain embodiments. For example, the via (390) can conduct heat quickly therethrough to each of three successive more conductive layers (386) where the heat can be received and dissipated away from the source of the heat (380). This can have the advantage of removing heat load from the onic components which can help keep the heat of the components down such that they can operate efficiently and last longer. Further, as shown in Figure 6C, an array of multiple vias (390) can be coupled with the structure (388) so as to further improve heat transfer away from the user.

In another embodiment, s or leads of electrically conductive material may be layered into an l composite structure to provide not only enhanced thermal conductivity, but also electrical conductivity, to on as a power, signal, or other lead that is built or integrated into such structure. The engineered composite structures disclosed herein may be hand-manufactured layer by layer, or may be robotically constructed. In one embodiment, a mold may be created, into which the various layers of fiber and/or fabric, and matrix material, may be placed for ation and curing. In one embodiment, a powder coating layer maybe placed first t the mold, and last against the other side of the mold, such that upon l of the cured component, both sides of such component are powder coated. Powder coating or other coating, sealing, or painting materials may be specifically selected for relatively high l tivity, to facilitate in the exiting of heat away from such componentry.

As described above in Figure 4, various components may be coupled to a head mounted wearable ent (58). In various embodiments, such components may be physically integrated within the layers of a composite such that they are ed within such components.

For example, in one embodiment, it may be desirable to have one or more copper loop magnetic flux capturing circuits embedded at specific positions adjacent an outer surface for omagnetic tracking. In another embodiment, it may be desirable to have one or more conductive leads functioning as a radiofrequency antenna, and it may be desirable for specific absorption rate ) s to position such antenna, r it is a transmitter or receiver, on the opposite side of such component relative to the user’s skin. In another embodiment, the fiber and/or fabric positioning may be specifically engineered to provide annular structural ement around locations of apertures to be created within a construct, such as for a camera lens or other .

In one embodiment, the various thermal components may be specifically ered to not only move heat away from certain components and away from the user, but also to eliminate certain conventional components such as air vents, fans, and the like. Thus, in various embodiments, the le component (58) may not include any fans and/or may not include any air vents. For example, structures can be provided where all or a majority of heat is transferred through a solid structure rather than through channels or apertures. An assembly can be provided where all or a majority of heat is transferred by conduction and no heat is erred through the structure by convection. An assembly can be provided where all or a majority of heat is transferred by conduction through the structure and by convection at external surfaces but no heat is transferred by heat advection.

Additional Aspects In a 1st aspect, a wearable component configured to be worn on a head of a user is disclosed. The wearable component can comprise a wearable support and an electronic component in thermal communication with the wearable support. A thermal management structure can be in thermal communication with the electronic component, the thermal management structure ured to transfer heat from the electronic component away from a user side of the le component.

In a 2nd aspect, the wearable component of aspect 1, wherein the thermal management structure comprises a mechanical structure disposed in or on the wearable support and in thermal communication with the electronic component.

In a 3rd aspect, the wearable component of aspect 2, further sing one or more grooves formed through at least a portion of a thickness of the mechanical structure, the one or more grooves configured to control deflection of the mechanical structure.

In a 4th aspect, the wearable component of any one of aspects 2 to 3, wherein the thermal management ure comprises an outer shell coupled with the mechanical ure such that the mechanical structure is between the user side of the wearable component and the outer shell structure, and n the mechanical structure is configured to transfer heat from the electronic ent to the outer shell.

In a 5th , the wearable component of aspect 4, further comprising a thermally conductive via extending from the mechanical structure at least partially through a thickness of the outer shell.

In a 6th aspect, the wearable component of aspect 5, wherein the mechanical structure comprises a thermally conductive planar member coupled to a back surface of the outer shell.

In a 7th aspect, the wearable component of aspect 6, wherein the thermally conductive via is d to or formed with the thermally conductive planar member, the thermally conductive via ed non-parallel relative to the thermally conductive planar member.

In a 8th aspect, the wearable component of any one of aspects 4 to 7, n the outer shell ses a laminate structure.

In a 9th aspect, the wearable component of aspect 8, wherein the laminate structure comprises a plurality of alternating first and second layers, the first layer having a higher thermal conductivity than the second layer.

