NZ602789B - Lamp - Google Patents

Abstract

602789 A LED lamp (1) is disclosed including a board (16) mounted on a flat plate portion with light emitting elements (15) mounted to the board (16). A cylindrical portion (2) extends from the back surface of the flat plate portion and contains an electrical circuit board. A plurality of heat radiation fins (25) are arranged radially around the cylindrical portion (2) and extend along the cylindrical portion (2) so that a gap (S) is formed between the cylindrical portion (2) and the heat radiation fins (25). A joint portion (105) joins the end portions of at least two paired heat radiation fins to form an air flow path between the cylindrical portion (2) and the joint portion (105). diation fins (25) are arranged radially around the cylindrical portion (2) and extend along the cylindrical portion (2) so that a gap (S) is formed between the cylindrical portion (2) and the heat radiation fins (25). A joint portion (105) joins the end portions of at least two paired heat radiation fins to form an air flow path between the cylindrical portion (2) and the joint portion (105).

Description

PATENTS FORM 5 Our Ref: PO46486NZ Dated: 4 March 2013 PATENTS ACT 1953 COMPLETE SPECIFICATION Lamp We, Iwasaki Electric Co., Ltd., incorporated in 116, Nihonbashi—bakurocho, u, which we pray that a patent may Tokyo, 103-0002, Japan, hereby declare the invention, for to be particularly described be d to us, and the method by which it is to be performed, in and by the following statement: 0013E(6750930_1)2AZT ,.;.:,_W 1-; Field of the Invent1on 'The present 1nvent10n relates toa base type lamp uS1nq ll1ghtemlttlng elements suchasLEDs(L1ght Em1tt1 y organic2EL ro Lum1nescence) or the llkeasa.l1ghtsource” 2.; Descr1pt1on of the Related Art v3e35 A base type LED lamp thatis avallable as an alternatlvegT’V of an lc light bulbhas been popular in connect1on w1thf25519‘”” '(forexample,;17" ‘DJp—A201160754) However, sufficient heat radiation performance can not be obtained by the conventional heat radiation fins, and particularly the heat generated from the rical portion cannot be efficiently radiated.

SUMMARY A need exists to provide a lamp that can obtain high heat radiation performance.

According to a first aspect of the present disclosure, a lamp including a board board having light emitting elements mounted n, a flat plate n having the flat mounted thereon, and a cylindrical portion that extends from the back surface of the electrical plate portion, has a base provided to the terminal thereof and contains an circuit board therein, comprises: a plurality of heat radiation fins that are ed radially and configured around the cylindrical portion on the back surface of the flat plate portion between the rical to extend along the cylindrical portion so that a gap is formed end portions at a n and each of the heat radiation fins; and a joint portion forjoining air flow path cylindrical portion side of at least two paired heat ion fins to form an between the cylindrical portion and the joint portion. between adjacent The lamp may further comprise a distributing fin that is disposed each of the adjacent pairs of heat pairs of heat radiation fins to distribute an air stream to radiation fins. 6975424_1 The lamp may further comprise a short heat radiation fin Lthat is ed between the respective paired heat radiation finsjoinedthroughthejointportionandconfiguredtobeshorter than the heat radiation fins in the extension length from the back surface of the flat plate portion.

The lamp may further se a plurality of annular heat radiation fins that are arranged on the back surface of the flat plate portion to surround the cylindrical portion and configured in the extension to be shorter than the short heat radiation fins length from the back surface of the flat plate portion. member that The lamp may comprise a thermally conductive of the electrical circuit is provided between a heating part board and the cylindrical portion to transfer heat of the heating part to the cylindrical portion. fins may'be molded In the lamp, each of the heat radiation on the back surface of the flat plate portion integrally withy the flat plate portion, and configured to be gradually thinner: outer peripheral side;' from the rical portion side to the 'In the lamp, a larger number of light emitting ts‘ outer side of the board that that at may be provided at the they center Side of the board In the lamp, the heat radiation fins maybe configured sothattheextenSionlengththereofalongthecylindricalportion Side to thef’ is lly reduced from the rical portion outer peripheral side.

In the lamp, the thickness of the heat radiation fins may, be gradually reduced from the back surfaCe side “of the flat plate portion to the base side.

The lamp may further comprise a gthe coverihg theLboardh of the flat plate portion, wherein the flat plate portion is,L configured in a tray~like shape having a side wall at the edge the side wall, thereof, an edge portion of the globe is fitted to the fitting n n the edge portion of the globe the side wall is sealed by a seal member, the seal member is othhe provided over the whole ery Of the outer surface between thesideu edge portion of the globe so as to be pressed cf theglobe, wall of the flat plate portion and the edge portion thesealmember, anda guide and a projection is provided below hold groove for introducing the projection of the globe from L side and guiding the projeCtion in a peripherAi“ an upper ehd L ion to held the globe the whole, -,L In the lamp, a fit~ in grOOVe may be proszdedLovLer 7, ery of the outer surface of the edge portion of the globe,é fit-in groove so that;7 and the seal membeeray be fitted ih the surface of theSidei the sealxnember is pressedloetween the inner wall of the flat plate portion an Lthefitin groove to seal€h9h L thefittingportionbetweentheSidewalloftheflatp z:_vfl if"; rand the edgeportion of the globe The lamp mayfurther comprise a reflection face for VW‘i~ is prOVided oh' reflecting light cf the light emitting elements the inner e of.the edge portion of the globe.

In the lamp, the cylindrical n may be configured base side, to be r fronlthe flat plate n side to the a cylindrical member for linking the cylindrical portion to the outer socket to which the base is screwed may be mounted on peripheral surface of the cylindrical portion, and a fitting member when structure portion to be fitted to the cylindrical the cylindrical member is mounted may be provided to the outer peripheral surface of the cylindrical portion.

In the lamp, the rical member may be a waterproof packing that covers an area extending from the socket having to prevent the base mounted thereon to the cylindrical portion water invasion between the base and the socket. be provided In the lamp, the fitting structure portion may an upper with a convex portion or a concave portion to which is fitted over the whole edge portion of the waterproof packing periphery of the cylindrical portion.

In the lamp, over a convex portion may be provided wholeperipheryoftheinnerperipheralsurfaceofthecylindrical member. between In the lamp, a connection member may be d atleasttwoheatradiationfins,andau1anti~dropsupportmember the connection member. may be connected to In the lamp, the heat radiation fins bridged by the in parallel to tion member may be provided substantially each other, a hole pertion may be fermed in each of the substantially parallel heat radiation fins so as to penetrate through the heat ion fin, the connection member may be configuredinarod—likeshape,andtherodélikeconnectionmember the hole portions of the substantially may be supported h parallel heat radiation fins.

In the lamp, the connection member may be joined toa band wound around the outer peripheral surface of a lamp holder for supporting the lamp.

In the lamp, the lamp may be rotated to be screwed to lamp holder, and the band mathave an adjusting pertion and be allowed to be adjusting censtriction force othhe band of the holder: rotatable on the outer peripheral surface lamp by loosening the constriction force of the band. be provided between In the lamp, the connection member may as to be nearer to their - the flat plate portion and the base so of the ightof w base than the centereofgrayitproSition L L LLLL the lamp.

In the lamp, the connection'member may beLprotided"toLbet nearerfixathebasethantheheatradiationfinsofthecmdindrical L'. r .- ~ 1 _,1 .V_~ .

Lportion The lamp may further comprise a lead wireunitthav to the base tosupply5;,L connected through the cylindrical n poWerto the plurality of light emitting elements, a. bagportion 1' formed at the and an ng tip othhe rical portion, "1r. portion that is formed on the outer periphery of the tip so as to be d with the base, wherein the bag n of the tip is projected to the outside of the fitting n, and the ted bag portion is provided a through—hole unit through which the lead wire unit penetrates.

In the lamp, the through-hole unit may have a pair of through—holes, the lead wire unit has a pair of through holes, the pair of lead wires a pair of introducing portions for guiding inner surface to the pair of througheholes may be formed on the be ted of the bag portion, and the introducing portions may fromeachotherbyapartitionwallforbisectingtheinnersurface.

In the lamp, the pair of introducing portions may configured as conical concaves that are tapered to the through—holes.

In the lamp, a groove portion in which one of the lead the outside is wires drawn through one of the hholes to fittedmaybeformedontheouterperipheralsurfaceofthefitting: portion, to that and the bag portion may configured to project outside of the groove portion. heat According to the lamp of the first aspect, the plural flat plate: radiation fins are provided to the back surface of the portionon which the board having the light emitting elementsy’y mounted thereon is mounted so that the heat radiation fins ares» to extend arranged radially around the cylindrical portion so as from the back surface of the flat plate n alOng the cylindricalportionandfernuagapbetweenthecylindricalportion and each heat radiation fin, and the jOint portion For joiningl end portions at the Cylindrical portion side of at leaSt two heat radiation fins is provided to form the air flow path between thecylindricalportionandthejointportion"Acdordinglyftfie- outer peripheral Surface of the cylindrical portiOn can be. airecooled by air passing through the air flow path, and the electricalCircuitboardaccommodatedinthecylindricalportion D F can be cooled.

BRIEF DESCRIPTION OF THE DRAWINGS deVice haVing anE - Fig;1 is a diagram g anLED lamp LED lamp accordingto anembodiment oF the tinvention,t Figs. 2A to 2C are plan View, side View and bottom~Viewp LWhich show an exterior ance construction of the LED lamp; Fig3 is an exploded perspective ViewoF the LEDlamp5l.

Side,F , when istaken from theupper Fig 4 is a croSS~sectional View taken along a line IVIV of Fig; 2C;‘ 'Fig;y5 "‘ is a bottom View Showing the LED lamprr m Which an'annuiar4watengaar~pa¢gingfigyartééhgd;x I I I I Of Fig 5; Fig. 7 isa Cros’s—sectional Viewtakenalong aline;VIIVII of‘FigtISXQ Fig. 8 is a partially-enlarged plan View of a fin having atrapezoidalshapehavinganopenlowerbase unraV-shapehaving a flat bottom); Fig. 9 is a plan view of a housing when the housing is viewed from a base plate side; Fig. 10 is a crOSS*sectional View taken along a line X—X of Fig. 9; Fig. 11 is an enlarged View showing the al an insulating cylinder portion; an anti—drop ure of Fig. 12 is a diagram g the LED lamp; and wherein Figs. 13A and 13B are diagrams showing a band, view showing Fig. 13A is a plan View and Fig. 13B is a perspective state that an anti—drop wire is secured; Fig. 14 is onship a diagram showing the onal between the gravity center position of the deadweight the LED lamp and a support hele, wherein the upper stage Fig. shows 14 shows a setup state and the lower stage of Fig. 14 a dropout state; Fig. 15 is a diagram showing the positional relationship the deadweight of an LED between the gravity center positidn of and a support hole, wherein lamp having a reference Construction the upper stage of Fig. 15 shows a setup state and the lower, stage of Fig. 15 shoWs a dropout state; Fig. 16 is a base plate; a cross~sectional View showing —lO- Fig.17isanenlargedviewoftheengagementportionbetween a globe and the base plate; Fig. 18 is a diagram showing a nce uction of a structure that the globe is threadably seCured to the base plate; and Fig. 19 is an enlarged View of a mount portion of the LED lamp to an exposed socket.

DETAILED DESCRIPTION OF THE EMBODIMENT An ment according to the present invention will be described with reference to the drawings.

Inthefollowingembodiment, anLEDlamphav1ngLEDs(light ng diedes) as light sourcesis.representatively<descr1bedf as a lamp having a light emitting element as a light sourceli but the present invention is not limited to this embodiment.

For example», the present invention may be d to alamp having 'another type light emitting element such as an organic EL éfif L L *“ 1 othe like as a light Source. 95 hav1ngi Fig. ‘1 is’a diagram ShowinganLED lamp device an LED lamp 1 according to an embodiment of the presentinvention.

The LED lamp device 95 shown inFig 1 is an outdoor mount . 'type lighting deV1ce used foroutdoor billboard lighting etc"iTi and it hasan LED lamp 1,a lamph lder60 inWthht toW“ 1-is mounted, an'dfan annular waterproofpacking red V I” the LED lamp 1 60 is a holder in which an ex1st1ng light: i The lamp holder -11.... bulb can be mounted, and the LED lamp 1 is configured to have ntially the same shape and optical characteristic as the ng light bulb, so that the LED lamp 1 can be mounted and used in the lamp holder 60 in place of the existing light bulb.

Specifically, the lamp holder 60 has a 'cylindrical holder housing 62, and an arm fixing unit 64 to which a support arm (not shown) is secured to be freely turnable is provided to the terminal n 62A of the holder housing have The tip 60E of the holder housing 62 is configured to an opening whose diameter is set so that the tip 60 is fitted bulb through to the surface of'a glass bulb of an existing light awaterproofpackingwithnospacetherebetweenwhentheexisting light bulb is mounted in the holder housing 62. Accordingly, invasion when the light bulb is mounted in the holder housing 62, into the holder of water from the edge portion 66 of the opening housing 62 is prevented. In Fig. l, a projection 68 provided 62 is to the tip 608 of the holder housing a member for fixing the LED a guard member (not shown) which covers and protects lamp 1 or an existing light bulb.

A socket 65 to which the base (metal cap) 3 of the existing light bulb or the LED lamp 1 is d is provided in the holder housing62. ZX powersupplywirewhichisledinfromtheexternal is connected to the socket 65, power is supplied through the socket 65 from the base 3 to the LED lanm>l or the existing light bulb lamp 1. .. 12..

The annular Waterproof packing 70 is formed of a rubber 1' moldedIneMber, and freely detaChablylnoUnted on the cylindrical When (barrel) portion 2 (described later) of the LED lamp 1. 1 is d on the lamp holder 60, the annular the LED lamp waterproof packing 70 blocks the opening of the lamp holder and prevents invasion of water from the gap between the laMp holder 60 and the LED lamp 1.

