NZ626604B2 - Apparatus for forming thin film - Google Patents

Apparatus for forming thin film Download PDF

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Publication number
NZ626604B2
NZ626604B2 NZ626604A NZ62660412A NZ626604B2 NZ 626604 B2 NZ626604 B2 NZ 626604B2 NZ 626604 A NZ626604 A NZ 626604A NZ 62660412 A NZ62660412 A NZ 62660412A NZ 626604 B2 NZ626604 B2 NZ 626604B2
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NZ
New Zealand
Prior art keywords
chamber
container
vacuum
heat generating
generating element
Prior art date
Application number
NZ626604A
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NZ626604A (en
Inventor
Keiichi Fujimoto
Masaki Nakaya
Hiroyuki Ooshima
Hiroyasu Tabuchi
Original Assignee
Kirin Beer Kabushiki Kaisha
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Publication date
Application filed by Kirin Beer Kabushiki Kaisha filed Critical Kirin Beer Kabushiki Kaisha
Priority claimed from PCT/JP2012/083679 external-priority patent/WO2013099960A1/en
Publication of NZ626604A publication Critical patent/NZ626604A/en
Publication of NZ626604B2 publication Critical patent/NZ626604B2/en

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D23/00Details of bottles or jars not otherwise provided for
    • B65D23/02Linings or internal coatings
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04Coating on selected surface areas, e.g. using masks
    • C23C16/045Coating cavities or hollow spaces, e.g. interior of tubes; Infiltration of porous substrates
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/26Deposition of carbon only
    • C23C16/27Diamond only
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/34Nitrides
    • C23C16/345Silicon nitride
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/40Oxides
    • C23C16/401Oxides containing silicon
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/40Oxides
    • C23C16/403Oxides of aluminium, magnesium or beryllium
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/448Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
    • C23C16/4488Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by in situ generation of reactive gas by chemical or electrochemical reaction
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/46Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54Apparatus specially adapted for continuous coating

Abstract

apparatus for forming thin film on the outer surface of a bottle. Film formation upon a surface of a container (4) is performed in a vacuum chamber (1) and using a heat generating element (21). The apparatus includes an vacuum evacuation device that evacuate said vacuum chamber; and a shifting device that, after evacuation, shifts the container and the heat generating element relatively to each other within said vacuum chamber. Wherein said vacuum chamber is divided into a chamber for the container (1) where the container is inserted and taken out, and a chamber for protection of the heat generating element (2) where the heat generating element is held in a vacuum state, and a vacuum isolation device is provided between said chamber for the container and said chamber for protection. vice that, after evacuation, shifts the container and the heat generating element relatively to each other within said vacuum chamber. Wherein said vacuum chamber is divided into a chamber for the container (1) where the container is inserted and taken out, and a chamber for protection of the heat generating element (2) where the heat generating element is held in a vacuum state, and a vacuum isolation device is provided between said chamber for the container and said chamber for protection.

Description

/Y')6ontt P"/u /-Jt DESCRI PT ION TITLE OF INVENT]ON: APPARATUS FOR FORM]NG THIN FILM TECHNICAL FIELD t00011 The present invention rel-ates to an apparatus forming thin film thj-n formation filrm apparatus) that forms a film gas performance thin whose barrier is high, such (Diamond as a DLC Like Carbon) fil-m, an SiOx film, an SiOC fi-Im, an SiOCN film, an SiNx film, an AIOx fil-m or the like, upon either the inner surface or the ouLer surface ot both, of a container such as a polyethylene (a terephthalate bottle bottle) or the like.
BACKGROUND ART 0002 While in the prior art hollow containers made from plastic which are light in weight, such as PET bottles, have been used for storing soft drinks and the like, the use of nlastir: r:onfai.nerS fielci has snre3d in the fOOd and drink ry! v rapidly due to their convenience and l-ow cost, and, at present PET quite proport.ion time, bottles constitute a Iarge of al-I of the containers. However, with respect to the plastic containers, as compared with the characteristics metallic cans and glass gas performance bottles, as barrier is lower, ingress of oxygen into the interior of the contaj-ners and discharge of carbonic gas acid to the exterior of the containers may wel-l occurr so that, in some cases, the performance quality for maintaining of the contents would inferior. Due to this, attempts have been made to form upon the inner surface of the container, a film having gas high performance, barrier such as a DLC film or the like. It is ncrssihle i-n fofm a film whOse.ras vvrrvru herri er nerformanr-o is hioh- ysp vq!!!s! yEt!v!lLtqIIUg Io rIIyIr, such as the DLC film or the like, upon either the inner surface or the out.er surface of the container in a vacuum chamber of a vacuum environment plasma according to a CVD method, a metallic vapor deposition method, a heat generating el-ement CVD method, a spattering method, or the like; and in this gas performance case the barrier against t.he ingress of oxygen into the interior of the container and the discharge of carbonic gas acid to the exterior of the container can be dramatically improved.
CITATION LIST PATENT LITERATURE Patent Document 1: Japanese Laid-Open Patent Publication 2008-127054.
Patent Document 2: Japanese Laid-Open Patent Publication 2004-107781.
TECHNICAL PROBLEM When a container is mass produced by forming a thin film such as a DLC film or the like upon its surface, the processes are repeated of: performing film formation upon the container in the interior of a vacuum chamber that is maintained in the vacuum state; after having completed film formation, returning the interior of the vacuum chamber to atmospheric pressure and taking out a processed container upon which processing has been completed; and after that, putting the next container into the vacuum chamber, vacuumizing the chamber, and performing film formation. Due to this, when performing vacuumization of the vacuum chamber, it is always necessary to vacuumize the chamber starting from the atmospheric pressure. Therefore, the problem arises that the time period for vacuumizing the vacuum chamber becomes long, and the cycle time becomes slow. In order to attain a shorter cycle time by shortening the time period for vacuumization, it is necessary to provide a large sized vacuum pump, so that there are problems that the facility cost and also its running cost are both increased.
Moreover, with respect to the heat generating element CVD method, which is also known as the hot wire CVD method, the hot filament CVD method, the catalytic chemical vapor deposition method and so on, in the process of forming a thin film upon the surface of the container, a heat generating element is installed within the vacuum chamber because the film formation is performed by putting the heat generating element in the neighborhood of the container. Since the vacuum chamber is returned to the atmospheric pressure after the film formation process has been completed, accordingly the heat generating element is periodically exposed to air. As a result, there are problems that deterioration of the heat generating element due to oxidization and so on takes place progressively, so that its functionality for film formation becomes worse. (8835805_1):SPM OBJECT OF THE INVENTION It is the object of the present invention to substantially overcome or ameliorate one or more of the above disadvantages, or at least provide a useful alternative.
