NZ749801B2 - Control of industrial water treatment via digital imaging - Google Patents
Control of industrial water treatment via digital imaging Download PDFInfo
- Publication number
- NZ749801B2 NZ749801B2 NZ749801A NZ74980117A NZ749801B2 NZ 749801 B2 NZ749801 B2 NZ 749801B2 NZ 749801 A NZ749801 A NZ 749801A NZ 74980117 A NZ74980117 A NZ 74980117A NZ 749801 B2 NZ749801 B2 NZ 749801B2
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- NZ
- New Zealand
- Prior art keywords
- deposit
- substrate
- industrial water
- water system
- series
- Prior art date
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- 239000008235 industrial water Substances 0.000 title claims abstract description 121
- 238000003384 imaging method Methods 0.000 title claims description 25
- 239000000758 substrate Substances 0.000 claims abstract description 193
- 238000010438 heat treatment Methods 0.000 claims abstract description 23
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 36
- 230000015572 biosynthetic process Effects 0.000 claims description 22
- 238000005755 formation reaction Methods 0.000 claims description 21
- 239000000203 mixture Substances 0.000 claims description 20
- VTYYLEPIZMXCLO-UHFFFAOYSA-L calcium carbonate Chemical group [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 14
- 239000003112 inhibitor Substances 0.000 claims description 12
- 230000002401 inhibitory effect Effects 0.000 claims description 12
- 239000000126 substance Substances 0.000 claims description 12
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 10
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 229960003563 Calcium Carbonate Drugs 0.000 claims description 7
- 239000008236 heating water Substances 0.000 claims description 7
- 229910052742 iron Inorganic materials 0.000 claims description 5
- 239000011575 calcium Substances 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 4
- 230000033116 oxidation-reduction process Effects 0.000 claims description 4
- 229960005069 Calcium Drugs 0.000 claims description 3
- OYPRJOBELJOOCE-UHFFFAOYSA-N calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims description 3
- 229910052791 calcium Inorganic materials 0.000 claims description 3
- 239000000498 cooling water Substances 0.000 claims description 3
- 230000000704 physical effect Effects 0.000 claims description 3
- 238000003380 quartz crystal microbalance Methods 0.000 claims description 3
- JEIPFZHSYJVQDO-UHFFFAOYSA-N Iron(III) oxide Chemical group O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims 1
- 229910000460 iron oxide Inorganic materials 0.000 claims 1
- 239000012530 fluid Substances 0.000 description 18
- 238000005286 illumination Methods 0.000 description 17
- 239000000523 sample Substances 0.000 description 16
- 238000004140 cleaning Methods 0.000 description 11
- 150000002500 ions Chemical class 0.000 description 10
- 238000005259 measurement Methods 0.000 description 10
- 238000004458 analytical method Methods 0.000 description 9
- 229910052500 inorganic mineral Inorganic materials 0.000 description 9
- 239000011707 mineral Substances 0.000 description 9
- 235000010755 mineral Nutrition 0.000 description 9
- 239000003973 paint Substances 0.000 description 9
- 230000003287 optical Effects 0.000 description 8
- 230000002906 microbiologic Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 238000000701 chemical imaging Methods 0.000 description 5
- 239000002253 acid Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 230000002194 synthesizing Effects 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- UIIMBOGNXHQVGW-UHFFFAOYSA-M buffer Substances [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 3
- 159000000007 calcium salts Chemical class 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000001556 precipitation Methods 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000011780 sodium chloride Substances 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 230000001131 transforming Effects 0.000 description 3
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L Calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- QVFWZNCVPCJQOP-UHFFFAOYSA-N Chloralodol Chemical compound CC(O)(C)CC(C)OC(O)C(Cl)(Cl)Cl QVFWZNCVPCJQOP-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 229940035295 Ting Drugs 0.000 description 2
- 230000002378 acidificating Effects 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000000875 corresponding Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000002708 enhancing Effects 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- PWHULOQIROXLJO-UHFFFAOYSA-N manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 2
- 229910052748 manganese Inorganic materials 0.000 description 2
- 239000011572 manganese Substances 0.000 description 2
- -1 manganese-iron Chemical compound 0.000 description 2
- 239000010445 mica Substances 0.000 description 2
- 229910052618 mica group Inorganic materials 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 230000003595 spectral Effects 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-L sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000975 Carbon steel Inorganic materials 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate dianion Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 101700015817 LAT2 Proteins 0.000 description 1
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 1
- 229910017621 MgSO4-7H2O Inorganic materials 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 238000000961 QCM-D Methods 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N Tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- QORWJWZARLRLPR-UHFFFAOYSA-H Tricalcium phosphate Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QORWJWZARLRLPR-UHFFFAOYSA-H 0.000 description 1
- 229920004738 ULTEM® Polymers 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K [O-]P([O-])([O-])=O Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- REDXJYDRNCIFBQ-UHFFFAOYSA-N aluminium(3+) Chemical class [Al+3] REDXJYDRNCIFBQ-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000003667 anti-reflective Effects 0.000 description 1
- 230000003115 biocidal Effects 0.000 description 1
- 239000003139 biocide Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- UXVMQQNJUSDDNG-UHFFFAOYSA-L cacl2 Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 1
- 239000001110 calcium chloride Substances 0.000 description 1
- 229910001628 calcium chloride Inorganic materials 0.000 description 1
- 239000001506 calcium phosphate Substances 0.000 description 1
- 229910000389 calcium phosphate Inorganic materials 0.000 description 1
- 235000011010 calcium phosphates Nutrition 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000010962 carbon steel Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 230000000295 complement Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000001808 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000003247 decreasing Effects 0.000 description 1
- 230000001809 detectable Effects 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000006056 electrooxidation reaction Methods 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000005206 flow analysis Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000004313 glare Effects 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-ZSJDYOACSA-N heavy water Substances [2H]O[2H] XLYOFNOQVPJJNP-ZSJDYOACSA-N 0.000 description 1
- 238000010191 image analysis Methods 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000001795 light effect Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005272 metallurgy Methods 0.000 description 1
- 244000005700 microbiome Species 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006011 modification reaction Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000010979 pH adjustment Methods 0.000 description 1
- 230000020477 pH reduction Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 229920001690 polydopamine Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910052904 quartz Inorganic materials 0.000 description 1
- 230000003134 recirculating Effects 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000007619 statistical method Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000010897 surface acoustic wave method Methods 0.000 description 1
- 230000001360 synchronised Effects 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
- 230000001960 triggered Effects 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000010200 validation analysis Methods 0.000 description 1
Abstract
Systems for and methods of monitoring and analyzing deposit (e.g., 99) in an industrial water system are provided. The methods comprise heating (e.g., via a heating element 103 ) a substrate (e.g., 105 ) while the substrate contacts industrial water in the industrial water system to form deposit (e.g., 99) on the substrate (e.g., 105 ). A series of digital images of the substrate while the substrate contacts the industrial water in the industrial water system is created (e.g., via a camera 111 ). A region of interest in the series of digital images of the substrate is defined. A deposit feature in the region of interest in the series of digital images of the substrate may be identified. The deposit feature in the region of interest in the series of digital images of the substrate may be analyzed to determine a deposit trend of the substrate in the industrial water system. g., 99) on the substrate (e.g., 105 ). A series of digital images of the substrate while the substrate contacts the industrial water in the industrial water system is created (e.g., via a camera 111 ). A region of interest in the series of digital images of the substrate is defined. A deposit feature in the region of interest in the series of digital images of the substrate may be identified. The deposit feature in the region of interest in the series of digital images of the substrate may be analyzed to determine a deposit trend of the substrate in the industrial water system.