Itisunnecessarytoprovidetheannularwaterproofpacking 70 in a case where waterproof is ssary, for example, in such a case that the LED lamp 1 is mounted and used in the lamp the outside holder 60 installed indoors or a socket exposed to because the annular waterproof packing 70 is o prevent. invasion of Water into the lamp holder 60. HoweVer, invasion 60 can be prevented of dust or the like into the lamp holder 70 when the LED lamp by mounting the annular waterproof packing 1 is used indoors ‘ Next, the construction OftheLED lamp1 will bedescribed Figs. 2wa>2Carediagramsshow1ngtheexteriorappearanceI COnstruCtionv of the LED lamp l,'wherein Fig. 2A is .View,.

Fig 28 is a side View and Fig. 20 is a bottom View.g Fig. 3 isa 1 stakeniif an exploded perspective View of theLED lamp I“ SS an upper Side, and Fig4is a “sectiona, ,\ from f gures,a tate that along a line IVIVof Fig2C In these th e annuIar waterproof packing 70 is mounted on the LEDlampfi l is shown. i 13 _ The LED lamp 1 of this embodiment has a light emitting portion 12, a cylindrical (barrel) portion 2 which extends downwards so as to be vertical to the substantially center of aloase the back surface of the light emitting portion 12 and has 3 at the terminal side thereof, and plural heat radiation fins provided to the back surface of the light ng portion 12, and the annular waterproof packing 70 bed above is fitted in the rical portion 2.

The light emitting portion 12 emits light upwards from and it has the substantially whole upper surface 12A thereof, plural LEDs (light emitting diodes) 15 as light sources, an LED board 16 which is configured to be substantially circular plan view and on which the LEDs 15 are mounted, a globe 22 and abaseplatel3aseaflatplateportionwhichisintegrallyprovided to the tip 2C of the cylindrical portion to have The base plate 13 is a member which is configured shape in top View and be larger in diameter than a disc-like the cylindrical portion 2. The cylindrical n 2 extends downwardssubstantiallyverticallyfromthesubstantiallycenter 13. As shown portion of the back surface 13A of the base plate intercommunicates with in Fig. 3, an ion opening 14 which the rical portion 2 is formed in the front surface of the base plate 13, and an electrical circuit board 8 having a powerv source (power conversion device) for turning 0n LEDs 15 and a drivingcircuitnmuntedthereonisinsertedthroughtheinsertion —14—. opening and mounted in the cylindrical portion 2.

The base plate 13 and the cylindrical portion 2 are integrally molded from the same material, that is, thermally-conductive resin.by resinInolding using a1netal.mold.

The housing 35 of the LED lamp 1 is constructed by the base plate 13, the rical portion 2 and an insulating er portion described later.

PluralLEDs15areannularlyarrangedsoastoformacircular ringvdflxfliissubstantiallyconcentricixathecylindricalportion 2, and have outer—peripheral side light emitting portions arrangedannularlyefl:theouterperipheralsidecflfthebaseplate 158 which l3 and innereperipheral side light emitting portions arearrangedannularlyefl:theinnerperipheralsideixbbelocated side light emitting on the inner side of the outer~peripheral portions 15A. In this case, as an example, with respect to the outerperipheral side light emitting portions 15A, thirty are arranged to be spaCed frOm one another at equal; elements intervals, and with respect to the inner~peripheral side light emittingportionslSB,fifteenelementsarearrangedtobeSpaced from one another at equal intervals. When estimated per unit area, the_ tion rate of the LED elements; of theC: ‘Outer—peripheralSidelightemittingportionslBAiSJergerthan1»s that of the peripheral side light emitting portions 15B.;.h That is, a larger number of LEDs 15 are mounted at the outer portionoftheLEDbOard15(correspondingtOtheouterpsripheral sidelightemittingportions15A)thanthatefizthecenterportion of the LED board 15 (corresponding to the inner peripheral side light emitting portions 15B), and the amount of heat generation of the outerwperipheral side light ng portions 15A per unit area is larger than that of the inner—peripheral side light emitting portions 15B.

Forexample,LEDs15areformedbypackagingtheLEDelements.

In this embodiment, white~color LED is used as LED 15. It is colors than needless to say that LEDs of other light emission white color may be used as LEDs 15.

As shown in Fig. 3, the LED board 16 is configured.to have so that plural LEstlS are mounted a substantially disc shape and fixed on the front surface as the upper surface thereof, Ito the upper surface of the base plate 13 by plural screws 18. is formed at the A lead wire draw—out opening 17 16. A pair of lead substantially center portion of the LED board (Fig. 4) for power supply is drawn out from wires 21A and 21B theelectricalcircuitboardESmountediJ1thecylindricalportion 2 through the lead-wire drawfout opening 17, and electrically connected to a circuit pattern (not shown) formed on the upper is e of the LED board 16, whereby each LED supplied with power h the circuit pattern and turned on.

As shown in Figs. 3 and 4, the base plate 13 is configured in a tray—like shape so as to have a flat disc and a side wall 19 along the peripheral edge of the flat disc, and the globe 22 covering the LED board 16 is fitted to the inner eral surface of the side wall 19 and held by the base plate 13. An 22 and 0 ring 26 as a seal member is provided between the globe the base plate 13, the O ring 26 is d between the globe 22 and the side wall 19 of the base plate 13 in connection with the fitting between the globe 22 and the side wall 19 of the baseplatel3andsealed,therebywaterproofingthelightemission portion 12. The fixing structure of the globe 22 and the base later. plate 13 will be described in more detail Asnotshowninthefigures,themodelnumber(brandnumber) the globe of the LED lamp 1 is provided to the inner surface of 22bypminting,stmmporthelike. Accordingly,themodelnumber (brand number) is prevented from vanishing even when the LED lamp 1 is exposed to weather, and also prevented fronlvanishing due to friction.

The heat radiation fins 25 are radially provided around from the back surface 13A the cylindrical portion 2 when viewed of the base plate 13. Each heat radiation fin 25 is provided back surface 13A along the cylindrical so as to extend from the portMMIZ,andradiatesheatemittedfrmntheLEDboardl6nmunted Each heat radiation fin 25 is formed on the base plate 13. integrallyvfiifiithecylindricalportionZixlaninjectionfiblding process for the housing 35. 2 is integrally The terminal 2A of the cylindrical n providedwithaabarreltypeinsulatingcylinderportion10formed -17.... ofaninsulatingmaterialtoinsulatethebase3andthecylindrical portion2fromeachother,andthebase3isnwuntedontheterminal shown 10A of the insulating cylinder portion 10 like a crown as in Fig. 4. The electrical circuit board 8 is mounted from the tipsideofthecylindricalportionZcmertheinsulatingcylinder portion 10, and electrically connected to the base 3 through theleadwiresZlAanleBattheterminalportionoftheinsulating cylinder n 10 side.

The base 3 has a threaded cylindrical shell 5 which is screwed into a socket 65 (for example, E39 or E26 (E39 in this embodiment)typesocket)ofanexisting(established)lampholder of the end portion 60, and an eyelet 7 provided to the apex portion of the shell 5 through the insulating n 6, and the shell and the eyelet 7 are configured in such a dimension that they lnounted in.an existing socket. Accordingly, the LED lamp 1 can be mounted in an ng socket on the ceiling or wall surface or in the socket 65 of the lamp holder 60 in which an existing light bulb is mounted and used, whereby the LED lamp 1 be used as an alternative for an existing light bulb.

Asdescribedabove,theshellESandthecylindricalportion each other by the insulating 2 are electrically insulated from er portion 10. Therefore, even when the cylindrical portionZZisformedofaamaterialhavingelectriCalconductivity, theinsulationbetweentheshellSofthebase3andthecylindrical portion 2 can be kept excellent. ~18—y When axnetal material such as aluminuntor the like is used for the rical portion 2, it has high heat radiation performance. However,thehousing35containingthecylindrical portion 2 is heavy in weight, and thus there is a problem that the strength is insufficient when an existing socket is used.

Therefore, according to this embodiment, thermally~conductive resin is used as the material of the cylindrical n 2, insulating resin is used as the material oftheinsulatingcylinderportionlO,andtheinsulatingcylinder portion 10 is molded integrally with the cylindrical n 2 by insert molding.

By forming the cylindrical portion 2 of thermally—conductive resin, the weight of the LED lamp 1 can bereducedmoregreatlyascomparedwiththecasewherethehousing is formed of a metal material such as aluminum or the like.

Therefore, even when the LED lamp Lis mounted as an alternative for an existing light bulb in an existing socket or an existing lampholder60,neitheraworknoranemberisrequiredtoreinforce the existing socket or the existing lamp holder 60 in order to support the weight of the LED lamp 1, and they can be directly usedxvithout dification;, Furthermore, the numberiof heat ion fins 25 can be increased because the weight is d, . so that the surface area increases and the heat radiationi performancecankxaefficientlyenhanced. ‘Aresinmaterialhaving high thermal conductivity which has a coefficient cf thermal «19w conductivity of 2W/mK or Inore is preferably used as the thermally—conductive resin, and polycarbonate resinrnixedxwith carbon fiber having high thermal conductivity (Raheama (registered trademark) produced by Teijin Limited in this embodiment) is preferably used.

The insulating cylinder portion 10 is formed ally resin with the cylindrical portion 2kn/the insertlnolding using is firmly material, whereby the insulating cylinder portion joined to the cylindrical portion 2. However, there is a risk that a crevice occurs in the joint face (mating face) of ginsulating cylinder portion 10 due to secular change and the waterproof mance is lost.

Therefore, as shown in Fig. 4, a fitting concavo—convex nZBisformedontheinnerperipheralsurfaceoftheterminal 2AofthecylindricalportionZ,andalsoafittingconcavo~mxwex n 10B which is engagedly fitted to the fitting concavo~convex n 2B is formed on the outer peripheral surface in the neighborhood of the end of the g of the insulatingcylinderportion10,therebyconstructimgaso—called labyrinth—like fitting structure. Furthermore, the‘area<1fthe strengtilis enhanced. joint portion increases and thus the joint Furthermore, a flange lOC with which the terminal 2A of cylindrical portion 2 comes into contact is formed below insulating cylinder fitting concave-convex portion 108 of the into_ n 10, thereby preventing water invasion the i 20 . labyrinth—like fitting structure portion. Accordingly, even when a(gap<3ccurs on the Inolding face at the joint portion between the cylindrical portion 2 and the insulating cylinder portion 10 due to a crack or the like caused by secular change, thewaterproofperformancecanbenaintainedbyhelabyrinth-like g structure portion and the flange 10C, and durability which is commensurate with the lifetime of the LED 15 can be obtained.

The shape of the joint face between the terminal 2A of the cylindrical portion 2 and the opening end tion end) of the insulating cylinder portion 10 is not limited to the labyrinth—like shape, and any shape such as a wedge—like shape as the waterproof performance or the like may be adopted insofar and the joint strength can be enhanced. Furthermore, the joint between the cylindrical portion 2 and the insulating cylinder portion 10 may be established by assembly using screwing or like insofar as requirements for various kinds of performance are satisfied. t board Next, the mount structure of the electrical in the cylindrical portion 2 will be described.

AsshownixlFig.4,'theelectricalcircuitboard8Aisformed so as to extend from the tip 20 of the cylindrical n 2 to the insulating cylinder portion 10, and configured to have al shapes of the cylindrical a shape which is fitted to the n 2 and the insulating cylinder 10. -21.. the diameter R of the upper portion of the That is, cylindrical portion 2 (Fig. 4) is set to be ntially equal the electrical circuit to the lateral width of the upper portion of when the electrical circuit board 8 is board 8. Therefore, inserted in the cylindrical portion 2, the electrical circuit 116 (Fig. 9) formed on board 8 is pinched by pinching portions , whereby the inner portion of the insulating cylinder n in the cylindrical portion the electrical t board 8 is fixed 2 is miniaturized At this time, when the cylindrical portion the upper portion thereof is reduced so that the diameter R of of the electrical to the same level as the width of the upper portion 8 approaches to circuit board 8, the electrical t board the cylindrical portion 2, and thus the electrical insulation 2 and the electrical performance between the cylindrical n circuit board 8 is degraded. Therefore, an insulating sheet 28 2 so as to is provided to be wound in the cylindrical portion surround the electrical circuit board 8, and the whole inner is d by the insulating surface of the cylindrical portion 2 between the sheet 28 to enhance the insulation performance electrical circuit board 8 and the rical portion 2.

The insulating sheet 28 is formed of one belt—like sheet and the ike having flexibility and insulation properties, in this embodiment) sheet is rolled once or at plural times (twice to make the belt-like sheet be cylindrical .

When the insulating sheet28isinsertedintothecylindricalportionZ,theinsulating sheet 28 unrolls and expands in the cylindrical portion 2. At me,theinsulatingsheet28:hsmountedontheinnersurface of the cylindrical portion 2 by the unrolling force so as to cover the inner surface.

As bed above, the insulating sheet 28 is formed in ion opening 14 of a belt—like shape, inserted into the the base plate 13 while rolled, and mounted in the cylindrical portion2bytheunrollingoftheinsulatingsheet28. Therefore, in the cylindrical the ting sheet 28 can.be easilylnounted portion2:Maastocmverthewholeinnersurfaceofthecylindrical portion 2. at the lower Furthermore, a cut~out portion 28B is formed (see Fig. 3) of the insulating sheet 28, and edge portion 28A positioned to a projecting portion 14A (see Fig. 9) provided in the cylindrical portion 2, whereby both the end portions of the insulating sheet 28 which other are overlapped with each when the insulating sheet 28 is rolled can be positioned.