In a 10th aspect, the wearable component of aspect 9, wherein the first layer ses a reinforcement material.

In a 11th , the wearable component of aspect 10, wherein the reinforcement material ses a fiber or fabric.

In a 12th aspect, the wearable component of aspect 11, wherein the first layer comprises carbon fiber.

In a 13th aspect, the wearable component of any one of aspects 9 to 12, wherein the second layer comprises an epoxy.

In a 14th aspect, the wearable component of aspect 13, r comprising one or more thermally conductive components within the epoxy.

In a 15th aspect, the wearable component of aspect 14, wherein the one or more thermally conductive components ses at least one of carbon nanotubes, graphene, or a metal.

In a 16th aspect, the wearable component of any one of aspects 1 to 15, wherein the electronic component comprises at least one of a processor and a camera.

In a 17th aspect, the wearable component of any one of s 1 to 16, wherein the wearable component comprises an augmented reality device.

In a 18th aspect, the le component of any one of aspects 1 to 17, further comprising one or more ical components embedded in the thermal ment system.

In a 19th aspect, the le component of any one of aspects 1 to 18, wherein the thermal management system does not include any fans.

In a 20th aspect, the le component of any one of aspects 1 to 19, n the thermal management system does not include any air vents.

In a 21st aspect, a wearable component configured to be worn on a head of a user is disclosed. The wearable component can comprise an internal mechanical structure and an outer shell structure mechanically coupled with the internal mechanical structure such that the internal mechanical structure is between a user side of the wearable component and the outer shell structure. The internal mechanical structure can be ured to transfer heat away from the user side of the wearable component to the outer shell structure. A thermally conductive via can extend from the internal mechanical structure at least partially through a thickness of the outer shell structure.

In a 22nd aspect, the wearable component of aspect 21, wherein the internal mechanical structure comprises a thermally tive planar member coupled to a back surface of the outer shell structure.

In a 23rd aspect, the wearable component of aspect 22, wherein the thermally tive via is d to or formed with the thermally conductive planar member, the thermally conductive via disposed non-parallel relative to the lly conductive planar member.

In a 24th aspect, the wearable component of any one of aspects 21 to 23, wherein the outer shell structure comprises a te ure, the thermally conductive via extending through a ity of layers of the laminate structure.

In a 25th aspect, the wearable component of aspect 24, wherein the laminate structure comprises a plurality of alternating first and second layers, the first layer having a higher thermal conductivity than the second layer.

In a 26th aspect, the wearable component of any one of aspects 21 to 25, r comprising an electronic component coupled with the wearable component, wherein the internal mechanical structure is configured to er heat from the electronic component to the outer shell structure.

In a 27th aspect, the wearable component of any one of aspects 25 to 26, wherein heat is conducted through the thermally conductive via and through the plurality of alternating first and second layers to conduct heat away from the head of the user when the wearable component is worn on the head of the user.

In a 28th aspect, a method of manufacturing a wearable component configured to be worn on a head of a user is disclosed. The method can comprise providing an internal mechanical structure and a thermally conductive via extending from the internal mechanical structure at least partially through a thickness of the outer shell structure. The method can comprise mechanically coupling a back surface of an outer shell structure to the internal mechanical ure such that the internal mechanical ure is between a user side of the wearable ent and the outer shell structure. The internal mechanical structure can be configured to transfer heat away from the user side of the wearable component to the outer shell structure.

In a 29th aspect, the method of aspect 28, further comprising providing an electronic component to be in thermal communication with the internal mechanical structure.

In a 30th , the method of aspect 28 or 29, further comprising forming one or more grooves through at least a portion of a thickness of the internal mechanical structure, the one or more grooves configured to control deflection of the internal mechanical structure.

Additional Considerations Each of the processes, methods, and algorithms described herein and/or depicted in the attached s may be embodied in, and fully or partially automated by, code modules executed by one or more physical computing systems, hardware computer sors, application-specific circuitry, and/or electronic hardware configured to execute specific and particular computer ctions. For example, computing systems can include general purpose computers (e.g., servers) programmed with ic computer instructions or special purpose computers, special purpose circuitry, and so forth. A code module may be compiled and linked into an executable program, installed in a dynamic link library, or may be written in an reted mming language. In some implementations, particular ions and methods may be performed by circuitry that is specific to a given function.