Description
CONTROL OF INDUSTRIAL WATER TREATMENT VIA DIGITAL IMAGING
This application is an international (i.e., PCT) application claiming the benefit of
U.S. Provisional Patent Application Serial No. ,138, filed July 19, 2016, the disclosure
of which is incorporated herein by reference in its entirety.
BACKGROUND
Maintaining deposit-free heat exchange surfaces in water systems, particularly in
industrial water systems, e.g., cooling water s and heating water systems, is important
to optimizing energy efficiency. Mineral deposit, ularly calcium salts, and more
particularly calcium carbonate, may be in the form of scaling or fouling. Generally, scaling is
the precipitation of inorganic salts on ent surfaces, and fouling results from deposit of
insoluble particles suspended in a liquid. Monitoring industrial water systems to minimize or
prevent t (mineral or otherwise) onto heat exchange surfaces can e ation
that can be utilized to improve, or at least maintain, efficiency in an industrial water system’s
operation and/or treatment program.
Biofilm deposit onto heat exchange surfaces can also cause inefficiency in
industrial water systems. For example, compared to mineral deposit, biofilm deposit is
generally a 4 to 5 times better insulator than mineral deposit. lly, biofilms are slimy,
and the microorganisms causing the formation of a biofilm may ent merely a small
fraction of the m’s content.
SUMMARY
[0003a] According to the present invention there is provided a method of analyzing a
deposit on a substrate contacting industrial water in an industrial water system, the method
comprising:
heating a substrate while the substrate contacts an industrial water in an
industrial water system to a ature higher than a temperature of the industrial
water, thereby forming a deposit on the substrate;
creating a series of digital images of the ate while the substrate contacts
the industrial water in the industrial water system;
1a (the next page is page 2)
identifying a deposit feature in each of the series of digital images of the
substrate; and
analyzing the deposit feature in each of the series of digital images of the
substrate to determine a deposit formation trend on the substrate in the industrial
water system.
The invention is directed to using l imaging of a ate to analyze deposit
in an industrial water system. In certain embodiments, the invention uses digital imaging of a
substrate to determine heat transfer resistance of the substrate, which can be utilized to
correlate to heat transfer resistance that may result from deposit.
A method of analyzing deposit on a substrate contacting industrial water in an
industrial water system is provided. The method comprises creating a digital image of the
substrate while the substrate ts the industrial water in the industrial water . A
region of interest in the digital image of the substrate is defined. A deposit e in the
region of interest in the digital image of the ate is fied. The deposit feature in the
region of interest in the digital image of the substrate is analyzed.
2017/042793
A method of analyzing deposit on a substrate contacting industrial water in an
industrial water system is provided. In certain embodiments, the method comprises heating
the substrate while the substrate contacts the industrial water in the industrial water system to
form deposit on the substrate. A series of digital images of the substrate while the substrate
contacts the rial water in the industrial water system is created. A region of interest in
the series of digital images of the substrate is defined. A deposit feature in the region of
interest in the series of digital images of the substrate is identified. The deposit e in the
region of interest in the series of digital images of the substrate is ed to determine a
deposit trend of the ate in the industrial water system.
A system for monitoring deposit in an industrial water system is provided. The
system comprises a fluid flow l haVing optical access. A heated substrate is
configured to contact industrial water present in the fluid flow channel. A camera is
configured to capture digital images of the substrate when d in the fluid flow channel.
A plurality of temperature sensors is configured to measure a temperature gradient across the
heated substrate.
BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE GS
is a schematic View of an embodiment of a system that may be utilized to
carry out a method described herein.
is an exploded View of a portion of a system that may be utilized to carry
out the s described herein.
is a partially-exploded schematic of a system that may be utilized to carry
out the methods described herein.
shows examples of images differentiating calcium t from
manganese-iron deposit.
shows examples of images ponding to graphically d heat
transfer reduction and reduced deposit image data of a substrate subject to a method
described .
shows an example of resulting binned image data collected over time of a
substrate subject to a method described herein.
shows examples of images corresponding to graphically tracked heat
transfer reduction and reduced deposit image data of a substrate subject to a method
described , wherein deposit removal is observed by decreasing pH of the industrial
water.
DETAILED DESCRIPTION
The ion is directed to using digital g of a substrate to analyze deposit
in an industrial water system. In certain embodiments, the invention uses digital imaging of a
substrate to determine heat transfer resistance of the substrate, which can be utilized to
correlate to heat transfer resistance that may result from deposit.
A method of analyzing deposit on a substrate contacting industrial water in an
industrial water system is provided. The method comprises creating a digital image of the
substrate while the substrate contacts the industrial water in the industrial water system. A
region of interest in the digital image of the substrate is defined. A t feature in the
region of st in the digital image of the substrate is fied. The deposit feature in the
region of interest in the digital image of the substrate is analyzed.
A method of analyzing deposit on a substrate contacting industrial water in an
industrial water system is provided. In certain embodiments, the method comprises g
the substrate while the substrate contacts the industrial water in the industrial water system to
form deposit on the substrate. A series of digital images of the substrate while the substrate
contacts the industrial water in the industrial water system is created. A region of interest in
the series of digital images of the substrate is defined. A deposit feature in the region of
interest in the series of digital images of the ate is identified. The deposit feature in the
region of interest in the series of digital images of the substrate is analyzed to determine a
deposit trend of the substrate in the industrial water system.
Provided are systems for and methods of analyzing deposit on a substrate
ting rial water in an industrial water . In certain embodiments, the method
is a method of quantifying deposit on a substrate contacting industrial water in an industrial
water system. The phrases “analyzing,” ing, 77 (4 synthesizing,” and ifying,” and
related ology (e.g., conjugate forms), are used herein to describe aspects of the
s, with “analyzing” being inclusive of “quantifying,” “defining,” and “synthesizing,”
which are all subsets of analyzing. The term “substrate,77 (L coupon,” and similar terms are to
be construed as including “or a portion thereof.”
A system for monitoring deposit in an industrial water system is provided. The
system comprises a fluid flow channel having optical access. A heated substrate is
configured to contact industrial water present in the fluid flow l. A camera is
configured to capture digital images of the ate when located in the fluid flow channel.
