NO894656D0 - PROCEDURE FOR MANUFACTURING AN ELECTRICAL DESIGN ON A SUBSTRATE. - Google Patents

PROCEDURE FOR MANUFACTURING AN ELECTRICAL DESIGN ON A SUBSTRATE.

Info

Publication number
NO894656D0
NO894656D0 NO894656A NO894656A NO894656D0 NO 894656 D0 NO894656 D0 NO 894656D0 NO 894656 A NO894656 A NO 894656A NO 894656 A NO894656 A NO 894656A NO 894656 D0 NO894656 D0 NO 894656D0
Authority
NO
Norway
Prior art keywords
procedure
substrate
manufacturing
electrical design
electrical
Prior art date
Application number
NO894656A
Other languages
Norwegian (no)
Other versions
NO894656L (en
Inventor
Jan Eugen Marthinsen
Frode Meringdal
Original Assignee
Autodisplay As
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from NO89890495A external-priority patent/NO890495L/en
Application filed by Autodisplay As filed Critical Autodisplay As
Priority to NO89894656A priority Critical patent/NO894656L/en
Publication of NO894656D0 publication Critical patent/NO894656D0/en
Priority to PCT/NO1990/000032 priority patent/WO1990009730A1/en
Priority to AU50971/90A priority patent/AU5097190A/en
Publication of NO894656L publication Critical patent/NO894656L/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1884Manufacture of transparent electrodes, e.g. TCO, ITO
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1343Electrodes
    • G02F1/13439Electrodes characterised by their electrical, optical, physical properties; materials therefor; method of making
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/08Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by electric discharge, e.g. by spark erosion
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0306Inorganic insulating substrates, e.g. ceramic, glass
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0104Properties and characteristics in general
    • H05K2201/0112Absorbing light, e.g. dielectric layer with carbon filler for laser processing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/032Materials
    • H05K2201/0326Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05Patterning and lithography; Masks; Details of resist
    • H05K2203/0548Masks
    • H05K2203/056Using an artwork, i.e. a photomask for exposing photosensitive layers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107Using laser light
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1142Conversion of conductive material into insulating material or into dissolvable compound
NO89894656A 1989-02-07 1989-11-22 PROCEDURE FOR MANUFACTURING AN ELECTRICAL DESIGN ON A SUBSTRATE. NO894656L (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
NO89894656A NO894656L (en) 1989-02-07 1989-11-22 PROCEDURE FOR MANUFACTURING AN ELECTRICAL DESIGN ON A SUBSTRATE.
PCT/NO1990/000032 WO1990009730A1 (en) 1989-02-07 1990-02-07 A process for manufacturing an electrode pattern on a substrate
AU50971/90A AU5097190A (en) 1989-02-07 1990-02-07 A process for manufacturing an electrode pattern on a substrate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NO89890495A NO890495L (en) 1989-02-07 1989-02-07 PROCEDURE FOR MANUFACTURING AN ELECTRICAL DESIGN ON A SUBSTRATE.
NO89894656A NO894656L (en) 1989-02-07 1989-11-22 PROCEDURE FOR MANUFACTURING AN ELECTRICAL DESIGN ON A SUBSTRATE.

Publications (2)

Publication Number Publication Date
NO894656D0 true NO894656D0 (en) 1989-11-22
NO894656L NO894656L (en) 1990-08-08

Family

ID=26648140

Family Applications (1)

Application Number Title Priority Date Filing Date
NO89894656A NO894656L (en) 1989-02-07 1989-11-22 PROCEDURE FOR MANUFACTURING AN ELECTRICAL DESIGN ON A SUBSTRATE.

Country Status (3)

Country Link
AU (1) AU5097190A (en)
NO (1) NO894656L (en)
WO (1) WO1990009730A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4103834A1 (en) * 1991-02-08 1992-08-13 Lpkf Cad Cam Systeme Gmbh Circuit board mfr. by channelling into metallic coating - using laser beam brightness variation in conjunction with orthogonal movements of table under process computer control
US5432015A (en) * 1992-05-08 1995-07-11 Westaim Technologies, Inc. Electroluminescent laminate with thick film dielectric
WO1997027727A1 (en) * 1996-01-26 1997-07-31 Emi-Tec Elektronische Materialien Gmbh Process for producing a conductor structure
GB9710344D0 (en) * 1997-05-21 1997-07-16 Cambridge Display Tech Ltd Patterning of organic light-emitting devices
US6379509B2 (en) 1998-01-20 2002-04-30 3M Innovative Properties Company Process for forming electrodes
US6300594B1 (en) * 1998-02-19 2001-10-09 Ricoh Microelectronics Company, Ltd. Method and apparatus for machining an electrically conductive film
KR100755810B1 (en) 1999-05-14 2007-09-07 쓰리엠 이노베이티브 프로퍼티즈 캄파니 Ablation enhancement layer
JP2003332054A (en) * 2002-05-16 2003-11-21 Bunwa Ko Manufacturing method of electroluminescent light
DE102010019406B4 (en) * 2010-05-04 2012-06-21 Lpkf Laser & Electronics Ag Method for partially releasing a defined area of a conductive layer
KR101628957B1 (en) * 2013-11-15 2016-06-13 한국에너지기술연구원 Patterned grid electrode and thin film solar cell using the same, and a method of manufacturing them