Further, certain implementations of the onality of the present disclosure are sufficiently mathematically, computationally, or technically complex that application-specific hardware or one or more physical computing devices (utilizing appropriate specialized executable instructions) may be necessary to perform the functionality, for example, due to the volume or complexity of the calculations involved or to provide s substantially in real-time. For example, a video may include many frames, with each frame having millions of pixels, and specifically programmed computer hardware is necessary to process the video data to provide a desired image processing task or ation in a commercially reasonable amount of time.

Code modules or any type of data may be stored on any type of nontransitory computer-readable , such as physical computer storage ing hard drives, solid state memory, random access memory (RAM), read only memory (ROM), optical disc, volatile or non-volatile storage, combinations of the same and/or the like. The methods and modules (or data) may also be transmitted as generated data signals (e.g., as part of a carrier wave or other analog or digital propagated signal) on a variety of computerreadable transmission mediums, including wireless-based and wired/cable-based mediums, and may take a variety of forms (e.g., as part of a single or multiplexed analog signal, or as multiple discrete digital packets or frames). The results of the disclosed processes or process steps may be stored, persistently or otherwise, in any type of non-transitory, tangible computer storage or may be icated via a computer-readable transmission .

Any processes, blocks, states, steps, or functionalities in flow diagrams described herein and/or depicted in the attached figures should be understood as potentially representing code modules, ts, or portions of code which include one or more executable ctions for implementing specific functions (e.g., logical or arithmetical) or steps in the process. The various processes, blocks, states, steps, or functionalities can be combined, rearranged, added to, deleted from, modified, or otherwise changed from the illustrative examples provided herein. In some embodiments, additional or different computing systems or code modules may perform some or all of the onalities described herein. The methods and processes described herein are also not d to any particular ce, and the blocks, steps, or states ng thereto can be performed in other sequences that are appropriate, for example, in serial, in parallel, or in some other manner. Tasks or events may be added to or removed from the disclosed example embodiments. Moreover, the separation of various system components in the implementations described herein is for illustrative purposes and should not be tood as requiring such separation in all implementations. It should be understood that the described m components, methods, and systems can generally be integrated together in a single er product or packaged into multiple computer products. Many implementation ions are possible.

The processes, methods, and systems may be implemented in a network (or distributed) computing environment. k environments include enterprise-wide computer networks, intranets, local area networks (LAN), wide area networks (WAN), al area networks (PAN), cloud ing networks, crowd-sourced computing networks, the Internet, and the World Wide Web. The network may be a wired or a wireless network or any other type of communication network.

The invention includes methods that may be performed using the subject devices. The methods may comprise the act of providing such a suitable device. Such provision may be med by the end user. In other words, the ding" act merely es the end user obtain, access, approach, position, set-up, activate, power-up or otherwise act to provide the requisite device in the subject method. Methods recited herein may be carried out in any order of the recited events which is logically possible, as well as in the d order of events.

The systems and methods of the disclosure each have several innovative aspects, no single one of which is solely responsible or required for the desirable utes disclosed herein. The various features and processes described above may be used independently of one another, or may be ed in s ways. All possible combinations and subcombinations are ed to fall within the scope of this disclosure.

Various modifications to the implementations described in this disclosure may be readily apparent to those skilled in the art, and the c principles defined herein may be applied to other implementations t departing from the spirit or scope of this disclosure. Thus, the claims are not intended to be limited to the implementations shown herein, but are to be accorded the widest scope consistent with this disclosure, the principles and the novel es disclosed herein.

Certain features that are described in this specification in the context of separate implementations also can be implemented in combination in a single implementation. Conversely, s features that are described in the context of a single implementation also can be implemented in multiple implementations separately or in any suitable subcombination. Moreover, although features may be described above as acting in certain combinations and even initially claimed as such, one or more features from a claimed combination can in some cases be excised from the combination, and the claimed combination may be directed to a subcombination or variation of a subcombination. No single feature or group of features is necessary or indispensable to each and every embodiment.