Therefore,thecylindricalportingcanbefurtherminiaturized. end portions That is, when the overlapped ns of both the into the cylindrical of the insulating sheet 28 are inserted portion2,underthestatethatitisunknownwheretheseoverlapped portionsarelocated,itwouldbenecessarytoprovideacflearance circuit board 8 and between the edge portion of the electrical thecylindricalportionZ:Uiconsiderationofthesheetthickness -23.. corresponding to three rolls of the insulating sheet 28 (under twice g) at the overlap position of both the end ns of the insulating sheet 28. That is, in this case, the rolling frequency of the insulating sheet 28 is equal to twice, but the sheet thickness corresponding to three rolls of the insulating sheet 28 must be considered.

However,whentheoverlapportionsofboththeendportions oftheinsulatingsheet28arepositionedbytheprojectingportion 14A so as to avoid the positions between the edge n of the electrical circuit board 8 and the cylindrical portion 2, electrical a clear may be provided between the edge portion of the circuit board 8 and the cylindrical portion 2 in consideration of the sheet ess corresponding to the rolling frequency oftheinsultingsheet28. Thatis,inthiscase,whentherolling sheet frequency of the insulating sheet 28 is equal to twice, the thickness corresponding to two rolls of the insulating sheet 28 may be considered. Accordingly, the clearance can be more greatly reduced, and the cylindrical portion 2 can be further miniaturized.

TheelectricalcircuitboardEBinsertedixlthecylindrical portion 2 is fixed in the cylindrical portion 2 while the lower end side thereof is pinched by the pinching portions 116 (Fig. 9) as described above. At this time, the upper end portion 80 of the electrical t boardi3is d downwardly through a fixing bush 27 by the LED board 16 secured to the base plate -24i Specifically, whicklis provided a heat generating part 8X turn on LEDS 15 is mounted on the to a power supply circuit to electrical circuit board 8 as shown in Fig. 4, and for example ametalheatsink29tmvinghighthermalconductivityispmovided tctheheatgeneratingpart8x. InFigs.3and4,referencenumeral for thinning. The surface 29B represents a recess portion 29B the heat sink 29 is coated the heat generating part 8X of or n filler to bring with grease type thermallyeconductive and the heat sink 29 into close both the heat ting part 8X contact with each other, whereby the heat generated from the is transferred to the heat sink 29. heat generating part 8X The fixing bush 27 is provided between the heat sink 29 and the cylindrical portion 2, and contact tions 27A are end of the fixing bush 27. integrally ed to the upper contactprojections27Acomeintocontactwiththebottomsurface circuit so that the electrical of the LEDlooard l6‘tokxepressed, boardESispressedthroughtheheatsink29andtheheatgenerating part 8X.

The fixing bush 27 is an elastic member having relatively and the fixing bush 27 is pressed high thermal conductivity, the heat sink 29 to thereby against the cylindrical porticw12 by member 29D by the heat sink construct a thermal tive from the heat and the fixing bush 27. The heat generated generating part 8X is transferred to the cylindrical portion - 25 _ 2 through the thermal conductive member 29d, and radiated to the outside from the outer peripheral surface of the cylindrical portion 2.

According to this embodiment, as shown in Figs. 3 and 4, the heat sink 29 is configured to extend to the neighborhood of the cylindrical portion 2, the fixing bush 27 formed in a capwlike shape is d on the tip portion 29A of the heat sink29,auxithefixingbush27 ispressedagainstthecylindrical portion 2.

Accordingtothisconstruction,thethicknessofthefixing bush 27 interposed between the heat sink 29 and the cylindrical portion 2 is reduced, so that heat is easily erred from the heat sink 29 to the rical portion 2.

Whenthefixingbush27isconfiguredtobethin,theelastic force of the fixing bush 27 is reduced by the amount corresponding to the reduction of the ess thereof, and sag occurs 8 the elastic circuit board 8 when the elastic circuit board sink 29 when the is pressed by the fixing bush 27 and the heat elastic circuit board 8ijsfixed. Therefore, it is desired that thefixingbush27:haconfiguredtohavesuchcushionperformance that the sag can be suppressed.

Furthermore, when the amount of heat ed from the surfaceoftheheatsink29totheatmospherearoundthecylindrical portion 2 is large, the heat stays in the cylindrical portion 2, and thus affects the other circuit parts. Therefore, with i26_ respect to the heat sink 29, a heat—radiation fin shape (concavo~convex shape) is formed at only the tip n 29A d by the fixing bush 27, and the cap—like shape of the fixing bush 27 is formed so as to intrude into and come into of the heat—radiation contact with the concavo‘convex portion fin shape, whereby heat is more easily transferred from the heat~radiation fin shape of the tip portion 29A to the fixing bush 27 than that from the peripheral surface. sink 29 to Accordingly, the heat radiation from the heat 2 can be suppressed, and the ambient of the cylindrical portion the generated heat can be efficiently transferred to cylindrical n 2.

As described above, the inner surface of the cylindrical sheet 28, and axnaterial portion 2 is covered by the ting havinghighthermalconductivityisusedfortheinsulatingsheet from the fixing bush 27 to the 28, so that the heat transfer sheet cylindrical portion 2 is not disturbed by the insulating ribedabove,theinsulatingsheet28hashighthermal conductivity, and the fixing bush 27 as a thermallywconductive thermally connecting the circuit parts of the member for sheet 28 is provided electrical circuit board 8 and the insulating of the electrical circuit board between each of the circuit parts 8 and the insulating sheet 28, whereby both the tion electrical circuit board 8 can be the heat radiation for the -27.. enhanced.

Furthermore, the above construction may be modified so that the insulation sheet 28 is provided with a cut~out portion by cutting out the insulation sheet 28 in a range which comes into contact with the fixing bush 27, whereby the fixing bush 27 is brought into direct contact with the cylindrical portion 2 through the cut—out portion. In this case, heat is directly transferred from the fixing bush 27 to the cylindrical portion 2 through no insulating sheet 28. 3,referencenumera1270representsasubstantially ke insulating bush sing a rubber part formed of a silicon al, and it is mounted on the upper end portion BC of the electrical circuit board 8 and pressed against the LED board 16 facing from the insertion opening 14. The voltage enduranceperformancecanbeenhancedbyprovidingtheinsulating bush 270 between the electrical circuit board 8 and the LED board Fig. 5 is a bottom View of the LED lamp 1 under the state that the annular waterproof packing 70 is detached frontthe LED lamp 1, Fig. 6 is a cross—sectional view taken along a line VI~VI, and Fig. 7 is a cross—sectional View taken along a line VII—VII.

As described above, the g 35 containing the cylindricalportionjzandthebaseplate1K3isintegrallyprovided with the plural heat radiation fins 25, y enhancing the heat radiation performance. “28- Theheatradiationfins25areconfiguredlikethinplates, andmanyheatradiationfins25areerectedsubstantiallyradially around the axial line of the cylindrical portion 2 whew Viewed ebacksurfacelBAcflfthebaseplate13. Finrootportions fins 25 are joined 25E$as the root portions of the heat radiation tothebacksurface13Aofthebaseplatel3,andtheheatradiation fins 25, the cylindrical portion 2 and the base plate 13 are resin described integrally molded from the l conductive mold. As described above, above by resin molding using axnetal fins 25 are integrally the base plate 13 and the heat radiation base plate 13 molded, whereby the heat ance between the and each heat radiation fin 25 heat can be suppressed and the can be increased transfer amount to the heat ion fins to achieve high heat radiation performance. rds fronlthe back The heat radiation fins 25 extend surface 13A of the base plate 13 along the cylindrical portion radiation fin 25 2, but a gap 8 is provided between each heat fins and the cylindrical portion 2 so that the heat radiation through.the gaps are separated fronlthe cylindrical porticw12 fins 25 are paired, S. Respective two adjacent heat radiation 2 side of and both the end portions at the rical portion are connected to each other each pair of heat radiation fins each fin 101 having througtxa joint portion 105, thereby forming lower base a substantially trapezoidal shape whose is.opened flat bottom) (hereinafter (or a substantially V—shape having a ~«.29.. referred to as "open trapezoidal fin") in bottom View. Here, the upper base of the trapezoidal shape and the flat bottom of the V~shape correspond to the joint portion 105. These open trapezoidal fins 101 are formed integrally with one another.

According to the open trapezoidal fins 101, an air flowing path F is formed between the cylindrical portion 2 and each joint portion 105 as shown in Fig. 5. Therefore, the outer peripheral surface of the cylindrical portion 2 is air—cooled and the electrical circuit board 8 mounted in the rical portion 2 is cooled. ularly, the heat of the heat generating part 8X of theelectricalcircuitboard8 istransferred1x>thecylindrical through the fixing bush 27 and the heat sink 29 portion 2 as described above. Therefore, the electrical circuit board 8 is efficiently cooled e the cylindrical portion 2 is cooled by air passing h the air flow paths F.

In this embodiment, the adjacent two heat radiation fins oinedtoeachotherthroughthejointportionlOS. r, three enclportions at the cylindrical porticw12 side of adjacent ormoreheatradiationfins25maybejoinedtooneanotherthrough a joint portion 105.

As shown in Fig. 5, a distributing fin 103 is provided trapezoidal fins 101 (each fin between the adjacent open corresponds to the pair of the heat radiation fins 25 joined, so that at both the ends thereof through the joint portion 105) -30.. air g through the gap between these adjacent open trapezoidal fins 101 to the cylindrical.portion.2ixsdistributed 101 concerned. to each of the adjacent open trapezoidal fins The distributing fins 103 extend from the back e 13A of 2 like the heat the base plate 13 along the cylindrical portion radiationfinsZS,anxiagapisprovidedbetweeneachdistributing 103 and the cylindrical portion 2 by fin a ting portion 91. The air stream passing through the gap between the open trapezoidalfins101isdistributedtoeachoftheopentrapezoidal fins101bythedistributingfin103,wherebyunevennessofcooling the 2 on the outer eral surface of cylindrical portion 2 can be uniformly can be suppressed, and the cylindrical portion cooled.

AsshownixiFig.1,thedistributingfins103areconfigured length from the base plate 13 along the to have a shorter cylindrical portion 2 (for example, a shorter vertical length in the vertical direction in Fig. 1) than the heat ion fins 25. Accordingly, air can flow over the distributing oidal fins 101, so that the air 103 between the open distribution of the distributing fins 103 can be uniformly performed. radiation fins 25 of the The respective confronting heat 101 are arranged in parallel to adjacent open trapezoidal fins formed the each other, and the distributing fin 103 is at portion between the paired confronting heat intermediate i 31 1 ionfins25zuiparalleltotheseconfrontingheatradiation fins 25.

As shown in Fig. 5, the back surface 13A of the base plate 13 is further provided with short heat radiation fins 102 each located.between the respective heat radiation fins 25 which are each joined to each other by the joint portion 105 to constitute oidal heat radiation fin 101. The short heat radiation fins 102 are configured to have a shorter length from the back surface 13A of the base plate 13 along the cylindrical portion 2(forexample,ashorterverticallengthintheverticaldirection of Fig. 1) than the heat radiation fins 25, and also have length the distribution fins 103. The heat radiation same as of the base plate 13 is assisted by each short radiation fin mounted. 102, and LEDs 15 having higher output power can be the short heat radiation fins 102 are formed to Furthermore, fins 25, and the end.portions be shorter than the heat ion 1020 at the cylindrical portion 2 side of the short radiation 105 h gaps fins 102 are separated from the joint portions 101 is not Sa. ore, air flow in the open trapezoidal fins disturbed, and; thus the cooling performance of the open trapezoidal fins 101 which mainly carry out heat radiation not disturbed.

In addition, as shown in Fig. 5, outside annular fins 106 and inside annular fins 107 are formed on the back surface 13A of the base plate 13 fins which are as annular heat radiation i 32 , arranged so as to surrOund the cylindrical portion 2. These outsideannularfinslO6andinsideannularfins107areconfigured surface 13A of the base to have a shorter length from the back plate 13 along the cylindrical portion 2 than the short heat inside radiation fins 102. The outside annular fins 106 and the air streanw in the open annular fins 107 brings randonlnature to fins 101, trapezoidal fins 101 and between the open trapezoidal thereby enhancing the g performance.

In addition, since the outside annular fins 106 and the inside annular fins 107 are short, when the LED lamp 1 is used 12 are located in a e that the light emitting ns at lower positions than the base 3 (under so-called downward trapped; lighting), water or the like is prevented from being annular fin 106, the inside in a space surroundeclby the outside fin 101. annular fin 107 and the open oidal The e annular fins 106 are formed just below 15A, the inside outer-peripheral side light emitting portions the inner—peripheral side annular fins 107 are formed.just.below and the outside and inside annular light emitting portions 158, outer peripheral side of fins 106 and 107 are located at can be the joint portions 105. The heat generated from LEDs the base plate 13 can be reinforced efficiently radiated and annular annular fins 106 and'the inside by arranging the outside fins 107 just below LEDs 15. fins 25, In this embodiment, not only the heat radiation but also the short heat ion fins 102, the buting fins 103, the outside annular fins 106 and the inside annular fins 107 which are shorter than the heat radiation fins are provided on the back surface 13A of the base plate 13 as described above. At this time, the heat radiation performance could be enhanced by lengthening the tive fins. If so, it causes increase of the weight of the housing 35. Therefore, in this embodiment,onlytheheatradiationfins250ftheopentrapezoidal fins 101 which are are in charge of most of heat radiation lengthened, and the other fins are shortened, whereby ight of the housing 35 is suppressed. However, as the fin length back surface increases, the moment applied to the fin roots on the 13A increases. ore, the heat radiation fins 25 are configuredtobethickerthantheotherfinstoenhancethestrength thereof.