SUMMARY [0006a] According to an aspect of the present invention, there is provided an apparatus for forming thin film comprising: a vacuum chamber in which film formation upon a surface of a container is performed in a vacuum state by using a heat generating element; a vacuum evacuation device that vacuumizes said vacuum chamber; and a relative shifting device that, after vacuumization of said vacuum chamber has started, shifts the container and the heat generating element relatively to each other within said vacuum chamber, wherein said vacuum chamber is divided into a chamber for the container where the container is inserted and taken out, and a chamber for protection of the heat generating element where the heat generating element is held in a vacuum state, and a vacuum isolation device is provided between said chamber for the container and said chamber for protection. [0006b] According to another aspect of the present invention, there is provided a method of forming thin film by using an apparatus for forming thin film comprising: a vacuum chamber in which film formation upon a surface of a container is performed in a vacuum state by using a heat generating element, the vacuum chamber being divided into a chamber for the container where the container is inserted and taken out, and a chamber for protection of the heat generating element where the heat generating element is held in a vacuum state; and a vacuum isolation device which is provided between said chamber for the container and said chamber for protection, wherein the method comprises the steps of: inserting and taking out the container into and from said chamber for the container, while keeping a state of the heat generating element in a vacuum state by closing said vacuum isolation device when said chamber for protection is in the vacuum state; (8835805_1):SPM opening said vacuum isolation device when said chamber for the container has been vacuumized to communicate together said chamber for the container and said chamber for protection; and shifting the container and the heat generating element relatively to each other after said vacuum isolation device has been opened to form said thin film.
An apparatus for forming film of at least a preferred embodiment comprises: a vacuum chamber in which film formation upon a surface of a container is performed in a vacuum state by using a heat generating element; an vacuum evacuation device that vacuumizes the vacuum chamber; and a relative shifting device that, after vacuumization of the vacuum chamber has started, shifts the container and the heat generating element relatively to each other within the vacuum chamber. The heat generating element is a component that the element itself is not substantially vaporized, and that is capable of decomposing a raw material gas into chemical species by a catalytic chemical reaction and/or thermally; this heat generating element may be a wire the main component of whose outer layer is, for example, tantalum, tantalum carbide, tungsten, tungsten carbide, nickel-chrome alloy, or carbon.
Preferably, it is possible to perform film formation at any of the following stages: the stage of inserting the heat generating element into the container; the stage of shifting the heat generating element and the container relatively to each other; and the stage of taking out the heat generating element from the container.
The insertion and removal need not only be performed once; they may be performed repeatedly. Accordingly, it becomes possible to perform film formation for only a short time period at the locations where time period for film formation should be limited from the point of view of thermal deformation, while with respect to the other locations, film formation is performed sufficiently, and as a result it becomes simple and easy to enhance the barrier performance of the entire container.
Preferably, the relative shifting device may relatively shift the container and the heat generating element at variable speed.
Preferably, since it is possible to shift the container and the heat generating element relatively to each other at variable speed, it is possible to adjust the time period for film formation upon each portion of the container according to the container shape, the container heat (8835805_1):SPM resistance characteristics, and the required performance for the container. Thereby, it becomes simple and easy to adjust the barrier performance and external appearance of the container.
Preferably, the vacuum chamber is divided into a chamber for the container where the container is inserted and taken out, and a chamber for protection of the heat generating element where the heat generating element is held in a vacuum state; and a vacuum isolation device may be provided between the chamber for the container and the chamber for protection.
Preferably, it is possible always to keep the interior of the chamber for protection in a vacuum state, since the vacuum chamber is divided into: the chamber for the container for inserting the container to perform film formation upon the container; and the chamber for protection for holding the heat generating element in a vacuum state. Due to this, it is possible to prevent deterioration of the heat generating element, and that its functionality for film formation does not decrease. Moreover, at the moment of film formation, vacuumization of the chamber for the container from atmospheric pressure is performed, and when the chamber for the container has reached the predetermined vacuum pressure, then it is possible to lower the vacuum pressure of the chamber for the container by establishing communication thereof with the chamber for protection having a lower vacuum pressure than the chamber for the container.
In other words, it is possible to shorten the time period for vacuumization of the chamber for the container and to shorten the cycle time, since the chamber for protection functions as a vacuum buffer.
Preferably, each of the chamber for the container and the chamber for protection may be linked to an individual vacuum evacuation device.
Preferably, the chamber for the container may be vacuumized from atmospheric pressure to be brought to a vacuum state at a moment of film formation upon the container, and be returned to atmospheric pressure after the film formation has been completed.
Preferably, while said chamber for the container is returned to atmospheric pressure after the film formation being completed, the chamber for protection may be kept in a vacuum state. (8835805_1):SPM Preferably, the vacuum isolation device may be opened when the chamber for the container has been vacuumized, so as to communicate together the chamber for the container and the chamber for protection.
The chamber for the container may be provided as a chamber for film formation where the film formation is performed upon the container, due to the relative shifting device which is provided to shift the heat generating element between the chamber for protection and the chamber for the container.
Preferably, the heat generating element may be inserted into the chamber for the container after the vacuum isolation device has been opened, and be returned to the chamber for protection after film formation has been completed.
Preferably, since the heat generating element is always kept in a vacuum state, accordingly it is possible to prevent deterioration of the heat generating element, and its functionality for film formation does not decrease.
Preferably, after the film formation has been completed and after the heat generating element has been returned to the chamber for protection, the vacuum isolation device may be closed.
[Paragraphs 0013 to 0014 intentionally deleted] Preferably, the chamber for protection may be provided as a chamber for film formation where the film formation is performed upon the container, due to the relative shifting device which is provided to shift the container between said chamber for the container and said chamber for protection. In particular, if a mechanism is provided that is capable of adjusting the shifting speed at which the container is shifted, then it is possible to adjust the time period for film formation upon each of the portions of the container according to the container shape, the container heat resistance characteristics, and the performance required for the container; and it becomes simple and easy to adjust the barrier performance and external appearance of the container.
Preferably, by raising and lowering the container between a container in/out chamber as the chamber for the container and a film deposition dedicated chamber as the chamber for protection, it is possible to supply the unprocessed container from the container in/out chamber (8835805_1):SPM into the film deposition dedicated chamber, and it is also possible to take out the processed container from the film deposition dedicated chamber and transfer it to the container in/out chamber.
Preferably, the container may be inserted into the chamber for protection after the vacuum isolation device has been opened, and is returned to the chamber for the container after the film formation has been completed. After the film formation has been completed and after the container has been returned to the chamber for the container, the vacuum isolation device may be closed.
[Paragraphs 0017 to 0018 intentionally deleted] Preferably, the heat generating element may be inserted into the container when the container has been shifted into the film deposition dedicated chamber. Since, due to this, film formation is performed upon the inner surface of the container, accordingly the thin film is prevented from physical contact imposed from the exterior of the container after the film formation, so that quality management of the container becomes simple and easy.
However, performing the film formation upon the outer surface of the container has the advantage that there is no contact between the film and the contents of the container, and this can be implemented according to other aspects of the present invention. In this case, the film deposition dedicated chamber may be adapted so that the heat generating element is disposed externally to the container. By disposing the heat generating element appropriately, provided are selectable variations which are a case that a film is formed only upon a part of the container outer surface at one time and a case that a film is formed upon the entire outer surface of the container at one time.
Preferably, the container chamber may comprise an open/close gate for taking out and inserting the container from and into the container chamber.