Conditional language used herein, such as, among others, “can,” “could,” “might,” “may,” “e.g.,” and the like, unless specifically stated otherwise, or otherwise understood within the context as used, is lly intended to convey that certain embodiments include, while other embodiments do not include, certain features, ts and/or steps. Thus, such conditional language is not lly intended to imply that features, elements and/or steps are in any way required for one or more embodiments or that one or more embodiments necessarily include logic for deciding, with or without author input or prompting, whether these features, elements and/or steps are included or are to be performed in any particular embodiment. The terms “comprising,” “including,” “having,” and the like are synonymous and are used inclusively, in an open-ended fashion, and do not exclude additional elements, features, acts, operations, and so forth. Also, the term “or” is used in its inclusive sense (and not in its exclusive sense) so that when used, for example, to connect a list of ts, the term “or” means one, some, or all of the elements in the list. In addition, the articles “a,” “an,” and “the” as used in this application and the appended claims are to be construed to mean “one or more” or “at least one” unless specified otherwise.

Except as specifically defined herein, all technical and scientific terms used herein are to be given as broad a commonly understood meaning as possible while maintaining claim ty.

It is further noted that the claims may be drafted to exclude any optional element.

As used herein, a phrase referring to “at least one of” a list of items refers to any ation of those items, including single members. As an example, “at least one of: A, B, or C” is intended to cover: A, B, C, A and B, A and C, B and C, and A, B, and C. ctive language such as the phrase “at least one of X, Y and Z,” unless specifically stated otherwise, is otherwise understood with the context as used in general to convey that an item, term, etc. may be at least one of X, Y or Z. Thus, such conjunctive language is not generally intended to imply that certain embodiments require at least one of X, at least one of Y and at least one of Z to each be present.

Similarly, while operations may be ed in the drawings in a particular order, it is to be ized that such operations need not be performed in the ular order shown or in sequential order, or that all illustrated ions be performed, to achieve desirable results. Further, the drawings may schematically depict one more example ses in the form of a flowchart. However, other operations that are not depicted can be incorporated in the example methods and processes that are schematically illustrated. For example, one or more additional operations can be performed before, after, simultaneously, or between any of the illustrated operations. Additionally, the operations may be rearranged or reordered in other implementations. In certain circumstances, multitasking and parallel processing may be advantageous. Moreover, the separation of s system components in the implementations described above should not be understood as requiring such separation in all implementations, and it should be understood that the described program components and systems can generally be integrated together in a single software product or packaged into multiple software products. Additionally, other entations are within the scope of the following claims. In some cases, the actions recited in the claims can be performed in a different order and still e ble results.

The reference in this ication to any prior publication (or ation derived from it), or to any matter which is known, is not, and should not be taken as an acknowledgement or admission or any form of suggestion that the prior publication (or information derived from it) or known matter forms part of the common general knowledge in the field of our to which this specification relates.

Claims (23)

WHAT IS CLAIMED IS:

1. A wearable component configured to be worn on a head of a user, the wearable component including a user e configured to face the head of the user when worn by the user and an outside surface opposite the user surface and spaced from the user surface along a first direction non-parallel to the user surface, the outside surface configured to face away from the head of the user when worn by the user, the wearable component comprising: a wearable support having a thickness along the first direction; an electronic component in thermal communication with the le support; a thermal management structure in thermal communication with the electronic component, the thermal management ure comprising a thermally conductive structure extending h at least a portion of the thickness of the wearable support and configured to transfer heat along the first direction from the electronic component away from the user surface of the wearable component towards the outside surface of the wearable component, wherein the lly conductive structure comprises a lly conductive planar member in thermal communication with the electronic component and a thermally conductive via coupled to or formed with the planar member, the thermally tive via ing non-parallel from the planar member such that the planar member is disposed between the thermally conductive via and the onic component, the thermal management structure comprising a plurality of layers disposed about the thermally conductive via.

2. The wearable component of Claim 1, wherein the thermal management structure comprises a ical structure ed in or on the wearable support and in thermal communication with the electronic component.

3. The wearable component of Claim 2, further comprising one or more grooves formed through at least a portion of a thickness of the ical structure, the one or more grooves configured to control deflection of the mechanical structure.