A plurality of temperature sensors is configured to e a temperature gradient across the
heated substrate.
An illustrative embodiment of a system for ring deposit in an industrial
water system is shown in FIGs. 1 and 2. The system comprises, among other things, probe
body 100 with flow channel 101 for fluid to enter and eXit. Heating element 103 is d
on a support medium with low thermal conductivity. Heating element 103 can be a cartridge,
ceramic, mica, or any of variety of heating devices. Substrate 105 is in direct contact with
heating element 103 on one side, with liquid (e.g., industrial water) flowing through flow
channel 101 and contacting a surface of substrate 105. Substrate 105 may be a separate piece
or, e.g., a -in” portion of the equipment that forms flow channel 101. In certain
embodiments of the , the ate is constructed of a le metal, alloy, or ceramic
material. The substrate may be constructed to have a user specified surface finish and/or
roughness.
Heating element 103 and ate 105 can be mounted using, e.g., a low thermal
conducting t 104. Preferably, support 104 inserts into probe body 100 such that a
surface of substrate 105 (1'.e., surface 105a) is flush with flow channel 101. In the illustrated
embodiment, ring 114 may be outfitted with an o-ring to form a seal between support 104 and
probe body 100 to constrain fluid in flow channel 101.
In certain embodiments of the systems described herein, a portion of the system is
constructed so as to be removable from the rest of the system. For example, the camera
and/or light source(s) and/or plurality of temperature sensors may be removable as one or
more units from the rest of the system.
In the illustrated embodiment, temperature probes 106, 107, 108, and 109 are
mounted on the support block to e temperature at ent locations. Though the
illustrated embodiment includes four temperature probes, less (e.g., 2 or 3) or more (e.g., 5, 6,
7, can be utilized. As shown, temperature probe 106 makes direct contact with
..., n)
substrate 105 through a hole in heating element 103. Temperature probe 107 makes direct
contact with the backside of heating element 103 and temperature probes 108 and 109 are
mounted at different locations in the support 104 to measure the heat flux h support
104. Connection leads 110 of heating element 103 eXit through support 104 for connecting to
a power supply.
With continued reference to FIGS. 1 and 2, flow channel 101 is made by mounting
a plate 102 to probe body 100. Plate 102 can be fabricated out of, e.g., clear acrylic material
or a modified mounting piece with a clear window such as glass, quartz, sapphire, acrylic,
such that plate 102 es optical access 102a to view surface 105a of ate 105.
Heating element 103 and substrate 105 can be assembled, e.g., using high thermal conducting
epoxy, e.g., DURALCO 128 or 132 epoxy, supplied by Cotronics Corp, 131 47th ,
Brooklyn, NY. The heater-substrate assembly can then be epoxied into support 104 using
DURALCO 4525 or 4538 epoxy. The heater-substrate-support assembly (1'.e., assembly 10)
can then be d into probe body 100, e.g., via retaining nut 115. As illustrated, retaining
nut 115 is notched to allow the temperature probes 106, 107, 108, 109 and connection leads
110 of heating element 103 to pass through notch 115a. A liquid tight seal is made by
tightening retaining nut 115 to compress o-ring 114 against probe body 100 and support 104.
In some cases, an automated in-silu cleaning process may be applied to plate 102.
Generally, deposit from a substrate surface may be removed under acidic conditions. Acidic
conditions can be generated by ing acid into the industrial water contacting the ate
surface. However, the aforestated ch tends to add xity, ing automated
valves, a delivery system (pump(s), etc.), and an acid supply onsite. A more convenient
approach utilizes electrochemical cleaning by applying a potential between the metal
substrate and a counter-electrode. For cleaning, the metal substrate is the anode and a
counter-electrode cathode is integrated into the system. The counter-electrode can be
constructed of, e.g., metal (e. g., stainless steel), graphite, or tive glass (e.g., indium tin
oxide or fluorine doped tin oxide). Using conductive glass provides dual functionality as a
window for optical access to view the substrate surface as well as a counter-electrode for
electrochemical cleaning. When utilized, the conductive glass can be, e.g., coated with anti-
reflective substance.
shows assembly 10 made up of the components ed in FIGs. 1 and 2
that are configured to attach to conduit 200 of, e.g., an industrial water system, via interfaces
204. In the illustrated embodiment, aces 204 are keyed such that assembly 10 is
oriented to allow fluid passing through flow channel 101. aces 204 connect to rd
piping and provide transitions from round to square geometry, and vice versa, while
maintaining the same cross-sectional area. Assembly 10 can be attached to interfaces 204 via
nuts 205. O-rings (not shown) can be utilized to provide seals between ly 10 and
interfaces 204.
On one side of interfaces 204, window 206 provides optical access 102a to
plate 102 through to surface 105a of substrate 105, thus, providing the y to view surface
105a of substrate 105 in flow channel 101 during operation.
As shown, g system 20 comprises camera 111 with lens 112 and optional
illumination sources 113. Though two illumination sources 113 are shown, less (e.g., 0 or 1,
with one illumination source 113 shown in or more (e.g., 3, 4,
..., 11) may be utilized
with imaging system 20. Positioning imaging system 20 in the illustrated manner allows for
imaging surface 105a of substrate 105 during operation (e.g., while exposed to fluid flowing
through flow channel 101).
le illumination sources 113 may be used to illuminate from different
direction to accentuate the desired es on the substrate or surface thereof, or to improve
the overall illumination . For example, illuminating a surface of the substrate with an
illumination source positioned near perpendicular to the surface can provide a bright field
illumination. In this case, the imaging device captures most of the direct reflected light.
Placing one or more illumination sources with large angle(s) of incidence relative to the
surface normal can enhance salient features, such as scratches, pits, and/or deposit
morphology, on the surface. In on, the light can be directional or diffuse. Diffuse
lighting provides more uniform illumination and attenuates the specular component when
illuminating reflective surfaces. The light may be sourced from one or more of a light
ng diode (“LED”), an incandescent bulb, a tungsten halogen bulb, light transported via
fiber optic or any combination of these or other standard means to provide illumination.
An example of an LED light source is available as CREEXPE21 from
Cree,Inc., 4600 Silicon Drive Durham, North Carolina 27703, which in n embodiments
is equipped with a Carclo lens model 10138, available from Carclo Optics, 6-7 Faraday Road,
Rabans Lane Industrial Area, Aylesbury HP19 8RY, England, UK.
Illumination sources 113 may be mounted so as to allow for angle and height
ment. The light emission wavelength spectrum can cover the white light region or
specific ngth bands to highlight specific features. For example, specific wavelengths
can be used to highlight color on the coupon surface or used with black and white camera to
extract color information from the surface. In certain embodiments presented herein, the
substrate is lit with light having a wavelength band of from about 390 nm to about 700 nm.
