NL7605903A - COMPOSITION WITH A SEMICONDUCTOR. - Google Patents

COMPOSITION WITH A SEMICONDUCTOR.

Info

Publication number
NL7605903A
NL7605903A NL7605903A NL7605903A NL7605903A NL 7605903 A NL7605903 A NL 7605903A NL 7605903 A NL7605903 A NL 7605903A NL 7605903 A NL7605903 A NL 7605903A NL 7605903 A NL7605903 A NL 7605903A
Authority
NL
Netherlands
Prior art keywords
semiconductor
composition
Prior art date
Application number
NL7605903A
Other languages
Dutch (nl)
Original Assignee
Int Rectifier Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Int Rectifier Corp filed Critical Int Rectifier Corp
Publication of NL7605903A publication Critical patent/NL7605903A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
NL7605903A 1975-06-02 1976-06-01 COMPOSITION WITH A SEMICONDUCTOR. NL7605903A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/582,610 US4008486A (en) 1975-06-02 1975-06-02 Compression-assembled semiconductor device with nesting circular flanges and flexible locating ring

Publications (1)

Publication Number Publication Date
NL7605903A true NL7605903A (en) 1976-12-06

Family

ID=24329807

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7605903A NL7605903A (en) 1975-06-02 1976-06-01 COMPOSITION WITH A SEMICONDUCTOR.

Country Status (9)

Country Link
US (1) US4008486A (en)
CH (1) CH612540A5 (en)
DE (1) DE2624807A1 (en)
ES (1) ES448440A1 (en)
FR (1) FR2313774A1 (en)
GB (1) GB1555515A (en)
NL (1) NL7605903A (en)
SE (1) SE7606179L (en)
SU (1) SU845810A3 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5354971A (en) * 1976-10-28 1978-05-18 Mitsubishi Electric Corp Semiconductor device
US4131905A (en) * 1977-05-26 1978-12-26 Electric Power Research Institute, Inc. Light-triggered thyristor and package therefore
DE2810416C2 (en) * 1978-03-10 1983-09-01 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Semiconductor component with plastic coating
US4257058A (en) * 1979-07-05 1981-03-17 Electric Power Research Institute, Inc. Package for radiation triggered semiconductor device and method
GB8410847D0 (en) * 1984-04-27 1984-06-06 Westinghouse Brake & Signal Semiconductor housings
EP0320618A1 (en) * 1987-12-14 1989-06-21 BBC Brown Boveri AG Housing for a GTO power thyristor
DE4227063A1 (en) * 1992-08-15 1994-02-17 Abb Research Ltd High-performance semiconductor component that can be switched off
DE69321965T2 (en) * 1993-12-24 1999-06-02 Cons Ric Microelettronica MOS power chip type and package assembly
US5798287A (en) * 1993-12-24 1998-08-25 Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno Method for forming a power MOS device chip
EP0660402B1 (en) * 1993-12-24 1998-11-04 Consorzio per la Ricerca sulla Microelettronica nel Mezzogiorno Power semiconductor device
EP0697728B1 (en) * 1994-08-02 1999-04-21 STMicroelectronics S.r.l. MOS-technology power device chip and package assembly
US6781227B2 (en) * 2002-01-25 2004-08-24 International Rectifier Corporation Compression assembled electronic package having a plastic molded insulation ring
US7132698B2 (en) * 2002-01-25 2006-11-07 International Rectifier Corporation Compression assembled electronic package having a plastic molded insulation ring
NO20130076A1 (en) * 2012-01-16 2013-07-17 Schlumberger Technology Bv Pipe-enclosed motor cable
USD712940S1 (en) * 2012-05-17 2014-09-09 Anthony Cerniglia Locating ring
CN113725085B (en) * 2021-08-31 2024-03-29 深圳技术大学 Assembling process method of packaging part and packaging part

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3058209A (en) * 1962-10-16 Method of manufacturing a vacuum tight closure
NL240675A (en) * 1958-07-02
DE1248814B (en) * 1962-05-28 1968-03-14 Siemens Ag Semiconductor component and associated cooling order
DE1514152A1 (en) * 1964-12-16 1969-09-11 Licentia Gmbh Semiconductor rectifier cell
US3337678A (en) * 1965-06-30 1967-08-22 John P Stelmak Sealed microminiature electronic package
US3437887A (en) * 1966-06-03 1969-04-08 Westinghouse Electric Corp Flat package encapsulation of electrical devices
FR2003573A1 (en) * 1968-03-09 1969-11-07 Mitsubishi Electric Corp
US3599057A (en) * 1969-02-03 1971-08-10 Gen Electric Semiconductor device with a resilient lead construction
DE2014289A1 (en) * 1970-03-25 1971-10-14 Semikron Gleichrichterbau Disc-shaped semiconductor component and method for its manufacture
US3688163A (en) * 1970-08-04 1972-08-29 Gen Motors Corp Cold welded semiconductor package having integral cold welding oil
US3654529A (en) * 1971-04-05 1972-04-04 Gen Electric Loose contact press pack
US3831067A (en) * 1972-05-15 1974-08-20 Int Rectifier Corp Semiconductor device with pressure connection electrodes and with headers cemented to insulation ring
US3918147A (en) * 1974-03-25 1975-11-11 Corning Glass Works Hermetic enclosure for electronic component

Also Published As

Publication number Publication date
FR2313774B1 (en) 1980-07-25
CH612540A5 (en) 1979-07-31
US4008486A (en) 1977-02-15
ES448440A1 (en) 1977-07-01
FR2313774A1 (en) 1976-12-31
SU845810A3 (en) 1981-07-07
DE2624807A1 (en) 1976-12-16
SE7606179L (en) 1976-12-03
GB1555515A (en) 1979-11-14

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Legal Events

Date Code Title Description
BV The patent application has lapsed