Preferably, by opening the open/close gate, it is possible to take out the container from the container chamber, or to insert the container into the container chamber. And moreover, after (8835805_1):SPM the container chamber is put into an airtight state by closing the open/close gate, it is possible to vacuumize the interior of the container chamber with a vacuum pump.
Preferably, the apparatus for forming thin film may further comprise a container transfer device that transfers an unprocessed container from a predetermined position into the chamber for the container, and that transfers a processed container from the chamber for the container to a predetermined position.
Preferably, it is possible to transfer the unprocessed container from a predetermined position, for example from the conveyance surface of a conveyer, into the chamber for the container, and moreover it is possible to transfer the processed container from the chamber for the container to a predetermined position, for example, to the conveyance surface of the conveyer.
If the film formation processing is performed upon the container in the chamber for protection with the container in the inverted state, then the container transfer device should include an inversion device. The container transfer device inverts with the inversion device, the unprocessed container at a predetermined position, for example upon the conveyance surface of a conveyer, to put the unprocessed container into an inverted state, and after that, the container transfer device transfers the unprocessed container of the inverted state into the chamber for the container. It should be understood that it would also be acceptable to arrange to invert the container in a waiting position after the container has been transferred. Moreover, the container transfer device transfers the processed container from the container in/out chamber to the inversion device, and after that, inverts with the inversion device the processed container to be put into the upright state. Then, the container transfer device returns the processed container in the upright state to a predetermined position, for example upon the conveyance surface of a conveyer.
On the other hand, if the film formation processing is performed upon the container in the chamber for protection with the container in the upright state, then the container transfer device should hold the unprocessed container at a predetermined position, for example upon the conveyance surface of the conveyer to transfer the unprocessed container into the chamber for the container. And, after having taken out the processed container from the chamber for the (8835805_1):SPM container, the container transfer device should transfer the processed container to a predetermined position, for example upon the conveyance surface of the conveyer.
Preferably, the predetermined position may be a position upon a conveyer.
Preferably, the volume of a film deposition chamber as the chamber for the container may be smaller than the volume of a heat generating element protection chamber as the chamber for protection.
Preferably, when the film deposition chamber is vacuumized, it is possible to shorten the time period for the vacuumization.
Preferably, the film deposition chamber may be disposed above, while the heat generating element protection chamber is disposed below.
Preferably, when the heat generating element is· inserted from the heat generating element protection chamber into the interior of the container within the film deposition chamber at a moment of film formation, by putting the container into the inverted state, it is enough to just elevate the heat generating element. Moreover, when the heat generating element is pulled out from the container after film formation and is returned to the heat generating element protection chamber, it is enough to just lower the heat generating element. Accordingly, it is possible to employ a simple mechanism such as an electrically driven rising and lowering cylinder or the like as a drive mechanism for the heat generating element.
Preferably, the capacity of the vacuum pump on the side of the film deposition chamber is smaller than the capacity of the vacuum pump on the side of the heat generating element protection chamber.
Preferably, it is possible to make the vacuum pump on the film deposition chamber side more compact.
A preferred embodiment of the present invention provides the advantageous effects listed below. (8835805_1):SPM (1) It becomes possible to perform film formation for only a short time period at the locations where the film formation time period could be limited from the point of view of thermal deformation, while with respect to the other locations it is possible to perform film formation sufficiently. As a result, it becomes simple and easy to enhance the barrier characteristics of the entire container. (2) It becomes simple and easy to form a film thickness distribution that is appropriate according to the intended purpose of the container and the required appearance quality of the container. Moreover, it becomes possible to implement coloration having graduations or the like. (3) In the prior art, as a countermeasure to prevent thermal deformation of the container, it was practiced only to start film formation after the heat generating element had been perfectly inserted into the container; but, according to the present invention, it becomes possible to reduce the cycle time, since the film formation can be started from the stage of inserting the heat generating element into the container. (4) Since it is possible always to keep the heat generating element in the vacuum state, accordingly it is possible to prevent deterioration of the heat generating element, so that the element's functionality for film formation does not decrease. (5) With respect to only the container chamber, vacuumization and open to atmosphere are implemented repeatedly, while the chamber for protection is always kept in the vacuum state.
Due to this, it is only necessary to vacuumize the chamber for the container at a moment of film formation. Therefore it is possible to shorten the time period required during film formation for vacuumizing the entire vacuum chamber, so that it is possible to shorten the cycle time. (6) When, after having put the container into the chamber for the container, the chamber for the container has been vacuumized from atmospheric pressure and has reached a predetermined vacuum pressure, the communication between the chamber for the container and the chamber for protection having a lower vacuum pressure than the chamber for the container is established. Thereby, it is possible to lower the vacuum pressure in the chamber for the container. In other words, since the chamber for protection functions as a vacuum buffer, accordingly it is possible to shorten the time period required for vacuumizing the chamber for the container, so that it is possible to shorten the cycle time. (8835805_1):SPM (7) By raising and lowering a plurality of containers between the chamber for the container and the chamber for protection, it is possible to supply this plurality of unprocessed containers from the chamber for the container to the chamber for protection all at the same time and to perform film formation processing upon this plurality of containers simultaneously. Moreover, once they have been processed, it is also possible to take out the plurality of containers processed from the chamber for protection and transfer them to the chamber for the container.
BRIEF DESCRIPTION OF DRAWINGS [0027a] Preferred embodiments of the invention will be described hereinafter, by way of examples only, with reference to the accompanying drawings, wherein: Fig. 1 is a schematic sectional view showing the overall structure of an apparatus for forming thin film (a thin film formation apparatus) according to the present invention; Fig. 2 is a side sectional view of the film formation apparatus shown in Fig. 1; Fig. 3 is a schematic sectional view showing the overall structure of a thin film formation apparatus according to a second embodiment of the present invention; Fig. 4 is a side sectional view of the film formation apparatus shown in Fig. 3; Fig. 5 is a schematic sectional view showing a PET bottle and a line for a heat generating element inserted into that PET bottle; Fig. 6 is a schematic figure showing a container and a heat generating element; and Fig. 7 is a graph showing the relationship between: the distance between the heat generating element and the inner surface of the container; and the relative shifting speed of the heat generating element and the container. (8835805_1):SPM DESCRIPTION OF EMBODIMENTS In the following, embodiments of the apparatus for forming thin film (the thin film formation apparatus) according to the present invention will be explained with reference to Figs. 1 through 7. It should be understood that, in Figs. 1 through 7, the same reference symbols are appended to structural elements that are the same or equivalent, and duplicated explanation will be omitted.
Figs. 1 and 2 are figures showing a first embodiment of the thin film formation apparatus according to the present invention.
Fig. 1 is a schematic sectional view showing the overall structure of the thin film formation apparatus according to a first embodiment of the present invention. And Fig. 2 is a side sectional view of the film formation apparatus shown in Fig. 1. As shown in Figs. 1 and 2, the thin film formation apparatus of the present invention has a structure in which a vacuum chamber is divided into two parts: a film deposition chamber 1, and a heat generating element protection chamber 2. The film deposition chamber 1 is disposed above, while the heat generating element protection chamber 2 is disposed below. The volume of the film deposition chamber 1 is set to be less than the volume of the heat generating element protection chamber 2.
