NO992932L - encapsulation - Google Patents
encapsulationInfo
- Publication number
- NO992932L NO992932L NO992932A NO992932A NO992932L NO 992932 L NO992932 L NO 992932L NO 992932 A NO992932 A NO 992932A NO 992932 A NO992932 A NO 992932A NO 992932 L NO992932 L NO 992932L
- Authority
- NO
- Norway
- Prior art keywords
- acid
- curing
- encapsulating material
- continuous phase
- resin
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J13/00—Colloid chemistry, e.g. the production of colloidal materials or their solutions, not otherwise provided for; Making microcapsules or microballoons
- B01J13/02—Making microcapsules or microballoons
- B01J13/025—Applications of microcapsules not provided for in other subclasses
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing Of Micro-Capsules (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Det er beskrevet et kolloidalt aggregat egnet til anvendelse ved herdningen av harpikser omfattende en kontinuert fase av et vannbasert innkapslingsmateriale og en dispergert fase omfattende en eller flere sterke syrer. Den kontinuerte fasen omfatter fortrinnsvis en blanding av gelatin og xantangummi. Aggregatet lydbehandles for å innkapsle syren i innkapslingsmaterialet. Den innkapslede syren blandes med en herdbar harpiks. Syrekapslene kan brytes på en hvilken som helst egnet måte, men fortrinnsvis ultralyd, for å frigi syren og initiere herdningen av harpiksen.There is disclosed a colloidal assembly suitable for use in the curing of resins comprising a continuous phase of a water-based encapsulating material and a dispersed phase comprising one or more strong acids. The continuous phase preferably comprises a mixture of gelatin and xanthan gum. The unit is audio processed to encapsulate the acid in the encapsulating material. The encapsulated acid is mixed with a curable resin. The acid capsules may be broken in any suitable manner, but preferably ultrasound, to release the acid and initiate the curing of the resin.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB9626152.4A GB9626152D0 (en) | 1996-12-17 | 1996-12-17 | Encapsulation |
PCT/GB1997/003346 WO1998026865A1 (en) | 1996-12-17 | 1997-12-16 | Encapsulation |
Publications (2)
Publication Number | Publication Date |
---|---|
NO992932D0 NO992932D0 (en) | 1999-06-16 |
NO992932L true NO992932L (en) | 1999-08-04 |
Family
ID=10804552
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO992932A NO992932L (en) | 1996-12-17 | 1999-06-16 | encapsulation |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP0948397A1 (en) |
JP (1) | JP2001507051A (en) |
CN (1) | CN1248928A (en) |
AU (1) | AU727915B2 (en) |
CA (1) | CA2275377A1 (en) |
GB (1) | GB9626152D0 (en) |
NO (1) | NO992932L (en) |
WO (1) | WO1998026865A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB9909763D0 (en) * | 1998-09-12 | 1999-06-23 | Cehmcolloids Ltd | Cluring of resins |
JP2005146064A (en) * | 2003-11-13 | 2005-06-09 | Konica Minolta Medical & Graphic Inc | Dispersion of microcapsuled dye dispersion, its manufacturing process, and photosensitive material for thermal development photography |
FI20085831L (en) * | 2008-09-05 | 2010-03-06 | Graveolens Oy A | Subject composition and use thereof |
DE102009046251A1 (en) | 2009-10-30 | 2011-05-19 | Evonik Röhm Gmbh | Reactive 1-component road markings |
DE102009046244A1 (en) | 2009-10-30 | 2011-05-19 | Evonik Röhm Gmbh | Encapsulation of reactive components for 1-component systems using coaxial nozzles |
CN112079993A (en) * | 2020-09-22 | 2020-12-15 | 肇庆市海特复合材料技术研究院 | Preparation method of epoxy resin latent curing agent |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1388786A (en) * | 1972-04-03 | 1975-03-26 | Scherer Corp R P | Integral solid gel-lattice dosage form of high-moisture content |
DE3447833A1 (en) * | 1984-12-29 | 1986-07-10 | Allan Gerhard 8047 Karlsfeld Frühauf | Cloth or the like with microcapsules containing an active ingredient |
-
1996
- 1996-12-17 GB GBGB9626152.4A patent/GB9626152D0/en active Pending
-
1997
- 1997-12-16 EP EP97949004A patent/EP0948397A1/en not_active Withdrawn
- 1997-12-16 JP JP52742798A patent/JP2001507051A/en active Pending
- 1997-12-16 AU AU77366/98A patent/AU727915B2/en not_active Ceased
- 1997-12-16 WO PCT/GB1997/003346 patent/WO1998026865A1/en not_active Application Discontinuation
- 1997-12-16 CN CN 97181767 patent/CN1248928A/en active Pending
- 1997-12-16 CA CA002275377A patent/CA2275377A1/en not_active Abandoned
-
1999
- 1999-06-16 NO NO992932A patent/NO992932L/en not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
WO1998026865A1 (en) | 1998-06-25 |
AU727915B2 (en) | 2001-01-04 |
GB9626152D0 (en) | 1997-02-05 |
EP0948397A1 (en) | 1999-10-13 |
AU7736698A (en) | 1998-07-15 |
CA2275377A1 (en) | 1998-06-25 |
CN1248928A (en) | 2000-03-29 |
JP2001507051A (en) | 2001-05-29 |
NO992932D0 (en) | 1999-06-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
MY132266A (en) | Encapsulation process | |
WO2000027519A3 (en) | Process to prepare microencapsulated formulations | |
WO2001043625A3 (en) | Fixation system and method | |
DK164538C (en) | COSMETIC SKIN CARE AND PROCEDURE FOR ITS MANUFACTURING | |
CA2126422A1 (en) | Consolidatable Particulate Material and Well Treatment Method | |
EP0680098A3 (en) | Light-transmissive resin sealed semiconductor and production process thereof | |
EP0558798A3 (en) | Epoxy resin composition, cured product obtained therefrom, curing method therefor, and bonding method using the composition | |
AU2737888A (en) | One step dressing delivery system | |
ES8605009A1 (en) | Conductive theromosetting compositions and process for using same. | |
NZ226858A (en) | Method of solidifying or encapsulating material in an aqueous medium using polymer particles capable of absorbing water | |
EP0195846A3 (en) | Photo-curable epoxy resin type composition and curing process | |
PL298158A1 (en) | Bonding composition for obtaining novel agglomerate based on disinteghrated materials, method of using such composition and novel agglomerate obtained thereby | |
NO992932L (en) | encapsulation | |
AU1842795A (en) | Cure controlled catalyzed mixtures of epoxy resins and curing agents containing mesogenic moieties, b-staged and cured products therefrom | |
MY116439A (en) | Epoxy resin composition for semiconductor encapsulation and semiconductor device | |
AU3629095A (en) | Encapsulated active materials and method for preparing the same | |
BR0013888A (en) | Microcapsule, process for forming microcapsules, and process for microencapsulating a material substantially insoluble in water within a porous film | |
BR9500773A (en) | Process modified epoxy resin composition for the preparation of a composition and encapsulated device | |
EP0202933A3 (en) | Encapsulating electrical components | |
JPS5614556A (en) | Curing method of thermosetting resin composition | |
JPS607931A (en) | Preparation of microcapsule | |
EP0259042A3 (en) | Process for bonding lignocellulosic material | |
AU6313996A (en) | Stabilisation of flavourants | |
GB8527547D0 (en) | Frangible housing | |
JPH0322400Y2 (en) |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FC2A | Withdrawal, rejection or dismissal of laid open patent application |