Here, the surface of the housing 35 containing the base is coated with coating plate 13, the heat radiation fins 25, etc. material or chemicals to enhance weather resistance or design Conventional LED performance after the resin molding thereof. heat radiation fins lamps are generally configured so that the and also the radially extend from the cylindrical portien 2, at the base plate 13 side of the heat radiation ifgl end portions the base plate.7l fins 25 are connected to the back surface 13A of 13. Therefore, there is~a problem that in thé above coatingr into process, the g material or the like hardly intrudes _ 34 i the corner portions of each joint portion between the baseIQlate l3 and each of the cylindrical portion 2 and the heat radiation fins 25, and also the coating material or the like droops in front of the fins when the amount of the coating material or the like is increased. ore, it is required in the coating process to coat the coating material or the like little by little ividingthecoatingprocessintopluralsteps. Therefore, the coating frequency increases, which causes increase of the cost.

On the other hand, in the LED lamp 1 of this embodiment, the separating portion 91 for separating the heat radiation fin and the cylindrical portion 2 from each other is provided over the area from the fin root portion 25B as the root portion (at the upper position in the vertical direction) of each heat radiation fin 25 (as a joint portion to the base plate 13) to the fin'tipJZSA (at the lower position in the vertical direction) of the heat ion fin 25 to provide the gap S between each heat radiation fin 25 and the cylindrical portion 2.

Accordingly,inthecwatingprocessofcmatingthehousing , no pool of liquid occurs between each heat radiation fin 25andthecylindricalportionZ. Therefore,theamountofliquid to be coated per once can be increased to reduce the coating frequency, and the coating material can be easily and mly coated on the g 35. Particularly, the coating material goes around the rical portion 2 through the separating “35’... portions 91 by ng the g material through a spray or the like, so that the coating material can be coated evenly in a broad range by only one coating operation..

Furthermore, the weight of the g 35 can be reduced by providing the separating portions 91, and the cost of the material can be suppressed. Furthermore, rain water or the like heat radiation fin carxbe prevented from collecting between the and the cylindrical portion 2 when the LED lamp 1 is used. radiation fins In addition, with respect to the short heat 102 provided in the open trapezoidal fins 101, the gap Se is 102 and the joint providedloetween each short heat radiation fin Accordingly, uneven (irregular) coating of the portion 105. the open trapezoidal coating material can be also prevented from fins 101.

As shown in Fig. l, the fins 101 open trapezoidal (the heat radiation fins 25), the short heat ion fins 102 and the distributing fins 103 are configured to be substantially fan—shapedinsideviewsoastodrawanmderatearcinthedirection from the back surface 13A of the base plate (Fig. 2) to the edge n 66 of the opening of the holder housing 62, fins 101 (the heat radiation lengths of the open trapezoidal 102 and the<distributing 7 fins 25), the short heat radiation fins of the cylindrical 31' fins 103 which extend in the axial direction pOrtion 2 (that is, the lengths thereof along the cylindricalu inner peripheral side: portion 2) are gradually reduced fronithe (the cylindrical portion 2 side) to the outer peripheral side.

Asdescribedabove,theheatradiationfinsZS,etc.areconfigured to be substantially fan~shaped in side View, whereby sense of be enhanced unity n the lamp holder 60 and the LED lamp 1 can when the LED lamp 1 is mounted in the lamp holder 60, thereby enhancing the design performance.

As shown in Fig. 6, the fin tips 101A of the open trapezoidal fins 101 are formed horizontally (vertically to the axial line ofthecylindricalportionZ),andtheuppersurfaceoftheannular 2 comes waterproof packing 70 mounted on the cylindrical portion into contact with the fin tips 101A.

As shown in Fig. 7, the base plate 13 is configured be gradually thinner from the inner peripheral portion connected to the cylindrical portion 2 to the outer peripheral portion 130. Specifically, the fixing e 13D of the base is fixed is formed to be vertical plate 13 to which the LED board 16 the axial line of the cylindrical portion 2, and the back radiation surface 13A of the base plate 13 on which the heat surface so that the fins 25 are formed is configured as a taper whole e thereof as thickness thereof is smaller over the side. The the position thereof shifts to the outer peripheral base plate 13 has lower heat ance to the heat radiation the outer peripheral fins 25 as the position thereof shifts to portionl3Csidewhichissmallerinplatethickness. Furthermore, theinnerperipheralportion13BofthebaseplatelBisconfigured -37.... ‘tx>bethicker,andthushashighrigidity. Therefore,thefixing surface 13D can be prevented from warping and the flatness the fixing surface 130 can be enhanced.

Fig. 8 is a partially enlarged plan view of the open trapezoidal fin 101.

As shown in Fig. 8, the heat ion fin 25 constituting the open trapezoidal fin 101 has a large ess portion 110 at which the plate ess of the fin root portion 258 is substantially equal to the plate thickness of the joint portion 105,andasmallthicknessportion111atwhichtheplatethickness of the fin root portion 25B is gradually smaller from the end n of the large thickness portion 110 to the tip side of the outer eral side of the heat radiation fin 25. The boundaryportionllOA<Fig.8)betweenthelargethicknessportion is located between the 110 and the small thickness portion 111 annular fin 106 and the inside annular fin 107. outside As described above, the fin root portions 258 of the heat fin 101 are radiation fin 25 constituting the open trapezoidal outer configured to be thinner in plate thickness toward the fin 101 is lighter peripheral side, so that the open trapezoidal in weight toward the outer peripheral side; _ In this, ment, as, described";y’aboi‘xir'é; the open, . trapezoidal: fins~ 101 Larer configuredfl t2} bef Substantially fan-shaped in side View so as to draw a modérate aid, andithéflfilxvf extension length of thé‘open trapezoidal fin 101 extending in -38.. the axial direction of the rical portion 2 is gradually reduced from the inner peripheral side to the outer peripheral side. Therefore,whenexternalforceactsontheopentrapezoidal fin lOl, bending moment applied to the fin root portion 25B of the open trapezoidal fin 101 is smaller as the applied position shifts to the outer peripheral side at which the length in the axial direction of the open trapezoidal fin 101 is r.

Therefore, the plate thickness of the fin root portion 258 of the heat radiation fin 25 constituting the open trapezoidal is d to be smaller toward the outer peripheral side 101 in conformity with the bending .

Furthermore, in order to prevent occurrence of sink (shrinkage)onthefixingsurface13Dintheresinmoldingprocess, it may be considered that the thickness of the base plate 13 is larger than the plate thickness of the open trapezoidal lOlatthefinrootportionZSB. Inthiscase,theheatresistance from the base plate 13 to the open trapezoidal fin 101 increases.

However, in this embodiment, the base plate 13 is configured 13C side in to be r toward the outer peripheral portion conformity with the plat thickness of the fin root portion the outer of the heat radiation fin 25 which is smaller toward peripheralside. Therefore,sinkcanbepreventedfromoccurring on the fixing surface 13D in the resin molding process with ing the heat radiation performance of the base plate surface 13D, the By preventing occurrence of sink of the fixing -39.. ss of the fixing surface 13D is enhanced, and the adhesiveness between the fixing surface 13D and the LED board of the 16 is enhanced, so that the heat ion performance base plate 13 can be enhanced. More specifically, when sink 25B of each open trapezoidal fin occurs in the fin root portion surface 13D and the LED 101, a gap occurs between the fixing board 16 at this n. However, by preventing occurrence of 16 can be brought sink, the fixing surface 13D and the LEDlaoard into close contact with each other, so that the heat radiation performance can be enhanced.

Furthermore, the base plate 13 and the open trapezoidal fins101arecmnfiguredixabethinnertowardtheouterperipheral and thus the weight of the housing can be reduced. side, Still furthermore, the base plate 13 and the open toward the trapezoidal fins 101 thinner are configured to be outer peripheral side, and the heat radiation mance at Therefore, the outer peripheral side is enhanced. heat of the outer—peripheral side light emitting portions 15A whose heat generation amount is larger than that of the peripheral side light emitting portions 158 can be efficiently radiated. the open trapezoidal fins Even when the base plate 13 and die cast, sink can be suppressed 101 are manufactured by aluminum by adopting the construction of this embodiment.

As shown in Figs. 6 to 8, the esses of the heat' fins 101, radiation fins 25 constituting the open trapezoidal the short heat ion fins 25, the distributing fins 103, the outside annular fins 106 and the inside annular fins 107 from the are set to be gradually smaller in the axial direction fin root portions 25B to the end of the base 3 side. ore, the thickness of each fin acts as a releasing taper, and when the housing 35 is molded by a metal mold, the housing 35 can be easily separated fronlthe metal mold in the axial direction.

Furthermore, groove portions 115 are formed at both the sides of the fin root portion 258 of each of the heat radiation fins 25 constituting the open trapezoidal fins 101, the short heat radiation fins 102, the distributing fins 103, the outside annular fins 106 and the inside annular fins 107. The groove portions 115 are formed over the whole length of each fin. shrinkage range of the resin in the neighborhood of the fin root ns 25B can be ed due to this groove portion 115, 13D can be suppressed so that sink occurring on the fixing surface 13 can and at the same time the surface area of the base plate be increased.

As shown in Figs. 1 to 4, the annular waterproof packing in side 70 is formed in a substantially truncated conical shape view (a substantially trapezoidal shape in section) so as to be continuous with arcs corresponding to the outer shapes of the heat radiation fins 25, the contour shape ucted by the heat radiation fins 25 and the annular waterproof packing 70 is set to be substantially equal to the contour shape of an _ 41 _ existing glass bulb. Accordingly, even when the LED lamp 1 is used in place of the existing light bulb, a trouble caused by the difference in shape can be prevented. fiber having high Here, a resin material mixed with carbon thermal conductivity (hereinafter referred to as “thermal conductive fiber”) is used as the material of the cylindrical portion 2. It is known that anisotropy occurs in thermal conductivity in ance with orientation of the l conductive fiber.

In this embodiment, the thermal conductive fiber is oriented so as to increase the l conductivity from the heat radiation cylindrical portion 2 and the base plate 13 to the radiation performance of fins 25, y enhancing the heat the cylindrical portion 2. The orientation of the thermal of the resin injecting conductive fiber is controlled on the basis direction in a resin injection molding process.

Next, 21B at a structure of passing lead wires 21A and portion 10 will the al 10A of the insulating rical be described. which is taken Fig. 9 is of housing 35 a plan view the from the base plate 13 side. 116 for As shown in Fig. 9, a pair of pinching portions f_ pinching and supporting the edge portions of the electrical circuit board 8 are provided on the inner peripheral surfade oftheinsulatingcylinderportionll)soasixaprojecttherefrom. -42..

The pinching portions 116 are arranged to be ly displaced fromthecenteroftheinsulatingcylinderportionlOandconfront each other, and the electrical circuit board 8 is supported to be ly displaced from the center of the insulating cylinder portion 10 so that the plate surface thereof is in parallel to the axial line of the insulating er portion 10.

Fig. 10 is a cross—sectional view taken along a line XeX of Fig. 9.

AsshowninFigs.4,9and10,theinsultingcylinderportion is closed by a bag portion 120 formed at the terminal 10A.

Specifically, the bag portion 120 has a plate portion 121 provided of the so as to close the terminal 10A at the inside end face of the terminal 10A, and a pair of projecting portions 122A and 122B obtained by projecting a part of the plate portion 121 to the eyelet side 7. The projecting portions 122A_and 122B a cylinder portion 123 formed at the end of are surrounded by the al 10A, and an inside portion of the cylinder portion not formed 123 at which the projecting n 122A and 122B are serves as a recess portion 124 which is inwardly concaved from the end face 123A of the cylinder portion 123. closer The projecting portion 122A and 122B project to be totheeyelet”?sidethantheendface123Acflfthecylinderportion 123, and they are formed to be d to the tips thereof. end of the eyelet side 7 of the housing 35 corresponds to the tips of the projecting portions 122A and 122B. -43..

Wire holes 125A and 125B as through~holes penetrating formed at the through the projecting portions 122A and 122B are and 122B, and the tip portions of the projecting portions 122A electrical circuit lead wires 21A and 21B extending from the and extend board 8 pass through the wire holes 125A and 125B to the base 3 side. The wire holes 125A and 125B are arranged parallel on the center line of the insulating cylinder portion View. Large~diameter to the electrical circuit board 8ij1plan wire holes 125A and portions 129 are formed at the ends of the 1258, and the lead wires 21A and 218 are easily bent at largewdiameter portions 129.

The projecting portions 122A and 122B are formed at the side of the bag n 120 inner surface so that the center portion of the plate portion 121 remains, whereby a partition wall 126 ting to the light emitting portion 12 side formed by the plate portion 121 .

The inner space of the terminal 10A which is substantially cylindrical in section substantiallybisectaflbythepartitionwall126. Thepartition the center of the wall 126 is disposed so as to pass through insulatingcylinderportion10andbesubstantiallyperpendicular to the plate surface of the ical Circuit board As shown in Fig. 9p the led lead wires 21A and 21B are outfronpOSitionscorrespondingtoboththeSidesofthepartitionI circuit board 8 wall 126 at the lower side of the electrical 127A and 127B fer g A pair of introducing portiOns -44.... the lead wires 21A and 21B to the wire holes 125A and 1258 are formed at the inside of the projecting portions 122A and 122B.

The introducing portions 127A and 127B are formed in a conical shape<funnel~shape) d to the wire holes 125A and 125B at 127B the tip thereof, so that the introducing portions 127A and can surely guide the lead wires 21A and 21B to the wire holes 125a and 125B. Furthermore, the inner space of the terminal 10A issubstantiallybisectedbythepartitionwall126,andoccupied by the ucing portions 127A and 1278. ore, the lead wires 21A and 21B necessarily abut against the introducing portions 127A and 127B, can so that the lead wires 21A and 21B be surely guided to the wire holes 125A and 1258.