The film deposition chamber 1 and the heat generating element protection chamber 2 are linked via a gate valve 3, which serves as a vacuum isolation device. The film deposition chamber 1 is linked via a link portion 1a to a vacuum pump (not shown in the drawings) that serves as a vacuum evacuation device, so that the interior of the film deposition chamber 1 can be vacuumized by this vacuum pump. Moreover, the film deposition chamber 1 comprises a door or shutter (not shown in the drawings) that opens and closes for taking out a PET bottle 4 from the film deposition chamber 1, or for inserting a PET bottle 4 thereinto. A bottle holding portion 11 is installed in the film deposition chamber 1, the bottle holding portion 11 holding the PET bottle 4 in an inverted state.
Moreover, the heat generating element protection chamber 2 is linked via a link portion 2a to a vacuum pump (not shown in the drawings) that serves as a vacuum evacuation devcie, so that the interior of the heat generating element protection chamber 2 can be vacuumized by this vacuum pump. In this embodiment, each of the film deposition chamber 1 and the heat (8835805_1):SPM generating element protection chamber 2 is linked to an individual vacuum pump. The capacity of the vacuum pump on the the film deposition chamber 1 side is smaller than the capacity of the vacuum pump on the the heat generating element protection chamber 2 side. A heat generating element unit 22 comprising a heat generating element 21 that is electrically connected to a power supply (not shown in the drawings), and an electrically operated cylinder for raising and lowering heat generating element unit 23 that raises and lowers the heat generating element unit 22 are disposed within the heat generating element protection chamber 2. Although this feature is not shown in the figure, it should be understood that a portion of the heat generating element 21 consists of a rod shaped component made from copper that can be inserted into the interior of the PET bottle 4 and removed therefrom, so that heat is not applied substantively when the heat generating element applies heat. The electrically operated cylinder for raising and lowering heat generating element unit 23 is configured so as to vary with a speed controller, the rising/lowering speed of raising or lowering the heat generating element unit 22.
This electrically operated cylinder for raising and lowering heat generating element unit 23 constitutes a relative shifting device that shifts the PET bottle 4 and the heat generating element 21 relatively to each other, and relatively shifts the PET bottle 4 and the heat generating element 21 so as to make the portion of the PET bottle 4 upon which a film is to be formed and the heat generating element 21 face each other. It should be understood that, in Figs. 1 and 2, the heat generating element 21 is shown in its elevated state.
In the film formation apparatus having a structure like that shown in Figs. 1 and 2, the interior of the heat generating element protection chamber 2 is always kept in a vacuum state, so that the heat generating element 21 existing in the heat generating element protection chamber 2 is always kept in a vacuum state. At this moment, the gate valve 3 is in the closed state, so that communication between the heat generating element protection chamber 2 and the film deposition chamber 1 is intercepted.
After the PET bottle 4 has been put into the film deposition chamber 1 and the PET bottle 4 has been set up on the bottle holding portion 11, the vacuumization of the interior of the film deposition chamber 1 starts. And, when the pressure in the interior of the film deposition chamber 1 has reached a predetermined vacuum pressure which is higher than the vacuum pressure within the heat generating element protection chamber 2, then the gate valve 3 is (8835805_1):SPM opened to establish the communication between the film deposition chamber 1 and the heat generating element protection chamber 2. Due to this, the vacuum pressure within the film deposition chamber 1 decreases and becomes equal to the vacuum pressure within the heat generating element protection chamber 2. Accordingly, it is possible to shorten the time period required for vacuumizing the film deposition chamber 1. And electrical power is supplied from a power supply not illustrated to the heat generating element unit 22, so that the heat generating element 21 produces heat. And, by operating the electrically operated cylinder for raising or lowering heat generating element unit 23, the heat generating element unit 22 is raised or lowered at a predetermined speed, (8835805_1):SPM generating so that the heat element 2t and the gas supply conduit 25 are inserted into or taken out from the PET bottle 4. fn the meantime, the interior of the film deposition chamber 1 reaches a vacuum pressure at which film formation is possible, and, with along supplyinq raw material gas from the supply conduit 25 to the interj-or of the PET bottle 4, also electrical current is flowed to the heat generating element 21.
Due to this, the heat generating el-ement 2I reaches a high temperature, and the heat generating element 2I becomes a heat catallystic element. The raw material gas that is blown gas out from the supply conduit 25 comes into contact with t.he heat generating element 2t that has become the heat catalytic element, and is decomposed into chemical species by a catalytic chemical reaction and/or thermaJ_Iy.
These chemical- species reach inner the surface of the bottle 4 so as to form a thin film upon the inner surface of the PET bottle 4. t00331 According to the present invention, by providing structure possible that makes it to adjust the rising and lowering speed at which the heat generating element unit 22 is raised and lowered, it is possible to adjust the time period during which the firm is formed over each portion container according to the shape of the container, the heat resistance characteristics of the container, and the required performance for the container, and it becomes simpre and easy to adjust the barrier performance and ext.ernal- appearance of the container.
These features will- be expl-ained in detail hereinafter. t0034 l when a thin film predetermined of a thickness has been formed on the inner surface of the bottle 4, which means that the film formation process has been completed, then the generating heat element unit 22 1s lowered, and the heat generating e]ement 2r is returned to the interior of the heat generating protection element chamber 2. Then the gate varve 3 is closed, so that the communication between the firm deposition chamber 1 and the heat generating element protection chamber 2 is intercepted.
Thereafter, the interror of the firm deposition chamber 1 is returned t.o atmospheric pressure, and, after the processed bottle 4 whose processing been completed has been taken out from film pET deposition chamber r, the next bottr-e put 4 is into the firm deposition chamber L, which is then vacuumized that the film formation is executed. During the processes described above, the heat generating element 21 is always kept in the vacuum state. Thereafter, the processes described above are repeated. t003sl Next, a second embodiment of the thin film formation apparatus present according to the invention will_ explained with reference to Figs. 3 through Fig. 3 is a schematic sectional view showing the overall structure of the thin film formation apparatus according the second embodiment of the present invention.
And Fig. 4 is a side sectional- view of the film formation apparatus shown in Fig. 3. As shown in Figs. 3 and 4, the thin film formation present apparatus of the invention comprises two chambers within a device frame F: a film deposition dedicated chamber 31, and a bottle inlout chamber 32. The film deposition dedlcated chamber 31 is disposed below, while the bottl_e inlout chamber 32 is disposed above. The film deposition dedicated chamber 31 and the bottle lnlout chamber 32 are gate connected via a val-ve 33, which serves as a vacuum isolation device. t00361 film deposition dedicated chamber 31 is ]inked via portion link 31a to a vacuum pump Vp1, which serves as a vacuum evacuation devcie, so that the interior of the film deposition dedicated chamber 31 can be vacuumized by the vacuum pump prurality VP1. A of heat generating element units 44 comprising heat generating elements 42 are disposed within the film deposition dedicated chamber 31. Electrical power supplied from a power supply not illustrated to the heat generating element units 44, and as a result the heat generating erements 42 are caused produce to heat.