Image acquisition control can be made by a PC, microprocessor, external
controller, and/or embedded processor in the camera. cial digital cameras generally
come standard with image acquisition speeds 30 frames per second (“fps”) or greater.
Because deposit generally occurs at a much longer time scale (e.g., 10s of minutes to weeks),
image acquisition control is the preferred method, i.e., acquiring a single image or average of
N images at a frequency that can be, e.g., fixed, variable, and/or event . Collecting
data in this manner es data storage more efficiently. For example, an image acquisition
rate of once per day, or once per week, may be sufficient for n industrial water systems
if only gross changes in deposit features are of interest. However, if the industrial water
system experiences an upset, e.g., a drop in pH, the dynamics of the deposit features can be
missed with infrequent image acquisition. In this case, triggering an increase in the
frequency of the creation of the digital images at the time of upset allows for collecting image
data at a finer time resolution. Electrical power and/or communication can be provided to
components of the imaging system by cabling connections and/or antennas.
Additional illumination control can be provided via the utilization of filters and/or
polarizers on light source(s) (e.g., attached to lens 109) and/or via imaging device 106. For
example, adding a linear polarizers can allow for the removal of reflections or hot spots (e.g.,
high light intensity glare) from the image ating from the light source rays that, e.g., may
reflect off the transparent window or pipe. Additionally or d, color fllters (e.g.,
bandpass, notch, shortpass, and/or longpass) may be used to enhance specific image detail or
remove background light effects. Filtering can be applied on the camera, light source, or
both. For example, red features on a surface can be enhanced using a light source with a
bandpass or ss fllter greater than 600 nm, e.g., 600—1100 nm, or more preferably 600—
700 nm, and even more preferably, 630 nm. In this case, the red light will reflect off the red
surfaces of the substrate to the imaging detection device that can also be ed with a
similar filter. This allows only the reflected light from the surface in the wavelength
transmission range of the filter to reach the detector, ing in red feature enhancement.
As shown in imaging device 20 may r comprise mount 220.
Mount 220 may be immovable or e. As rated, mount 220 is movable so as to
provide focusing capability of imaging device 20. As shown in mount 220 and
illumination source 113 are d to base 225. Imaging device 20 can be enclosed via
cover 210. The powered components of imaging system can be connected to power and
ication ports, e.g., via wiring 240. While an autofocusing camera may obviate the
need for using a movable mount, an autofocus camera may be used with an immovable or
movable mount.
Camera 111 can be CMOS, CCD, Silicon PDA, or any array style detector that
provides spatial light intensity information. cial cameras that use either CMOS or
CCD technology are readily available and provide image data when coupled with a lens (e.g.,
lens 112). Camera 111 can be integrated with a computer for image acquisition and
processing or utilize embedded processing where a dedicated processer is present in camera
111. The on of a series of digital images may be made, e.g., by a set scheduled time
(e.g., once per hour) or triggered based on an event (e.g., when pH is detected outside a
control range).
The digital image, or series thereof, provides evidence of the presence or absence
of deposit on the substrate (e.g., deposit 99 on e 105a of ate 105). The digital
image, or series f, can provide further insight into, e.g., type of deposit based on color
and/or logy, early onset of deposit formation, percent coverage on the surface, and
estimated thickness based on depth of focus.
An aspect of the s ed herein allows for accelerated formation of
deposit on the substrate by heating the substrate. Accelerated formation of deposit can
provide information to the user that can be utilized to take action to prevent the formation of
deposit in critical heat transfer equipment, e.g., a heat exchanger, a condenser, a cooling
tower, etc.
Applying power to heating element 103 creates a local temperature differential
between substrate 105 and fluid d in flow channel 101, with the substrate area having a
higher temperature than the fluid flowing through flow channel 101. In applications
involving salts with inverse-solubility teristics (e.g., calcium salts, more particularly,
calcium carbonate, calcium sulfate, calcium phosphate, etc.), precipitation on surface 105a of
substrate 105 can occur, which results in the formation of deposit 99. As deposit 99 forms on
surface 105a of substrate 105, the temperature of ate 105 will increase because of the
reduced thermal conductivity, 1'. e., insulating properties of deposit 99, which reduces the
convective heat removal from ate 105. The temperature gradient can be measured
using a plurality of temperature probes (e.g., temperature probes 106, 107, 108, 109). The
plurality of temperature probes may be one or more of any suitable type of temperature
probes, e.g., thermocouple, resistance temperature detector (“RTD”), fiber optic ature
probe, ed temperature probe, or any suitable temperature measurement device.
Measuring ate 105 temperature and knowing the fluid temperature and flow conditions
in or near flow channel 101, the heat transfer resistance (“HTR”) due to t 99 can be
determined using mathematical ormation(s).
For example, to determine the heat transfer resistance of deposit on the substrate a
heat flow analysis is d starting with
Qelectric: Qout water + Qloss (l)
where Qelectfic is the heater power determined from the input voltage to the heater and the
heater ance, QoutwaterlS the heat removed to the water flow stream above the substrate,
and Qloss is the heat lost through the heater support structure. To simplify the analysis, a one-
dimensional heat flow is assumed, i.e., flow in the radial ion and losses through the
sides are assumed negligible =0), to illustrate the basic concept. Using Fourier’s law
Qoutwaterln Equation (1) gives the total HTR as
1 AAT
HTRTotal : E (2)
Qelectric
where HTRtotal is the reciprocal of the overall heat transfer ient and is the sum of all
heat transfer resistances of certain materials, such as the substrate, heater, mount, convection,
and deposit. A is the area of the heated e and AT is the temperature difference between
the heater and bulk fluid flowing across the substrate. For a clean substrate HTRdeposit: O and
HTRtotal is then given by
HTRtota1= HTRheater + HTRsubstrate + HTRmount + HTRconvection (3)
To determine the fixed HTR values (heater, substrate, and mount) the convective terms is
calculated from the Nusselt number (Nu) having a general expression as
Nu = CRemPr"
E = (4)
where C, m, and n are constants determined experimentally, l is the length, k is the fluid
thermal conductivity, h is the convective heat er, Re is the Reynolds number, and Pr is
the Prandtl number. Nusselt number ations can be found in the literature for different
geometries and d number ranges. Knowing the fluid physical properties and flow
conditions, the HTRconvection(1/h) is calculated from Equation (4). The fixed heat transfer
resistance for a clean substrate is given by
d: HTRtotal - vection (5)
The change in heat transfer resistance at time, t, is then
HTRt : HTRtotal-HTRfixed-HTRconvection (6)
The heat transfer resistance of the deposit is then determined by measuring identical
ions for a clean substrate and a substrate having deposit:
HTRdeposit: HTRt,deposited — HTRt, clean (7)
When coupled with in-situ cleaning (e.g., electrochemical, chemical, air,
ultrasonic, mechanical, etc.) to remove deposit formed on the surface, the digital image, or
series thereof, can provide feedback on the state of deposit removal, e.g., whether the deposit
is completely d or is still present, which can be used to trigger stoppage of the in-silu
cleaning process. If the image data indicates deposit is still present on the substrate, the
cleaning ion can continue until a desired level of cleanliness is reached.
