NL7605233A - MICRO CIRCUIT FACED ELEMENTAL DISK WITH ELECTROLYTICALLY GROWN SOLDER BALLS AND PROCEDURE FOR MANUFACTURING THEM. - Google Patents

MICRO CIRCUIT FACED ELEMENTAL DISK WITH ELECTROLYTICALLY GROWN SOLDER BALLS AND PROCEDURE FOR MANUFACTURING THEM.

Info

Publication number
NL7605233A
NL7605233A NL7605233A NL7605233A NL7605233A NL 7605233 A NL7605233 A NL 7605233A NL 7605233 A NL7605233 A NL 7605233A NL 7605233 A NL7605233 A NL 7605233A NL 7605233 A NL7605233 A NL 7605233A
Authority
NL
Netherlands
Prior art keywords
procedure
manufacturing
solder balls
micro circuit
elemental
Prior art date
Application number
NL7605233A
Other languages
Dutch (nl)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Priority to NL7605233A priority Critical patent/NL7605233A/en
Priority to DE19772720097 priority patent/DE2720097A1/en
Priority to GB20197/77A priority patent/GB1577226A/en
Priority to IT23577/77A priority patent/IT1074890B/en
Priority to SE7705615A priority patent/SE7705615L/en
Priority to ES458814A priority patent/ES458814A1/en
Priority to BR3144/77A priority patent/BR7703144A/en
Priority to JP5555177A priority patent/JPS52140277A/en
Priority to BE177630A priority patent/BE854701A/en
Priority to AU25147/77A priority patent/AU2514777A/en
Priority to FR7715056A priority patent/FR2352468A1/en
Publication of NL7605233A publication Critical patent/NL7605233A/en
Priority to US05/895,711 priority patent/US4134801A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C19/00—Digital stores in which the information is moved stepwise, e.g. shift registers
    • G11C19/02—Digital stores in which the information is moved stepwise, e.g. shift registers using magnetic elements
    • G11C19/08—Digital stores in which the information is moved stepwise, e.g. shift registers using magnetic elements using thin films in plane structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00—Thin magnetic films, e.g. of one-domain structure
    • H01F10/06—Thin magnetic films, e.g. of one-domain structure characterised by the coupling or physical contact with connecting or interacting conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05599—Material
    • H01L2224/056—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/05638—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/05655—Nickel [Ni] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/061—Disposition
    • H01L2224/0612—Layout
    • H01L2224/0616—Random array, i.e. array with no symmetry
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01064—Gadolinium [Gd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Non-Insulated Conductors (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
NL7605233A 1976-05-17 1976-05-17 MICRO CIRCUIT FACED ELEMENTAL DISK WITH ELECTROLYTICALLY GROWN SOLDER BALLS AND PROCEDURE FOR MANUFACTURING THEM. NL7605233A (en)

Priority Applications (12)

Application Number Priority Date Filing Date Title
NL7605233A NL7605233A (en) 1976-05-17 1976-05-17 MICRO CIRCUIT FACED ELEMENTAL DISK WITH ELECTROLYTICALLY GROWN SOLDER BALLS AND PROCEDURE FOR MANUFACTURING THEM.
DE19772720097 DE2720097A1 (en) 1976-05-17 1977-05-05 ELEMENTARY DISC WITH ELECTROLYTICALLY GROUTED METAL NUMBERS, AND METHOD OF MANUFACTURING SUCH A DISC
GB20197/77A GB1577226A (en) 1976-05-17 1977-05-13 Terminal connections on microcircuit chips
IT23577/77A IT1074890B (en) 1976-05-17 1977-05-13 METHOD OF MANUFACTURING A SLAB EQUIPPED WITH A MICROCIRCUIT AND A SYSTEM OF CONDUCTIVE SLOPES
SE7705615A SE7705615L (en) 1976-05-17 1977-05-13 MICROCRETE DEVICE AND MANUFACTURING PROCEDURE
ES458814A ES458814A1 (en) 1976-05-17 1977-05-14 Terminal connections on microcircuit chips
BR3144/77A BR7703144A (en) 1976-05-17 1977-05-16 IMPROVEMENT IN THE MANUFACTURING PROCESS OF AN ELEMENTARY SLICE EQUIPPED WITH A MICROCIRCUIT
JP5555177A JPS52140277A (en) 1976-05-17 1977-05-16 Method of manufacturing unit slice provided with micro circuit
BE177630A BE854701A (en) 1976-05-17 1977-05-16 ELEMENTARY PLATE EQUIPPED WITH A MICROCIRCUIT AND ELECTROLYTICALLY SHAPED WELDING SPHERULES
AU25147/77A AU2514777A (en) 1976-05-17 1977-05-16 Terminal connections on microcircuit chips
FR7715056A FR2352468A1 (en) 1976-05-17 1977-05-17 ELEMENTARY PLATE EQUIPPED WITH A MICRO-CIRCUIT AND ELECTROLYTICALLY SHAPED WELDING SPHERULES, AND PROCESS FOR THE MANUFACTURE OF THIS PLATE
US05/895,711 US4134801A (en) 1976-05-17 1978-04-12 Terminal connections on microcircuit chips

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7605233A NL7605233A (en) 1976-05-17 1976-05-17 MICRO CIRCUIT FACED ELEMENTAL DISK WITH ELECTROLYTICALLY GROWN SOLDER BALLS AND PROCEDURE FOR MANUFACTURING THEM.

Publications (1)

Publication Number Publication Date
NL7605233A true NL7605233A (en) 1977-11-21

Family

ID=19826203

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7605233A NL7605233A (en) 1976-05-17 1976-05-17 MICRO CIRCUIT FACED ELEMENTAL DISK WITH ELECTROLYTICALLY GROWN SOLDER BALLS AND PROCEDURE FOR MANUFACTURING THEM.

Country Status (11)

Country Link
JP (1) JPS52140277A (en)
AU (1) AU2514777A (en)
BE (1) BE854701A (en)
BR (1) BR7703144A (en)
DE (1) DE2720097A1 (en)
ES (1) ES458814A1 (en)
FR (1) FR2352468A1 (en)
GB (1) GB1577226A (en)
IT (1) IT1074890B (en)
NL (1) NL7605233A (en)
SE (1) SE7705615L (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59195837A (en) * 1983-04-21 1984-11-07 Sharp Corp Chip bonding method for large-scale integrated circuit

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3484341A (en) * 1966-09-07 1969-12-16 Itt Electroplated contacts for semiconductor devices
CA929675A (en) * 1972-02-16 1973-07-03 A. Hamer Colin Fabrication of beam leads
US3926746A (en) * 1973-10-04 1975-12-16 Minnesota Mining & Mfg Electrical interconnection for metallized ceramic arrays
JPS5441181B2 (en) * 1973-11-08 1979-12-07
FR2263577B1 (en) * 1974-03-08 1978-07-07 Tecsi Tech Systemes Inf
JPS5548390B2 (en) * 1974-03-11 1980-12-05

Also Published As

Publication number Publication date
FR2352468A1 (en) 1977-12-16
IT1074890B (en) 1985-04-20
BR7703144A (en) 1978-02-08
GB1577226A (en) 1980-10-22
JPS52140277A (en) 1977-11-22
SE7705615L (en) 1977-11-18
ES458814A1 (en) 1978-08-01
DE2720097A1 (en) 1977-12-01
AU2514777A (en) 1978-11-23
BE854701A (en) 1977-11-16

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