In the ling process, the electrical circuit board to the 8 is inserted through the insulating er portion.10 7 side along the pinching portions 116. In connection eyelet board with the insertion of the electrical circuit 8, the lead circuit wires 21A and 21B at the lower portion of the electrical board 8 come into contact with the introducing portions 127A wall 126 and and 127B which are partitioned by the partition located below the lead wires 21A and 218, and surely led to the wire holes 125A and 1258 while guided by the funnel~shaped introducing portions 127A and 127B.

As shown in Fig. 4, the lead wire 21A drawn out from the wire hole 125A is passed through the inside of the base 3 and connected to the eyelet 7. The lead wire 2lB drawn out fronlthe -45... wire hole 1258 is bent to the outside at the terminal 10A of the ting er 10, extends along the outer e of to the the insulating cylinder portion 10 and then is connected shell 5.

As described above, the wire holes 125A and 1258 through drawn out are which the lead wires 21A and 218 are respectively provided in front of the position at which the lead wire 218 is outwardly bent. Therefore, the lead wires 21A and 218 can be prevented from intertangling with each other and thus short—circuited to each other. Furthermore, by providing the introducing portions 127A and 1278, the lead wires 21A and 218 and 1258. can be simply passed through the wire holes 125A 1258 are formed Therefore, 125A and even when the wire holes is substantially equal to that of so that the diameter thereof occurs therebetween, the lead wires 21A and 218 and thus no gap these lead wires 21A and 218 can simply passed h the wire holes 125A and 1258. terminal 10A of the Fig. 11 is an enlarged view of the ting cylinder portion 10.

A screw portion 33 (locking portion) which is engaged with the inner peripheral Surface of the shell 5 to lock the base of the terminal 10A 3 is formed on the-outer peripheral surfaCe ’. A wire grboVe‘ 34 , of the insulating Cylinder portiOn (grd‘ovél portiOn) extending in the axial direction 0f the insulating” cylinder portion 10 is formed on the outer peripheral surface _ 46 _ of the terminal 10A, and the wire groove 34 is provided to be engraved in a part of the screw portion 33. The lead wire 21B whichbendsandextendsoutwardsfromtheinsideoftheinsulating cylinderll)extendstx>thecylinderporthmuZsidewhileembedded in the wire groove 34. That is, under the state that the shell insulating cylinder 10, the lead wire 21 is secured to the 34 at the inside of the shell passes through the wire groove to the outer peripheral surface cf the shell 5 , and joined of the shell 5. The end in the neighborhood of the opening end 34 is d at the end face 123A of 34A of the wire groove the cylinder portion 123, and the projecting portions 122A 1228 projects to the eyelet 7 side at the outside of the end 34A of the wire groove 34. 34 through which the lead Furthermore, the wire groove wire 218 passes links to the inside of the insulating cylinder intercommunicate , and the eyelet 7 and the cylinder portion 2 wire holes 125A and 125B in the with each other h the ting cylinder 10. Therefore, air can get into/out of the 34 and the wire holes cylinder n.2 through the wire groove 125Aand125B,therebypreventingdewcondensationinthecylinder portion 2.

When the base 3 is secured to the insulating cylinder 10, insulating cylinder 10 and fixed to the insulating cylinder is engaged with the screw portion under the state that the shell 5 ..47_ 33 of the ting cylinder 10.

A pair of prepared holes 56 for swage of the base 3 are provided in the side surface of the insulating er 10. The shell 5 of the base 3 is swaged at the positions corresponding to the prepared holes 56, y the shell 5 is deformed so the ation as to intrude into the prepared holes 56, whereby amount of the shell 5 increases, and the th of the swaging portions can be enhanced.

When the LED lamp 1 is installed in a downward ng stateunderwhichtheLEDlamp1.lightsdownwards,thebagportion 120 constitutes the upper surface of the housing 35. In this embodiment, the bag portion 120 projects to the upper side of under the end face 123A of the insulating cylinder portion 125A and 125B the downward lighting state, and the wire holes of the end face 123A. Therefore, are located at the upper side even when water invades into the upper surface portion of the like, these housing 35 due to dew condensation, rain water or from the wire holes 125A water can be prevented from invading and 125B into the housing 35. Furthermore, when the invasion amountofwaterislarge,thewaterispooledintherecessportion 124 of the upper surface portion. However, the wire holes 125A that water and 1258 are located above the end face 123A, so can‘ Wire holes 125A and 1258... be prevented from invading into the located at It Furthermore, the wire holes 125A and 1258 are higherpOSitionsthantflmeend34Acfifthewiregroove34 Therefore,e V w48.... even when water invades along the wire groove 34 into the upper surface portion of the g 35, the water can be prevented frontinvading into the wire holes 125A and 125B. Therefore, air can get into/out of the cylindrical portion 2 through the wire groove 34, whereby water can be ted from the wire holes 125Aand125Bintothehousing35withpreventingdewcondensation in the housing 35.

Next, there will be described an anti~drop structure for the LED lamp 1 suitably used when the LED lamp 1 is installed in a so~called downward lighting state under which the LED lamp 1 is set up at a high place and lights an illumination target object such as an advertizing display or a wall e which is disposed at the vertical lower side, an indoor or the like.

Fig. 12 is for a diagram showing the anti—drop structure the LED lamp 1.

As shown in Figs. 1 to 3, Fig. 5 and Fig. 12, the LED lamp 1 has a pair of metal pins 130 joined to the adjacent open trapezoidal fins 101 (two pairs of adjacent open trapezoidal fins 101 in this embodiment), and a pair of rop wires 131 joined to the pins 130. Each of the anti—drop wires 131 is connected to a metal band 133 fixed to the lamp holder 60, whereby theLEDlampl.isjoinedtothelampholder60throughtheanti~drop wire 131 need as the . Any rod—like or string—like member may be anti~drop wire 131 insofar as it ons as a support member for supporting the LED lamp 1. ~ 49 -' As shown in Fig. 5, each pin 130 is bridged between the pair of adjacent open trapezoidal fins 101 between which the distributing fh1103 issandwiched. Specifically,each;fl11130 is bridged between the heat radiation fins 25 arranged substantially in parallel so as to penetrate through the heat ion fins 25 substantially dicularly to the surface of the fin 25. As described above, the pins 130 are joined to plural heat radiation fins 25, y the pins 130 are firmly fixed.

Each of the heat radiation fins 25 through which the pins 130 penetrate is provided with a suppOrt hole 134 at the ediate portion of a portion thereof which extends in the radial direction of the base plate 13, and.both the end.portions ofeachpin130areinsertedthroughthesupportholes134,whereby the pins 130 is fixed to the heat radiation fins 25. Each pin 130 is fixed to the intermediate portion in the height direction' ofeachheatradiatLMIfM125,andlocatedbelowthecflstributing' fin 103.

Each pin 130 has a flange portion 130A.at one end thereof, and the pin 130 is inserted through the support hole 134 of one ‘ eatradiationfins25tobetmidge bythepin13Oconc1rniwvl while the portion130A thereo radiation fin 25 concerned, and the other ” :5‘5i’ concerned is inserted through the support hole 134of theother55fvinlg heat radiation fin 25and fitted in a fiXing ring130B Sothat - _ 50 _ the pin 130 is fixed to the heat radiation fin 25 by the fixing ring 130B.

Inthisembodiment,theheatradiationfins251x>bebridged by the pins 130 are arranged substantially in parallel to each other. Therefore, the support holes 134 can be easily formed in the heat radiation fins 25 by a machine work or the like forming through~holes penetrating through the heat radiation fins 25 after the resin g process. The t holes 134 metal mold may be formed by a boring ism provided to the used for the resinxnolding of the housing 35. In this case, the supportholes134<xu1beeasilyformedbecausetheheatradiation fins 25 are arranged substantially in parallel. rmore, the pair of pins 130 are provided so as to confront each other through the cylindrical portion 2.

The antivdrop wire 131 is constructed by crooking both the crooked the ends of a wire in a ring~like shape and swaging and has a pin joint ends of the wire with swaging portions 131D, portion 131A to be hooked to the pin 130 at one end thereof, and a band joint portion 131B to be joined to the band 133 at the other end thereof. The ring—shaped portion of the pin joint 130. portion 131A has a hook 131C to be hooked to the pin Figs. 13A and 13B show the band 133, wherein Fig. 13A is and Fig. 13B is a ctive View a plan View of the band 133, showing the state that the anti—drop wire 131 is secured.

As shown in Fig. 13, the band 133 has aCZtype ring portion ”51.. 135obtainmdbybendimgaband—likeplateannularly(likearing), of the C type an adjusting portion 136 ed to an open end ring portion 135, and a pair of wire joint portions 137 formed on the outer peripheral surface of the C type ring portion 135 so as to project outwards from the outer peripheral surface.

The adjusting portion 136 has a nut portion 136A formed at one end of the C type ring portion 135, a hole portion 136B C type ring n 135, and a formed at the other end of the bolt 136C screwed to the nut portion 136A. The er of the C type ring portion 135 of the band 133 can be changed by fastening 136B to the nut the bolt 136C inserted through the hole portion portion 136A, whereby the constriction force of the band to the lamp holder 60 can be adjusted. 131B of the A hole 137A to which the band joint n the wire joint portion antiedrop wire 131 is joined is formed in around the wire joint 137, and the anti—drop wire 131 is le portion 137. as to The wire joint portions 137 are provided so confronteachotherinconnectionwiththepins130. Enrthermore, the wire joint portions 137 are arranged so that the antiedrop wires 131 to the axial line of the are substantially parallel LEDlamp1.underthestatethattheantivdropWires131areJOined t to the pins 130.

L Theband133iswoundandfixedaroundabandwmndingportimnI 6mjprov1dedcn1theouterperipheralsurface311theneighborhood ofthetipGOBofthelampholder60 Astepportion6ODprOjecting _ 52 _ outwards is formed at the tip 60B side of the band winding portion 60C. When the band 133 moves to slip out of the lamp holder 60, the band 133 abuts against the step portion 60D, whereby the band 133 is prevented from slipping out in the axial direction of the lamp holder 60.

When the LED lamp 1 is secured to the lamp holder 60, the hook 131C of each anti—drop wire 131 is joined to each pin 130 of the LED lamp 1 to connect the band 133 to the LED lamp 1.

Subsequently, the band 133 is kept under an expanded state, the LED lamp 1 is inserted into the lamp holder 60 from the base 3 side while the lamp holder 60 is passed through the band 133, and the band 133 is arily fixed to the band g portion 60C of the lamp holder 60. Under this state, the constriction force of the band 133 is loosened by the adjusting portion 136, and the diameter thereof is set so that the band 133 is rotatable on the outer peripheral surface of the lamp holder 60, but it does not detach from the lamp holder 60.

Subsequently, the base 3 of the LED lamp 1 is screwed to the socket 65 by rotating the LED lamp 1. At this time, the band 133 rotates together with the LED lamp 1. As described above, the LED lamp 1 is screwed to the lamp holder 60 under the state that the LED lamp 1 is ted to the lamp holder 60- through the anti-drop wires 131 and the band 133. Therefore, when the~ LED lamp 1 is secured to the lamp holder 60, the LED lamp 1 can' be suppressed from ng off the lamp holder 60 .

Furthermore, 153.. when the LED lamp 1 is detached from the lamp holder 60, the LED lamp 1 can be prevented from dropping by rotating the LED lamp 1 while the band 133 is loosened.

After the LED lamp 1 is screwed to the socket 65, the band 133 is completely constricted by the adjusting portion 136, whereby the band 133 is fixed to a predetermined position of the band winding portion 60C of the lamp holder 60 . Accordingly, the LED lamp 1 is fixed to the lamp holder 60 through the pair of antiwdrop wires 131, thereby preventing the LED lamp 1 from dropping off. That is, even when the engagement between the base 3 and the socket 65 is ed from any cause, the LED lamp 1 can be ted from dropping off because it is fixed to the lamp holder 60 by the antiedrop wires 131.

Tension is applied to the anti—drop wires 131 by adjusting the on at which the band 133 is fixed, whereby the r waterproofpacking'fl)iscompressedbetweentjuaopentrapezoidala fin 101 and the tip 60B of the lamp holder 60], Therefore, eVen‘ when Vibration acts, occurrence of a gap between the annular waterproof packing 70 and the lamp holder 60 can be prevented,’ and the waterproof performance can be enhanced. ‘ Furthermore,the weight of theLED1'31 'the antidrop Wires 131 andthe socket vacting on the socket 6r>¥5 reducedgj’ can be prevented_frombeing deformed or dama.. lfhlfind or the like act’s; -54...

Furthermore, the LED lamp 1 is supported by the anti-drop wires 131 which confront each other h the cylindrical portion 2. Therefore, even when the engagement between the base 3 and the socket 65 is released, the LED lamp 1 can be ted from dropping out of the lamp holder 60. For example, when the is supported above construction is modified so that the LED lamp 1 the LED lamp by only one antivdrop wire 131, the dropping of 1 can be prevented, but the rop wire 131 and the LED lamp 1 may turn around the pin 130, so that the LED lamp 1 drops out of the lamp holder 60. that This ment has been described.on the assumption wires 131 are provided. However, this a pair of anti~drop wire 131 embodiment may be modified so that only one anti—drop in consideration of the weight of the LED lamp 1 is provided to be imposed and the LED lamp or an estimated load or the like 1 is supported by only one antivdrop wire 131.