4. The wearable component of Claim 2 or Claim 3, wherein the thermal management structure comprises an outer shell coupled with the ical structure such that the mechanical structure is between the user side of the wearable component and the outer shell structure, and wherein the mechanical ure is configured to transfer heat from the electronic component to the outer shell, the outer shell comprising the plurality of .

5. The wearable component of Claim 4, wherein the thermally conductive via extends at least partially through a thickness of the outer shell.

6. The wearable component of Claim 5, wherein the thermally conductive planar member is coupled to a back surface of the outer shell.

7. The wearable ent of any one of the Claims 4 to 6, wherein the outer shell comprises a laminate structure.

8. The wearable component of Claim 7, wherein the laminate structure comprises a plurality of alternating first and second layers, the first layer having a higher thermal conductivity than the second layer.

9. The wearable component of Claim 8, wherein the first layer comprises a reinforcement material.

10. The le component of Claim 9, wherein the reinforcement material ses a fiber or fabric.

11. The wearable component of Claim 10, wherein the first layer comprises carbon fiber.

12. The wearable component of any one of the Claims 8 to 11, n the second layer comprises an epoxy.

13. The wearable component of Claim 12, further comprising one or more thermally conductive components within the epoxy.

14. The wearable component of Claim 13, wherein the one or more thermally conductive components comprises at least one of carbon bes, graphene, or a metal.

15. The wearable component of any one of the Claims 1 to 14, wherein the electronic component comprises at least one of a processor and a camera.

16. The wearable component of any one of the Claims 1 to 15, wherein the wearable component comprises an augmented y device.

17. The wearable component of any one of the Claims 1 to 16, further comprising one or more electrical components ed in the thermal ment system.

18. The wearable component of any one of the Claims 1 to 17, wherein the thermal management system does not include any fans.

19. The wearable component of any one of the Claims 1 to 18, wherein the thermal management system does not include any air vents.

20. A wearable component configured to be worn on a head of a user, the wearable component including a user surface configured to face the head of the user when worn by the user and an outside surface te the user surface and spaced from the user surface along a first direction non-parallel to the user surface, the outside surface configured to face away from the head of the user when worn by the user, the wearable component comprising: a wearable support having a thickness along the first direction; an electronic ent in thermal communication with the wearable support; a thermally conductive planar member in thermal communication with the electronic ent; an array of le conductive vias in thermal ication with the electronic component and ured to transfer heat from the onic component away along the first ion from the user surface of the wearable component through at least a portion of the thickness, the multiple conductive vias coupled to or formed with the planar member, the le conductive vias extending non-parallel from the planar member such that the planar member is disposed between the le conductive vias and the electronic ent; and a ity of layers disposed about the multiple conductive vias.

21. The wearable component of Claim 20, further comprising a mechanical structure disposed in or on the wearable support and in thermal communication with the electronic component and an outer shell coupled with the mechanical structure such that the mechanical structure is between the user surface of the wearable component and the outer shell structure, and wherein the mechanical structure is configured to transfer heat from the electronic component to the outer shell, the array of multiple conductive vias extending at least partially h a thickness of the outer shell, the outer shell comprising the plurality of layers.

22. A wearable component configured to be worn on a head of a user, the wearable component including a user surface configured to face the head of the user when worn by the user and an outside surface opposite the user surface and spaced from the user surface along a first direction rallel to the user surface, the outside surface configured to face away from the head of the user when worn by the user, the wearable component comprising: a le support having a thickness along the first direction; an electronic component in thermal communication with the wearable support; a thermal management structure in thermal communication with the electronic component, the thermal management structure comprising a thermally conductive structure extending through at least a portion of the ess of the wearable support and configured to transfer heat along the first ion from the electronic component away from the user surface of the wearable component towards the outside surface of the wearable component, wherein the thermally conductive structure comprises a thermally conductive planar member in thermal communication with the electronic component and a thermally conductive via coupled to or formed with the planar , the thermally conductive via ing generally perpendicular from the planar member such that the planar member is disposed between the thermally conductive via and the electronic component.

23. The wearable ent of Claim 22, further comprising a plurality of alternating first and second layers disposed about the thermally conductive via, the first layer having a higher thermal conductivity than the second layer. THERMAL MANAGEMENT SYSTEMS FOR WEARABLE COMPONENTS