The digital image, or series thereof, can also provide insight into the type of
deposit based on color and/or morphology of the deposit. Using data related to the digital
image, or series thereof, along with knowledge of water chemistry and treatment can allow
for the identification of the deposit composition. For example, a white crystalline deposit is a
good tor that the deposit is likely from calcium salt whereas a dark sh deposit
could indicate high manganese and/or iron content. Generally, biofilm will have a different
reflective characteristic due to the slimy nature of microbiological deposit. Combining this
observed change in ation with, e.g., low oxidation-reduction potential measurement
es credence that the deposit is at least partially microbiological in origin, e
microbiological deposits generally se multiple components, e.g., mineral, silt, and
microbiological components.
Thus, in certain embodiments of the methods and systems, multiple methods
and/or systems are utilized so as to allow for differentiation of type(s) of deposits. For
example, a plurality of systems operating at different heated substrate temperatures may be
implemented so as to analyze a plurality of deposit formations. At a relatively low
temperature range (e.g., from about 30° C to about 50° C) tends to provide conditions for
biofllm growth, s a relatively high temperature range (e.g., from about 70° C to about
120° C) tests the water potential for mineral scale.
The method of collecting and ing the substrate image data is not limited to
the configuration shown in the figures, or to a heat transfer resistance measurement device.
For example, deposit imaging can be conducted on a quartz crystal microbalance (“QCM,”
such as, e.g., described in US. Patent No. 8,945,371), surface acoustic wave sensor, optical
probe for measuring the evanescent wave, substrate surface d with an ultrasonic sensor
for deposit thickness, tube sensor to measuring pressure drop, cartridge heated tube, or any
combination of these devices. Deposit measurement may be ted via the methods
described herein as long as optical access is provided to a surface of a substrate, or the system
can be modified to provide optical access. Implementing in-silu imaging to detect deposit
formation provides a complementary measurement for proof-of-deposit, proof-of-surface
cleanliness, information on the type of deposit based on color and morphology, qualitative
assessment on the amount of deposit, and detecting the early onset of deposit formation. In
certain embodiments, the substrate is capable of heating without the need for a separate
heating element.
In certain ments, the substrate is a coupon. In certain embodiments, the
substrate is a section of a conduit. In certain embodiments, the substrate is representative of a
material of construction of the rial water system. In certain embodiments, the substrate
is constructed of a metal, which in certain ments is selected from steel, iron,
aluminum, copper, brass, nickel, um, and related alloys. In certain embodiments, the
steel is one of mild steel, stainless steel, and carbon steel. In certain embodiments, the metal
is capable of passivation, and in other embodiments the metal is incapable of passivation.
The substrate contacts industrial water in an industrial water system, as shown in
the figures, via flow channel 101. Examples of industrial water systems include, but are not
limited to, heating water systems (e.g., boiler s), g water systems (e.g., systems
sing a cooling tower), pipelines for water transport (e.g., seawater transport, which
may be in transport to mining operations), and the like. Industrial water is any aqueous
substance that is or will be used in an rial water system. Generally, industrial water
systems comprise industrial water that may be treated in some manner to make the water
more suitable for use in the industrial water system of interest. For example, industrial water
used in heating water s (e.g., boiler systems) may be deaerated. The industrial water
used in heating water systems may be r d with, e.g., a deposit inhibitor, a
corrosion inhibitor, a scale tor, and/or a microbiological control agent. Other
ents may be rendered for various rial water systems. In n embodiments, the
2017/042793
industrial water of the industrial water system is treated with a deposit tor. In certain
embodiments, the industrial water system is a cooling water system. In certain embodiments,
the industrial water system is a heating water system, which may be a boiler system. In
certain embodiments, the rial water of the heating water system has been deaerated.
Examples of suitable deposit inhibitors include, but are not limited to, suitable
antifoulants, antiscalants, and/or biocides.
The deposit inhibitor may be present in the industrial water at a concentration of
from about 0.01 ppm to about 1000 ppm by weight, including from about 0.1 ppm or from
about 1 ppm, to about 500 ppm, or to about 200 ppm.
Other substances may be present in the industrial water, including, but not limited
to, one or more of a ion inhibitor, a buffer, other treatment chemicals and combinations
thereof.
In certain embodiments, a parameter of the industrial water system is measured.
Parameters include, but are not limited to, temperature, pressure, pH, conductivity, oxidation-
ion potential, linear polarization resistance, derivatives thereof, and combinations
thereof.
The substrate is sufficiently lit to allow for creation of digital images of the
substrate located in the industrial water system. In preferred ments, the substrate is
sufficiently lit using one or more illumination sources, which may be a light-emitting diode,
and, more preferably, a plurality of light-emitting diodes.
In the s provided herein, a l image, or series thereof, of the substrate
is created. In certain preferred embodiments, the digital image, or series f, of the
substrate is created while the substrate is located in an industrial water system. Though not
red, the digital image, or series thereof, of the substrate can be created while the
substrate is not located in an industrial water system. In the preferred embodiments, the
substrate d in the industrial water system is generally in contact with the industrial
water.
When utilized, the series of digital images may be two or more digital images. In
certain embodiments, the series of digital images comprises a quantity of l images
sufficient to perform trend analysis of the digital images, and thus of the surface of the heated
ate. In preferred embodiments, series of l images is a quantity sufficient to
perform deposit trend analysis of the substrate. In certain embodiments, the series of digital
images is created at a fixed time interval, 1'. e., each image is taken after a fixed amount of
time has elapsed. In certain embodiments, the series of digital images is created at a fixed
time interval when a parameter of the rial water system is within a control limit, but the
series of digital images is created at an al of time less than the fixed time interval when
the parameter of the rial water system is not within the control limit. In other words,
when the process is in control, a digital image is d at a rate of one digital image per t-
length of time, but when the s is out of control, a digital image is created at a rate faster
than one digital image per t-length of time.
In certain embodiments, the digital image, or series thereof, of the substrate is
analyzed to determine a deposit trend of the substrate in the industrial water system. In
certain embodiments, analyzing ses defining a region of interest in the digital image,
or series thereof, of the substrate and synthesizing trend data of the region of interest from the
digital image, or series thereof. In some embodiments, analyzing comprises mathematical
transformation of data to synthesize information related to size, color profile, percent area
covered by deposit, overall mean surface area of deposit, heat transfer resistance (or increase
thereof), related ation (e.g., heat transfer coefficient, change in heat transfer
coefficient, etc.), and combinations thereof, to calculate a deposit trend (e.g., a deposit rate).
Deposit trending and examples of mathematical transformations of data are discussed further
herein.