Each of generating the heat erements 42 is inserted into one of a prurarity of PET bottles 4 being held in the inverted state. order to heat the heat generating erements 42, an AC or Dc power supply can be employed, the poser supply providing r L^^f *- eas.i I v el er:f ri end hai nn nhaa^o- f l.rrn uqrrrJ srsvLr rUq! ^- tICctL_LLt9, arru vsrrtV urrCCp€I tnan a combi-nation of a high freguency power suppty and an impedance matching device, which woul-d be used in a plasma cVD method. rn this embodiment generating elght heat element units 44 are providedr so that it becomes possible to perform firm formation processing upon a totar of eight bottres within the film deposition dedicated chamber 31 at the same trme. 0037 Furthermore, the bottle inlout chamber 32 is linked via a l-ink portion 32a to a vacuum pump VP2, which serves as a vacuum evacuation devcie, so that the interior of the bottl_e inlout chamber 32 can be vacuumized by the vacuum pump Vp2.
Two sets of bottle rising/lowering devices 51, each of which raises and lowers a plurality of PET bottl,es 4 while holding them, are instarred within the bottre inlout chamber 32.
Each these bottle rising/lowering devices 51 is configured so as to be capable of raising and lowering four bottles 4 a=nh l.rnr-r-nla While hOldincr i-hom Tcrohrr pOttOIe riqina/1ar;ari wrrrlE rrvrurlty urrsrr!. rE!svy, ea(.)Il , *-,,---ng devices is capable of lowering four PET bottles 4 into the rirm rlanncif icn dedicated vvurvq9su chamber vrrqllrvg! holdinn fhern 31 Jl whi]e wIlfIE rrvrvfllg LIlElil., ctlLLl al-so capable of taking out the four PET bottl-es 4 from the film deposition dedicated chamber 31 and bringing them into the bottle inlout chamber 32. The bottole rising/lowering device 51 is configured t.o be capable of varying rising/rowering speed at which the bottofes 4 are raised or lowered between the film deposition dedicated chamber 31 and the bottle inlout chamber 32. The bottl-e rising/rowering device 51 constitutes a rerative shifting device that makes the PET bottle 4 and the heat generating element 42 shift rerativery to each otherr so that the bottl-e rising/lowering device 51 shifts the PET bottres 4 and the heat. generating e]ements 42 relatively so as to make the portion of each bottle upon which a film is to be formed face the heat j-ng generat erement 42 corresponding to t.he erement 42.
Rising/lowering mechanism portion of each bottle rising/lowering device 51 may be instal-l-ed at the interior the chamber, or may be installed at the exterior of the chamber. rn a case that the rising/rowering mechanism portion is instal]ed at the exterior of the chamber, portion only the for holding the PET bottles 4 exsits at the interior of the chamber, and this port.ion is raised and lowered by the rising/lowering mechanism portion instal-red at the exterior of the chamber. 0038 An open/cl-ose gate provided 56 is at the upper end of t.he bottle inlout chamber 32, and, by closing this open/close gate 56, possibre it is to put the interior of the bottle suppry/remove chamber 32 into an airtight stater so that the bottol-e supply/remove chamber 32 can be vacuumized by vacuum pump VP2. And, by opening this open/crose gate 56, 1t possible pET is put to unprocessed bottles 4 into the j-nterior of the bottle inlout chamber 32, or to take out processed PET bottles 4 from the bottle inlout chamber 32. t00391 inversion inverts PET Next, dD device 57 that the bottles 4 and a bottl-e handling device 60 that inserts the inverted PET bottles 4 into the bottle inlout chamber 32 and processed al-so takes out the PET bottles 4 from the bottle in/out chamber 32 wj-l-l be explained. The inversion device 51 and the botole handling device 60 constitute a bottle transfer device.
As shown in Fig. 4, a conveyer 10 that conveys PET bottles 4 in the upright state is install-ed within the device frame F. A screw 71 for pitch regulation is disposed in parallel 70 with the conveyer for making a space between the pet bottles 4 at a certain regulated pitch, thus defining fixed intervals between the PET bottles upon the conveyer 70. Moreover, the inversion device 51 for invert.ing the PET bottl-es 4 is installed in contiguity with the conveyer 70. 100401 plurality The inversion device 51 comprises a of chucks 58 that catch the body portions of the PET bottles 4. The inversion device is configured so as to catch and invert qQ j r.ri t-h {-ha nl rrrq r- ha n'l rrr2l ptrT f rz nf l i trz of r:hrrr:ks hottleS 4 that have been spaced by the screw 7l- at regulated hit-^l-r rrhnh t-ha 1n Mnranrrar 1-ha !rv!vvvv!, inVefSiOn deViCe 51 ^Ah\r6\rar plurality is configured so as to catch and invert the of PET bottles 4 in the inverted state with the plurality of chucks 58, and return the pet bottles 4 Ln the upright state to the conveyer 10. In this embodiment, the inversion device 57 is made to be capable of inverting eight PET bottles 4 simultaneously. t00411 As shown in Figs. 3 and 4, the bottle handling device 60 is installed position upon the device frame F in a above the bottl-e inlout chamber 32 and the conveyer 70. Thj-s bottle h:nd I 'i nn Aa.ri n5 y 6n nn.|- 6rnl rr hri nnq J- ha nl rrr: l 1' a€ (JII_Ly rrqrrullrrV \,asVIUE \JV tt\JL v!ftrVJ UtrE UI }JrL.lfdIJ_Ly unprocessed PET bott1es 4 into the interior of the bottl-e inlout chamber 32 in the inverted state, but also takes out from the bottle inlout chamber 32, plurality processed the of PET bottles 4 that are being held in the inverted state within the bottle inlout chamber 32 by the bottle rising/lowering device 51. In this embodiment, the bottle handling device 60 is capable of handling eight bottles simul-taneously. 100421 bottle handling device 60 comprises rising/lowering shaft 63, and a suction head 64 that suctions the bottom portions of the PET bottles 4 is provided at the lower end of the rising/lowering shaft 63. The bottle hanrj I i no derri gg so qe f o 60 is conf vvrr!!yu!vv iorrred he rer:i nror-ef i nr^rl rz ev uv vs !Evrl/!vuoLtIIvry shiftable by a reciprocating shift mechanism 62 between position above the bottle inlout position chamber 32 and a above the inversion device 51. Accordingly, the bottle handling device 60 can lower the rising/Iowering shaft 63 to suction, with the suction head 64, a pluralit.y of unprocessed PET bottles 4 in the i-nverted state that are at the position of the inversion device 5J, and can then raise the rising/Iowering shaft 63. After that, the bottle handling device 60 shifts to the position above the bottle inlout chamber 32 by the reciprocating shift mechanism 62. After that, the bottle handling device 60 l-owers the rising/lowering shaft 63 to put the plurality of bottles 4 into the bottle inlout chamber 32. Moreover, the bottle handling device 60 can 1ower the rising/lowering shaft 63 suction, with the suction head 64, a plurality processed PET bottles 4 in the inverted state that are in the interror of the bottle inlout chamber 32, and can raise the rising/lowering shaf t 63 . Af ter that, the bott.l-e handling device 60 shift.s position to the above the inversion device by the reciprocating shift mechanism 62. After that, the bottole handling device 60 can l-ower the rising/lowering shaft 63 to return the plurality of PET bottles 4 to the i-nversion device 51 . t00431 In the film formation apparatus having a structure shown in Figs. 3 and 4, the interior of the firm deposition dedicated chamber 31 is always kept in the vacuum state the operation of the vacuum pump Vp1, so that the heat oeneratino e'l ino in the film emenLS 42 eXiSf vz]+r u!rry !ll Lrlg denosif inn ! Mtr vEyvoI uJvtl dedicated chamber 31, are arways kept in the vacuum state. At this moment, gate the valve 33 is kept in the c]osed state, so that the communicatlon between the film deposition dedicated chamber 3L and the bottle inlout chamber 32 is infereenfecj The - 4 heino r-nnqcr-r'r Iirrolrz r.nnrrorzed PET bottles vvL ureu : vErrry vvrrJEUuLf vE-Ly 9\.,rllvgyELr in the upright state by the conveyer fO, are spaced by the screw 11 for pitch reguration.