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4181563A (en) * 1977-03-31 1980-01-01 Citizen Watch Company Limited Process for forming electrode pattern on electro-optical display device
DE2944927A1 (en) * 1979-11-07 1981-05-21 Brown, Boveri & Cie Ag, 6800 Mannheim DEVICE FOR PRODUCING THIN FILM CIRCUITS
US4544442A (en) * 1981-04-14 1985-10-01 Kollmorgen Technologies Corporation Process for the manufacture of substrates to interconnect electronic components
DE3245272A1 (en) * 1982-12-07 1984-06-07 Ernst Roederstein Spezialfabrik für Kondensatoren GmbH, 8300 Landshut Method for producing miniaturised thick-film and thin-film circuits
US4568409A (en) * 1983-11-17 1986-02-04 Chronar Corp. Precision marking of layers
US4490210A (en) * 1984-01-24 1984-12-25 International Business Machines Corporation Laser induced dry chemical etching of metals
US4490211A (en) * 1984-01-24 1984-12-25 International Business Machines Corporation Laser induced chemical etching of metals with excimer lasers

Also Published As

Publication number Publication date
NO894656L (en) 1990-08-08
AU5097190A (en) 1990-09-05
WO1990009730A1 (en) 1990-08-23

Similar Documents

Publication Publication Date Title
DE69017287T2 (en) Clear substrate.
DE69111929D1 (en) Semiconductor device on a dielectric insulated substrate.
DE69008963T2 (en) Electronic circuit substrate.
DK164848C (en) PROCEDURE FOR MAKING A TEXTURED COATING ON A SUBSTRATE
DE59006957D1 (en) Flaky substrates.
KR900010950A (en) Method for manufacturing an electrically insulating semiconductor film from a substrate
NO892550L (en) ELECTRICAL MANAGEMENT CONTACT ELEMENT.
NO892669L (en) PROCEDURE FOR MANUFACTURING SOLCELLE SILICONE.
NO894656D0 (en) PROCEDURE FOR MANUFACTURING AN ELECTRICAL DESIGN ON A SUBSTRATE.
DE69008953T2 (en) Blackable substrate.
DE69023266T2 (en) Mask-controlled coupling between optical components on a substrate.
NO894583D0 (en) PROCEDURE FOR CELLPLAST MANUFACTURING.
EP0619283A3 (en) Substrate having a superconductor layer.
FR2630617B1 (en) METHOD FOR MANUFACTURING A MULTILAYER CONDUCTIVE SUBSTRATE
NO905432D0 (en) INITIAL MECHANISM BASED ON ELECTRICAL FIELD ACTION.
FI891730A0 (en) POLY (VINYLALKOHOL-VINYLAMIN) KOPOLYMERER FOER FOERBAETTRANDE AV VAOTPRESSTYRKA HOS PAPPERSPRODUKTER.
NO890495D0 (en) PROCEDURE FOR MANUFACTURING AN ELECTRICAL DESIGN ON A SUBSTRATE.
FI902012A0 (en) FARING EQUIPMENT FOR MANUFACTURING WITH PARAMETERS HAS BEEN GASSTROEMNINGEN.
NO901509L (en) PROCEDURE FOR MANUFACTURING POLYKETONES.
FR2752141B1 (en) PROTECTION FOR AN ELECTRICAL CIRCUIT ON A SUBSTRATE
NO904061D0 (en) PROCEDURE FOR MANUFACTURING NMDA ANTAGONISTS.
DE58901850D1 (en) MANUFACTURING METHOD FOR HYBRID CIRCUIT HOUSING.
NO904747L (en) PROCEDURE FOR MANUFACTURING A SINK.
NO895313L (en) PROCEDURE FOR MAKING A PROTECTIVE MOVIE ON A MAGNESIUM BASED SUBSTRATE.
NO862800D0 (en) PROCEDURE FOR MANUFACTURING A FLEXIBLE SILICONE FILM COAT ON A SUBSTRATE.