In certain embodiments, the methods comprise defining a region of interest in the
digital image, or series thereof, of the substrate. The region of interest may se a
surface of the substrate, or portion thereof. In certain embodiments, the region of interest is a
surface, or n thereof, of the substrate.
In certain embodiments, deposit develops on the region of interest, and thus, in
certain embodiments, the region of interest comprises a deposit feature. In certain
embodiments, the method comprises identifying a deposit feature in the region of interest. In
n ments, the surface area of the deposit e is calculated, which can be
analyzed to determine a deposit trend of the substrate in the industrial water system. The
analysis may further include determination of the heat transfer ance (“HTR”), which can
be determined using the plurality of temperature . The analysis may further include
measuring a parameter of the industrial water in the industrial water system selected from pH,
tivity, ion-reduction potential, linear polarization resistance, electrochemical
corrosion monitoring, tives thereof, and combinations thereof. The analysis can be
utilized to act to minimize or t deposit formation in the industrial water system.
In certain embodiments, action is taken based on the analysis of the deposit
feature in the region of interest of the digital image, or series thereof, of the substrate, and
optionally including, e.g., heat er resistance and/or any, one, ation of, or all of,
the ters listed herein. Generally, the action taken will be one or more action to prevent
or lessen the effects of deposit in the industrial water system. Any one or more actions may
be taken, including, but not limited to, increasing dosage of deposit inhibitor, selecting a
different deposit inhibitor, modifying the deposit inhibitor, altering a physical property of the
rial water system, blowing down the industrial water system, shutting down the
industrial water system, and combinations thereof.
In certain embodiments, a plurality of imaging devices is utilized to create a
plurality of digital images, or series l) thereof. The plurality of systems could be
configured to interface directly to, e.g., a ller that can be a PC, microprocessor,
gateway, or combination of such devices to establish electronic communication for
acquisition l as well as store and/or transmit image data. Data could be transmitted via
wired connection and/or a wireless protocol (e.g., one or more of Wi-Fi, Zigbee, LoRa,
Thread, BLE OnRamp, RPMA, the BBB 802.11 network family, IEEE 80215.4, oth,
AN, LoRa, etc.). Powering the systems can be via cable, battery, solar, or other
energy ting means, e.g., vibration. The combination of using a wireless protocol with a
self-powered method allows convenient installation at multiple locations. Image data
collected by the controller can be stored, processed using advanced image analysis
algorithms, processed and reduced to key trending variables, transmit data to a remote server,
or communicate with a control device, e.g., a distributed control system (“DC S,” e.g., Nalco
3D technology, available from Nalco Water, an Ecolab company, 1601 West Diehl Road,
Naperville, Illinois 60563), a laboratory information management system (e.g., a “LHVIS”
software/hardware package), and/or a cloud ing system.
Creating the digital image can be acquired by simply taking a snap-shot of the
substrate, and a series of digital images can be acquired by taking two or more snap-shots of
the substrate over time. In certain embodiments, the l images of the series of digital
images are averaged, which can provide improved signal-to-noise ratio, which, for example,
may be used to create a apse video synchronized to process data collected by measuring
a ter of the industrial water in the industrial water . The method may further
comprise analyzing (e.g., synthesizing) the data collected from the digital image, or series
thereof, by mathematically transforming the data, which in certain embodiments may provide
further insight on the detected deposit.
The ability to capture the substrate image at different times provides a means to
monitor the changes ing on the substrate surface, in this instance, due to deposit.
Furthermore, the ability to store image data provides the ability to compare current image
data to past ations of different substrates of all kinds, e.g., similarly-situated substrates
in the same industrial water system, rly-situated substrates in different rial water
systems, statistical analyses of a population of substrates, and the like. For example, a series
of digital images of a substrate can be created every 5, 10, 15 days and analyzed against
historical digital image data ted at the same ental periods for one or more
substrates located at the same position within the industrial water system. Observed
differences between the data can indicate changes in the process due to the treatment program
and/or water quality.
Utilizing digital image-processing algorithms can provide quantitative tion
of the digital images, which provides quantitative tion of the deposit of the substrate,
and therefore of the deposit of the industrial water system. Data collected from the l
image, or series thereof, can be used to develop overall trends related to a feature (or plurality
thereof) on changes on the substrate surface area.
The methods and systems provided herein may be modified to allow for
multispectral g, which in certain embodiments allows for terization of the type
of deposit formed on the substrate. In certain embodiments of the methods and systems
provided herein, illumination of the substrate is made using narrow band wavelength light
source such as a RGBW (red, green, blue, white) light emitting diode. Illumination of the
substrate at different wavelength bands can ght different colored s that e
insight into classifying the type of deposit. Generally, the light source is limited to RGB, but
a combination broad band light source with narrow band s can be utilized to select
certain more narrow wavelength bands. Alternatively, a multispectral imaging device,
ble from Surface Optics Corporation, 1155 Rancho Bernardo Rd, San Diego,
California, may be utilized as the camera in the system, or to create the digital image, or
series thereof, via multispectral imaging. Generally, a multispectral imaging device can
provide continuous spectral information over a wavelength range from about 400 nm to about
1000 nm for each pixel. In embodiments that utilize multispectral imaging, the spectral range
of the multispectral imaging device allows for identification of the type of deposit, e.g.,
mineral deposit (and possibly type of mineral deposit) versus microbiological deposit.
In certain embodiments of the s and systems described , the substrate
is a quartz crystal microbalance (“QCM”) or with the imaging system. For
embodiments utilizing a QCM detector, the substrate described above and illustrated in FIGS.
1 and 2 is a QCM device operating at, e.g., 5 MHz. The QCM crystal counter ode may
be operated as a heating device to heat the electrode that is exposed to the fluid. Heating the
electrode surface induces calcium carbonate deposit from an industrial water stream
contacting the electrode surface, assuming that calcium and carbonate are present in the
industrial water stream. As deposit forms on the surface, the resonant frequency of the QCM
detector decreases due to mass loading following the Sauerbrey equation. Generally, heating
of the QCM detector is stopped when the mass measurement is made. The QCM detector
does not directly provide information on the composition of the deposit, but only the mass of
the deposit.
Techniques using dissipation are cially available, e.g., QCM-D from
QSense part of Biolin Scientific USA, 215 College Road, Paramus, New Jersey, to determine
whether the scale is soft (e.g., microbiological in nature) or hard (e.g., calcium carbonate).
By coupling, an imaging system as shown in FIGs. 1—3 to a QCM detector in a configuration
such as shown in FIGs. 1—3, insight into the type of scale formed on the surface may be
obtained from the image data.
An example illustrating this point is shown in The top series of images
from left to right asing time) shows calcium carbonate t whereas the bottom
series of images shows a brownish manganese and/or iron deposit on the surface determined
from offline analysis. In both cases, the QCM sensor measured a mass increase over time.
r, without feedback from the imaging system information about the nature of the
t is lost. The additional insight on the deposit aids in treatment program try and
dosage optimization and validation of the effectiveness.