Thereby, fixed gaps are made between adjacent ones of these bottl-es 4 at the regulated pitch. The plurarity of bottles 4 having the fixed gaps of the regulated pitch are inverted by the inversion device 57, so that they come to be in the inverted state. Then the plurality of PET bottles 4, now in the inverted state, are suctioned by the suction head 64 of the bottle handling device 60. At this time, the open/close gate 56 of the bottle in/out chamber 32 is opened. The bottle handling device 60 transfers a plurality of unprocessed PET bottles 4 and puts them into the bottle in/out chamber 32. In this embodiment, it is possible for the bottle handling device 60 to put eight of the PET bottles 4 into the bottle in/out chamber 32 simultaneously. When the plurality of PET bottles 4 put into the interior of the bottle in/out chamber 32 gets held by the bottle rising/lowering device 51, the open/close gate 56 is closed. And, the vacuum pump VP2 is operated to start vacuumization of the interior of the bottle in/out chamber 32 starts.
When due to the operation of the vacuum pump VP2 the vacuum pressure within the bottle in/out chamber 32 reaches a predetermined vacuum pressure, which is still higher than the vacuum pressure of the interior of the film deposition dedicated chamber 31, the gate valve 33 is opened to establish the communication between the film deposition dedicated chamber 31 and the bottle in/out chamber 32. Due to this, the vacuum pressure of the interior of the bottle in/out chamber 32 decreases, and becomes equivalent to the vacuum pressure of the interior of the film deposition dedicated chamber 31. Accordingly, it is possible to shorten the time period required for vacuumization of the bottle in/out chamber 32. Subsequently, the bottle rising/lowering device 51 within the bottle in/out chamber 32 is operated to supply the plurality of unprocessed PET bottles 4 into the interior of the film deposition dedicated chamber 31. These plurality of PET bottles 4 supplied into the interior of the film deposition dedicated chamber 31 are being held by the bottle rising/lowering device 51. The PET bottles 4 are raised and lowered at a speed that has been determined in advance while being held by the bottle rising/lowering device 51.
Thereby, the heat generating elements 42 are inserted into, and taken out from, the PET bottles 4 respectively.
Fig. 5 is a schematic sectional view showing one of the PET bottles 4 with one of the heat generating elements 42 that has been inserted into the interior of that PET bottle 4. (8835805_1):SPM Fig. 5, the state of the pet bottole 4 is shown in which, due to rising and lowering by the bottle rising/lowering device 51, the heat generating el-ement 42 of the heat generating element unit 44 gas and a supply conduit 43 have been inserted into the PET bottl-e 4. rt should be understood that the bottle rising/lowering device 51 is omitted from 1- hi e f i nrrra f)rrri na l-ha el.rnyg qllu uvv v v deSCf vsJ9! MU ibed inSeftiOn III9g! UJVII taki no- and LqArrry out process, pressure the in the interior of the fllm deposition dedicated chamber 31 pressure reaches a vacuum which film formation possible, is and, along with materiar gas being suppried to the interior of the bottle 4 gas from the supply conduit 43, arso electrical- current is flowed to the heat generating element 42. Due to this, heat generating element 42 reaches a high temperature, the heat generat.ing el-ement becomes a heat catalystic element.
The raw material gas blown out from the gas supply conduit 43 comes into contact with the heat generating element 42 that has become the heat catalystic el_ement, and is decomposed into chemical- species by a catalyt.ic chemical- reaction and/or thermarry.
These chemicar species reach the inner surface the PET bottle 4, and form a thin film on the inner surface of the PET bottle 4. t00461 According to the present invention, by providing structure that makes possible it to adjust rising/lowering pET speed for raislng and lowering the bottles possible 4t it is to adjust the time periods f *^ F.i r ^-*.i rvt.rrrrrrg !r-Lr.uD on varrous portions - of a contaj-ner accordinq to qh:no l-ha harl- r^d.i f he nf i-ho nnnl- r i nor LrlE rrccru .r_ccrStdflCe characteristics of the container, and the required performance for the container; and thereby it becomes simple and easy to adjust the barrier performance and external appearance of the container.
This feature of the present invention will be further described l_ater. t00471 After a thin firm having predetermined a thickness been pET formed upon the inner surfaces of the bottres 4, operation of film formation has been compreted. Next, processed PET bottres 4 have been taken out from the film deposition dedicated chamber 31 by the bottle rising/rowering device 51 to be returned to the bottle inlout chamber 32. arf a r'- r-'^ 'l Af ,- ar .- ha.- ,- ha n! LE! urrqL, LlrE ycruE vdrve JJ 33 is rs Srrhseorrcnf rr_ cl_osed. t-roseq vacuum (not rel-ief val-ve shown in the drawings) instarled to the bottle in/out chamber 32 is operatedr so that the interior of the bottle inlout chamber 32 is opened to atmosnhere- At fhis moment. the interior of the film formation dedecated chamber 31 is always kept in the vacuum stater so that the heat generating elements 42 existing in film the deposition dedicated chamber 31, are always held in the vacuum state. And next, the open/cl-ose gate 56 is opened, and the PET bottles 4 within the bottle in/out chamber 32 are taken out and are returned to the inversion device 57 by the bottle handling device 60. And the bottle handling device 60 suncktions plurality a of new unprocessed PET bottl-es 4, and brings them into the bottle inlout chamber 32. After these new PET bottles 4 have been brought into the bottle inlout nh ?) i-ha nrnnaq f nr crlnh l rri nn t-hagg =ml-rar ust/yrl rrlY Lrrv PET bOttleS 4 into the film deposition dedicated chamber 31 and process of fil-n formation upon the PET bottles 4, whi-ch have been above mentioned, are repeated. t00481 AIthough, wi-th the film formation apparatus shown in Figs. 3 through 5, an example is shown of a case in which film formation processing is performed plurality upon a of PET bottles 4 in inverted the state, it would also be acceptable perform to arrange to film formation processing plurality upon a of PET bottl-es 4 in the upright state. this case, a structure would be adopted in which the fil-m deposition dedicated chamber 31 is arranged above while the bottle inlout chamber 32 is arranged below, and in which generating heat element 42 extends from the plate portion of the film deposition dedicated chamber 1 downward, and open/close gate of the bottl-e inlout chamber 32 is install-ed at the lower end portion of the bottle in/out chamber 32. The inversion device would 51 be omitted. Moreover, the bottl_e handling device 60 would be configured so as to hold a plurality of unprocessed PET bottles 4 in the upright state upon the conveyer and put to these PET bottles lnto the bott]e inlout chamber 32, and to hold and return to the plurality conveyer a of processed PET bott1es 4 existing in the bottle inlout chamber t00491 As wirl be crear from the above explanation of the first embodiment and the second embodlment of the present invent.ion, in present the invention, it is arranged to shift the container and the generating heat el-ement rel-atively to each other after the vacuum chamber has been c]osed and vacuumi-zation thereof has started, and moreover the relative chifr-inn enaarl orr!! LrrrV DyEEut Of the LlIe U(JII Cgntainer LdIIleI' dIIq and the LIIe heat Il-- oenerafinr -*..J efement can be varied.
