Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/02—Containers; Seals
  • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
  • H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
  • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor

Landscapes

• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Computer Hardware Design (AREA)
• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Ceramic Engineering (AREA)
• Manufacturing & Machinery (AREA)
• Crystals, And After-Treatments Of Crystals (AREA)
• Die Bonding (AREA)

Applications Claiming Priority (1)

Publications (1)

Family

ID=10212259

Family Applications (2)

Family Applications After (1)

Country Status (5)

Families Citing this family (8)

Family Cites Families (3)

• 0
  • NL NL85899D patent/NL85899C/xx active
  • NL NL7202527.A patent/NL164481B/en unknown
• 1950
  • 1950-10-06 GB GB24474/50A patent/GB683248A/en not_active Expired
• 1951
  • 1951-09-26 US US248308A patent/US2723370A/en not_active Expired - Lifetime
  • 1951-10-02 FR FR1042521D patent/FR1042521A/en not_active Expired
  • 1951-10-03 DE DEG7122A patent/DE865489C/en not_active Expired

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