The water stress of the industrial water in the industrial water system may be
tested, e.g., likelihood to form t as well as type of deposit, by operating the heated
substrate at different surface temperatures as well as ochemically changing the pH
locally near the heated substrate e. Furthermore, information related to water chemistry
via alternate analysis, e.g., pH, conductivity, oxidation-reduction potential, treatment
chemical consumption, alkalinity, metal ion concentration, phosphate, sulfate, and silica
concentrations, may be input into a modeling software package, for example, French Creek
Software, which, additionally may include input from the methods and s described
herein. For example, incrementally adjusting the temperature of the heated ate to drive
deposit formation on the heated substrate can provide information on the saturation level or
t precipitation potential of the mineral salt in the industrial water. Additionally, a
matrix of probe systems can be used in contact with, e.g., a single stream of industrial water
with each probe set at a different operating condition, e.g., substrate temperature and/or local
pH adjustment, as well as different substrate surface finish or metallurgy, etc.
In certain embodiments of the methods and s described herein, the heated
substrate comprises a glass-bonded mica block. In certain embodiments of the methods and
systems described herein, the heated substrate comprises a polyetherimide resin (e.g.,
ULTEM resin, available from SABIC).
In certain embodiments of the methods and systems bed herein, the heated
substrate or a portion thereof is coated with temperature sensitive paint. When utilized, the
temperature sensitive paint can provide additional accuracy in measurement of surface
temperature of the heated substrate. Surface temperature of the heated substrate can be a
critical parameter for measuring the water system scale potential because generally the
operator attempts to reach conditions close to that found in a heat ger. Temperature
sensitive paint is ble as, for example, UniTemp temperature sensitive paint supplied by
Innovative if1c Solutions, Inc., 7610 McEwen Road, Dayton, Ohio. In n
embodiments, the surface of the heated substrate in contact with the industrial water is
completely covered with temperature sensitive paint, and in other embodiments, one or more
ns of the surface of the heated substrate in t with the industrial water are covered.
Generally, as the deposit forms on the surface and over the portion(s) of the surface covered
with ature sensitive paint, the emission intensity of the temperature sensitive paint will
se due to reduction in the excitation source penetration to the temperature sensitive
paint. Upon further deposit formation, the emission ses, becoming less detectable
since the deposit formed on the substrate will completely block the excitation source present
in the temperature sensitive paint.
EXAMPLES
An application using the combination of heat transfer and imaging is
demonstrated using a recirculated water system starting with the initial composition shown in
WO 17670
Table l, which is an experimental example of industrial water in an industrial water system.
The water composition of Table l is utilized in all examples.
Table 1: Water composition for recirculating scale test system.
WaterContents ppm as ppm as Water Recipe mg/l Grams
CaC03 Substance substance (CaC03) nce
Ca (Cacos) 550 220 CaCI2-2H2O 550 16.17
Mg (Ca003) 225 54 MgSO4-7H2O 225 11.115
Alkalinity ) 300 366 NaH003 300 10.08
Chloride (Cacos) 600 426 NaCI 50 1.17
Sulfate (Cacos) 225 216
e 1:
For this configuration water recirculated through a manifold with the system as
shown in FIGs. l—3 mounted in the flow loop that used flow rate control to maintain a flow
rate at 1 gallon per minute for 1 inch Schedule 40 NPT pipe. To induce deposit formation,
calcium carbonate tration in the water was adjusted by adding 50 ppm calcium
chloride and 100 ppm sodium bicarbonate at different increments. To benchmark the
measurement a Bridger Scientific INC. DATS (Deposit Accumulation Test System) was
installed on the recirculation loop. The probe used a Model HTl9R 23 mm diameter 19 W
c heater from THORLAB S, 56 Sparta Ave, Newton, NJ, to a 302 stainless steel
substrate having a ess of 0.01 inch. For temperature monitoring, type J thermocouples,
model JlVIQSS-O62G—6 from Omega Engineering INC., One Omega Drive, Stamford,
Connecticut, were utilized. An additional RTD probe was used to e bulk water
temperature. Temperature logging was made on a United Electronics ries, Inc., 27
Renmar Avenue, Walpole, MA, DNA-PPC8 and DNA-AI-207 system connected to a
personal computer. Flow rate monitoring and control was provided by the DATS unit, which
was equipped with feedback flow control. Water conductivity, pH, and oxidation-reduction
potential were continuously monitored using Nalco/ECOLAB 3D TRASAR control with
probes inserted into a holding tank that fed and received the recirculated water.
Results from the experiment show the measured change in the heat transfer
ance, selected image data, and processed image data, which are presented in FIGs. 5—7.
shows the change in HTR is evident by the increasing value starting after 5 hours as
deposit forms on the heated ate. Simultaneously with the HTR measurement, the series
of digital images shows the formation of deposit onto the surface of the heated substrate.
ed sample images are shown in at different points in time. Image data is
2017/042793
collected on a PC using a camera from THE NG SOURCE LLC, 6926 Shannon
Willow Rd, Charlotte, NC, model DFK ECU010-M12 camera with a 8 mm lens from THE
IMAGING SOURCE model TBLC. Illumination was controlled with a Cree XLamp XP-
E2 LED (Cree INC, 4600 Silicon Drive, Durham, North Carolina) and Carlco 10140 lens
(Carlco Optics, 600 Depot Street, e, PA). The example images show conditions before
deposit is t (~2 hours), just after deposit began to form (~ 7 hours), and after an extend
period (~20 hours) to show the extent of deposit formation on the surface of the heated
substrate.
The series of digital images is processed to reduce the 2D image data (1280
ntal x 720 vertical pixel tion) to a single point that is plotted as a trend on
as the integrated image. Image processing steps involve first binning (1'. e., summing) the
pixel intensity values along the vertical direction to generate a horizontal intensity line profile
from 0 to 1280 pixels. An example showing the resulting binned imaged data collected at
different times is shown in Also shown in are vertical dashed lines that
represent the edges of the substrate. The flow direction is from left to right indicated by the
arrow on The binned line profile is initially flat for all processed images because this
is the unheated section to the left of the substrate, as observed in the image data shown in
The binned line profile between the dashed lines represents the substrate area and
changes ing on the substrate are observed in the intensity values of the line profile. As
deposit forms on the substrate surface, the binned line profile increases over time. The
largest change in the line profile is observed at the far right because this is the area where
deposit formation occurs first, because this is the warmest region of substrate. Outside the
substrate area to the right, the binned line profile shows more sensitivity than the left side due
to deposit forming downstream in the direction of the water flow.