The reasons for this are explained bel-ow.
The heat generating el-ement CVD method that is the subject of present the invention has the following characteristics.
/T\ Tho nlnqor + generatinq the container is to the urrv heat rrv alamant- i-ha hioher is fhe srsrrlsrrur Lrrc 1.r:.rvr snce|_ :n6 mr film IJ_J-IIt fOfmatiOn IOfmatlOn vrrvvs, *.,*,,.JfeOVef the greater is the thermal- Ioad upon the container.
Normally 1 to 10 centimeters is taken as being a suitable pasca]s distance applicable for firm formation at a few under vacuum conditions.
As a resul-t., when forming a film upon three dimensional_ (and container, the film thickness quality) the film of the film that formed is at each location upon the three dimensiona1 container, and the thermal load, are determined .ina rnnnrd l-^ r-he creneral-ino diStanCe betWeen vvLyyuurr the urrv heat- rtsqL y9rrE!qLItty element E and the container, and the time period which over heat is :nn l i aA l-rrr l-1.ra l.ra=.|- nn o l amon1- aIJPf rE\r r,/y LIIE lIEcrL rrV s!srrrEtrL. ^ahdr3f 9eIIC!ctLf The film thickness and the film quality determine performance barrier and the coloration at each l-ocation, and the thermal Ioad determines whether or not thermal- deformation takes pl-ace. If the thermal deformation takes pIace, generally this three dimensional- container wiII fose its commercial- val-ue.
Wifh resnect danendino r tO a three dimenSiOnal_ \ / Conf:inor- vvrruqrrrE! uEygrrutttv rrn^n it- c in1- ondad h11r^nc6 aq r^ral I aq nrofgg3[]_e qe qu baffief lJle performance of the container as a whole, a preferable distribution of firm preferab]e thickness and a distribution coloration have been known. Moreover, depending upon the shape of t.he container, there are some locations at which the fil-m formation speed wirl increase or decrease, and moreover there are some locations at which the thermal- l-oad is likerv to become greater or smaller. 00s0 For the film format.lon apparatus prior of the art, a method of film formation has been employed in which positions of the heat generating element and the container are fixed.
However, in such method, it is difficurt to make adjustments between different l-ocations where to form firm according to purpose the intended of the container and its shape, by varying t.he distance between the heat generating element and the container. 00s1 According to the present invention, by employing a structure in which performed the film formation is whil_e shift.ing the heat generating element and t.he three dimensional- container relatively to each other, and also by configureing the relative shifting speed means so as to provide variable rel-ative shifting speed, it becomes possible rn nar€nrm €i l_m na 1-n t- hp i nl- ended nrrr Lv rrtll.l formation I(JIIttdLI(.)II dL,-* 3r-nardi 1;sr!vlrrr F*-.'pOSe of the vellesl and it.s shape, while minutely adjusting conditions of film formation in a relati-ve manner with respect to different film formation l-ocations. As to this nain{- 1- l'ra urvrr will, vv!J! v9 be described v99v! lvEu in ItM!g!grtug reference to Fios- ^-nlanation uv L Jyo . 6 and 7.
Fig. 6 is a schematic figure showing a contalner and a heat generating element. graph And Fig. 7 is a showing the relationship between the distance between: the heat --+; -^ grclTteot yE*E!qLrrry and the inner surface of the container; and the relative shifting speed with respect to the heat olement qrrv he nrer:ise. en L and the urlv container. vvrlLqrrrE!. To ME y!gvf Jg, At_ ^6n6r:t.inn example is expJ-ained in which the formation speed for forming a thin film of the proportional same substance is to the distance between the heat generating element and the inner surface of the container. The contour of a three dimensional (shown container by a solid line) and a heat generating passing position el-ement along which the heat generating passes (shown element by a dotted line) are shown in Fig. 6.
As shown in Fig. 6, when the axial- distance along the contai-ner from its portion mouth toward its bottom portion set as the X axis, and the radial- direction extending from the axial- center of the container to the inner surface of container is set as the Y axis, the heat generating element passing position coincides with the axial- direction of the (i.e. container with the X axis). When plotted is distance between the heat generating element and the inner (the surface of the container Y axj-s) to the distance from portion (x=0) the mouth of the container to the bottom portion (x=100), of the container the resul_t is shown bv a thin solid line in Fiq. 1. As shown in the figure, distance between the heat generating element and the inner surface of the container varies.
And the rel-ative shifting speed with rewpect to the heat generating element and the container is varied accordi-ng to the variation of the above mentioned distance, as shown by a thick solid line in Fig. i.
In other words, the rel-ative shifting speed is made fast at qeneratinq l-ocations where the distance between the heat el-ement and the inner surface of the container is smal-I, whereas the relative shifting speed is made sl-ow at locatlons where the distance between heat generating the eJ-ement and the inner surface of the great. container is The means for implementing this variabl-e speed shifting may, for example qar\rar qJ- 1 \ : mnl- nr a\r : orrn i nn mnl- nr. rllv 9v! indar anrrinnad 2\ An air 6.yl in eneed 4 With an el-egtrnm:rrnaf u! vrrrs\rrre Lrv t ol:,r controller; 3) a mechanical means cam and a cam foll-ower) or the like. 00s2 providing By a structure such as that described above, possible it is to anticipate advantageous effects such as those described below. (1) ior narfnrmrnnp (nrerrenf + F,nhanr:ement inn of the baff v \ / \y!v of thermal deformation of the container) T1- hanamoq n^qcil-r'la l-a na-fC1m film fOfmatiOn !v!rLLq9rvrr OVer OnIv vv9! vrr!) a qhnrJ- 1-ima period sv at lOcatj_ons vv!fvg where time for film ^o':i_od formation sirould be limited from the point of view of thermal- deformation, wihle with respect to the other locations, it is possible perform to film formation to a sufficient extent, i+ l-.annm6q qimnlo thaf ae 2 16crr1f :nrl oia\/ ]-n anhan^a fl.ra - qJ q gIIIIAII\-e: urrqut !eJUfL, fL J.rEU\,/LttEo o!Ittyrg OrlU sqJy LV LIIe: performance barrier of the entire container.