Furthermore, in this embodiment, the pin 130 bridged between two heat radiation fins 25 is provided as a connection this member. r, the present invention is not limited to embodiment. Theconnectionmembermaybeconfiguredtobebridged between two or more heat ion fins 25. For example, the connectionmembermaybearing~shapedmemberwhichmakesacircuit the support, of the cylindrical portion 2 while paSSing thrcugh holes 134 formed in all (twelve)heat radiation fins 25, and the connection member. anti—drop wire 131 may be connected to this _ 55 _ In place of the rod—like pin 130, a string—like wire may be used as the connection member. rmore, the present invention is not limited to the construction that the anti—drop wire 131 is secured to the lamp holder 60 by using the band 133. For example, one end side of around the lamp holder a string—like anti—drop>wire 131 is wound 60 or the like to fix the one end side of the string—like antiwdrop wire 131 to the lamp holder 60, and the other end f is fixedtothepin130orthelikeoftheLEDlampl,therebypreventing drop of the LED lamp 1.

Here, since the LED lamp 1 is heavier than a normal incandescent light bulb or the like, the load imposed on the socket 65 and the base 3 increases. Therefore, when the LED lamp 1 is used while d on a lamp holder 60 having an existing socket 65 which is designed for an incandescent light bulb, example, vibration is applied to the LED lamp 1 from vehicles, etc. running on a road. When the effect of the vibratiOn the socket accumulatively applied to the socket 65 and the base 3, 65, the base 3, etc. are damaged, so that the LED lamp 1 may drop out of the lamp holder 60 with high probability. two antidropfelfl In this embodiment, as describedabove, the wires 131 extendlng from the lamp holder 60are connectedtqih5~'6 ore,event}. the pins 130 of the LED lamp 1 at tWO pOS1tions , when the LED lamp i~ 1 drops out of the socket 65, the drop of the LED lamp 1 can be prevented, ...56_ However, as described above, the dead weight of the LED lamp1.islargerthantheincandescentlightbulb,etc. Therefore, in a case where the LED lamp 1 dropped out of the socket 65 greatly swings when ded by the anti-drop wire 131, the LED lamp alsillboard 1 may collide against an nation target such.as so that the LED lamp or the like and thus suffer a great impact, 1 is damaged by the impact. according to this embodiment, in order to Therefore, suppress the swing width of the LED lamp 1 when LED lamp ldropsout<1fthesocket65,thesupporthole3134forsupporting 3 than the the pins 130 are ed to be nearer to the base the LED lamp center—ofwgravity position Gx of the dead weight of emitting portion 12 and the bags 3. 1 between the light relationship Fig. 14 is a diagram showing the positional between the center—of—gravity position Gx of the dead weight of the LED lamp 1 and the support hole 134, wherein the upper stage of Fig. 14 shows 1 is installed a state that the LED lamp and the lower stage of Fig. 14 shows a state that the LED lamp 1 drops out.

The center—of~gravity position Gx of the dead weight correspondstothepositioncorrespondingtothecenterofgravity of the eight of the LED lamp 1 .1 When there is any-”accessory 70 or the like“Which is such as the annular waterproof packing 1 when the LED lamp 1 dropS"V kept to be mounted 0n the LED lamp out of the socket 65, the total weight centaining the weight 157.. of the accessory concerned is adopted as the dead weight of the LED lamp 1.

When the LED lamp 1 is used under the downward lighting state, as shown at the upper stage of Fig. 14, the LED lamp 1 is set up so that the base 3 is d in the socket 65 in such a posture that the light emitting portion 12 of the LED lamp 1 faces a vertical lower side and the base 3 is located at a vertically higher position than the light emitting portion 12.

When the base 3 drops out of the socket 65 under this setup state as shown at the lower stage of Fig. 14, the support hole 134 is turned as a supporting point so that the —of—gravity position Gx of the dead weight is located vertically just below thesupporthole134ixnwhichtheantiedropwire131iscmnneCted.

In the LED lamp 1 of this embodiment, the support hole 134 is ed to be nearer to the base 3 than the center—of~gravity position Gx of the dead weight, and the: center—of—gravityposition(hcofthedeadweighthasbeenalreadv 134 Under located at a vertically lower side of the support hole the setup state. ore, the turn (swing) amount of the LED_ lamp 1 under the dropout state corresponds to the level of displacement amount in the horizontal direction nthefr‘.' center——Ofgravity pOSition Gx of the dead weightandthesupporti‘jlf’ ho is 134,_-so_ that the swing Width of the LEDlamp 1 caused by,_f}}f_r the turning Can be suppressed to arelaWSS‘flhSh Fig. 15 iS a diagramShOWlng thepositional relatio ShlpSL‘hih ”—58— between the center—of—gravity on Gx of the dead weight of the LED lamp 1, wherein the upper stage of Fig. 15 shows the setup state of the LED lamp and the lower stage of Fig. 158 shows the dropout state of the LED lamp. In the case of the LED lamp 1 in which the support hole 134 is disposed to be nearer to the light emitting portion 12 than the centervof-gravity position Gx of the dead weight of the LED lamp 1 as shown at the upper socket stage of Fig. 15, when the base 3 drops out of the 65, the LED lamp 1 greatly turns (swings) around the support hole 134 as a supporting point so that the center—of—gravity position side of the Gx of the dead weight located at a vertically upper side of the support hole 134 moves to the vertically just lower supporthole134,andtheswingwidthoftheLEDlamplisrelatively in connection with the turn (swing) of the LED large lamp 1.

That is, as in the case of this ment, the support hole 134 is provided to be nearer to the base 3 than center—of~gravity position Gx of the dead weight, Whereby the turn (swing) amount of the LED lamp 1 when the base 3 drops out of the socket 65 can be reduced. Therefore, the swing width of the LED lamp 1 can be suppressed to a relatively small value.

As a result, even when the LED 1amp 1 is loosened and temporarily drops out of thesocket 6E the p 1 can be avoided frOm impinging t anilluminati aktar etsuch Widthof the LED lamp. a billboard or the like because the sw1ng 5116) 1 under the drop-out state is small Furthermore, even.when'the3' -59..

LED lamp 1 impinges against the illumination target, the impact at that time can be suppressed, and thus the LED lamp 1 can be prevented from being damaged. ribedabove,theimpactappliedixathesupporthole 134 is suppressed. Therefore, the housing 35 of the LED lamp be formed of resin material which will be liable to be 1 may lowerimlstrengththannmtalnaterialafterthenmldingprocess.

Accordingly, everlwhen the connection portion (the t hole in this embodiment) of the anti—drop wire 131 is formed integrally with the housing 35, the tion portion can be prevented from being damaged while the weight of the housing is d.

Furthermore, in this embodiment, in order to locate the support hole 134 at base 3 side than a position nearer to the the dead weight when the the center—of—gravity position Gx of radiation fin 25, weight support hole l34'is provided to the heat balance is designed so that the center—ofsgravity poSitiOn to the light emitting of the dead weight is located to be nearer portion 12 side than the support hole 134. Accordingly, support holes 134 can beprovided to the heat radiation fins.‘ f;5"’ ‘25,: tWe t holes134 can be prevented from intrudinginto? the lamp holder60 when theLED lamp1 ismounted inth’ holder 60,andthe antidrop Wire 131 can VConnectedgnIf,g. to the support hole 134 In this embodiment the support hole134prOVided to the7 _ 60 i heat ion fin 25 is exemplified as the connection portion of the anti—drop wire 131. However, the present invention is not limited to the support hole 134, and any structure may be adopted insofar as the anti—drop wire 131 is connectable to the structure.

Any member such as a rod—like or string—like member may be d as the rop wire 131 r as it may be a support member whose one end is connected and fixed to a stable place of 60 the like to support a building, the lamp holder or LED lamp 1.

Next, to the base plate a structure for fixing the globe 22 13 will be described. 22 to the base A screwing structure for fixing the globe 13 is generally plate 13 by screwing the globe 22 in the base plate with used as the fixing structure of the globe 22. However, respect to the screwing structure, the globe 22 rotates at any number of times when the globe 22 is fixed to the base plate and thus it has a problem that the rotation of the globe in the Owring 26, 22 twists an Oering 26 and causes tion so that the sealing performance is lowered.

Therefore, according to this embodiment, the¥fitting structure between they a progection an d a grOOve isadopted as fiXingstructureoftheglobeZZinplaceofthescrewingstructurefl thereby suppressing the distortion of the O— ring 26 caused by. the fixing Of the globe 22. -61..

Fig. 16 is a cross—sectional View of the base plate 13.

As shown in Figs. 16 and l, the base plate 13 is formed in a tray-like shape having a side wall 19 at the edge thereof.

A step portion 200 of one step is formed on the whole periphery of the inner peripheral surface (inner surface) of the side wall 19. The step portion 200 is formed by projecting a lower end with the upper 19B side of the side wall 19 ly as compared end 19A side of the side wall 19 so that the lower end 198 side . Plural guide is larger in thickness than the upper end 19A side andholdgrooves201areformedonalower—stageperipheralsurface end 19B side of the 200A as the peripheral surface of the lower step portion 200.

As shown in Fig. 3, the edge portion 22A of the globe 22 extends ally in a substantially cylindrical shape, and plural projections 202 projecting outwards are formed on the outer peripheral surface (outer surface) of the edge n the globe 22 is fixed to the base 22A. When plate 13, the 22 are fitted projections 202 of the edge portion 22A of the globe 201 of the side wall 19 and held in the guide and hold grooves of the base plate 13 More speCifically, as ShOWHJJlFlg 16, the guideanuiholdjy‘ groove201 has an introduCing (guide)groove 201A anda hold groove 201B. The introducing groove201A.lSEigrOOVe lntC)Wthhivy L from theupperfjw the projection 202 oft he glObe 22 isintroduced end 19A side, and it is ed by forming a vertical grooveIW -62— on the lowerwstage peripheral surface 200A of the step portion 200. rmore, the hold groove 201B is a transverse groove which is continuous with the introducing groove 201A and extends in the eral direction Xs while moderately sloped downwards.

When the projections 202 of the globe 22 are inserted into the introducing grooves 201A of the guide and hold grooves 201 to be introduced into the guide and hold grooves 201 and then the globe 22 is turned, the projections 202 are moderately guided downwards along the hold grooves 201B, and the globe 22 is pushed into the base plate 13 side.

As shown in Fig. 17, a flange 203 is formed above the projection 202 at the edge portion 22A of the globe 22. When the projections 202 of the globe 22 are guided into the guide the flange and hold grooves 201 and pushed into the base plate 13, wall 203 abuts t the upper end 19A of the side 19, so that into the base plate it is ible to further push the globe 22 13., 13 and the globe 22 is held in the base plate As described above, the O~ring 26 as an example of seal member for preventing water invasion into the fitting place between the globe 22 and the base plate 13 is provided between the globe 22 and the base plate 13 O—ring 26 isnotymounted .The a the outer peripheralsurface ('t'heconfronting j 'wall 19) of the edge portion 22A of theglobe 22le over. thewhole an Oring fitting prejection 204 isprOVlded ~63~ ery of the edge portion 22A below the flange 203 of the globe 22. The flange 203 and the O—ring fitting projection 204 of the globe 22 constitute an Oering fit~in groove 205, and the Owring 26 is fitted in the O—ring fit—in groove 205.

Theo—rim326fitjx1the0~ringfit~ingroove205ispmeSSed n the inner peripheral e of the side wall 19 of the base plate 13 and the O—ring fit—in groove 205 when the globe 22issecuredtothebaseplatelB,therebysealingthegapbetween the globe 22 and the base plate 13.

Furthermore, in this embodiment, as not shown, caulking agent is injected into the 26 and the gap between the O—ring thereof side wall 19 of the base plate 13 over the whole periphery to construct a dUal seal structure; Furthermore, by injecting, the caulking agent, the introducing groove 201A of the guide and holding groove 201 is sealed, and the bore occurring in the step portion 200 in top View due to the introducing groove 201A is blocked by the introducing groove 201A. Accordingly, even» when the globe 22 is loosened, the introducing groove 201A as the exit for the projection 202 is blocked, whereby the globe 22 can be ted frOm dropping In the Seal structure described above,when theglob; amount is large’, the 0ring 26is eaSilytWisted and distorted 264- by the rubbing from the side wall 19.

Therefore, according to this embodiment, as shoWn in Fig. 16, the extension length Lh in the eral ion Xs of the hold groove 2018 of the guide and hold groove 201 is set to be shorter than that of the whole periphery of the lower-stage peripheral surface 200A, preferably set to be shorter than at least the half peripheral length, and more preferably set so that the rotational angle of the globe 22 when the globe 22 is rotated while guided by the hold groove 2018 is equal to 30°.

Accordingly, as compared with the structure that the globe 22 is fixed to the base plate 13 by screwing, the rotation (turning) amount of the globe 22 when the globe 22 is fixed is suppressed totheupperlimitcorrespondingtothelengtthintheperipheral direction Xs of the hold groove 201B, so that the distortion of the O—ring 26 can be reduced, and degradation of the waterproof mance can be prevented.

Fig. 18 is a m showing a comparative example in which the globe 22 is screwed to the base plate 13.

As the screwing structure of the globe 22 may be considered on the side wall a structure that the step portion 200 is formed 19 of the base plate 13 a- screw grOoVe 210 is formed on then,‘ tage peripheral surface 200A of the step portion 200,212327* 2. ankdl the edge portion 22A of the globe 22 is screwed tothe screw . grooVe 210 as shown in Fig18:. Astheseal structure uSing the; O— ring 26 may be conSidered a structure that the02-ring 26 ism -65.. mounted on the upper end face ZOOB of the step portion 200 shown pressed by the flange 203 of the glove 22 for sealing as in Fig. 18. the O—ring 26 is ched between the However, globe 22 and the step n 200 of the base plate 13. Therefore, when the screwing of the globe 22 is loosened and thus it moves upwards even slightly with respect to the base plate 13, press force of the globe 22 against the O—ring 26 is weakened and the waterproof performance degrades.