By integrating the line profile between the dashed lines shown in the curve
is reduced to a single point. When preformed at different time increments the integrated
value can then be plotted as a trend. The value of the point is representative of the change in
reflectivity and/or color of the substrate e. illustrates this point by comparing
the integrated image data with the ed heat transfer resistances. As deposit forms on
the substrate surface, HTR increases as well as the integrated image data with both g a
corresponding increase. The trend result shown in is corrected for the offset, i.e., no
deposit region, and normalized to the maximum integrated value to rescale the data from zero
to one. In this example, the ated image data detects the presence of deposit
approximately 2 hours sooner than the HTR measurement based on using a detection limit of
2x noise level. In this case, the HTR noise is due to variations in the flow from the flow
control system. Small variations in the flow rate propagate into the HTR calculation because
of convection. Unlike HTR ement, the image measurement is independent of fluid
flow rate and/or temperature.
Example 2:
In the second example shown in a deposit is present on the substrate
e at the start of the plot. The deposit continues to form on the substrate surface
resulting in HTR increasing, which plateaus at time of approximately 3:12, followed by a
sharp decrease around 8:00 due to deposit being removed after introducing acid into the flow
stream. The pH changed from 8.5 to less than 2. The integrated image data shows a similar
trend but differs in the structure leading up to the acid injection. In both cases, after the
deposit is removed from the ate surface, the HTR and integrated image return to a
baseline value that is less than the values at the beginning of the plot.
All references, including publications, patent applications, and patents, cited
herein are hereby incorporated by reference to the same extent as if each reference were
dually and specifically indicated to be incorporated by reference and were set forth in
its entirety herein.
The use of the terms “a” and “an” and “the” and “at least one” and similar
referents in the context of describing the ion (especially in the context of the following
claims) are to be construed to cover both the singular and the plural, unless otherwise
indicated herein or clearly contradicted by context. In particular, the word “series” appears in
this application and should be construed to cover both the singular and the , unless
otherwise ted herein or clearly contradicted by context. The use of the term “at least
one” followed by a list of one or more items (for example, “at least one of A and B”) is to be
construed to mean one item selected from the listed items (A or B) or any combination of two
or more of the listed items (A and B), unless ise indicated herein or clearly
contradicted by context. The terms “comprising,” “having,” “including,” and “containing”
are to be ued as open-ended terms (i.e., meaning “including, but not limited to,”) unless
otherwise noted. Recitation of ranges of values herein are merely intended to serve as a
shorthand method of referring individually to each te value falling within the range,
unless otherwise indicated , and each separate value is incorporated into the
specification as if it were individually recited herein. All methods described herein can be
performed in any suitable order unless otherwise indicated herein or otherwise clearly
contradicted by context. The use of any and all examples, or exemplary language (e.g., “such
as” provided herein, is intended merely to better illuminate the invention and does not pose a
limitation on the scope of the ion unless ise claimed. No language in the
specification should be construed as indicating any non-claimed element as essential to the
practice of the invention.
Preferred embodiments of this invention are described herein, including the best
mode known to the inventors for carrying out the invention. ions of those preferred
embodiments may become nt to those of ordinary skill in the art upon reading the
foregoing description. The inventors expect skilled artisans to employ such variations as
appropriate, and the inventors intend for the invention to be practiced otherwise than as
specifically described herein. Accordingly, this invention includes all modifications and
equivalents of the subject matter recited in the claims appended hereto as permitted by
applicable law. Moreover, any combination of the above-described elements in all le
variations f is encompassed by the ion unless ise indicated herein or
otherwise clearly contradicted by context.
Claims (20)
1. A method of analyzing a deposit on a ate contacting industrial water in an industrial water system, the method comprising: heating a ate while the substrate contacts an industrial water in an industrial water system to a temperature higher than a temperature of the industrial water, y forming a deposit on the substrate; ng a series of l images of the substrate while the substrate contacts the industrial water in the rial water system; identifying a deposit feature in each of the series of digital images of the substrate; and analyzing the deposit feature in each of the series of digital images of the substrate to determine a deposit formation trend on the substrate in the industrial water system.
2. The method of claim 1, further comprising controlling treatment of the industrial water of the industrial water system with a deposit inhibitor based on the determined deposit formation trend.
3. The method of claim 1 or claim 2, further comprising determining a heat transfer resistance of the substrate.
4. The method of any one of the preceding claims, further sing measuring a parameter of the rial water in the rial water system selected from pH, conductivity, oxidation-reduction potential, linear polarization resistance, derivatives thereof, and combinations thereof.
5. The method of any one of the preceding claims, further comprising measuring temperature at a plurality of points to determine heat transfer resistance of the substrate.
6. The method of any one of the preceding claims, wherein the deposit comprises a calcium-containing substance.
7. The method of claim 6, wherein the m-containing substance is calcium carbonate.
8. The method of any one of the preceding claims, wherein the deposit comprises an iron-containing substance.
9. The method of claim 8, wherein the iron-containing substance is ferric oxide.
10. The method of any one of the ing claims, wherein creating the series of l images of the substrate comprises capturing multispectral digital images.
11. The method of any one of the preceding , further comprising acting to control deposit formation in the industrial water system.
12. The method of claim 11, wherein the acting to control deposit formation in the industrial water system comprises taking an action selected from sing dosage of a deposit inhibitor, selecting a different deposit inhibitor, modifying the deposit inhibitor, altering a physical property of the industrial water system, shutting down the industrial water system, and ations thereof.
13. The method of any one of the preceding claims, n analyzing the deposit feature comprises classifying the deposit feature on the substrate according to color.
14. The method of any one of the ing claims, further comprising moving the substrate in the industrial water system to expose a second region of interest to digital imaging; and repeating the steps of the method.
15. The method of any one of the preceding claims, wherein forming the deposit on the substrate comprises forming an inorganic deposit on the substrate.
16. The method of any one of the preceding , wherein the industrial water system comprises at least one of a heat exchanger, a condenser, and a cooling tower, and heating the substrate to the temperature higher than the temperature of the industrial water comprises accelerating formation of the deposit beyond a rate at which the deposit would otherwise form on the at least one of the heat exchanger, the condenser, and the cooling tower.
17. The method of any one of the preceding claims, wherein ing the deposit feature in each of the series of digital images further comprises determining a composition of the deposit based on at least one of a color of the deposit e and a morphology of the deposit feature.
18. The method of any one of the preceding claims, wherein the industrial water system is a heating water system or a cooling water system.
19. The method of any one of the ing claims, wherein the substrate is formed of metal.
20. The method of any one of claims 1 to 18, wherein the ate is a quartz crystal microbalance. WO 17670 1 l6 W0 17670
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201662364138P | 2016-07-19 | 2016-07-19 | |
US62/364,138 | 2016-07-19 | ||
PCT/US2017/042793 WO2018017670A1 (en) | 2016-07-19 | 2017-07-19 | Control of industrial water treatment via digital imaging |
Publications (2)
Publication Number | Publication Date |
---|---|
NZ749801A NZ749801A (en) | 2021-09-24 |
NZ749801B2 true NZ749801B2 (en) | 2022-01-06 |
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