Coloration adjustment Formation of a film thickness distribution according to the intended purpose of the container and the required external appearance and quality for the container becomes simple easy. And moreover it becomes possible to implement coloration havj-ng graduations or the like.
/ ? \ E'nh:naomall prOdUCtiVitV \v/ the unt1l now, as a countermeasure to prevent thermar deformation of the container, it has practiced been to start film formation generating after the heat element has been perfectly inserted. By contrast, according to the present invention, it becomes possible to reduce the cycle time, since film formation can be started from the stage of inserting the heat generating erement into the container. 0053 while various embodiments of the present invention have been exprained above, the present invention is not limited to the embodiments described above of course, i would be possible to implement various other embodiments of the present invention, within the scope of its technical- concept.
INDUSTRIAL APPLICABILITY The present invention can be applied to a film formation apparatus that forms a thin film whose gas barrier performance is high, such as a DLC (Diamond Like Carbon) film, an SiOx film, an SiOC film, an SiOCN film, an SiNx film, an ALOx film, or the like, upon either the inner surface or the outer surface, or both, of a container such as a Polyethylen terephthalate bottle (a PET bottle) or the like.
REFERENCE SIGNS LIST 1: film deposition dedicated chamber 1a: link portion 2: heat generating element protection chamber 2a: link portion 3: gate valve 4: PET bottle 11: bottle holding portion 21: heat generating element 22: heat generating element unit 23: electrically operated cylinder for raising and lowering heat generating element unit : gas supply conduit 31: film deposition dedicated chamber 31a, 32a: link portions 32: bottle in/out chamber 33: gate valve 42: heat generating element 43: gas supply conduit 44: heat generating element unit 51: bottle raising/lowering device 56: open/close gate 57: inversion device 58: chuck AH26(9770010_1):SPM 60: bottle handling device 62: reciprocating shift mechanism 63: rising/lowering shaft 64: suction head 70: conveyer 71: screw 72: vacuumized 73: heat generating element passing position 74: contour of three dimensional container 75: relative shifting speed 76: distance between heat generating element and inner surface of container F: device frame VP1, VP2: vacuum pumps AH26(9770010_1):SPM

Claims (15)

CLAIMS :
1. An apparatus for forming thin film comprising: a vacuum chamber in which film formation upon a surface of a container is performed in a vacuum state by using a heat generating element; an vacuum evacuation device that vacuumizes said vacuum chamber; and a relative shifting device that, after vacuumization of said vacuum chamber has started, shifts the container and the heat generating element relatively to each other within said vacuum chamber, wherein said vacuum chamber is divided into a chamber for the container where the container is inserted and taken out, and a chamber for protection of the heat generating element where the heat generating element is held in a vacuum state, and a vacuum isolation device is provided between said chamber for the container and said chamber for protection.
2. The apparatus for forming thin film according to Claim 1, wherein each of said chamber for the container and said chamber for protection is linked to an individual vacuum evacuation device.
3. The apparatus for forming thin film according to Claim 1, wherein said chamber for the container is vacuumized from atmospheric pressure to be brought to a vacuum state at a moment of film formation upon the container, and is returned to atmospheric pressure after the film formation has been completed.
4. The apparatus for forming thin film according to Claim 3, wherein while said chamber for the container is returned to atmospheric pressure after the film formation being completed, said chamber for protection is kept in a vacuum state by closing said vacuum isolation device.
5. The apparatus for forming thin film according to Claim 4, wherein said vacuum isolation device is opened when said chamber for the container has been vacuumized, so as to communicate together said chamber for the container and said chamber for protection. (8835805_1):SPM
6. The apparatus for forming thin film according to any one of claims 1 to 5, wherein said chamber for the container is provided as a chamber for film formation where the film formation is performed upon the container, due to said relative shifting device which is provided to shift the heat generating element between said chamber for protection and said chamber for the container.
7. The apparatus for forming thin film according to Claim 6, wherein the heat generating element is inserted into said chamber for the container after said vacuum isolation device has been opened, and is returned to said chamber for protection after the film formation has been completed.
8. The apparatus for forming thin film according to claim 7, wherein, after the film formation has been completed and after the heat generating element has been returned to said chamber for protection, said vacuum isolation device is closed.
9. The apparatus for forming thin film according to any one of claims 1 to 5, wherein said chamber for protection is provided as a chamber for film formation where the film formation is performed upon the container, due to said relative shifting device which is provided to shift the container between said chamber for the container and said chamber for protection.
10. The apparatus for forming thin film according to Claim 9, wherein the container is inserted into said chamber for protection after said vacuum isolation device has been opened, and is returned to said chamber for the container after the film formation has been completed.
11. The apparatus for forming thin film according to Claim 10, wherein, after the film formation has been completed and after the container has been returned to said chamber for the container, said vacuum isolation device is closed.
12. The apparatus for forming thin film according to any one of Claims 1 to 11, wherein said chamber for the container comprises an open/close gate for taking out and inserting the container from and into said chamber for the container. (8835805_1):SPM
13. The apparatus for forming thin film according to any one of claims 1 to 12, further comprising a container transfer device that transfers an unprocessed container from a predetermined position into said chamber for the container, and transfers a processed container from said chamber for the container to a predetermined position.
14. The apparatus for forming thin film according to Claim 13, wherein the predetermined position is a position upon a conveyer.
15. A method of forming thin film by using an apparatus for forming thin film comprising: a vacuum chamber in which film formation upon a surface of a container is performed in a vacuum state by using a heat generating element, the vacuum chamber being divided into a chamber for the container where the container is inserted and taken out, and a chamber for protection of the heat generating element where the heat generating element is held in a vacuum state; and a vacuum isolation device which is provided between said chamber for the container and said chamber for protection, wherein the method comprises the steps of: inserting and taking out the container into and from said chamber for the container, while keeping a state of the heat generating element in a vacuum state by closing said vacuum isolation device when said chamber for protection is in the vacuum state; opening said vacuum isolation device when said chamber for the container has been vacuumized to communicate together said chamber for the container and said chamber for protection; and shifting the container and the heat generating element relatively to each other after said vacuum isolation device has been opened to form said thin film. Kirin Beer Kabushiki Kaisha By the Attorneys for the Applicant SPRUSON & FERGUSON Per: (8835805_1):SPM
NZ626604A 2011-12-27 2012-12-26 Apparatus for forming thin film NZ626604B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011284609 2011-12-27
JP2011-284609 2011-12-27
PCT/JP2012/083679 WO2013099960A1 (en) 2011-12-27 2012-12-26 Apparatus for forming thin film

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NZ626604A NZ626604A (en) 2015-03-27
NZ626604B2 true NZ626604B2 (en) 2015-06-30

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