Ontheotherhand,accordingtothisembodiment,theO-ring fit~in grooVe 205 26 is fitted in the gap between the O-ring and the side wall 19 of the edge portion 22A of the globe 22 of the base plate 13 . Therefore, even when the globe 22 upwardly no great variation.occurs moves vely to the base plate 13, inthegapbetweentheO-ringfit~ingroove205oftheedgeportion 22 and the side wall 19 of the base plate 22A of the globe 26 is kept, so that the and thus the press force of the O-ring sealing performance is not weakened.

The projections 202 of the globe 22 are inferior mechanicalstrengthtothescrewthreadsinthescreWingstructure shown in Fig. 18. HOWever, under the fixed State Of theglobe betweenv 22, the repulsive forceof the O—ring26 acts. ohthe gap the edge portion 22A of theaglobeig}: V the O— ring fit— in grOOVe 205 of not“, 22 and the side wall 19 of the base plate 13, and it does act so as to puSh up the flange 203 of the globe 22 from the —66-— step portion 200 of the side wall 1S9. Therefore, the repulsive force of the O—ring 26 does not serve as a load on the projection 202,andthustheprojectionscanbepreventedfrombeingdamaged.

In the screwing structure of Fig. 18, the screw groove 210 is provided on the low—stage peripheral surface 200A.

Therefore, the lower—stage peripheral surface 200A projects 210A inwardly by the amount corresponding to the screw thread of the screw groove 210, which cause increase of the thickness of the side wall 19. In addition, in order to keep the strength to enlarge of each groove of the screw groove 210, it is necessary thus increase the screw thread 210A in the height direction and in increase of the the ess n the grooves, resulting height of the side wall 19.

As described above, in the screwing structure, the side the volume wall 19 is designed to be thick and high, so that thereof is increased, the weight of the housing 35 is caused fronts tional glass to increase and the weight difference bulb lamp is increased. Furthermore, since the side wall 19 is ed to be high, the light shielding amount of light 212 emitted from LED 15 increases, and the light output ratio (luminaire efficiency) is d. it is On the other hand, according to this embodiment, ssary to provide the screw groove 210tothe Side wall; wall 19 can; 19. Therefore, thethickness and height of theSlde be suppressed, and the weight ofthe hou81ng 39 can bereduced In addition, the light shielding amOunt of light of LED 15 can be reduced, and the luminaire efficiency can be increased.

Furthermore, ing to this embodiment, as shown in Fig. 17, the inner peripheral a reflection face 215 is provided to reflect light surface of the edge n 22A of the globe 22 to further 212 incident fronlthe LEE>15 to the side wall 19, thereby increasing the luminaire ency.

Furthermore, the O~ring 26 is used as the seal member sealingthegapbetweentheglobe22andthebaseplatelB. However, or the like may be used a packing member having another shape as the seal member.

‘ The LED lamp 1 of this embodiment is used not only while 60 shown in Fig. l, but also while mounted on the lamp holder mounted on an exposed socket 65. When the socket 65 is set up into the socket outdoors, in order to prevent invasion of water from 230 as shown in Fig. 19, thereby preVenting water invasion an opening 65A of the socket 65.

Furthermore, the waterproof packing 230 has llty,t‘ rand fastens the cylindrical portion 2 of the LED lamp 1 andthe121 funct secket 65. Therefore,thewaterproofpacking 230 has a the 1; “ lam 1 to the socket65 and preventing , of linking the LED LED lamp 1 from dropping out of thesocket65Particularly,11 embodimenthaseasocketxnounti“k the waterproof packing 230 Cf this l 68 _ barrel portion 238 as a chest portion to be mounted on the socket 65, and the socket mount barrel portion 238 s its diameter so as to firmly fasten the socket 65, y the waterproof packing 230 is firmly joined to the socket 65.

However, the outer peripheral surface of the cylindrical portion 2 of the LED lamp 1 is configured in a tapered surface shape which is narrowed to the base 3. Accordingly, if no countermeasure is taken, the engagement between the LED lamp landthesocket65startsloosening,andtheclosecontactbetween 2 of the the waterproof packing 230 and the rical portion LEDlampl.degrades,sothatthewaterproofperformancedegrades. 1 and the rmore, when the engagement between the LED lamp socket 65 starts loosening, the ing of the cylindrical portion 2 of the LED lamp 1 by the waterproof packing 230 the LED weakened, so that the anti-drop function of preventing lamp 1 from dropping out of the socket 65 is weakened.

Particularly, the LED lamp 1 has relatively high power, of billboards and it is suitably used for outdoor illumination it is liable to and outdoor light~up illumination. Therefore, suffer vibration of vehicles running on a road near to the LED lamp 1, and the ion may cauSe the engagement between the j.”‘ 'poSitionf' orthefiTlhfl" higher than an illumination target such as abillboard Side? like and illuminates the illumination target fron1the upper -69.... of the illumination target while the base 3 is postured to be higher than the light emitting portion 12, force which makes LED lamp 1 drop out of the socket 65 is applied to the LED lamp 1 due to the dead weight of the LED lamp 1 at all times . Therefore, once the engagement n the LED lamp 1 and the socket 65 starts loosening, it immediately causes the LED lamp 1 to drop out of the socket 65.

Therefore, according to this embodiment, as shown in Fig. 19, which a convex portion 232 as a fitting structure portion.to the upper edge n 230A of the waterproof packing 230 is fittedisprovidedoverthewholeperipheryoftheouterperipheral surface of the cylindrical portion 2 so as to be located at a higher position than the base 3. In,addition, a concave portion 234 in which the convex portion 232 is fitted is provided over the upper the whole periphery of the inner peripheral surface of edge portion 230A of the roof g 230.

Accordingly,evenwhentheengagementbetweentheLEDlamp 1 and the socket 65 is loosened, the upper edge portion 230A of the water proof packing 230 continues to be fitted to the convex portion 232 as the fitting Structure portion, and thus the Furthermore, roof performance does not degrade in__ order to allow the LED lamp 1 to drOp out Of the socket 65, thejr' convex portion 232 of the cylindrical portion 2 is required tofi,_- get OVer the e portiOn 234 cftheupper edgeportion 230A U ofthewaterproofpacking230.-Therefore,theanti~dropfunction,5‘-" l 70 _ of the LED lamp 1 can be continued.

Inaddition,thewaterproofpacking230andthecylindrical‘ portion 2 are fitted to each other by the convex portion 232 of the cylindrical portion 2 and the concave portion 234 of the waterproof packing 230, whereby the sealing performance can be achieved by the engagement between the convex portion and the concave portion, and water on fronlthe upper edge portion 230A of the waterproof g 230 can be suppressed.

Furthermore, plural convex portions 236 are provided over the whole periphery of the inner eral e of the waterproof packing 230, and the convex portions 236 come into contact with the outer peripheral surface of the cylindrical portion2toenhancethesealingperformance. Stillfurthermore, 230 and the the frictional force n the waterproof packing cylindrical portion 2 is enhanced, thereby further enhancing the anti—drop effect.

Theforegoingconstructionmaybemodifiedsothataconcave is provided the fitting structure portion to the portion as cylindrical portion 2 in place of the convex portion 232 and 230A alsc>a convex portion is ed to the upper edge portion of the waterproof packing 230 in place of the COncave portion 234. Eurthermore,whenthelEDlamp].isusedindoors armcking 1 haVing waterproof properties such as the waterproofpacking 230 as it =’ is not necessarily used. Anymembermay be used insofar isacylindricalmemberwhiChiSmountedonthecylindricalportion, _ 71 _ 2 of the LED lamp 1 to fasten the cylindrical portion 2 and has 2 to the socket a structure for linking the cylindrical portion obtained As described above, the following s carxbe by the foregoing embodiment.

That is, according to the embodiment, the O—ring 26 which 19 of the base is pressed between the globe 22 and the side wall is provided over the whole periphery of the outer plate 13 22, the peripheral surface of the edge portion 22A of the globe and the guide tions 202 are provided below the O—ring 26, and hold groove 201 for introducing (guiding) the projection 19A the 202 of the globe 22 from the upper end side, guiding 202 in the peripheral direction and holding the projection surface of projection 202 is provided on the inner eral the side wall 19 of the base plate According to this construction, as compared with the uctbmioffixingtheglobebyscrewing,therotationamount is fixed can (turning amount) of the globe 22 when the globe 22 22 in be reduced to the guide amount level of the projection and hold groove 201. the peripheral direction along the guide when the globe is Therefore, the distortion of the Seal member fixed of the can be reduced, and the degradation waterproof: performance can be prevented.

Furthermore, ing to this embediment, the O~ring‘26 205 provided over the whole is fitted in the-O-ring fit—in groove -72.. periphery of the outer peripheral surface of the edge portion 22A of the globe 22, and the O—ring 26 is pressed between the inner peripheral surface of the side wall 19 of the base plate 13 and the O—ring fit~in groove 205 to seal the gap between the base plate 13 and the globe 22.

According to this construction, even when the globe 22 pwardswithrespecttothebaseplate13,nogreatvariation in the gap between the O—ring fit—in groove 205 of the occurs edge portion 22A of the globe 22 and the side wall 19 of the base plate 13, and the press force of the O—ring 26 is kept, so that the sealing performance is not weakened.

Furthermore, the repulsive force of the O~ring 26 acts between the Oering fit~in groove 205 of the edge portion 22A of the globe 22 and the side wall 19 of the base plate 13, and of the thus there is not any force which acts on the flange 203 203 of the globe 22 from globe 22 so as to push up the flange thestepportionZOOofthesidewalll9. Therefore,therepulsive force of the O—ring 26 is prevented from being applied to the projections 202 as a load, and thus the projections 202 can be prevented from being damaged.

Still rmore,according to thisembodiment, the VVK,*~ '"cldent, from; " , yreflection face 215 for ting the light 212 ' light‘shieldedby the's’idé‘w'a11i'1“9*ca'h'bé. uséd‘far"’iliumihatibn;r» -73... and the ire efficiency can be increased.

Still furthermore, the plural heat radiation fins 25 extending along the cylindrical porticme are arranged radially around the cylindrical portion 2 on the back surface 13A of the base plate 13 on which the LED board 16 having LEDs 15 mounted thereon is mounted so that the gap S is provide between each There are heat radiation fin 25 and the cylindrical portion 2. provided the joint portions 105 through which the end portions two adjacent at the cylindrical portioniZside of the respective heat radiation fins 25 are joinecito each other, thereby forming 2 and each the air flow path F between the cylindrical portion joint n 2. Accordingly, the outer peripheral surface of thecylindricalportbmuZcanbeair—cooledbyairpassingthrough board 8 the air flow paths F, and the electrical circuit in the cylindrical portion can be cooled. accommodated Particularly,thethermalconductivemember29Disprovided between the g part 8X of the ical circuit board 8 the heat of the heating and the cylindrical portion 2 to transfer 2. Therefore, the heat of part 8X to the cylindrical n the g part 8X of the electrical circuit board 8 can be efficiently cooled, and the Circuit can be stably ed_“p., Furthermore,.according this; embodiment, , to §7therj of the -*x distributing fisn 1 03 for distributing air streantto each 'adjacent open trapeZOidal fins lOI is prOVided between the/g._, adjacent open trapezoidal fins 101. -74..

According to this construction, the air stream passing through the gap between the adjacent open trapezoidal fins can distributed to each of the adjacent open oidal fins 101 by the distributing fin 103 located between the adjacent open trapezoidal fins 101. Accordingly, unevenness of cooling hardly'occurs on the outer‘peripheral surface of'the(:ylindrical portion 2, and thus the cylindrical portion 2 can be uniformly cooled.

According to this embodiment, the short heat radiation fin 25 in the fin 102 which is shorter than the heat radiation ion length from the back surface 13A of the base plate of the LED 13 (in the longitudinal cal) direction lamp fins 25 tuting 1) is ed n the heat radiation each open trapezoidal fin 101.

According to this construction, the heat and LED 15 having performance of the base plate 13 is assisted, heat higher power can be mounted. In addition, the short than the heat radiation fin 102 can be configured to be shorter radiation fin 25, so that air flow in each open trapezoidal 101 is not disturbed, and the cooling performance of the open trapeZOidal fins 101 whichlnainly.radiate heatLis notdisturbed theoutSidei,giVle Furthermore, according t o this embodiment, annular fins 106and the inSide annular fins 107 as the plural ygfjt7t 'annular heat radiation fins which are shorter than the short, heat radiation fins 102 in the extenSion length from the back ~75— surface 13A (in the udinal (vertical) direction of the LED lamp 1) and surround the cylindrical portion 2 are provided on the back surface 13A of the base plate 13.

According to this construction, randomness occurs in the air flow in each open trapezoidal fin 101 and between adjacent open trapezoidal fins 101 by the e annular fins 106 and the inside annular fins 107, and the retaining period of air be enhanced. is lengthened, so that the cooling performance can According to this embodiment, the base plate 13 to which fins 25 formed LEDs 15 are secured and the plural heat radiation 13 are molded integrally on the back surface 13A of the base plate with each other by using resin, and the base plate 13 and the heatradiationfinsZSareconfiguredsoastokxagraduallythinner from the inner periphery to the outer periphery f.

Accordingly,theheatradiationfins25arethickeronthethicker side f, and thinner base plate 13 at the inner peripheral the outer eral side thereof. on the thinner base plate at Therefore, occurrence of sink (shrinkage) of resin at the fin rootportions25Bcfiftheheatradiationfins25<n1thebacksurface 13A of the base plate 13 can be prevented, and the flatness of the base plate 13 can be enhanced, thereby radiating heath efficiently ' Furthermore, the strength 0£ the heat radiation fins25f}5'” hi.2 can be Secured by the thick base plate 13and the thick heath radiation fins 25 at the inner peripheralside cfthe base plate '76- 13, and the heat radiation performance can be enhanced by the thin base plate 13 and the thin heat radiation fins 25 at the outer peripheral side.

Still furthermore, according to this embodiment, a larger side light number of LEDS 15 are provided to the outer-peripheral emitting portion 15A at the outer peripheral side of the base plate 13 than the inner-peripheral side light emitting portion 158 at the inner peripheral side of the base plate Although at the outer peripheral side is the amount of generated heat larger,thebaseplate13attheouterperipheralsideisconfigured tobethinner,andthustheheatresistanceattheouterperipheral side of the base plate 13 is smaller, so that the heat can be ently radiated.

Stillfurthermore,accordingtothisembodiment,thelength in the axial (height) direction of the heat radiation fins 25 13. Therefore, the 13 to the outer periphery of the base plate radiation fins 25 is larger bending moment acting on the heat at the inner eral side of the base plate 13 and smaller the base plate 13. However, the at the outer peripheral side of base plate 13 and the heat radiation fins 25 are configured be gradually thinner from the inner periphery tothe outer 13 and the heat radiation fins-gay ery, an d the base plate can be made r Therefore, both the strength and the fins 25 can heat radiation performance. of the heat radiation l 77 _ be performed.

Still furthermore, according to this embodiment, the thickness of the heat radiation fins 25 is gradually reduced from the back surface 13A of the base plate 13 to the base 3 side. Therefore, the slope surface of the heat radiation functions as a release taper at a demolding step, so that the resin g of the base plate 13 and the heat radiation fins 25 can be easily performed. lead According to this embodiment, the)3ase23tc>which the is provided wires 21A and 21B extending from LED 15 are connected the of to the tip of the insulating cylinder portion 10, tip theinsulatingcylinderportion10isconfiguredasthebagportion 33 which is engaged 120, the terminal 10A having the screw n with the base 3 is provided on the outer periphery of the tip, the bag portion 120 of the tip is projected to the upper outer side of the end face 123A of the terminal 10A, and the which the wire holes 125A and 125B as the h—holes through to the projecting lead wires 21A and 21B penetrate are provided TherefOre, even portions 122A and 122B of the bag portion 120. the like adheres to the when water such as dew condensation or neighborhood of the terminal lOA, thewater hardly intrudes intof::' 122A the wire holes 125Aand 125Bof the ting portions ZBprOJectingtotheoutSideoftheendface123A;33 theWire holes 125A g ,g3 water Can beprevented from invadingfrom _ and 125B into the housing 35 of the LED lampI According to this ment, the pair of introducing portions 127A and 1278 for leading the pair of lead wires 21A and 218 into the wire holes 125A.and 1258 are formed on the inner e of the bag portion 120, and the introducing portions 127A and 127B are separated from each other by the ion wall 126 for bisecting the inner surface of the bag portion 120.

Therefore, the wire leads can be surely guided.to the wire holes 125A and 1258 corresponding to the introducing portions 127A and 1278 by the pair of introducing portions 127A and 127B formed by bisecting the inner surface of the bag portion 120 through the partition wall 126, and the assembling performance of the lead wires 21A and 218 can be enhanced.

Still furthermore, according to this embodiment, the introducing portions 127A and 1278 are conical concaves which and the lead wires are d to the wire holes 125A and 1258, 21A and 218 can be easily passed through the wire holes 125A and 1258 along the conical shapes.

Furthermore, the wire groove 34 in which the lead wire outside 218 passed through the wire hole 1258 and drawn out to the edisformedontheouterperipheralsurfaceoftheterminal 10A, and the bag portion 120 projects to the upper and outer SidecflftheWiregroove34 Therefore,water111theneighborhoodj.V5 of the wire groove 34 can be suppressed from invadingfrom then wire holes 125A, 1258 of the bag portion 120 into the houSing of the LED lamp 1. -79..

Furthermore,accordingtotheaboveembodiment,theplural heat radiation fins 25 formed on the base plate 13 are provided, the pin 130 is bridged between the two heat radiation fins andtheanti~gropwirel3lisconnectedtothepinl30. Therefore, the simple structure the antiwdrop wire 131 can be connected with that the pin 130 is bridged between the heat ion fins heat radiation fins and the pin 130 is provided between the two ,sothatthepinl30canbefirmlyprovidedtotheheatradiation fronldropping fins 25, and the LED lamp e surelyrprevented out. Furthermore,itisunnecessarytoprovideadedicatedmember for fixing the pin 130. this embodiment, the heat Furthermore, according to radiationfins25betweenwhichthepinlBOisbridgedarearranged ntiallyix1paralleltoeachother,thepflxll30issupported throughthesupporthcles134formedinthesubstantiallyparallel heat radiation fins 25, and the support holes 134 can be easily formed in the substantially parallel heat radiation fins Therefore,thepin130canbesimplyprovidedtotheheatradiation fins 25. according to this embodiment, the Still furthermore, anti—drOp wire l3l is joined to thiei band l33 wound aroundLithei the LED lamp l Therefore, the LEDlamp1 can.befpreven I then dropping With a Simpleconstruction that around the outer peripheral surfaceof the lamp holder 60 and - 80 _ the rop wire 131 is connected to the band 133. Since the band 133 is wound around the lamp holder 60, the band 133 is ble to lamp holders having various shapes.

The LED lamp 1 is screwed to the socket 65 of the lamp holder60byrotatingtheLEDlamp1. Thebandl33hastheadjusting of the band portion 136 which can adjust the constriction force 133,andifluabandl33:usrotatablecnltheouterperipheralsurface force of of the lamp holder 60 by loosening the constriction theband133. Therefore,theanti-dropwire13l<xu1beoonnected to the band 133, and the band 133 is slightly loosened so as surface of the lamp to be rotatable around the outer peripheral holder 60. Under this state, the work of attaching/detaching the LED lamp 1 the Led lamp 1, so can be performed by rotating that the LED lamp 1 can be prevented from dropping during attaching/detaching work.

‘According to this embodiment, the convex portion 232 as is configured to be fitted the fitting structure portion which the cylindrical member having to the waterproof packing 230 as 2 to the socket the function of linking the cylindrical portion ovidedcnitheouterperipheralsurfacecflfthecylindrical portion 2. ingly,evenwhentheengagementbetweentheLEDlamp l and the socket 65 is loosened, the upper edge portion 230A ofthewaterproofpacking230continuestXJbefittedtothecmnvex portion232asthewaterproofpackingfittingportion. Therefore, i 81 _ the waterproof performance does not degrade, and the anti-drop effect of the LED lamp 1 is prevented from being lost by the fitting between the upper edge portion 230A of the waterproof packing 230 and the convex portion 232 as the waterproof packing fitting portion.

Furthermore,accordimgtothisembodiment,thewaterproof fitting portion is constructed by the convex portion packing 230Atof the waterproof 232 tc>be fitted to the upper edge portion portion packing 230 over the whole periphery of the cylindrical the sealing mance is obtained by the 2. ore, the engagement between the convex portion 232 of rical the waterproof packing 230, and water on portion 2 and of the waterproof packing 230 from the upper edge n 230A can be suppressed.

Stillfurthermore,accordingtothisembodiment,theconvex of the inner portion 236 is provided over the whole periphery 230. Therefore, peripheral surface of the waterproof packing the waterproof performance can be enhanced. embodiment, the support holes 134 as According to this the anti—drop wire l31 is the connection ns to which connected are prOVided between the light emitting portionlZl. 'and the the base 3t base 23 so as it’o be nearerto of the dead weight of the LEDlamp center-ofgravitypOSition Gx According to this constrUCtiOn, even when the-LED lampikf _ 82 i l drOps out of the socket 65 under the state that the LED lamp 1 is mounted on the socket 65 while the bees 3 is ed to. beverticallyhigherthanthelightemittingportiontoilluminate the lower side, the center—of~gravity position Gx of the dead holes weight has been already vertically lower than the support of turning of the LED lamp 1 caused by 134, so that the amount width of the LED lamp the drop—out can be reduced and the swing lcausedbyifluaturningcankxareduced. Accordingly,impingement such as a billboard of the LED lamp 1 against an nation target of the LED lamp 1 can or the like existing in the neighborhood be d, and even when the LED lamp impinges against the illumination target, the impact caused by the impingement can be suppressed. the holes 134 Furthermore, in this embodiment, support radiation fins 25. Therefore, when the are provided to the heat the lamp holder 60, the support LED lamp 1 is used while mounted on and the anti-drOp holes 134 do not intrude in the lanm>holder 60, wire 131 to 134. can be simply connected the support holes foregoing embodiment is an example of the t be made to invention, and any cation and application may _ fromth: subject matteriéfleffpf the above embodiment Withoutdeparting ’ofiythejpresent,inventionVi;ptlffiflgfhl‘

Claims (21)

CLAIMS :

1. A lamp including a board having light emitting elements mounted thereon, a flat plate portion having the board mounted thereon, and a rical n that extends from the back surface of the flat plate portion, has a base provided to the terminal f and contains an electrical circuit board therein, comprising: a plurality of heat radiation fins that are arranged radially around the cylindrical portion on the back surface of the flat plate portion and configured to extend along the of the cylindrical n so that a gap is formed between the cylindrical portion and each heat radiation fins; and side of at least two a joint n forjoining end portions at a cylindrical portion and the paired heat radiation fins to form an air flow path between the rical portion joint portion.

2. The lamp according to claim 1, r comprising a buting fin that is air stream to each disposed between adjacent pairs of heat radiation fins to bute an of the adjacent pairs of heat ion fins.

3. The lamp according to any one of claim 1 or 2, further comprising a short heat heat radiation fins joined radiation fin that is provided between the respective paired than the heat radiation fins in the through the joint portion and configured to be r extension length from the back surface of the flat plate portion. of annular heat

4. The lamp according to claim 3, further comprising a plurality of the flat plate portion so as to radiation fins that are arranged on the back surface surround the cylindrical portion and configured to be shorter than the short heat radiation of the flat plate portion. fins in the extension length from the back surface 1 to 4, further comprising a thermally

5. The lamp according to any one of claims of the electrical circuit board conductive member that is provided between a heating part to the cylindrical portion. and the rical portion to transfer heat of the heating part

6. The lamp according to claim 1, wherein each of the heat radiation fins is molded with the flat plate portion, and on the back surface of the flat plate portion integrally side to the outer peripheral configured to be gradually thinner from the cylindrical portion side. 6975573__1

7. The lamp according to claim 6, wherein a larger number of light emitting elements are provided at the outer side of the board that that at the center side of the board.

8. The lamp according to claim 6 or 7, wherein the heat radiation fins are ured so that the ion length thereof along the cylindrical portion is gradually reduced from the cylindrical portion side to the outer peripheral side.

9. The lamp according to any one of claims 6 to 8, wherein the ess of the heat ion fins is gradually reduced from the back surface side of the flat plate portion to the base side.

10. The lamp according to claim 1, further comprising a globe covering the board of the flat plate portion, wherein the flat plate portion is configured in a tray-like shape having a side wall at the edge thereof, an edge portion of the globe is fitted to the side wall, the fitting portion between the edge portion of the globe and the side wall is sealed outer by a seal member, the seal member is provided over the whole periphery of the of the surface of the edge portion of the globe so as to be pressed between the side wall below the flat plate portion and the edge portion of the globe, a projection is provided seal member, and a guide and hold groove for introducing the projection of the globe to hold the from an upper end side and guiding the projection in a peripheral direction globe.

11. . The lamp according to claim 10, n a fit-in groove is ed over seal whole periphery of the outer surface of the edge n of the globe, and the the inner member is fitted in the fit-in groove so that the seal member is pressed between surface of the side wall of the flat plate portion and the fit-in groove to seal the fitting portion between the sidewall of the flat plate portion and the edge portion of the globe.

12. The lamp according to claim 11, further comprising a reflection face for the edge reflecting light of the light emitting ts is provided on the inner surface of portion of the globe.

13. The lamp according to claim 1, wherein the cylindrical portion is configured to be thinner from the flat plate portion side to the base side, a cylindrical member for g the cylindrical portion to a socket to which the base is screwed is mounted on the outer eral surface of the cylindrical portion, and a fitting structure portion to be fitted to 6975573__1 the cylindrical member when the cylindrical member is mounted is provided to the outer eral surface of the cylindrical portion.

14. The lamp according to claim 13, wherein the rical member is a waterproof g that covers an area extending from the socket having the base mounted thereon to the cylindrical portion to prevent water invasion n the base and the .

15. The lamp according to claim 14, wherein the fitting ure portion is provided with a convex portion or a concave portion to which an upper edge portion of the waterproof packing is fitted over the whole periphery of the rical portion.

16. The lamp according to claim 14 or 15, wherein a convex portion is provided over the whole periphery of the inner peripheral surface of the cylindrical member.

17. The lamp according to claim 1, wherein a connection member is bridged between at least two heat radiation fins, and an anti-drop support member is connected to the connection member.

18. The lamp ing to claim 17, wherein the heat radiation fins bridged by the connection member are provided substantially in parallel to each other, a hole n formed in each of the ntially parallel heat radiation fins so as to penetrate through the heat radiation fin, the connection member is configured in a rod-like shape, and therod—like connection member is supported through the hole portions of the substantially parallel heat radiation fins.

19. The lamp according to claim 17 or 18, wherein the connection member is joined to a band wound around the outer peripheral surface of a lamp holder for supporting lamp.

20. The lamp according to claim 19, wherein the lamp is rotated to be screwed to the lamp , and the band has an adjusting portion for adjusting constriction force the band, and is allowed to be rotatable on the outer peripheral surface of the lamp holder by loosening the constriction force of the band.

21. The lamp according to any one of claims 17 to 20, wherein the connection member is provided between the flat plate portion and the base so as to be nearer to the base than the center-of—gravity position of the dead weight of the lamp. 6975573